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Enpirion Power Datasheet: Description Application

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Enpirion® Power Datasheet

EP53F8QI 1500 mA PowerSoC


Voltage Mode Synchronous
PWM Buck with Integrated Inductor

Description Application
The EP53F8QI provides high efficiency in a very • Wireless wide area networking data cards.
small footprint. Featuring integrated inductor, the
• Replacement of inefficient LDOs
device delivers up to 1500mA of continuous
output current. Total solution footprint can be as • Noise Sensitive Applications such as RF,
little as 40mm2. Audio and Video, and high speed IO
Output voltage is programmed via an external • Computing, Computer Peripherals, Storage,
resistor divider providing a wide range of Networking, and Instrumentation
flexibility while maintaining a very small footprint.
• USB, DSL, STB, DVR, DTV, and iPC
Integration of the inductor reduces conducted
and radiated noise providing excellent
compatibility with sensitive RF and high speed
data applications.

Features
• Integrated Inductor Technology
• Total Solution Footprint as Small as 40 mm2
• 3 mm x 3 mm x 1.1 mm QFN Package
• Solution Power Density up to 140mW/mm2 Figure 1: Typical Application Circuit

• 1500 mA Continuous Output Current Product Performance


• High Efficiency, up to 94 %
95
• Low Ripple Voltage; 8 mVP-P Typical
85
• Power OK Signal with 5 mA Sink Capability
75
• 2.4V to 5.5V Input Voltage Range
Efficiency (%)

65
• Fast Transient Response
55
• 4 MHz Fixed Switching Frequency 45

• Low Dropout Operation: 100 % Duty Cycle 35

• Under Voltage Lockout, Over Current, Short 25


Circuit, and Thermal Protection 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5
Load Current (A)
• RoHS Compliant; MSL 3 260 °C Reflow
Figure 2: Efficiency, VIN=5V, VOUT=3.7V

01542 February 25, 2014 Rev G


EP53F8QI

Ordering Information Pin Assignments (Top View)


Part Number Temp Rating (°C) Package
EP53F8QI -40 to +85 16-pin QFN T&R
EVB-EP53F8QI QFN Evaluation Board

Figure 3: Pin Diagram (Top View)

Pin Description

PIN NAME FUNCTION


No Connect. These pins are internally connected to the common drain output of the internal
1, MOSFETs. NC(SW) pins are not to be electrically connected to any external signal,
NC(SW)
15,16 ground, or voltage. However, they must be soldered to the PCB. Failure to follow this
guideline may result in part malfunction or damage.
Input/Output Power Ground. Connect these pins to the ground electrode of the input and
2-3, PGND
output filter capacitors. Refer to Layout Considerations section for details.
4 AVIN2 Analog input voltage. Connect to AVIN1 only.
Feedback Pin for External Voltage Divider Network. Connect a resistor divider to this pin to
5 VFB
set the output voltage. Use 237 kΩ, 1% or better for the upper resistor.
6 NC No Connect.
7,8 VOUT Voltage and Power Output. Connect these pins to output capacitor(s).
9 AGND Analog Ground for the Controller Circuits
Analog Voltage Input for the Controller Circuits. Connect this pin to PVIN with a 10Ω
10 AVIN1
resistor. Connect a 1 µF capacitor between this pin and AGND. Connect AVIN2 to this pin.
11 POK Power OK with an Open Drain Output. Refer to Power OK section.
Input Enable. A logic high signal on this pin enables the output and initiates a soft start. A
logic low signal disables the output and discharges the output to GND. The ENABLE pin
12 ENABLE should not be left floating as it could be in an unknown and random state. It is
recommended to enable the device after both PVIN and AVIN is in regulation. See ENABLE
operation for details.
13-14 PVIN Input Power Supply. Connect to input supply. Decouple with input capacitor(s) to PGND.

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01542 February 25, 2014 Rev G
EP53F8QI

Absolute Maximum Ratings


CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond the
recommended operating conditions is not implied. Stress beyond the absolute maximum ratings may
cause permanent damage to the device. Exposure to absolute maximum rated conditions for
extended periods may affect device reliability.
Absolute Maximum Electrical Ratings MIN MAX
Voltages on: PVIN, AVIN, VOUT -0.3 V 6.5 V
Voltages on: ENABLE, POK -0.3 V VIN
Voltage on: VFB -0.3 V 2.7 V
ESD Rating (Human Body Model) 2 kV
ESD Rating (Charge Device Model) 500 V
Absolute Maximum Thermal Ratings MIN MAX
Ambient Operating Range -40 °C +85 °C
Storage Temperature Range -65 °C +150 °C
Reflow Peak Body Temperature MSL3 (10 s) +260 °C

Recommended Operating Conditions

PARAMETER SYMBOL MIN MAX UNITS


Input Voltage Range VIN 2.4 5.5 V

Output Voltage Range VOUT 0.6 VIN - VDROPOUT V
Output Current ILOAD 0 1500 mA
Operating Junction Temperature TJ -40 +125 °C
Operating Ambient Temperature TA -40 +85 °C

VDROPOUT is defined as (ILOAD x Dropout Resistance) including temperature effect

Thermal Characteristics

PARAMETER SYMBOL MIN TYP MAX UNITS


Thermal Shutdown (Junction Temperature) TSD 155 °C
Thermal Shutdown Hysteresis TSDH 15 °C
††
Thermal Resistance: Junction to Ambient (0 LFM) θJA 55 °C/W
††
Based on a 2 oz. copper board and proper thermal design in line with JEDEC EIJ/JESD51 standards

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01542 February 25, 2014 Rev G
EP53F8QI

Electrical Characteristics
Typical values for VIN = 5V and TA =25°C, unless otherwise noted.

PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS


Operating Input Voltage VIN 2.4 5.5 V
Under Voltage Lockout VUVLO VIN going low to high 2.2 V
Under Voltage Lockout VUVLO VIN going high to low 2.1 V
VFB Voltage Initial TA = 25 °C; VIN = 5V
VFB 0.588 0.600 0.612 V
Accuracy ILOAD = 100 mA
Line Regulation 2.4 V ≤ VIN ≤ 5.5V 0.31 %/V
Load Regulation ILOAD = 0 to 1.5A 0.420 %/A
Temperature Variation -40°C ≤ TA ≤ +85°C 0.0012 %/°C
-40°C ≤ TA ≤ +85°C;
0.5A ≤ ILOAD ≤ 1.0A;
Typical Accuracy 1.5 %
4.5V ≤ VIN ≤ 5.5V;
0.95V ≤ VOUT ≤ 1.5V;
VOUT Rise Time TRISE From time ENABLE goes high 0.78 1.2 1.62 mS
VFB, ENABLE, Pin Input
-40°C ≤ TA ≤ +85°C -40 +40 nA
Current (Note 1)
ENABLE Voltage Logic Low 0.0 0.4 V
Threshold Logic High 1.4 VIN V
Continuous Output Current 1500 mA
Peak Output Current 1.0V ≤ VOUT ≤ 1.5V; <21ms 1800 mA
POK Upper Threshold VOUT Rising 111 %
POK Upper Threshold VOUT Falling 102 %
VOUT Rising;
POK Lower Threshold 92 %
percent of VOUT Nominal
VOUT Falling;
POK Lower Threshold 90 %
percent of VOUT Nominal
POK Low Voltage ISINK = 5 mA, -40°C ≤ TA ≤ +85°C 0.15 0.4 V
POK Pin VOH Leakage
POK High, -40°C ≤ TA ≤ +85°C 500 nA
Current
Shutdown Current ENABLE Low 14 µA
2.4 V ≤ VIN ≤ 5.5 V,
Current Limit Threshold 2.0 3.2 A
-40°C ≤ TA ≤ +85°C
Dropout Resistance 250 360 mΩ
Operating Frequency FOSC 4 MHz
Note 1: VFB, ENABLE pin input current specification is guaranteed by design.

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01542 February 25, 2014 Rev G
EP53F8QI

Typical Performance Characteristics†††


95 95

85 85

75 75
Efficiency (%)

Efficiency (%)
65 65

55 55

45 45

35 35

25 25
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
Load Current (A) Load Current (A)

Efficiency vs. Load Current: VIN = 5.0V, VOUT (from Efficiency vs. Load Current: VIN = 3.3V, VOUT (from
top to bottom) = 3.7, 2.5V, 1.8V, 1.2V top to bottom) = 2.5V, 1.8V, 1.2V

20 MHz BW limit 500 MHz BW

Output Ripple: VIN = 5V, VOUT = 3.7V, ILOAD = 900mA Output Ripple: VIN = 5V, VOUT = 3.7V, ILOAD = 900mA

20 MHz BW limit 500 MHz BW

Output Ripple: VIN = 3.3V, VOUT = 1.8V, ILOAD = 900mA Output Ripple: VIN = 3.3V, VOUT = 1.8V, ILOAD = 900mA

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01542 February 25, 2014 Rev G
EP53F8QI

Transient Response: VIN = 5.0V, VOUT = 1.2V Transient Response: VIN = 3.3V, VOUT = 1.8V
Load Step 0 to 1.5A Load Step 0 to 1.5A

ENABLE ENABLE

VOUT VOUT

POK POK

Startup and Shutdown Waveform Startup and Shutdown Waveform


VIN = 5.0V, VOUT = 3.7V, ILOAD = 0mA VIN = 5.0V, VOUT = 3.7V, ILOAD = 900mA

†††
Application Circuit in Figure 1 used for
typical performance characteristics.

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01542 February 25, 2014 Rev G
EP53F8QI

Functional Block Diagram


POK PVIN

UVLO
POK
Thermal Limit

Current Limit

ENABLE Soft Start NC (SW)

P-Drive

(-) Logic VOUT


PWM
Comp N-Drive
(+)
PGND

Sawtooth
Generator
Compensation
Network

(-) VFB
Error
Amp
(+)

DAC

VREF BIAS

Package Boundary
AVIN

Figure 4: Functional Block Diagram

Functional Description
The EP53F8QI leverages advanced CMOS it is within ±10% of nominal. Protection
technology to provide high switching features include under voltage lockout (UVLO),
frequency, while also maintaining high over current protection, short circuit protection,
efficiency. and thermal overload protection.
Packaged in a 3 mm x 3 mm x 1.1 mm QFN, Stability over Wide Range of Operating
the EP53F8QI provides a high degree of Conditions
flexibility in circuit design while maintaining a
very small footprint. High switching frequency The EP53F8QI utilizes an internal
allows for the use of very small MLCC input compensation network and is designed to
and output filter capacitors. provide stable operation over a wide range of
operating conditions. The high switching
The converter uses voltage mode control to frequency allows for a wide control loop
provide high noise immunity, low output bandwidth. .To improve transient performance
impedance and excellent load transient or reduce output voltage ripple with dynamic
response. Most compensation components are loads you have the option to add
integrated into the device, requiring only a supplementary capacitance to the output.
single external compensation capacitor. Please refer to the section on soft start for
Output voltage is programmed via an external limitations on output capacitance.
resistor divider. Output voltage can be
programmed from 0.6V to VIN-VDROPOUT.
POK monitors the output voltage and signals if

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01542 February 25, 2014 Rev G
EP53F8QI
Soft Start output voltage to the desired value. A logic low
will allow the device to discharge the output
The EP53F8QI has an internal soft-start circuit
and go into shutdown mode for minimal power
that controls the ramp of the output voltage.
consumption. When the output is discharged,
The control circuitry limits the VOUT ramp rate to
an auxiliary NFET turns on and limits the
levels that are safe for the Power MOSFETS
discharge current to 300 mA or below. The
and the integrated inductor.
ENABLE pin should not be left floating as it
could be in an unknown and random state. It is
The device has a constant VOUT ramp time. recommended to enable the device after both
Therefore, the ramp rate will vary with the PVIN and AVIN is in regulation. At extremely
output voltage setting. Output voltage ramp cold conditions below -30°C, the controller may
time is given in the Electrical Characteristics not be properly powered if ENABLE is tied
Table. directly to AVIN during startup. It is
recommended to use an external RC circuit to
Excess bulk capacitance on the output of the delay the ENABLE voltage rise so that the
device can cause an over-current condition at internal controller has time to startup into
startup. The maximum total capacitance on regulation (see circuit below). The RC circuit
the output, including the output filter capacitor may be adjusted so that AVIN and PVIN are
and bulk and decoupling capacitance, at the above UVLO before ENABLE is high. The
load, is given as: startup time will be delayed by the extra time it
takes for the capacitor voltage to reach the
COUT_TOTAL_MAX = 1.867x10-3/VOUT Farads ENABLE threshold.
The nominal value for COUT is 22uF.
The above number and formula assume a no
load condition at startup.

Over Current/Short Circuit Protection


When an over current condition occurs, VOUT is
pulled low. This condition is maintained for a
period of 1.2 ms and then a normal soft start
cycle is initiated. If the over current condition
still persists, this cycle will repeat.
Under Voltage Lockout
An under voltage lockout circuit will hold off
switching during initial power up until the input
voltage reaches sufficient level to ensure
proper operation. If the voltage drops below the Figure 5: ENABLE Delay Circuit
UVLO threshold the lockout circuitry will again
disable switching. Hysteresis is included to
prevent chattering between UVLO high and low Thermal Shutdown
states. When excessive power is dissipated in the
Enable device, its junction temperature rises. Once the
junction temperature exceeds the thermal
The ENABLE pin provides means to shut down shutdown temperature, the thermal shutdown
the converter or initiate normal operation. A circuit turns off the converter, allowing the
logic high will enable the converter to go device to cool. When the junction temperature
through the soft start cycle and regulate the decreases to a safe operating level, the device
will be re-enabled and go through a normal
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01542 February 25, 2014 Rev G
EP53F8QI
startup process. The specific thermal
shutdown junction temperature and hysteresis
can be found in the thermal characteristics
table
Power OK
The EP53F8QI provides an open drain output
to indicate if the output voltage stays within
92% to 111% of the set value. Within this
range, the POK output is allowed to be pulled
high. Outside this range, POK remains low.
However, during transitions such as power up,
power down, and dynamic voltage scaling, the
POK output will not change state until the
transition is complete for enhanced noise
immunity.
The POK has 5 mA sink capability for events
where it needs to feed a digital controller with
standard CMOS inputs. When POK is pulled
high, the pin leakage current is as low as 500
nA maximum over temperature. This allows a
large pull up resistor such as 100 kΩ to be
used for minimal current consumption in
shutdown mode.
The POK output can also be conveniently used
as an ENABLE input of the next stage for
power sequencing of multiple converters.

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01542 February 25, 2014 Rev G
EP53F8QI

Application Information
dielectrics lose too much capacitance with
Setting the Output Voltage
frequency, DC bias, and temperature.
Therefore, they are not suitable for switch-
mode DC-DC converter filtering, and must be
avoided.
The input filter capacitor requirement is a 10
µF, 10V 0805 MLCC capacitor in parallel with a
680pF MLCC capacitor. The 680pF capacitor
provides additional high frequency decoupling
and is manditory. The 680pF capacitor must
be placed closest to the EP53F8QI as shown
Figure 6: Typical Application Circuit in Figure .
The EP53F8QI uses a simple resistor divider to The output filter capacitor requirement is a
program the output voltage. 22 µF, 6.3V, 0805 MLCC for most applications.
Referring to Figure , use 237 kΩ, 1% or better The output ripple can be reduced by using 2 x
for the upper resistor (Ra). The value of the 22 µF, 6.3V, 0805 MLC capacitors.
bottom resistor (Rb) in kΩ is given as: Additional bulk capacitance for decoupling and
142.2 bypass can be placed at the load as long as
Rb = kΩ there is sufficient separation between the VOUT
VOUT − 0.6
Sense point and the bulk capacitance.
Where VOUT is the output voltage. Rb should Excess total capacitance on the output (Output
also be a 1% or better resistor. Filter + Bulk) can cause an over-current
A 5.0pF MLCC capacitor is required in parallel condition at startup. Refer to the section on
with Ra for compensation. Soft-Start for the maximum total capacitance
on the output.
Power-Up/Down Sequencing
AVIN Decoupling
During power-up, ENABLE should not be
asserted before PVIN, and PVIN should not be AVIN should be connected to PVIN using a
asserted before AVIN. The PVIN should never 10Ω resistor. An 0402 or smaller case size is
be powered when AVIN is off. During power recommended for this resistor. A 1 µF, 10 V,
down, the AVIN should not be powered down 0402 MLC capacitor should be connected from
before the PVIN. Tying PVIN and AVIN or all AVIN to AGND to provide high frequency
three pins (AVIN, PVIN, ENABLE) together decoupling for the control circuitry supply for
during power up or power down meets these optimal performance.
requirements. POK Pull Up Resistor Selection
Pre-Bias Start-up If the POK signal is required for the application.
The EP53F8QI does not support startup into a The POK pin must be pulled up through a
pre-biased condition. Be sure the output resistor to any voltage source that can be as
capacitors are not charged or the output of the high as VIN. The simplest way is to connect
EP53F8QI is not pre-biased when the POK to the power input of the converter
EP53F8QI is first enabled. through a resistor. A 100 kΩ pull up resistor is
recommended for most applications for
Input and Output Capacitor Selection minimal current drain from the voltage source
Low ESR MLC capacitors with X5R or X7R or and good noise immunity. POK can sink up to
equivalent dielectric should be used for input 5mA.
and output capacitors. Y5V or equivalent
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01542 February 25, 2014 Rev G
EP53F8QI

Layout Recommendation
Figure 7 shows critical components and layer 1
traces of a recommended minimum footprint
EP53F8LQI/EP53F8HQI layout with ENABLE
tied to VIN. Alternate ENABLE configurations,
and other small signal pins need to be
connected and routed according to specific
customer application. Please see the Gerber
files on the Altera website
www.altera.com/enpirion for exact dimensions
and other layers. Please refer to Figure 7 while
reading the layout recommendations in this
section.
Recommendation 1: Input and output filter
capacitors should be placed on the same side Figure 7: Top PCB Layer Critical Components
of the PCB, and as close to the EP53F8QI and Copper for Minimum Footprint
package as possible. They should be Recommendation 4: Multiple small vias
connected to the device with very short and should be used to connect the ground traces
wide traces. Do not use thermal reliefs or under the device to the system ground plane
spokes when connecting the capacitor pads to on another layer for heat dissipation. The drill
the respective nodes. The +V and GND traces diameter of the vias should be 0.33mm, and
between the capacitors and the EP53F8QI the vias must have at least 1 oz. copper plating
should be as close to each other as possible on the inside wall, making the finished hole
so that the gap between the two nodes is size around 0.20-0.26mm. Do not use thermal
minimized, even under the capacitors. reliefs or spokes to connect the vias to the
Recommendation 2: Input and output grounds ground plane. It is preferred to put these vias
are separated until they connect at the PGND under the capacitors along the edge of the
pins. The separation shown on Figure 7 GND copper closest to the +V copper. Please
between the input and output GND circuits see Figure 7. These vias connect the
helps minimize noise coupling between the input/output filter capacitors to the GND plane
converter input and output switching loops. and help reduce parasitic inductances in the
input and output current loops. If the vias
Recommendation 3: The system ground
cannot be placed under CIN and COUT, then put
plane should be the first layer immediately
them just outside the capacitors along the
below the surface layer. This ground plane
GND. Do not use thermal reliefs or spokes to
should be continuous and un-interrupted below
connect these vias to the ground plane.
the converter and the input/output capacitors.
Please see the Gerber files on the Altera Recommendation 5: AVIN is the power supply
website www.altera.com/enpirion. for the internal small-signal control circuits. It
should be connected to the input voltage at a
quiet point. In Figure 7 this connection is made
with RAVIN at the input capacitor close to the
VIN connection.

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01542 February 25, 2014 Rev G
EP53F8QI

Recommended PCB Footprint

Figure 8: EP53F8QI Package PCB Footprint

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01542 February 25, 2014 Rev G
EP53F8QI

Package and Mechanical

Figure 9: EP53F8QI Package Dimensions

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01542 February 25, 2014 Rev G
EP53F8QI

Revision History

Change(s) from Datasheet Rev F to Rev G in February 2014


- ENABLE functional description has been rewritten and updated to include delay circuit………………Page 8

Contact Information
Altera Corporation
101 Innovation Drive
San Jose, CA 95134
Phone: 408-544-7000
www.altera.com
© 2014 Altera Corporation—Confidential. All rights reserved. ALTERA, ARRIA, CYCLONE, ENPIRION, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX
words and logos are trademarks of Altera Corporation and registered in the U.S. Patent and Trademark Office and in other countries. All other words and logos identified as
trademarks or service marks are the property of their respective holders as described at www.altera.com/common/legal.html. Altera warrants performance of its semiconductor
products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any products and services at any time without
notice. Altera assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in
writing by Altera. Altera customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for
products or services.

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01542 February 25, 2014 Rev G

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