Department of Education

National Capital Region

Division of City Schools – Manila
TECHNOLOGY AND LIVELIHOOD EDUCATION
Senior High School – Regular School

Electronic Products
Assembly and Servicing
Grade 11
MOUNT and
SOLDER
1st Semester – Midterm
Week 7 Module 5

Most Essential Learning Competency 3 – Mount and Solder Electronic

Components (TLE_IAEPAS9- 12AEP-IVc-f-29)
3.1. Soldering Principles
3.2. Soldering Technology
3.3. Mounting of Components
3.4. Soldering and Desoldering Procedures

1
 How to use this Module?

Before you start answering the module, I want you to set aside other tasks that
will disturb you while enjoying the lessons. Read the simple instructions below to
successfully enjoy the objectives of this kit. Have fun!

1. Follow carefully all the contents and instructions indicated in every page of
this module.
2. Write on your notebook or any writing pad the concepts about the lessons.
Writing enhances learning, that is important to develop and keep in mind.
3. Perform all the provided activities in the module.
4. Let your facilitator/guardian assess your answers.
5. Analyze conceptually the posttest and apply what you have learned.
6. Enjoy studying!

Parts of the Module

• Expectations - These are what you will be able to know after completing
the lessons in the module.
• Pre-test - This will measure your prior knowledge and the concepts to be
mastered throughout the lesson.
• Looking Back to your Lesson - This section will measure what learnings
and skills did you understand from the previous lesson.
• Brief Introduction- This section will give you an overview of the lesson.
• Activities - This is a set of activities you will perform with a partner.
• Remember - This section summarizes the concepts and applications of the
lessons.
• Check your Understanding- It will verify how you learned from the lesson.
• Post-test - This will measure how much you have learned from the entire
module.
2
 3. Mount and Solder Electronic Components

EXPECTATIONS:
1. Identify the principles to produce a good solder joint.
2. Discuss soldering tips to make a good solder joint.
3. Explain the different soldering technology.
4. Discuss the safety precaution in soldering.
5. Identify electrostatic discharge protection.
6. Explain the kinds of mounting components.
7. Apply the proper procedure in mounting components.
8. Identify the procedures in hot iron soldering/desoldering and hot air
soldering/desoldering.
9. Describe the step by step procedure in hot iron soldering and hot air
soldering.

PRE-TEST

Direction: True or False. Write true of the statement is correct and false
if the statement is wrong.

____1. Ensure the electronic components are clean and free from
grease.
____2. Ensure the temperature of the solder when making the joint is
correct.
____3. Ensure the heat is applied to the joint for the correct amount
of time
____4. Ensure the correct amount of solder is used.

3
Direction: Read the questions carefully and encircle the letter of the
correct answer.

5. It is heating materials or joints to be soldered and applying solder

onto heated joints to ensure permanent electrical connection.
A. Hand Soldering
B. Lead-free Soldering
C. Reflow Soldering
D. Wave Soldering

6. In what soldering technology is the molten solder is pumped up to the

level of the printed circuit board in the form of waves.
A. Hand Soldering
B. Lead-free Soldering
C. Reflow Soldering
D. Wave Soldering

7. It is a process in which a solder paste is used to temporarily attach

one or several electrical components.
A. Hand Soldering
B. Lead-free Soldering
C. Reflow Soldering
D. Wave Soldering

8. What does RoHS means?

A. Restriction of Hazardous Substance
B. Restricted Oil and Hazardous Substance
C. Restricted Operation in House System
D. Rescue Operation and Health System

9. What does ESD means?

A. Electro-standard display
B. Electrolytic discharge
C. Electronic system display
D. Electrostatic discharge

10. Identify the what kind of mounting is shown below.

4
SEQUENCING
Soldering Technique (use numbers 1 – 5)
___ Feed a little solder onto the joint. It should flow smoothly onto the lead
and track to form a volcano shape. Apply the solder to the joint, not to
the soldering iron.
___ Hold the soldering iron like a pen, near the base of the handle. Imagine
you are going to write your name. Remember to never touch the hot
element or tip.
___ Inspect the joint closely. It should look shiny and have a volcano shape.
If not, you will need to reheat it and feed in a little more solder. This
time ensure that both the lead and track are heated fully before
applying solder.
___ Touch the soldering iron on the joint to be made. Make sure it touches
both the component’s lead and the track. Hold the tip there for a few
seconds (2-3 seconds).
___ Remove the solder, then the iron while keeping the joint still. Allow the
joint a few seconds to cool before you move the circuit board.

Desoldering using desoldering pump (use numbers 1 – 6)

___ Then press the button on the pump to release the plunger and suck the
molten solder into the tool.
___ The pump will need emptying occasionally by unscrewing the nozzle.

___ Set the pump by pushing the spring-loaded plunger down until it locks.

___ Wait a second or two for the solder to melt.

___ Apply both the pump nozzle and the tip of your soldering iron to the
joint.

___ Repeat if necessary to remove as much solder as possible.

5
 3.1. Soldering Principles

EXPECTATIONS:
1. Identify the principles to produce a good solder joint.
2. Discuss soldering tips to make a good solder joint.

LOOKING BACK TO YOUR LESSON

Direction: Arrange the steps in chronological order. Write 1, 2, 3, 4

and 5 on the space provided.
Setting-up of Mini Drill
____ Test the rotation of the unit if it is well aligned. If not, align it following
step 1 and 2.
____ Loosen the chuck by using a long metal tool and change the drill bit.
This is done in a counter clockwise movement.
____ Turn the long metal tool clockwise to tighten the jaw of the unit. Be
sure that the drill bit is well secured on the chuck.
____ Before inserting the 12 volts adaptor, you should turn of the unit.
____ Insert the drill bit 0.8mm diameter in size and attach it to the chuck
of the unit.

BRIEF INTRODUCTION

In this lesson, we shall be identifying the soldering principles to

produce a good solder joint. Also, we will discuss some soldering tips in
achieving a good solder joint. This will help you improve your soldering
technique/skills and be able to achieve a good solder joint.

6
TOPIC: SOLDERING PRINCIPLES

LEARNING CONTENT:

SOLDERING PRINCIPLES

The four key principles to producing a good solder joint are:

1. Ensure the joint surfaces are clean and free from grease.
2. Ensure the temperature of the solder when making the joint is
correct.
3. Ensure the heat is applied to the joint for the correct amount of time
4. Ensure the correct amount of solder is used.

SOLDERING TIPS

The following tips provide a quick guideline on how to make proper joints.
A. Cleanliness
All parts, including the soldering iron tip, must be clean and free
from grease, oxidation and contamination. Solder does not flow over
contaminated areas. Ensure all components have shiny leads and
the PCB has clean traces.

B. Tinning
Tinning the tip of the soldering iron allows solder to flow on the tip
more quickly rather than the soldering iron itself. Tinning involves
adding a few millimeters of solder to the tip and then wiping and
rotating the tip on the damp sponge to reveal a shiny surface on the
tip of the soldering iron: a thin layer of solder will coat or tin the tip
of the soldering iron.
When done soldering, tinning the iron is required to protect the tip
form oxidation thereby dramatically increasing its life.

C. Temperature
Ensure that both the component leads, and the PCB’s copper layer
are heated at the same time. This will ensure that each surface is
relatively close temperature resulting in a good joint. If there is a
temperature difference between the two surfaces, the solder will form
a “dry” joint. Too much heat causes excessive “sputtering” of flux
and too little does not melt the solder in a timely manner.

7
 D. Duration
The duration of the iron in contact with the component and PCB is
dependent on the size of the joint and your soldering iron
temperature.

E. Adequate solder coverage

If too little solder is applied, the joint will not make a secure
connection and will cause erratic behavior. However, if too much
solder is applied, the joint may bridge with adjacent joints resulting
in electrical shorts. It is how much solder to apply comes with
experience.

F. Handling
Most modern electronics systems contain static-sensitive devices.
Use proper handling procedures to minimize the likelihood of
damage: grounding wrist straps, grounded soldering iron, grounding
mats, etc.

Other Useful Tips

Soldering is something that needs to be practiced. These tips should help
you become successful so you can stop practicing and get down to some
serious building.
1. Use heat sinks. Heat sinks are a must for the leads of sensitive
components such as IC’s and transistors. If you don’t have a clip on
heat sink, then a pair of pliers is a good substitute.

2. Keep the iron tip clean. A clean iron tip means better heat
conduction and a better joint. Use a wet sponge to clean the tip
between joints.

3. Double check joints. It is a good idea to check all solder joints with
an ohmmeter after they are cooled. If the joint measures any more
than a few tenths of an ohm, then it may be a good idea to resolder
it.

4. Use the proper iron. Remember that bigger joints will take longer
to heat up with an 30W iron than with a 150W iron. While 30W is
good for printed circuit boards and the like, higher wattages are great
when soldering to a heavy metal chassis.

8
 5. Solder small parts first. Solder resistors, jumper leads, diodes and
any other small parts before you solder larger parts like capacitors
and transistors. This makes assembly much easier.

Summary of How to Make the Perfect Solder Joint

1. All parts must be clean and free from dirt and grease.
2. Try to secure the work firmly.
3. “Tin” the iron tip with a small amount of solder. Do this immediately,
with new tips being used for the first time.
4. Clean the tip of the hot soldering iron on a damp sponge.
5. Many people then add a tiny amoung of fresh solder to the cleansed
tip.
6. Heat all parts of the joint with theiron for under a second or so.
7. Continue heating, then apply sufficient solder only, to form an
adequate joint.
8. Remove and return the iron safely to its stand.
9. It only takes two or three seconds at most, ot solder the averange
PCB joint.
10. Do not move parts until the solder has cooled.

REFERENCES

Tan, Michael Q., Gantalao, Fred T., Lasala, Rommel M. Simple Electronics
pages 279-280; Andes Mountain Printers: 2004
TESDA – Training Regulation for Electronic Products Assembly and
Servicing NC II
Meralco Foundation Inc. - Practical Electronics pages 79-80

9
WORKSHEET 1
Direction: Read and answer the following guide questions.

Name: ______________________ Gr. & Sec: ________Score: ____________

Teacher: ____________________ School: ___________Date: _____________

1. Explain the principles to produce a good solder joint.

2. How to make a good solder?

REMEMBER

Soldering principles and soldering tips are use as a guidelines to

make a good solder. This will help you improve your soldering
technique/skills and be able to achieve a good solder joint.

10
 CHECK YOUR UNDERSTANDING

Enumeration:
List the four key principles in producing a good solder joint.
1.
2.
3.
4.

Discuss two soldering tips.

1.

2.

3.2. Soldering Technology

EXPECTATIONS:
1. Explain the different soldering technology.
2. Discuss the safety precaution in soldering.
3. Identify electrostatic discharge protection.

11
 LOOKING BACK TO YOUR LESSON

Direction: True or False. Write true of the statement is correct and false if
the statement is wrong.

____1. Heat sinks are a must for the leads of sensitive components
such as IC’s and transistors.

____2. A clean iron handle means better heat conduction and a better
joint.

____3. If too little solder is applied, the joint will not make a secure
connection and will cause erratic behavior.

____4. The duration of the iron in contact with the component and
PCB is dependent on the size of the joint and your soldering iron
temperature.

____5. Cleaning the tip of the soldering iron allows solder to flow on
the tip more quickly rather than the soldering iron itself.

BRIEF INTRODUCTION

In this section, you will learn the different soldering technology that
will help you to understand the different soldering technology. And you
will also learn the safety precaution in soldering and the use of electrostatic
discharge protection that give you knowledge about safety while working.

TOPIC: SOLDERING TECHNOLOGY

LEARNING CONTENT:
REFLOW SOLDERING
Reflow soldering is a process in which a solder paste (a sticky mixture of
powdered solder and flux) is used to temporarily attach one or several
electrical components to their contact pads, after which the entire
assembly is subjected to controlled heat, which melts the solder,

12
permanently connecting the joint. Heating may be accomplished by passing
the assembly through a reflow oven or under an infrared lamp or by
soldering individual joints with a hot air pencil
The goal of the reflow process is to melt the solder and heat the
adjoining surfaces, without overheating and damaging the electrical
components. In the conventional reflow soldering process, there are usually
four stages, called "zones", each having a distinct thermal profile: preheat,
thermal soak (often shortened to just soak), reflow, and cooling.

Figure 1 – Process of
Reflow Soldering
Machine

WAVE SOLDERING
In wave soldering (sometimes referred to as fountain soldering), the
molten solder is pumped up to the level of the printed circuit board in the
form of waves. This method of soldering, as compared with dip soldering,
permits more favorable angles of solder insertion, provides better control of
the duration of solder contact and reduces the amount of heat applied to
other parts of the assembly.

Figure 2 – Wave Soldering

13
Wave soldering is also a large-scale soldering process by which electronic
components are soldered to a printed circuit board (PCB) to form an
electronic assembly. The name is derived from the use of waves of molten
solder to attach metal components to the PCB. The process uses a tank to
hold a quantity of molten solder; the components are inserted into or
placed on the PCB and the loaded PCB is passed across a pumped wave or
waterfall of solder. The solder wets the exposed metallic areas of the board
(those not protected with solder mask, a protective coating that prevents
the solder from bridging between connections), creating a reliable
mechanical and electrical connection. The process is much faster and can
create a higher quality product than manual soldering of components.

HAND SOLDERING

Hand soldering is heating materials or

joints to be soldered and applying
solder onto heated joints to ensure
permanent electrical connection. The
reason for soldering connections is that
it makes a good bond between the
jointed metals, covering the joint
completely to prevent oxidation. The
coating of solder provides protection for Figure 3 – Hand Soldering
practically an indefinite period of time.
The trick in hand soldering is to heat the joint, not the solder. When the
joint is hot enough to melt the solder, the solder flows smoothly to fill all
the cracks, forming a shiny cover without any air spaces. Do not move the
joint until the solder has set, which takes only a few seconds.
Either a soldering iron or a soldering gun can be used, rated at 30 to
100 watts. The gun is convenient for intermittent operation, since it heat
instantaneously when you press the trigger. The small pencil iron of
30watts is helpful for soldering small connections where excessive heat can
cause damage. This precaution is particularly important when working the
PC boards, where too much heat can soften the plastic form and loosen the
printed wiring.

RoHS and LEAD-FREE SOLDERING

The Restriction of Hazardous Substances (RoHS) is easily the most

important piece of legislation affecting electronic products today, especially
as it relates to engineering and supply chain impacts. The law requires
that certain products placed on the market after July 1, 2006 must not
contain certain substances in excess of the allowable amount. Table 1
summarizes these substances and the allowable levels of each.

14
 Maximum Concentration Value
Restricted substance (MCV)

Lead and its compounds 0.1% by weight

Mercury and its compounds 0.1% by weight

Hexavalent chromimum and its 0.1% by weight

compounds
Cadmiun and its compounds 0.01% by weight

Polybrominated biphnyls (PBBs) 0.1% by weight

Polybrminated diphenyl ethers 0.1% by weight

(PBDEs)
Table 1 Maximum concentration values for RoHS-restricted
substances

In the US, manufacturers may receive tax benefits by reducing the

use of lead-based solder. Lead-free solders in commercial use may contain
tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other
metals. Most lead-free replacements for conventional 60/40 and 63/37 Sn-
Pb solder have melting points from 5 to 20 °C higher,[6] though there are
also solders with much lower melting points.

Lead-free solder generally melts at a higher temperature and doesn't wet

as quickly to metals. Manufacturers generally recommend setting soldering
iron temperatures between 700-800 °F for lead-free instead of 600-700 °F
for tin-lead soldering.

CLEANING

Tip Maintenance and Cleanup

1. After soldering, cool off iron and clean the tip with soft brush
2. Solder nuggets should not be left on PCB or inside the equipment as
they might short the equipment.
3. Inspect work carefully and use soft brush to whisk away bits of
solder.

Keep the soldering iron tip clean. Wipe often on a wet sponge or cloth; then
apply solder to it to give the entire tip a wet look. This “tinning” process
will protect the tip and enable you to make good connections. When the
solder tends to “ball” or not stick to the tip, the tip need to be cleaned and
re-tinned. Use rosin core, radio-type solder (60:40 or 50:50 tin-lead
content) for all soldering.

15
SAFETY

Safety is everyone’s responsibility. It is the job of everybody in and out

of class to exercise proper precautions to ensure that no one is injured and
no equipment is damaged.

Safety Precautions

1. Do not permit hot solder to be sprayed into the air by shaking a hot
gun or iron or a hot soldered joint.
2. Always grasp a soldering gun or iron by its handle. Do not grasp the
bare metal part.
3. Do not permit the metal part of a soldering gun or iron to rest on
combustible materials. An iron should always rest on a soldering
stand or rack.

ELECTROSTATIC DISCHARGE (ESD) PROTECTION

Static charge is a form of electricity at rest. It can be generated by

simple friction that is, rubbing two objects together.

A simple method of generating a static charge is to rub a plastic

ballpen case on a nylon cloth. Once generated, the static electricity will
remain on the ballpen for as long as it is not placed on any other charged
materials.

If ever the ballpen comes in contact with another object, the static
electricity can move to or from the ballpen to equalize the charge between
the two objects. The transfer of static electricity from any of the two objects
is called electro-static discharge.

ESD wrist straps are also called conductive wrist straps or bands.
They usually made of elastic cloth but contain conductive strands that
touch your skin and so bleed of any static electricity on your body. Some
straps are made of conductive rubber. The wire attached to the strap
contains a large value resistor usually one mega ohm (1,000,000 ohms)
allows nay charge on your body to be slowly transferred to an electric fan
ground point. This build in resistor also limits the amount of current to a
safe level in case the other end of the wire touches a power supply voltage.

REFERENCES

Enriquez, Marcelo T. Electronics Technology IV page 71; Souvenir

Publications, Inc.: 2003

Tan, Michael Q., Gantalao, Fred T., Lasala, Rommel M. Simple

Electronics; Andes Mountain Printers: 2004

16
REFERENCES

Gates, Earl – Introduction to Basic Electricity and Electronics Technology

pages 81-82

Bath, Jasbir – Lead-Free Soldering page 421-425

https://en.wikipedia.org/wiki/Reflow_soldering

https://en.wikipedia.org/wiki/Wave_soldering

Figure 1
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Figure 2
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Figure 3
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WORKSHEET 1
Direction: Read and anwer the question.

Name: ______________________ Gr. & Sec: ________Score: ____________

Teacher: ____________________ School: ___________Date: _____________

1. Differentiate the soldering technology and explain each.

17
 REMEMBER

 Reflow soldering is a process in which a solder paste (a sticky mixture

of powdered solder and flux) is used to temporarily attach one or several
electrical components to their contact pads, after which the entire
assembly is subjected to controlled heat, which melts the solder,
permanently connecting the joint.

 Wave soldering is also a large-scale soldering process by which

electronic components are soldered to a printed circuit board (PCB) to
form an electronic assembly.
 Hand soldering is heating materials or joints to be soldered and applying
solder onto heated joints to ensure permanent electrical connection.
 ESD wrist straps are also called conductive wrist straps or bands. They
usually made of elastic cloth but contain conductive strands that touch
your skin and so bleed of any static electricity on your body.

CHECK YOUR UNDERSTANDING

Direction: Read the questions carefully and encircle the letter of the
correct answer.

1. It is heating materials or joints to be soldered and applying solder

onto heated joints to ensure permanent electrical connection.
E. Hand Soldering
F. Lead-free Soldering
G. Reflow Soldering
H. Wave Soldering
2. In what soldering technology is the molten solder is pumped up to the
level of the printed circuit board in the form of waves.
E. Hand Soldering
F. Lead-free Soldering
G. Reflow Soldering
H. Wave Soldering
3. It is a process in which a solder paste is used to temporarily attach
one or several electrical components.
11. Hand Soldering
12. Lead-free Soldering
13. Reflow Soldering
14. Wave Soldering

18
 4. What does RoHS means?
A. Restriction of Hazardous Substance
B. Restricted Oil and Hazardous Substance
C. Restricted Operation in House System
D. Rescue Operation and Health System

5. What does ESD means?

A. Electro-standard display
B. Electrolytic discharge
C. Electronic system display
D. Electrostatic discharge

3.3. Mounting of Components

EXPECTATIONS:
1. Explain the kinds of mounting components.
2. Apply the proper procedure in mounting components.

LOOKING BACK TO YOUR LESSON

Enumeration:
List the four (4) soldering technology.

1.

2.

3.

4.

BRIEF INTRODUCTION

In this section, you will learn the kinds of mounting components and
apply the soldering principles in mounting the components. It will help
you to improve your soldering skills.

19
TOPIC: MOUNTING OF COMPONENTS
LEARNING CONTENT:
SURFACE-MOUNT
Surface mount soldering requires
more experience and skill than
through-hole. It is recommended that
one practice with through-hole prior to
attempting any surface mount
soldering. As the name suggests,
surface mount involves soldering a
component to either the top or the
bottom surface of a PCB. Depending
on the footprint, the pads are usually
a spaced closer together (finer pitch), Figure 4 – Example of Surface-
making the soldering more susceptible Mount Component
to solder bridges.

For soldering surface mounted devices, a solder is available with 62% tin,
36% lead and 2% silver (62/36/2). To prevent lead poisoning, solder
manufacturers now produce solder with a very low lead content or without
lead.
The actual soldering of the joints is similar to the through-hole
method. One difficulty is maintaining the part’s alignment on the PCB
pads. A good technique is outlined here:
a. Align the component on the PCB pads. This can be aided with the
use of tweezers and dental picks.

b. Secure the component to the PCB by applying a small amount of the

pressure onto the top of the component using a small slot
screwdriver. An index finger resting on the end of the screwdriver
provides enough force to secure the device.

c. Solder one of the corner component leads to the PCB pad.

d. Align the remaining pads and solder the opposite corner PCB pad.

e. Solder the remaining pads in a pattern that does not build-up too
much heat in the device.

20
THROUGH-HOLE MOUNT
Most of the soldering done in the
laboratory is through-hole. A through-hole
joint is a type of soldering joint in which the
component joins with the PCB pad through
a physical hole in the board. The following
steps will illustrate how to make a proper Figure 5 – Example of
through-hole solder joint on a PCB. Through-Hole Component

1. Ensure that the printed circuit board and all components are
clean. Cleaning can be achieved with a mild abrasive or the
application of flux.

2. Plug in the soldering iron, turn it on and let it warm up for 2-3
minutes.

3. Wet the soldering station sponge with the water provided in the
lab. Do not wet the sponge in the bathroom or the water fountain.

4. Clean the tip of the soldering iron and tin it with solder.

5. Insert the component into the holes. Ensure that the component
is secure by taping the component or by using a third hand.
Optionally, the component leads can be sided boards, as the flow
of solder to the component side is restricted.

6. Apply the soldering iron tip to one side of joint making contact
with the component lead and the board copper foil, ensuring that
both are heated up to the same temperature.

7. Slowly add a few millimeters of solder to the other side of the joint.
Do not apply solder to the soldering iron tip. If enough heat was
applied to the PCB pad and component wire, the solder will flow
freely onto the joint.

8. Remove the solder when the joint is suitably covered. The goal is
to get the joint to be a “fillet”: a curve.

9. If the PCB is double-sided, the solder should flow through the hole
around the component lead and make a bond on the component
side of the board (opposite to the side that the solder was applied).
If this “wicking” does not occur, the hole may be undersized,
clinching could be blocking the solder’s path or the component
lead is not clean.

10. Remove the soldering iron and allow the joint to cool naturally.

11. Cut the lead of the component, if necessary.

21
Mounting Technique
Horizontal Mounting - Resistor / Diode Lead Angle
Correct Way Incorrect Way
Resistor/Diode leads not properly
The resistor/diode terminal must
mounted to the PCB may result to
be perpendicular to the PCB
bad joints strains.
Resistor / Diode from PCB
Long terminal leads can cause the
component to touch other
components terminal lead that may
Give resistor Proper Ventilation short the two.
Too much close to the PCB can
generate heat faster.
Vertical Mounting – Resistor Terminal Lead Angle
Proper bending of a resistor / diode
in vertical position. Use long nose
plier to bend.

Non-Polarized Capacitor
Capacitor Terminal Lead Angle
Correct Way Incorrect Way
The capacitor lead is properly The capacitor lead diagonally
mounted on the PCB on the right mounted on the PCB.
angle.
Capacitor Distance from PCB
Too close to the PCB can cause
Give capacitor proper ventilation terminal lead breakage if the
capacitor is accidentally moved.
Electrolytic Capacitor
Bend the terminal lead using long Long lead from PCB is not advisable
nose plier to insert the terminal (as resistor or any other
lead to the PCB holes if the two components)
holes are not close to each other.

Transistors
Correct Way Incorrect Way
Terminal lead must be straight (90o)
if the PCB holes are exact distance
Ben the terminal lead away from to the terminal of the transistor.
the upper portion of the transistor Do not bend the transistor terminal
body. lead at the upper portion near the
transistor body. It can cause
breakage of the terminal lead.

22
REFERENCES

Simple Electronics by M. Enriquez, F. Gantalao, R. Lasala pages 262-266

Gates, Earl – Introduction to Basic Electricity and Electronics Technology
pages 487

Malvino, Albert Paul - Electronic Principles page 248

Meralco Foundation Inc. - Practical Electronics pages 81-84

Figure 7
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Figure 8
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5.png

WORKSHEET 1

Name: ______________________ Gr. & Sec: ________Score: ____________

Teacher: ____________________ School: ___________Date: _____________

Title: Mounting of Components - Through-Hole Mount

Performance Objective: Given a PCB and electronics Materials, you

should be able to mount the electronic
components properly.

Supplies/Materials : Electronic components and PCB

Equipment/Tools : Long Nose Pliers and Side Cutter

23
WORKSHEET 1 (Continuation)
Direction: After mounting the components properly, take a picture of your
final output and paste it here. Explain how you mount your components
properly.

REMEMBER

Mounting electronic components is important because it will affect

the operation of the device if this is not properly mounted. To mount
components properly, use appropriate tools like long nose plier and side
cutter.

24
 CHECK YOUR UNDERSTANDING

Direction: Differentiate through-hole mounting to surface mounting.

Through-hole Mounting Surface Mounting

3.4. Soldering and Desoldering Procedure

EXPECTATIONS:
1. Identify the procedures in hot iron soldering/desoldering and hot air
soldering/desoldering.
2. Describe the step by step procedure in hot iron soldering and hot air

LOOKING BACK TO YOUR LESSON

Direction: Identify what kind of mounting shows in the picture below.

1. 2.

25
 BRIEF INTRODUCTION

In this section, you will learn the preparation before soldering using
soldering iron and the proper technique in soldering. You will also learn
the proper procedure in desoldering. And the proper procedure in using a
hot air gun in soldering. This knowledge will help you to better
demonstrate the proper technique in soldering and to be able to accomplish
your work efficiently and effectively without causing any damage on the
project.

TOPIC: SOLDERING / DESOLDERING PROCEDURE

LEARNING CONTENT:

HOT IRON SOLDERING PROCEDURE

Preparing the soldering iron
1. Place the soldering iron in its stand before plugging it. The iron will
take a few minutes to reach its operating temperature of about 400
C.
2. Dampen the sponge in the stand. The best way to do this is to lift it
out of the stand and hold it under a cold tap for a moment, then
squeeze to remove excess water. It should be damp, not dripping
wet.
3. Wait a few minutes for the soldering iron to warm up. You can check
if it is ready by trying to melt a little solder on the tip.
4. Wipe the tip of the iron on the damp sponge. This will clean the tip.
5. Melt a little solder on the tip of the iron. This is called tinning and it
will help the heat to flow from the iron’s tip to the joint. It only need
to be done when you plug in the iron and occasionally while soldering
if you need to wipe the tip clean on the sponge.
Soldering Technique
1. Hold the soldering iron like a pen, near the base of the handle.
Imagine you are going to write your name. Remember to never touch
the hot element or tip.

2. Touch the soldering iron on the joint to be made. Make sure it

touches both the component’s lead and the track. Hold the tip there
for a few seconds (2-3 seconds).

3. Feed a little solder onto the joint. It should flow smoothly onto the
lead and track to form a volcano shape. Apply the solder to the joint,
not to the soldering iron.

26
 4. Remove the solder, then the iron while keeping the joint still. Allow
the joint a few seconds to cool before you move the circuit board.
5. Inspect the joint closely. It should look shiny and have a volcano
shape. If not, you will need to reheat it and feed in a little more
solder. This time ensure that both the lead and track are heated
fully before applying solder.
DESOLDERING
At some stage, you will probably need to desolder a joint to remove
or reposition a wire or component. There are two ways to remove the solder
by using desoldering pump and using solder remover wick.

Using a desoldering pump (solder sucker)

The easiest and most common in way in desoldering is the use of
desoldering pump.
1. Set the pump by pushing the spring-loaded plunger down until it
locks.
2. Apply both the pump nozzle and the tip of your soldering iron to the
joint.
3. Wait a second or two for the solder to melt.
4. Then press the button on the pump to release the plunger and suck
the molten solder into the tool.
5. Repeat if necessary to remove as much solder as possible.
6. The pump will need emptying occasionally by unscrewing the nozzle.

Using solder remover wick (copper braid)

Solder wick has no moving parts. It looks like wick used in oil
lamps except that it is made of copper. To use it, you need to put the
wick over the joint and heat it.
1. Apply both the end of the wick and the tip of your soldering iron to
the joint.
2. As the solder melts, most of it will flow onto the wick, away from the
joint.
3. Remove the wick first then the soldering iron.
4. Cut off and discard the end of the wick coated with solder.

After removing most of the solder from the joint, you may be able to
remove the wire or component lead straight away (allow a few seconds for
it to cool). If the joint does not come apart easily, apply your soldering iron
to melt the remaining traces of solder, at the same time pulling the joint
apart, be careful to avoid burning yourself and to be sure that no
component is damaged during the process.

27
HOT AIR SOLDERING PROCEDURE

1. Apply the solder paste.

Apply the enough quantity of
solder paste and install the SMD
on the PCB.
2. Preheat SMD.
3. Soldering
Heat the lead frame evenly.
4. Cleaning Figure 9 – Actual hot air
soldering tool and accessories
Wash away the flux when soldering
is completed.
Note: While there are merits in soldering by hot air, it is also possible to
cause defects such as solder balls and solder bridges. It is recommended
that conditions of soldering be examined sufficiently.

HOT AIR DESOLDERING PROCEDURE

1. Plug the power cord into the power supply.

After connection, the automatic blowing function will start
sending air through the pipe but the heating element remains cool.
Turn on the power switch.
The power switch may be turned on anytime while the
automatic blowing function is operating. Once the power switch is
turned on, the heating element will begin to warm up.
2. Adjust air flow and temperature
After adjusting the air flow and temperature control, wait for
the temperature to stabilize. It is recommended that the temperature
be adjusted around 300 to 350 C.
For the air flow, set the control knob from 1 to 3 in case of
single nozzle. For other nozzles, set the knob from 4 to 6. Never set
the control knob higher than 6 when using a single nozzle, otherwise,
air will come out from the nozzle connector and can melt the plastic
handle.
3. Place the FP pick-up under the IC lead.
Slip the FP wire under the IC lead. If the width of the IC does
not match the size of the FP pick-up, adjust the width of the wire by
suppressing it.
4. Melt the solder.
Hold the iron so that the nozzle is located directly over but not
touching the IC and allow the hot air to melt the solder. Be careful
not to touch the leads of the IC with the nozzle.
28
 5. Remove the IC.
Once the solder has melted, remove the IC by lifting the FP pick-up.
6. Turn the power switch off.
After the power switch is turned off, the automatic blowing
function begins sending cool air through the pipe in order to cool
both the heating element and the handle. Therefore, do not
disconnect the plug during this cooling process.
7. Remove remaining solder
After removing the IC, remove remaining solder with a wick or
desoldering tool.

Note: For SOP and PLCC, desolder it by using tweezers.

REFERENCES

Enriquez, Marcelo T. Electronics Technology IV page 71; Souvenir

Publications, Inc.: 2003
Tan, Michael Q., Gantalao, Fred T., Lasala, Rommel M. Simple
Electronics; Andes Mountain Printers: 2004
Meralco Foundation Inc. - Practical Electronics pages 79-88

Figure 9
https://www.allaboutcircuits.com/uploads/articles/Ethan_852D+.JPG

WORKSHEET 1
Direction: Perform the soldering procedure indicated ing the worksheet 1
activity sheet.

Name: ______________________ Gr. & Sec: ________Score: ____________

Teacher: ____________________ School: ___________Date: _____________

29
 WORKSHEET 1 – Activity Sheet

Title: Soldering/Desoldering Electronic Components

Performance Objective: Given a soldering/desoldering tools, you

should be able to demonstrate the proper
soldering/desoldering technique following
the step by step procedures in accordance
with established standards and
requirements.

Supplies/Materials : Electronic components, PCB and schematic

diagram

Equipment : Soldering iron, desoldering tool, soldering tool

stand, soldering wire, damp sponge, soldering
flux, side cutter and long nose

Steps/Procedure:

1. Place the soldering iron on the stand before plugging it.

2. Wait a few minutes for the soldering iron to attain its operating
temperature of about 400 C.
3. Wipe the tip of the soldering iron on the wet damp sponge.
4. Melt a little solder (soldering lead – 60/40) on the tip of the iron.
5. Wipe again the tip of the soldering iron on the wet damp sponge.
6. Hold the soldering iron like a pen, near the base of the handle.
7. Touch the soldering iron onto the joint to be soldered. Hold the
tip there for a few seconds (2-3 seconds).
8. Apply a small amount of solder onto the joint.
9. Remove the solder, then the soldering iron, while keeping the joint
in still position.
10. Inspect the joint closely. It should look shiny and in a volcano
shape.
11. If you observe that the joint is incorrect, apply the proper
desoldering technique then resolder.
12. Set the pump by pushing the spring-loaded plunger down until
it locks.

13. Apply both the pump nozzle and the tip of your soldering iron to
the joint.
14. Wait a second or two for the solder to melt.
15. Then press the button on the pump to release the plunger and
suck the molten solder into the tool.

30
 16. Repeat if necessary to remove as much solder as possible.

17. The pump will need emptying occasionally by unscrewing the

nozzle
18. Repeat the procedure 7-11 for all the electronic components.

Assessment Method:

Demonstration Assessment using Performance Criteria Checklist

Performance Criteria Checklist

CRITERIA
YES NO
Did you….

1. Use the following tools properly

• Soldering iron
• Desoldering tool

2. Handle the soldering iron correctly

3. Solder the joint correctly making a volcano shape

solder

4. Check the quality of soldered joint

5. Desolder the joint efficiently and not parts damage

6. Perform visual check on all electronic products after

soldering
7. Follow the step by step procedure in accordance with
the established standards and requirements
8. Comply with the OHS standards while working

9. Accomplish the task with the given time

31
 REMEMBER

Knowing the soldering and desoldering procedure helps you to better

demonstrate the proper technique in soldering and to be able to accomplish
your work efficiently and effectively without causing any damage on the
project.

CHECK YOUR UNDERSTANDING

SEQUENCING:
Arrange the following steps in chronological order. Write the correct
number (1-5) on the space provided.

Preparing the soldering iron

___ Place the soldering iron in its stand before plugging it. The iron will
take a few minutes to reach its operating temperature of about 400 C.
___ Wait a few minutes for the soldering iron to warm up. You can check
if it is ready by trying to melt a little solder on the tip.
___ Melt a little solder on the tip of the iron. This is called tinning and it
will help the heat to flow from the iron’s tip to the joint. It only need to
be done when you plug in the iron and occasionally while soldering if
you need to wipe the tip clean on the sponge.
___ Dampen the sponge in the stand. The best way to do this is to lift it
out of the stand and hold it under a cold tap for a moment, then squeeze
to remove excess water. It should be damp, not dripping wet.
___ Wipe the tip of the iron on the damp sponge. This will clean the tip.

32
 POST TEST

Enumeration:
List the four key principles in producing a good solder joint.
1.
2.
3.
4.

Discuss two soldering tips.

1.

2.

Direction: Read the questions carefully and encircle the letter of the
correct answer.
1. It is heating materials or joints to be soldered and applying solder onto
heated joints to ensure permanent electrical connection.
A. Hand Soldering
B. Lead-free Soldering
C. Reflow Soldering
D. Wave Soldering

2. It is a process in which a solder paste is used to temporarily attach

one or several electrical components.
A. Hand Soldering
B. Lead-free Soldering
C. Reflow Soldering
D. Wave Soldering

33
 3. What does ESD means?
A. Electro-standard display
B. Electrolytic discharge
C. Electronic system display
D. Electrostatic discharge
4. In what soldering technology is the molten solder is pumped up to
the level of the printed circuit board in the form of waves.

A. Hand Soldering
B. Lead-free Soldering
C. Reflow Soldering
D. Wave Soldering

5. What does RoHS means?

A. Restriction of Hazardous Substance
B. Restricted Oil and Hazardous Substance
C. Restricted Operation in House System
D. Rescue Operation and Health System

Direction: Identify what kind of mounting shows in the picture below.

1.

2.

34
SEQUENCING
Soldering Technique
___ Feed a little solder onto the joint. It should flow smoothly onto the lead
and track to form a volcano shape. Apply the solder to the joint, not to
the soldering iron.
___ Hold the soldering iron like a pen, near the base of the handle. Imagine
you are going to write your name. Remember to never touch the hot
element or tip.
___ Inspect the joint closely. It should look shiny and have a volcano shape.
If not, you will need to reheat it and feed in a little more solder. This time
ensure that both the lead and track are heated fully before applying
solder.
___ Touch the soldering iron on the joint to be made. Make sure it touches
both the component’s lead and the track. Hold the tip there for a few
seconds (2-3 seconds).
___ Remove the solder, then the iron while keeping the joint still. Allow the
joint a few seconds to cool before you move the circuit board.

Desoldering using desoldering pump (use numbers 1 – 6)

___ Then press the button on the pump to release the plunger and suck the
molten solder into the tool.
___ The pump will need emptying occasionally by unscrewing the nozzle.
___ Set the pump by pushing the spring-loaded plunger down until it locks.
___ Wait a second or two for the solder to melt.
___ Apply both the pump nozzle and the tip of your soldering iron to the joint.
___ Repeat if necessary to remove as much solder as possible.

Desoldering using solder remover wick (use numbers 1-4)

___ Cut off and discard the end of the wick coated with solder.
___ Remove the wick first then the soldering iron.
___ As the solder melts, most of it will flow onto the wick, away from the joint.
___ Apply both the end of the wick and the tip of your soldering iron to the
joint.

Hot air soldering procedure (use numbers 1-4)

___ Apply the solder paste.

35
___ Soldering
___ Preheat SMD.
___ Cleaning

Hot air desoldering procedure (use numbers 1-7)

___ Remove the IC.

___ Remove remaining solder
___ Plug the power cord into the power supply.
___ Place the FP pick-up under the IC lead.
___ Adjust air flow and temperature
___ Melt the solder.
___ Turn the power switch off.

REFLECTIVE LEARNING SHEET

I learned that…
___________________________________________________________________
_________________________________________________________________________
_________________________________________________________________________
_________________________________________________________________________
_________________________________________________________________________
_________________________________________________________________________
_________________________________________________________________________
_________________________________________________________________________
_________________________________________________________________________
_________________________________________________________________________
_________________________________________________________________________
_________________________________________________________________________
_________________________________________________________________________
_________________________________________________________________________
_________________________________________________________________________

36
 LET’S DO THE CHECKING

ANSWER KEY

PRE-TEST
1. F 6. D
2. T 7. C
3. T 8. A
4. T 9. D
5. A 10. Surface Mounting

SEQUENCING
Soldering technique
3
1
5
2
4

Desoldering using desoldering pump

4
6
1
3
2
5

POST TEST
Enumeration
1. Ensure the joint surfaces are clean and free from grease.
2. Ensure the temperature of the solder when making the joint is
correct.
3. Ensure the heat is applied to the joint for the correct amount of time
4. Ensure the correct amount of solder is used.
Soldering tips (Any 2)

1. Cleanliness
All parts, including the soldering iron tip, must be clean and free from
grease, oxidation and contamination. Solder does not flow over
contaminated areas. Ensure all components have shiny leads and the
PCB has clean traces.
37
2. Tinning
Tinning the tip of the soldering iron allows solder to flow on the t more
quickly rather than the soldering iron itself. Tinning involves adding a
few millimeters of solder to the tip and then wiping and rotating the tip
on the damp sponge to reveal a shiny surface on the tip of the soldering
iron: a thin layer of solder will coat or tin the tip of the soldering iron.
When done soldering, tinning the iron is required to protect the tip form
oxidation thereby dramatically increasing its life.
3. Temperature
Ensure that both the component leads and the PCB’s copper layer are
heated at the same time. This will ensure that each surface is relatively
close temperature resulting in a good joint. If there is a temperature
difference between the two surfaces, the solder will form a “dry” joint.
Too much heat causes excessive “sputtering” of flux and too little does
not melt the solder in a timely manner.
4. Duration
The duration of the iron in contact with the component and PCB is
dependent on the size of the joint and your soldering iron temperature.
5. Adequate solder coverage
If too little solder is applied, the joint will not make a secure connection
and will cause erratic behavior. However, if too much solder is applied,
the joint may bridge with adjacent joints resulting in electrical shorts.
It is how much solder to apply comes with experience.

Multiple Choice
1. A
2. C
3. D
4. D
5. A

Identification
1. Surface mounting
2. Through-hole mounting

Sequencing
Soldering technique
3
1
5
2
4

38
Desoldering using desoldering pump
4
6
1
3
2
5

Desoldering using solder remover wick

4
3
2
1

Hot air soldering procedure

1
3
2
4

Hot air desoldering procedure

5
7
1
3
2
4
6

39
 ACKNOWLEDGEMENT

This module was outlined based on the Most Essential Learning

Competencies (MELC) for S.Y. 2020-2021, the K to 12 Basic Education
Curriculum Guide, Learning Continuity Plan (LCP) for EPAS and Training
Regulation of TESDA for Electronic Products Assembly and Servicing NC II.

DEVELOPMENT TEAM OF THE MODULE

Writer: Catherine P. Pablo,ERVHS/SHS EPAS Coordinator

Editor: Dr. Ariel D. Tosio, EPS – TLE-TE / VOC

Reviewer/Validator: Rufo G. Malla, ERVHS/ HT-VI

Illustrator: Catherine P. Pablo,ERVHS/SHS EPAS Coordinator

Layout Artist: Catherine P. Pablo,ERVHS/SHS EPAS Coordinator

Management Team: Malcolm S. Gamma, Regional Director

Genia V. Santos, CLMD Chief

Dennis M. Mendoza, Regional EPS in charge of

LMS and Regional ADM Coordinator

Maria Magdalena M. Lim, CESO V, SDS

Aida H. Rondilla, Chief-CID

Lucky S. Carpio, Division EPS In-charge of LRMS

and Division ADM Coordinator

40