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Design Rule Check: By:-Chandan ROLL NO. 15/914 B.SC (Hons.) ELECTRONICS Science

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DESIGN RULE CHECK

BY:- CHANDAN
ROLL NO. 15/914
B.Sc (Hons.)ELECTRONICS
SCIENCE
DESIGN RULE CHECK

Design rule checking(DRC) is the area of electronic


design automation that determines whether the
physical layout of a particular chip layout satisfies
a series of recommended parameters called design
rules.
 
Design rule checking is a major step during
physical verification signoff on the design, which
also involves LVS (layout versus schematic) check,
XOR checks, ERC (electrical rule check) and
antenna checks.
 
For advanced processes some fabrications also
insist upon the use of more restricted rules to
improve yield.
1 Design rules

The three basic DRC checks


width,

WIDTH

SPACING
SPACING

WIDTH

SPACING
Enclosure
The most basic design rules are shown
in the diagram on the right. The first
are single layer rules.
A width rule specifies the minimum
width of any shape in the design.
A spacing rule specifies the minimum
distance between two adjacent
objects.
These rules will exist for each layer of
semiconductor manufacturing
process, with the lowest layers having
the smallest rules (typically 100 nm as
of 2007) and the highest metal layers
having larger rules(perhaps 400 nm
as of 2007).
OBJECTIVE OF DESIGN RULE CHECK
The main objective of design rule checking (DRC)
is to achieve a high overall yield and reliability
for the de-sign. If design rules are violated the
design may not be functional.
To meet this goal of improving die yields, DRC has
evolved from simple measurement and Boolean
checks, to more involved rules that modify
existing features, insert new features, and check
the entire design for process limitations such as
layer density.
A completed layout consists not only of the
geometric representation of the design, but also
data that provides support for the manufacture of
the design.
While design rule checks do not validate that the
design will operate correctly, they are
constructed to verify that the structure meets the
process constraints for a given design type and
process technology.
DRC SOFTWARE

DRC software usually takes as input


a layout in the GDSII standard
format and a list of rules specific to
the semiconductor process chosen for
fabrication.
From these it produces a report of
design rule violations that the
designer may or may not choose to
correct.
Carefully “stretching” or waiving
certain design rules is often used to
increase performance and component
density at the expense of yield.
Example of DRC’s in IC design include:

Active to active spacing

Well to well spacing

Minimum channel length of the transistor

Minimum metal width

Metal to metal spacing

Metal fill density (for processes using CMP) Poly


density

ESD and I/O rules

Antenna effect

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