VN750 / VN750S VN750PT / VN750-B5: High Side Driver
VN750 / VN750S VN750PT / VN750-B5: High Side Driver
VN750 / VN750S VN750PT / VN750-B5: High Side Driver
® / VN750PT / VN750-B5
DESCRIPTION
compatibility table). Active current limitation
The VN750, VN750S, VN750PT, VN750-B5 are a combined with thermal shutdown and automatic
monolithic device designed in STMicroelectronics restart protect the device against overload.
VIPower M0-3 Technology, intended for driving
any kind of load with one side connected to The device detects open load condition both is on
ground. and off state. Output shorted to VCC is detected in
Active V CC pin voltage clamp protects the device the off state. Device automatically turns off in case
against low energy spikes (see ISO7637 transient of ground pin disconnection.
BLOCK DIAGRAM
VCC
VCC OVERVOLTAGE
CLAMP DETECTION
UNDERVOLTAGE
DETECTION
GND
Power CLAMP
INPUT DRIVER
OUTPUT
LOGIC
CURRENT LIMITER
OVERTEMPERATURE
DETECTION OFF STATE OPENLOAD
AND OUTPUT SHORTED TO V CC
DETECTION
CONFIGURATION DIAGRAM (TOP VIEW) & SUGGESTED CONNECTIONS FOR UNUSED AND N.C.
PINS
5 OUTPUT
VCC 5 4 N.C.
4 STATUS
OUTPUT STATUS 3 VCC
OUTPUT INPUT 2 INPUT
VCC 8 1 GND 1 GND
VF
IIN
VCC
INPUT
ISTAT IOUT
STATUS OUTPUT VCC
GND
VIN
VSTAT VOUT
IGND
2/31
VN750 / VN750S / VN750PT / VN750-B5
THERMAL DATA
Value
Symbol Parameter Unit
S0-8 PENTAWATT P2PAK PPAK
Rthj-case Thermal Resistance Junction-case Max - 2.1 2.1 2.1 °C/W
Rthj-lead Thermal Resistance Junction-lead Max 30 - - - °C/W
93 (1) 62.1 52.1 (3) 77.1 (3) °C/W
Rthj-amb Thermal Resistance Junction-ambient Max
82 (2) 62.1 37 (4) 44 (4) °C/W
(1) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick) connected to all VCC pins. Horizontal
mounting and no artificial air flow.
(2) When mounted on a standard single-sided FR-4 board with 2cm2 of Cu (at least 35µm thick) connected to all VCC pins. Horizontal mount-
ing and no artificial air flow.
(3) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick). Horizontal mounting and no artificial air
flow.
(4) When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35µm thick). Horizontal mounting and no artificial air flow.
SWITCHING (V CC=13V)
Symbol Parameter Test Conditions Min Typ Max Unit
td(on) Turn-on Delay Time RL=6.5Ω from VIN rising edge to VOUT=1.3V 40 µs
td(off) Turn-off Delay Time RL=6.5Ω from VIN falling edge to VOUT =11.7V 30 µs
dVOUT/dt(on) Turn-on Voltage Slope RL=6.5Ω from VOUT=1.3V to VOUT=10.4V (#) V/µs
dVOUT/dt(off) Turn-off Voltage Slope RL=6.5Ω from VOUT=11.7V to VOUT =1.3V (#) V/µs
INPUT PIN
Symbol Parameter Test Conditions Min Typ Max Unit
VIL Input Low Level (#) 1.25 V
IIL Low Level Input Current VIN=1.25V 1 (#) µA
VIH Input High Level 3.25 (#) V
IIH High Level Input Current VIN=3.25V (#) 10 µA
Vhyst Input Hysteresis Voltage 0.5 (#) V
IIN=1mA 6 6.8 8 V
VICL Input Clamp Voltage
IIN=-1mA -0.7 V
3/31
1
VN750 / VN750S / VN750PT / VN750-B5
STATUS PIN
Symbol Parameter Test Conditions Min Typ Max Unit
VSTAT Status Low Output Voltage ISTAT =1.6mA (#) 0.5 V
ILSTAT Status Leakage Current Normal Operation; VSTAT=5V (#) 10 µA
Status Pin Input
CSTAT Normal Operation; VSTAT=5V 100 pF
Capacitance
ISTAT =1mA 6 6.8 8 V
VSCL Status Clamp Voltage
ISTAT =-1mA -0.7 V
Note 1: To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be
used together with a proper software strategy. If the device operates under abnormal conditions this software must limit the duration and
number of activation cycles.
4/31
2
VN750 / VN750S / VN750PT / VN750-B5
OPEN LOAD STATUS TIMING (with external pull-up) OVERTEMP STATUS TIMING
VOUT > VOL IOUT< IOL
Tj > Tjsh
VIN
VIN
VSTAT
VSTAT
5/31
1
VN750 / VN750S / VN750PT / VN750-B5
VOUT
90%
80%
dVOUT/dt(on) dVOUT/dt(off)
10%
t
VIN
td(on) td(off)
TRUTH TABLE
CONDITIONS INPUT OUTPUT STATUS
L L H
Normal Operation
H H H
L L H
Current Limitation H X (Tj < TTSD) H
H X (Tj > TTSD) L
L L H
Overtemperature
H L L
L L X
Undervoltage
H L X
L L H
Overvoltage
H L H
L H L
Output Voltage > VOL
H H H
L L H
Output Current < IOL
H H L
6/31
VN750 / VN750S / VN750PT / VN750-B5
TEST LEVELS
ISO T/R 7637/1
Delays and
Test Pulse I II III IV
Impedance
1 -25 V -50 V -75 V -100 V 2 ms 10 Ω
2 +25 V +50 V +75 V +100 V 0.2 ms 10 Ω
3a -25 V -50 V -100 V -150 V 0.1 µs 50 Ω
3b +25 V +50 V +75 V +100 V 0.1 µs 50 Ω
4 -4 V -5 V -6 V -7 V 100 ms, 0.01 Ω
5 +26.5 V +46.5 V +66.5 V +86.5 V 400 ms, 2 Ω
CLASS CONTENTS
C All functions of the device are performed as designed after exposure to disturbance.
E One or more functions of the device is not performed as designed after exposure to disturbance
and cannot be returned to proper operation without replacing the device.
7/31
VN750 / VN750S / VN750PT / VN750-B5
Figure 1: Waveforms
NORMAL OPERATION
INPUT
LOAD VOLTAGE
STATUS
UNDERVOLTAGE
VCC VUSDhyst
VUSD
INPUT
LOAD VOLTAGE
STATUS undefined
OVERVOLTAGE
VCC<VOV VCC>VOV
VCC
INPUT
LOAD VOLTAGE
STATUS
INPUT
VOUT >VOL
LOAD VOLTAGE
VOL
STATUS
LOAD VOLTAGE
STATUS
OVERTEMPERATURE
Tj TTSD
TR
INPUT
LOAD CURRENT
STATUS
8/31
1
1
VN750 / VN750S / VN750PT / VN750-B5
APPLICATION SCHEMATIC
+5V +5V
Rprot VCC
STATUS
Dld
µC Rprot INPUT
OUTPUT
GND
RGND
VGND DGND
GND PROTECTION NETWORK AGAINST This small signal diode can be safely shared amongst
REVERSE BATTERY several different HSD. Also in this case, the presence of
the ground network will produce a shift (j600mV) in the
Solution 1: Resistor in the ground line (RGND only). This input threshold and the status output values if the
can be used with any type of load. microprocessor ground is not common with the device
The following is an indication on how to dimension the ground. This shift will not vary if more than one HSD
RGND resistor. shares the same diode/resistor network.
1) RGND ≤ 600mV / (IS(on)max). Series resistor in INPUT and STATUS lines are also
2) RGND ≥ (−VCC) / (-IGND) required to prevent that, during battery voltage transient,
the current exceeds the Absolute Maximum Rating.
where -IGND is the DC reverse ground pin current and can
be found in the absolute maximum rating section of the Safest configuration for unused INPUT and STATUS pin
device’s datasheet. is to leave them unconnected.
Power Dissipation in RGND (when VCC<0: during reverse LOAD DUMP PROTECTION
battery situations) is: Dld is necessary (Voltage Transient Suppressor) if the
PD= (-VCC)2/RGND load dump peak voltage exceeds VCC max DC rating. The
This resistor can be shared amongst several different same applies if the device will be subject to transients on
HSD. Please note that the value of this resistor should be the VCC line that are greater than the ones shown in the
calculated with formula (1) where IS(on)max becomes the ISO T/R 7637/1 table.
sum of the maximum on-state currents of the different µC I/Os PROTECTION:
devices.
If a ground protection network is used and negative
Please note that if the microprocessor ground is not transients are present on the VCC line, the control pins will
common with the device ground then the RGND will be pulled negative. ST suggests to insert a resistor (Rprot)
produce a shift (IS(on)max * RGND) in the input thresholds in line to prevent the µC I/Os pins to latch-up.
and the status output values. This shift will vary
depending on many devices are ON in the case of several The value of these resistors is a compromise between the
high side drivers sharing the same RGND. leakage current of µC and the current required by the
HSD I/Os (Input levels compatibility) with the latch-up limit
If the calculated power dissipation leads to a large resistor of µC I/Os.
or several devices have to share the same resistor then
the ST suggests to utilize Solution 2 (see below). -VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH-VGND) / IIHmax
Solution 2: A diode (DGND) in the ground line. Calculation example:
A resistor (RGND=1kΩ) should be inserted in parallel to For VCCpeak= - 100V and Ilatchup ≥ 20mA; VOHµC ≥ 4.5V
DGND if the device will be driving an inductive load. 5kΩ ≤ Rprot ≤ 65kΩ.
Recommended Rprot value is 10kΩ.
9/31
VN750 / VN750S / VN750PT / VN750-B5
Off state open load detection requires an external pull-up 2) no misdetection when load is disconnected: in this
resistor (RPU) connected between OUTPUT pin and a case the VOUT has to be higher than VOLmax; this
positive supply voltage (VPU) like the +5V line used to results in the following condition RPU<(VPU–VOLmax)/
supply the microprocessor. IL(off2).
The external resistor has to be selected according to the Because Is(OFF) may significantly increase if Vout is pulled
following requirements: high (up to several mA), the pull-up resistor RPU should
1) no false open load indication when load is connected: be connected to a supply that is switched OFF when the
in this case we have to avoid VOUT to be higher than module is in standby.
VOlmin; this results in the following condition The values of VOLmin, VOLmax and IL(off2) are available in
VOUT=(VPU/(RL+RPU))RL<VOlmin. the Electrical Characteristics section.
V batt. VPU
VCC
RPU
DRIVER
INPUT + IL(off2)
LOGIC
OUT
+
R
-
STATUS
VOL
RL
GROUND
10/31
VN750 / VN750S / VN750PT / VN750-B5
2.5
6
Off state
Vin=3.25V
2 Vcc=36V
5
Vin=Vout=0V
1.5
4
1
3
0.5
2
0
-0.5 1
-1 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (ºC) Tc (ºC)
7.8
Iin=1mA
7.6 0.04
7.4 Vstat=5V
7.2 0.03
6.8 0.02
6.6
6.4 0.01
6.2
6 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (°C) Tc (°C)
7.8
0.5 Istat=1mA
7.6
Istat=1.6mA
7.4
0.4
7.2
0.3 7
6.8
0.2
6.6
6.4
0.1
6.2
0 6
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (ºC) Tc (°C)
11/31
VN750 / VN750S / VN750PT / VN750-B5
110
120 Iout=2A
Iout=2A 100
Vcc=8V; 13V; 36V Tc= 150°C
100 90
80
80
Tc= 125°C
70
60
60
40 50
Tc= 25°C
40
20 Tc= - 40°C
30
0 20
-50 -25 0 25 50 75 100 125 150 175 5 10 15 20 25 30 35 40
Tc (ºC) Vcc (V)
200
3.4
Vcc=13V
180
Vin=5V
3.2
160
140 3
120
2.8
100
80 2.6
60
2.4
40
2.2
20
0 2
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (ºC) Tc (ºC)
2.6 1.4
1.3
2.4
1.2
2.2
1.1
2
1
1.8
0.9
1.6
0.8
1.4
0.7
1.2 0.6
1 0.5
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (ºC) Tc (ºC)
12/31
VN750 / VN750S / VN750PT / VN750-B5
48 4.5
46 Vin=0V
4
44
3.5
42
40 3
38
2.5
36
2
34
1.5
32
30 1
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (°C) Tc (ºC)
900 450
Vcc=13V Vcc=13V
800 400
Rl=6.5Ohm Rl=6.5Ohm
700 350
600 300
500 250
400 200
300 150
200 100
100 50
0 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (ºC) Tc (ºC)
Ilim Vs T case
Ilim (A)
20
18
Vcc=13V
16
14
12
10
0
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
13/31
1
VN750 / VN750S / VN750PT / VN750-B5
ILMAX (A)
100
10
A
B
C
1
0.1 1 10 100
L(mH)
A = Single Pulse at TJstart=150ºC
B= Repetitive pulse at T Jstart=100ºC
C= Repetitive Pulse at T Jstart=125ºC
Conditions:
VCC=13.5V
Values are generated with R L=0Ω
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves B and C.
VIN, IL
Demagnetization Demagnetization Demagnetization
14/31
VN750 / VN750S / VN750PT / VN750-B5
ILMAX (A)
100
10
1
0.1 1 10 100
L(mH)
A = Single Pulse at TJstart=150ºC
B= Repetitive pulse at T Jstart=100ºC
C= Repetitive Pulse at T Jstart=125ºC
Conditions:
VCC=13.5V
Values are generated with R L=0Ω
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves B and C.
VIN, IL
Demagnetization Demagnetization Demagnetization
15/31
VN750 / VN750S / VN750PT / VN750-B5
SO-8 PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: 0.14cm2, 0.8cm2, 2cm2).
110
105
100
95
90
85
80
75
70
0 0.5 1 1.5 2 2.5
PCB Cu heatsink area (cm^2)
16/31
VN750 / VN750S / VN750PT / VN750-B5
P2PAK PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: 0.97cm2, 8cm2).
RTHj_amb (°C/W)
55
Tj-Tamb=50°C
50
45
40
35
30
0 2 4 6 8 10
PCB Cu heatsink area (cm^2)
17/31
VN750 / VN750S / VN750PT / VN750-B5
PPAK PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: 0.44cm2, 8cm2).
RTHj_amb (ºC/W)
90
80
70
60
50
40
30
20
10
0
0 2 4 6 8 10
PCB Cu heatsink area (cm^2)
18/31
VN750 / VN750S / VN750PT / VN750-B5
ZTH (°C/W)
1000
0.5 cm2
100
2 cm2
10
0.1
0.01
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
19/31
VN750 / VN750S / VN750PT / VN750-B5
ZTH (°C/W)
1000
6 cm2
10
0.1
0.0001 0.001 0.01 0.1 1 10 100 1000
T ime (s)
20/31
VN750 / VN750S / VN750PT / VN750-B5
ZTH (°C/W)
1000
100
0.5 cm 2
6 cm2
10
0.1
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
21/31
VN750 / VN750S / VN750PT / VN750-B5
mm. inch
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 1.75 0.068
a1 0.1 0.25 0.003 0.009
a2 1.65 0.064
a3 0.65 0.85 0.025 0.033
b 0.35 0.48 0.013 0.018
b1 0.19 0.25 0.007 0.010
C 0.25 0.5 0.010 0.019
c1 45 (typ.)
D 4.8 5 0.188 0.196
E 5.8 6.2 0.228 0.244
e 1.27 0.050
e3 3.81 0.150
F 3.8 4 0.14 0.157
L 0.4 1.27 0.015 0.050
M 0.6 0.023
S 8 (max.)
L1 0.8 1.2 0.031 0.047
22/31
VN750 / VN750S / VN750PT / VN750-B5
23/31
VN750 / VN750S / VN750PT / VN750-B5
P010R
24/31
VN750 / VN750S / VN750PT / VN750-B5
P032T1
25/31
VN750 / VN750S / VN750PT / VN750-B5
SO-8 TUBE SHIPMENT (no suffix)
B
C Base Q.ty 100
Bulk Q.ty 2000
Tube length (± 0.5) 532
A A 3.2
B 6
C (± 0.1) 0.6
REEL DIMENSIONS
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 12.4
N (min) 60
T (max) 18.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 12
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 5.5
Compartment Depth K (max) 4.5
Hole Spacing P1 (± 0.1) 2
Start
26/31
VN750 / VN750S / VN750PT / VN750-B5
Base Q.ty 50
Bulk Q.ty 1000
B Tube length (± 0.5) 532
A 18
B 33.1
C (± 0.1) 1
C
All dimensions are in mm.
27/31
VN750 / VN750S / VN750PT / VN750-B5
P2PAK TUBE SHIPMENT (no suffix)
Base Q.ty 50
Bulk Q.ty 1000
B Tube length (± 0.5) 532
A 18
C
B 33.1
C (± 0.1) 1
REEL DIMENSIONS
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 24.4
N (min) 60
T (max) 30.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 16
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 11.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2
Start
28/31
VN750 / VN750S / VN750PT / VN750-B5
PPAK SUGGESTED PAD LAYOUT PPAK TUBE SHIPMENT (no suffix)
A
C
Base Q.ty 75
Bulk Q.ty 3000
Tube length (± 0.5) 532
A 6
B B 21.3
C (± 0.1) 0.6
3 1.8 6.7
All dimensions are in mm.
REEL DIMENSIONS
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 16.4
N (min) 60
T (max) 22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 16
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 7.5
Compartment Depth K (max) 2.75
Hole Spacing P1 (± 0.1) 2
Start
29/31
1
VN750 / VN750S / VN750PT / VN750-B5
REVISION HISTORY
Date Revision Description of Changes
- Current and voltage convention update (page 2).
- “Configuration diagram (top view) & suggested connections for unused and n.c.
pins” insertion (page 2).
May 2004 1 - 6cm2 Cu condition insertion in Thermal Data table (page 3).
- VCC - OUTPUT DIODE section update (page 4).
- Revision History table insertion (page 30).
- Disclaimers update (page 31).
30/31
1
VN750 / VN750S / VN750PT / VN750-B5
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
31/31