ECE467: Introduction To VLSI Design: Lecture-7
ECE467: Introduction To VLSI Design: Lecture-7
Lecture-7
Masud H. Chowdhury
Electrical and Computer Engineering
University of Illinois at Chicago
CMOS Logic
Defining Characteristics:
• These logic circuits are built using both NMOS and
VDD
PMOS devices
• Consist of a pull-down network and a pull-up network
• Normally pull-down network is made of NMOS
Pull-up
device and pull-up network is made of PMOS device network Iup
Selection of Device:
• Pull-down network: NMOS
– NMOS is a very good pull-down device
• Pull-up network: PMOS
– PMOS is very good pull-up device
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Static CMOS Inverter
Definition:
• The inverter is the most fundamental logic gate that performs the Boolean
operation of inversion on a single input variable
Symbol and Logic Function:
Truth Table
A B
A B= A 0 1
1 0
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Different Types of Inverter
Ratioless Inverter:
• Static CMOS Inverter
Ratioed Inverter:
• Resistive Load Inverter
• Active Load Inverter
– Enhancement-type Saturated Load MOS Inverter
– Depletion Load NMOS Inverter
– Pseudo NMOS Inverter
Ratioless Logic Circuit: The logic values do not depend on the relative size or the ratio
of the transistors in PUN and PDN
Ratioed Logic Circuit: The logic values depend on the relative size or the ratio of the
transistors in PUN and PDN
– In complimentary MOS design the purpose of PUN and PDN is to provide a
conditional connection between either VDD or GND
– In CMOS technique PUN is implemented with PMOS devices and PDN is
implemented using NMOS devices.
– In case of ratioed design technique, PDN is consists of NMOS transistors
that realize logic function, and the entire PUN is replaced by a single
unconditional load device that pulls up the output for high output as shown
in figure in next slide
4
Ratioed Logic
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Resistive Load Inverter
• In the resistive load inverter the PDN is consist of an
NMOS transistor and the load consists of a simple
VDD
linear resistor RL.
• Operating Regions:
Resistive
• Here Vin = VGSn and Vout = VDSn
Load RL
Vin < VTn ……………………… Cut-off
Vin – VTn < Vout (or VDS)…….. Saturation
out Vin – VTn > Vout (or VDS)………Linear
In • Need to Determine:
PDN • VOH, VOL, VM, VIL and VIH
• Static Power Consumption
• Propagation delay
VSS
• Disadvantage of Resistive Load Inverter
• RL >>> Rtr to make VOL close to zero
• Area sacrifice due to large RL.
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• Static power consumption
Resistive Load Inverter
•
VDD
• When Vin = 0, NMOS is OFF and Vout is raised to
VDD through RL
• When Vin = Vdd, NMOS driver is ON. Resistive
• There is a race condition between NMOS and RL. Load RL
NMOS tries to discharge the output capacitance,
while current through RL tries to charge the output
capacitance
out
• The value of RL is made much higher than Rtrn to
obtain a low output voltage
In
• By ensuring RL >> Rtrn a low output voltage is PDN
obtained. But it is not equal to zero
VOL = RPN
t pL = 0.69 RLCL
RPN + RL
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Active Load Inverters
VDD VDD VDD
• The simple resistive load inverter is not suitable for most VLSI design due to
large area occupied by the load resistor.
• Another class of inverter was introduced with MOSFET transistors as active
load device.
• The main advantage of using MOSFET as the load device is that silicon area
occupied by the transistors is smaller than that occupied by a comparable
resistive load. 8
Pseudo NMOS Inverter
• In pseudo NMOS design technique a permanently grounded PMOS load is used
instead of a linear resistor. VDD
Advantages:
• Lower transistor count PMOS
load
• Smaller area compared to resistive load and CMOS design L I
Vout = VDSn
Disadvantage: D I
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Derivation of Different Characteristics of
Ratioed Inverter
• Need to Determine:
• VOH, VOL, VM, VIL and VIH
• Noise Margins
• Static Power Consumption
• Propagation delay
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Exam Question
1. True/False: Write ‘T’ for true and ‘F’ for false on the right side of
each question (1x10=10 points)
a. Static power is due to the short circuit between Vdd and GND
during switching
2. Briefly Answer the Following Questions (2x5=10 points)
a. Why in a Pseudo NMOS Inverter the resistance of load device
must be much higher than the resistance of the PDN transistor?
b. Keeping all other parameter unchanged if you double both the
channel length (L) and gate oxide thickness (tox) of a transistor
what will be the change in current ID?
3. Three Problems Similar to HW1 and HW2 (3x20 = 60)
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