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Datashee t

AS5215
Programmable 360º Magnetic Angle Encoder with Buffered SINE &
COSINE Output Signals
1 General Description 2 Key Features
The AS5215 is a redundant, contactless rotary encoder sensor for Contactless angular position encoding
accurate angular measurement over a full turn of 360º and over an High precision analog output

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extended ambient temperature range of -40ºC to +150ºC.
Buffered Sine and Cosine signals
Based on an integrated Hall element array, the angular position of a
simple two-pole magnet is translated into analog output voltages. SSI Interface

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The angle information is provided by means of buffered sine and Low power mode
cosine voltages. This approach gives maximum flexibility in system
design, as it can be directly integrated into existing architectures and Two programmable output modes: Differential or Single ended

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optimized for various applications in terms of speed and accuracy. Wide magnetic field input range: 20 – 80 mT
With two independent dies in one package, the device offers true Wide temperature range: -40ºC to +150ºC

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redundancy. Usually the bottom die, which is exposed to slightly less
Fully automotive qualified to AEC-Q100, grade 0
magnetic field is employed for plausibility check.
An SSI Interface is implemented for signal path configuration as well Thin punched 32-pin QFN (7x7mm) package

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te G
as a one time programmable register block (OTP), which allows the
customer to adjust the signal path gain to adjust for different 3 Applications
mechanical constraints and magnetic field.
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The AS5215 is ideal for Electronic Power Steering systems and
nt general purpose for automotive or industrial applications in
microcontroller-based systems.
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Figure 1. AS5215 Block Diagram

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PROG OTP Register AS5215

Digital Part

CS POWER VDD
DCLK SSI Interface MANAGEMENT
VSS
DIO
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BUFFER Stage
SINP/SINN
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SINN/SINP/CM_SIN
BUFFER Stage COSP/COSN
Hall Array
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&
Frontend
COSN/COSP/CM_COS
Amplifier

Note: This Block Diagram presents only one die.

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AS5215
Datasheet - C o n t e n t s

Contents
1 General Description .................................................................................................................................................................. 1
2 Key Features............................................................................................................................................................................. 1
3 Applications............................................................................................................................................................................... 1
4 Pin Assignments ....................................................................................................................................................................... 3
4.1 Pin Descriptions.................................................................................................................................................................................... 3

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5 Absolute Maximum Ratings ...................................................................................................................................................... 5
6 Electrical Characteristics........................................................................................................................................................... 6
6.1 Timing Characteristics ..........................................................................................................................................................................

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7
7 Detailed Description.................................................................................................................................................................. 8
7.1 Magnet Diameter and Vertical Distance ............................................................................................................................................... 8

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7.1.1 The Linear Range ........................................................................................................................................................................ 8
7.1.2 Magnet Thickness...................................................................................................................................................................... 11

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7.1.3 Axial Distance (Airgap) .............................................................................................................................................................. 12
7.1.4 Angle Error vs. Radial and Axial Misalignment.......................................................................................................................... 12
7.1.5 Mounting the Magnet ................................................................................................................................................................. 12

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7.1.6
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Summary ................................................................................................................................................................................... 14
8 Application Information ........................................................................................................................................................... 15
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8.1 Sleep Mode ........................................................................................................................................................................................ 15
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8.2 SSI Interface....................................................................................................................................................................................... 15
8.3 Device Communication / Programming .............................................................................................................................................. 16
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8.4 Waveform – Digital Interface at Normal Operation Mode................................................................................................................... 18

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8.5 Waveform – Digital Interface at Extended Mode ................................................................................................................................ 18

8.6 Waveform – Digital Interface at Analog Readback of the Zener Diodes ............................................................................................ 19
8.7 EasyZapp OTP Content ..................................................................................................................................................................... 19
8.8 Analog Sin/Cos Outputs with External Interpolator ............................................................................................................................ 20
8.9 OTP Programming and Verification .................................................................................................................................................... 21
9 Package Drawings and Markings ........................................................................................................................................... 23
10 Ordering Information............................................................................................................................................................. 25
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AS5215
Datasheet - P i n A s s i g n m e n t s

4 Pin Assignments
Figure 2. Pin Assignments (Top View)

DCLK_2
DCLK_1
VDD_2
VDD_1
CS_2
CS_1

NC
NC

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32 31 30 29 28 27 26 25
DIO_1 1 24 NC

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DIO_2 2 23 NC
TC_1 3 22 NC

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TC_2 4 21 NC
AS5215
A_TST_1 5 20 NC

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A_TST_2 6 19 NC
7

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PROG_1 te G 18 COSN_2 / COSP_2 / CM_COS_2
PROG_2 8 17 COSP_2 / COSN_2
9 10 11 12 13 14 15 16
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SINP_1 / SINN_1
VSS_1
VSS_2

SINP_2 / SINN_2

COSP_1 / COSN_1
COSN_1 / COSP_1 / CM_COS_1
SINN_1 / SINP_1 / CM_SIN_1

SINN_2 / SINP_2 / CM_SIN_2

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4.1 Pin Descriptions

Table 1. Pin Descriptions
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Pin Name Pin Number Description

DIO_1 1
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Data I/O for digital interface

DIO_2 2
TC_1 3
Test coil
TC_2 4
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A_TST_1 5
Analog test pin
A_TST_2 6
PROG_1 7
OTP Programming Pad
PROG_2 8

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AS5215
Datasheet - P i n A s s i g n m e n t s

Table 1. Pin Descriptions

Pin Name Pin Number Description
VSS_1 9
Supply ground
VSS_2 10
SINP_1 / SINN_1 11 Switchable buffered analog output
SINN_1 / SINP_1 / CM_SIN_1 12 Switchable buffered analog or common mode output

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SINP_2 / SINN_2 13 Switchable buffered analog output
SINN_2 / SINP_2 / CM_SIN_2 14 Switchable buffered analog or common mode output
COSP_1 / COSN_1 15 Switchable buffered analog output

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COSN_1 / COSP_1 / CM_COS_1 16 Switchable buffered analog or common mode output
COSP_2 / COSN_2 17 Switchable buffered analog output

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COSN_2 / COSP_2 / CM_COS_2 18 Switchable buffered analog or common mode output
NC 19

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NC 20
NC 21

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NC
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22
------
NC 23
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NC
nt
24
NC 25
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NC 26
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VDD_1 27
Digital + analog supply
VDD_2 28
DCLK_1 29
Clock input for digital interface
DCLK_2 30
CS_1 31
Clock input for digital interface
CS_2 32
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AS5215
Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter Min Max Units Comments
Electrical Parameters

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Supply voltage (VDD) -0.3 7 V
Input pin voltage (V_in) -0.3 VDD+0.3 V

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Input current (latchup immunity), I_scr -100 100 mA Norm: EIA/JESD78 Class II Level A
Electrostatic Discharge

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Electrostatic discharge (ESD) ±2 kV Norm: JESD22-A114E
Continous Power Dissipation

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Total power dissipation (Ptot) 275 mW
Package thermal resistance (Θ_JA) 27 ºC/W Velocity =0; Multi Layer PCB; Jedec Standard Testboard
Temperature Ranges and Storage Conditions

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Storage temperature (T_strg)
te G -65 150 ºC
Norm: IPC/JEDEC J-STD-020.
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The reflow peak soldering temperature (body temperature)
Package body temperature (T_body)
nt 260 ºC
specified is in accordance with IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification for Non-
Hermetic Solid State Surface Mount Devices”.
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The lead finish for Pb-free leaded packages is matte tin

(100% Sn).
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Humidity non-condensing 5 85 %
Moisture Sensitive Level (MSL) 3 Represents a maximum floor time of 168h
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AS5215
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s

6 Electrical Characteristics
Unless otherwise noted all in this specification defined tolerances of parameters are assured over the whole operation conditions range and also
over lifetime.
Table 3. Operating Conditions
Symbol Parameter Condition Min Typ Max Unit
VDD Positive Supply Voltage 4.5 5.5 V
VSS Negative Supply Voltage 0.0 0.0 V

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T_amb Ambient temperature -40 150 ºC

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Table 4. DC/AC Characteristics for Digital Inputs and Outputs
Symbol Parameter Condition Min Typ Max Unit

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CMOS Input
V_IH High level Input voltage 0.7 * VDD V
V_IL Low level Input Voltage 0.3 * VDD V

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I_LEAK Input Leakage Current 1 µA
CMOS Output

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V_OH
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High level Output voltage 4 mA VDD - 0.5 V
V_OL Low level Output Voltage 4 mA VSS + 0.4 V
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C_L Capacitive Load 35 pF
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t_slew Slew Rate 30 ns
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t_delay Time Rise Fall 15 ns

CMOS Output Tristate
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I_OZ Tristate Leakage Current 1 µA

Table 5. Magnetic Input Specification

Symbol Parameter Condition Min Typ Max Unit
Two pole cylindrical magnet, diametrically magnetized:
dMAG Diameter 4 6 mm
Bpp Magnetic input field amplitude 200 – 800 Gauss 20 50 80 mt
frot Rotational speed Max 30000 RPM 0 500 Hz
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Table 6. Electrical System Specifications

Symbol Parameter Condition Min Typ Max Unit
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Max value derived at maximum I_H (Hall Bias

IDD Current Consumption Current) 20 28 mA
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Note: For single die only.

tpower_on Power up time 1.275 ms
tprop Propagation delay -40 to 150ºC 18 22 30 µs
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M Magnetic Sensitivity 1G = 0.1 mT 1 6 mV/G

Vss+ Vdd-
Vout Analog output range V
0.25 0.5
SF=SF25C
- (AP1_1/ Amplitude ratio tracking accuracy -40 to 150ºC -1 +1 %
AP2_1) over temperature

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AS5215
Datasheet - E l e c t r i c a l C h a r a c t e r i s t i c s

Table 6. Electrical System Specifications

Symbol Parameter Condition Min Typ Max Unit
SF=AP1_ Amplitude ratio mismatch at room -2 2 %
1/AP2_1 temperature
Voffset1 0.294 0.3 0.306 V / VDD
DC Offset Ratiometric to VDD
Voffset2 0.49 0.5 0.51 V / VDD
DCoffdrift DC Offset Drift -40 to 150ºC -50 +50 µV/ºC

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THD Total Harmonic Distortion 0.2 %
SR Slew Rate 1 V/µs

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CLOAD Capacitive Load 1000 pF

6.1 Timing Characteristics

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Table 7. Timing Characteristics
Symbol Parameter Condition Min Typ Max Unit

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t1_3 Chip select to positive edge of DCLK 30 - ns
t2_3 Chip select to drive bus externally 0 - ns

st
t3
Setup time command bit
te G 30 - ns
Data valid to positive edge of DCLK
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Hold time command bit
t4 15 - ns
nt
Data valid after positive edge of DCLK
Float time DCLK/
t5 - ns
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Positive edge of DCLK for last command bit to bus float 2+0
Bus driving time
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DCLK/
t6 Positive edge of DCLK for last command bit to bus - ns
2+0
drive
Data valid time DCLK/ DCLK/
t7 ns
Positive edge of DCLK to bus valid 2+0 2+30
Hold time data bit DCLK/
t8 2+0 - ns
Data valid after positive edge of DCLK
Hold time chip select DCLK/
t9_3 - ns
Positive edge DCLK to negative edge of chip select 2+0
Bus floating time
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t10_3 - 30 ns
Negative edge of chip select to float bus
Setup time data bit at write access
t11 30 - ns
Data valid to positive edge of DCLK
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Hold time data bit at write access

t12 15 - ns
Data valid after positive edge of DCLK
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Bus floating time

t13_3 - 30 ns
Negative edge of chip select to float bus

Remark: The digital interface will be reset during the low phase of the CS signal.
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AS5215
Datasheet - D e t a i l e d D e s c r i p t i o n

7 Detailed Description
The AS5215 is a redundant rotary encoder sensor front end. Based on an integrated Hall element array, the angular position of a simple two-pole
magnet is translated into analog output voltages. The angle information is provided by means of sine and cosine voltages. This approach gives
maximum flexibility in system design, as it can be directly integrated into existing architectures and optimized for various applications in terms of
speed and accuracy.
With two independent dies in one package, the device offers true redundancy. Usually the bottom die, which is exposed to slightly less magnetic
field is employed for plausibility check.

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An SSI (SPI standard) protocol is implemented for internal test access to the different circuit blocks and for signal path configuration.
A One Time Programmable register block (OTP) allows the customer to adjust the signal path gain to adjust for different mechanical constraints
and magnetic field strengths. Furthermore, for internal use, the test mode can be enabled and the system oscillator is trimmable, DC offset of the

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output signal can be set to either 1.5V or 2.5V. A unique chip ID is stored to ensure traceability.
For operating point control, a band gap circuit is implemented together with a central bias block to distribute all reference bias currents for the
analog signal conditioning. The digital signal part is based on a 2MHz system, CLK derived via. divider from a 4MHz system oscillator.

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Figure 3. Typical Arrangement of AS5215 and Magnet

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7.1 Magnet Diameter and Vertical Distance

Note: Following is just an abstract taken from the elaborate application note on the Magnet.
For more detailed information, please visit our homepage www.austriamicrosystems.com → Magnetic Rotary Encoders → Magnet
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Application Notes

7.1.1 The Linear Range

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The Hall elements used in the AS5000-series sensor ICs are sensitive to the magnetic field component Bz, which is the magnetic field vertical to
the chip surface. Figure 4 shows a 3-dimensional graph of the Bz field across the surface of a 6mm diameter, cylindrical NdFeB N35H magnet at
an axial distance of 1mm between magnet and IC.
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The highest magnetic field occurs at the north and south poles, which are located close to the edge of the magnet, at ~2.8mm radius (see Figure
5). Following the poles towards the center of the magnet, the Bz field decreases very linearly within a radius of ~1.6mm. This linear range is the
operating range of the magnet with respect to the Hall sensor array on the chip. For best performance, the Hall elements should always be within
this linear range.

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AS5215
Datasheet - D e t a i l e d D e s c r i p t i o n

Figure 4. 3D-Graph of Vertical Magnetic Field of a 6mm Cylindrical Magnet

BZ; 6mm magnet @ Z=1mm

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area of X- Y-misalignment from cen-
ter: ±0.5mm

circle of Hall elements on chip

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Bz [mT]
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Y -displacement [mm]

X -displacement [mm]
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As shown in Figure 5 (grey zone), the Hall elements are located on the chip at a circle with a radius of 1mm. Since the difference between two
opposite Hall sensors is measured, there will be no difference in signal amplitude when the magnet is perfectly centered or if the magnet is
misaligned in any direction as long as all Hall elements stay within the linear range.

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Datasheet - D e t a i l e d D e s c r i p t i o n

For the 6mm magnet (shown in Figure 5), the linear range has a radius of 1.6mm, hence this magnet allows a radial misalignment of 0.5mm
(1.6mm linear range radius; 1mm Hall array radius). Consequently, the larger the linear range, the more radial misalignment can be tolerated. By
contrast, the slope of the linear range decreases with increasing magnet diameter, as the poles are further apart. A smaller slope results in a
smaller differential signal, which means that the magnet must be moved closer to the IC (smaller airgap) or the amplification gain must be
increased, which leads to a poorer signal-to-noise ratio. More noise results in more jitter at the angle output. A good compromise is a magnet
diameter in the range of 5…8mm.

Small Diameter Magnet (<6mm) Large Diameter Magnet (>6mm)

+ stronger differential signal =

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+ wider linear range =
good signal / noise ratio,
larger horizontal misalignment area
larger airgaps
- weaker differential signal =

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- shorter linear range =
poorer signal / noise ratio,
smaller horizontal misalignment area
smaller airgaps

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Figure 5. Vertical Magnetic Field Across the Center of a Cylindrical Magnet

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st
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Bz [mT]
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Hall elements (side view)

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X -displacement [mm]
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AS5215
Datasheet - D e t a i l e d D e s c r i p t i o n

7.1.2 Magnet Thickness

Figure 6 shows the relationship of the peak amplitude in a rotating system (essentially the magnetic field strength of the Bz field component) in
relation to the thickness of the magnet. The X-axis shows the ratio of magnet thickness (or height) [h] to magnet diameter [d] and the Y-axis
shows the relative peak amplitude with reference to the recommended magnet (d=6mm, h=2.5mm). This results in an h/d ratio of 0.42.

Figure 6. Relationship of Peak Amplitude vs. Magnet Thickness

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Bz amplitude vs. magnet thickness
of a cylindrical diametric magnet with 6mm diameter

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160%

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140%
Relative peak amplitude [%]

120%

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100%
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80%
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60%
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d= 6mm x h= 2.5mm ref. magnet:

40%
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h/d = 0.42
Rel. amplitude = 100%
20%

0%
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8
thickness to diameter [h/d] ratio
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As the graph in Figure 6 shows, the amplitude drops significantly at h/d ratios below this value and remains relatively flat at ratios above 1.3.
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Therefore, the recommended thickness of 2.5mm (at 6mm diameter) should be considered as the low limit with regards to magnet thickness.
It is possible to get 40% or more signal amplitude by using thicker magnets. However, the gain in signal amplitude becomes less significant for h/
d ratios >~1.3. Therefore, the recommended magnet thickness for a 6mm diameter magnet is between 2.5 and ~8 mm.
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AS5215
Datasheet - D e t a i l e d D e s c r i p t i o n

7.1.3 Axial Distance (Airgap)

Figure 7. Sinusoidal Magnetic Field Generated by the Rotating Magnet

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vertical
field

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0 360º

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The recommended magnetic field, measured at the chip surface on a radius equal to the Hall sensor array radius (typ 1mm) should be within a

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certain range. This range lies between 45 and 75mT or between 20 and 80mT, depending on the encoder product.
Linear position sensors are more sensitive as they use weaker magnets. The allowed magnetic range lies typically between 5 and 60mT.
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7.1.4 Angle Error vs. Radial and Axial Misalignment
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The angle error is the deviation of the actual angle vs. the angle measured by the encoder. There are several factors in the chip itself that
contribute to this error, mainly offset and gain matching of the amplifiers in the analog signal path. On the other hand, there is the nonlinearity of
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the signals coming from the Hall sensors, caused by misalignment of the magnet and imperfections in the magnetic material.
Ideally, the Hall sensor signals should be sinusoidal, with equal peak amplitude of each signal. This can be maintained, as long as all Hall
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elements are within the linear range of the magnetic field Bz (see Figure 5).

7.1.5 Mounting the Magnet

Generally, for on-axis rotation angle measurement, the magnet must be mounted centered over the IC package. However, the material of the
shaft into which the magnet is mounted, is also of big importance.
Magnetic materials in the vicinity of the magnet will distort or weaken the magnetic field being picked up by the Hall elements and cause
additional errors in the angular output of the sensor.

Figure 8. Magnetic Field Lines in Air

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Figure 8 shows the ideal case with the magnet in air. No magnetic materials are anywhere nearby.

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Datasheet - D e t a i l e d D e s c r i p t i o n

Figure 9. Magnetic Field Lines in Plastic or Copper Shaft

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If the magnet is mounted in non-magnetic material, such as plastic or diamagnetic material, such as copper, the magnetic field distribution is not
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disturbed. Even paramagnetic material, such as aluminium may be used. The magnet may be mounted directly in the shaft (see Figure 9).
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Note: Stainless steel may also be used, but some grades are magnetic. Therefore, steel with magnetic grades should be avoided.
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Figure 10. Magnetic Field Lines in Iron Shaft

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If the magnet is mounted in a ferromagnetic material, such as iron, most of the field lines are attracted by the iron and flow inside the metal shaft
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(see Figure 10). The magnet is weakened substantially.

This configuration should be avoided!

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Datasheet - D e t a i l e d D e s c r i p t i o n

Figure 11. Magnetic Field Lines with Spacer Between Magnet and Iron Shaft

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If the magnet has to be mounted inside a magnetic shaft, a possible solution is to place a non-magnetic spacer between shaft and magnet, as
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shown in Figure 11. While the magnetic field is rather distorted towards the shaft, there are still adequate field lines available towards the sensor
IC. The distortion remains reasonably low.
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7.1.6 Summary
Small diameter magnets (<6mm Ø) have a shorter linear range and allow less lateral misalignment. The steeper slope allows larger axial
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distances.
Large diameter magnets (>6 mm Ø) have a wider linear range and allow a wider lateral misalignment. The flatter slope requires shorter axial
distances.
The linear range decreases with airgap; Best performance is achieved at shorter airgaps.
The ideal vertical distance range can be determined by using magnetic range indicators provided by the encoder ICs. These indicators are
named MagInc, MagDec, MagRngn, or similar, depending on product.
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AS5215
Datasheet - A p p l i c a t i o n I n f o r m a t i o n

8 Application Information
8.1 Sleep Mode
The target is to provide the possibility to reduce the total current consumption. No output signal will be provided when the IC is in sleep mode.
Enabling or disabling sleep mode is done by sending the SLEEP or WAKEUP commands via. the SSI interface. Analog blocks are powered
down with respect to fast wake up time.

8.2 SSI Interface

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The setup for the device is handled by the digital interface. Each communication starts with the rising edge of the chip select signal. The
synchronization between the internal free running analog clock oscillator and the external used digital clock source for the digital interface is
done in a way that the digital clock frequency can vary in a wide range.

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Table 8. SSI Interface Pin Description

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Port Symbol Function
Indicates the start of a new access cycle to the device
Chip select CS
CS = LO → reset of the digital interface

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DCLK DCLK Clock source for the communication over the digital interface
Command and data information over one single line
Bidirectional data input output DIO

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te G The first bit of the command defines a read or write access

Table 9. SSI Interface Parameter Description

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Symbol Parameter Notes Min Typ Max Unit
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f_DCLK Clock frequency at normal operation no limit 5 6 MHz
The nominal value for the clock frequency can
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Clock frequency at easy zap read be derived from a 10MHz oscillator source.
f_EZ_RW no limit 5 6 kHz
write access
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Correct access to the programmable zener

diode block needs a strict timing – the zap pulse
f_EZ_PR Clock frequency at easy zap access is exact one period.
200 - 650 kHz
OG program OTP
The nominal value for the clock frequency can
be derived from a 10MHz oscillator source.
20pF external load allowed.
f_EZ_AR Clock frequency at easy zap analog no limit 156.3 162.5 kHz
B readback The nominal value for the clock frequency can
be derived from a 10MHz oscillator source.
Interface General at normal mode
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Protocol: 5 command bit + 16 data input output

Command 5 bit command: cmd<4:0> ← bit<21:16>
Data 16 bit data: data<15:0> ← bit<15:0>
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Interface General at extended mode

Protocol: 5 command bit + 46 data input output
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Command 5 bit command: cmd<4:0> ← bit<50:46>

Data 34 bit data: data<45:0> ← bit<45:0>
Interface Modes
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Normal read operation mode cmd<4:0> = <00xxx> → 1 DCLK per data bit
Extended read operation mode cmd<4:0> = <01xxx> → 4 DCLK per data bit
Normal write operation mode cmd<4:0> = <10xxx> → 1 DCLK per data bit
Extended write operation mode cmd<4:0> = <11xxx> → 4 DCLK per data bit

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Datasheet - A p p l i c a t i o n I n f o r m a t i o n

8.3 Device Communication / Programming

Table 10. Digital Interface at Normal Mode
# command bin mode 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
WRITE CONFIG
23 10111 write go2sleep gen_rst analog_sig OB_bypassed
1

16 EN_PROG 10000 write 1 0 0 0 1 1 0 0 1 0 1 0 1 1 1 0

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Name Functionality
go2sleep Enter/leave low power mode (no output signals)

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gen_rst Generates global reset
analog_sig Switches the channels to the test bus after the PGA
Disable and bypass output buffer for testing purpose

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OB_bypassed

Table 11. Digital Interface at Extended Mode

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Factory Settings User Settings
# command bin mode
<43: <22:2 <19:1 <17:1
<45:44> <25:23> <13> <12> <11> <10> <9> <8:7> <6> <5:0>
26> 0> 8> 4>

st
31 WRITE OTP 11111 xt write
te G otp test ID 10µbiastrim vref osc
lock_O
TP
n.c.
invert_
channel
cm_sin cm_cos gain
dc_
offset
hall_
bias
on A
lock_O invert_ dc_ hall_
25 PROG_OTP 11001 xt write otp test ID 10µbiastrim vref osc TP n.c. channel cm_sin cm_cos gain offset bias

15 RD_OTP 01111 xt read

nt ID 10µbiastrim vref osc
lock_O
n.c.
invert_
cm_sin cm_cos gain
dc_ hall_
otp test TP channel offset bias
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9 RD_OTP_ANA 01001 xt read

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Remark:
1. Send EN PROG (command 16) in normal mode before accessing the OTP in extended mode.
2. OTP assignment will be defined/updated.

Name Functionality
Otp_test Dummy fuse bit used in production test
ID Part identification
n.c. Not connected
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10µbiastrim 10µ bias current trim bits

vref Bias Block reference voltage trim bits
osc Oscillator trimming bits
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lock_OTP To disable the programming of the factory bits <45…14>

Inverts SIN and COS channel before the PGA for inverted output function (0...SIN/COS, 1...SINN/
invert_channel
COSN)
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cm_sin Common mode voltage output enabled at SINN / CM pin (0...differential, 1...common)
cm_cos Common mode voltage output enabled at COSN / CM pin (0...differential, 1...common)
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gain PGA gain setting (influences overall magnetic sensitivity), 2bit

dc_offset Output DC offset (0…1.5V, 1…2.5V)
Hall_b Hall bias setting (influences overall magnetic sensitivity), 6bit

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AS5215
Datasheet - A p p l i c a t i o n I n f o r m a t i o n

Figure 12. Sensitivity Gain Settings - Relative Sensitivity in %

Magnetic Sensitivity vs. OTP Hall Current & PGA Gain Setting

600

550

500
Relative Sensitivity in %

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450

400
M_PGA_00

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350 M_PGA_01
M_PGA_10
300
M_PGA_11

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250

200

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150

100

st
0 10
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Hall Current OTP setting (6 bits)

40 50 60
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The amplitude of the output signal is programmable via sensitivity (6bit) and/or gain (2bit) settings (see Figure 12).
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Figure 13. Sensitivity Gain Settings - Sensitivity [mV/mT]

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Magnetic Sensitivity vs. OTP Hall Current & PGA Gain Setting

70

60

50
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Sensitivity [mV/mT]

M_PGA_00
40
M_PGA_01
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M_PGA_10
30
M_PGA_11
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20

10
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0
0 10 20 30 40 50 60

Hall Current OTP setting (6 bits)

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AS5215
Datasheet - A p p l i c a t i o n I n f o r m a t i o n

8.4 Waveform – Digital Interface at Normal Operation Mode

Figure 14. Digital Interface at Normal Operation Mode

CMD_PHASE DATA_PHASE

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DCLK
t9_3

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t1_3
CS
t2_3 t5

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DIO CMD4 CMD3 CMD2 CMD1 CMD0 CMD
t3 t7 t10_3
t6 t8
t4
DIO D15 D14 D13 D0 READ

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t11
t13_3
t12
DIO D15 D14 D13 D0 WRITE

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8.5 Waveform – Digital Interface at Extended Mode

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In the extended mode, the digital interface needs four clocks for one data bit. During this time, the device is able to handle internal signals for
special access (e.g. the easy zap interface).

Figure 15. Digital Interface at Extended Mode

CMD_PHASE DATA_PHASE
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DCLK
t1_3 t9_3
CS
t7
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t2_3 t5
DIO CMD4 CMD3 CMD2 CMD1 CMD0 CMD
t3 t6 t8 t10_3
DIO t4
READ
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D45 D44 D0

t11 t12 t13_3

DIO WRITE
D45 D44 D0
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AS5215
Datasheet - A p p l i c a t i o n I n f o r m a t i o n

8.6 Waveform – Digital Interface at Analog Readback of the Zener Diodes

To be sure that all Zener-Diodes are correctly burned, an analog readback mechanism is defined. Perform the ‘READ OTP ANA’ sequence
according to the command table and measure the value of the diode at the end of each phase.

Figure 16. Digital Interface at Analog Readback of Zener Diodes

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CMD_PHASE DATA_PHASE_EXTENDED

EXT D45 EXT D44 EXT D1 EXT D0

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DCLK

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CS

DIO

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CMD4 CMD3 CMD2 CMD1 CMD0

OTP D45 OTP D44 OTP D43 OTP D0

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PROG
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perform analog measurements at PROG
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Table 12. Serial Bit Sequence (16-bit read / write)

Write Command Read / Write Data
C4 C3 C2 C1 C0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

8.7 EasyZapp OTP Content

Each AS5215 die has an integrated 32-bit OTP ROM (Easyzapp) for trimming and configuration purposes. The PROM can be programmed via.
the serial interface. For irreversible programming, an external programming voltage at PROG pin is needed. For security reasons, the factory
trim bits can be locked by a lock bit.
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Name Bit Count OTP Start OTP End Access Comments

Hall Bias 6 0 5 user Sets overall sensitivity
DC offset 1 6 6 user Output DC offset setting
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gain 2 7 8 user Programmable gain amplifier setting

Lock 1 13 13 austriamicrosystems Set in production test
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Inverts SIN and COS channel before the

invert_channel 1 11 11 user
PGA for inverted output function
Common mode voltage output enabled at SINN /
cm_sin 1 10 10 user
CM pin
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Common mode voltage output enabled at COSN /

cm_cos 1 9 9 user
CM pin

Remark: OTP assignment will be defined/updated.

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AS5215
Datasheet - A p p l i c a t i o n I n f o r m a t i o n

8.8 Analog Sin/Cos Outputs with External Interpolator

Figure 17. Sine and Cosine Outputs for External Angle Calculation

+5V
VDD

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100k

VDD VDD PROG

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SINP_1/SINN_1
D A
SINN_1/SINP_1/CM_SIN_1

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SINP_2 / SINN_2

AS5215
Micro
D A
AS5130
SINN_2/SINP_2/CM_SIN_2
Controller 100n
COSP_1/COSN_1

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D A
COSN_1/COSP_1/CM_COS_1

COSP_2/COSN_2

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D A
COSN_2/COSP_2/CM_COS_2
VSS
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VSS
nt
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Notes:
1. We recommend to use a 100k pull-up resistance.
2. Default conditions for unused pins are: DCLK_1/2, CS_1/2, DIO_1/2, TC_1/2, A_TST_1/2, TBO_1/2, TB1_1/2, TB2_1/2,
TB3_1/2 connect to VSS
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The AS5215 provides analog Sine and Cosine outputs (SINP, COSP) of the Hall array front-end for test purposes. These outputs allow the user
to perform the angle calculation by an external ADC + µC, e.g. to compute the angle with a high resolution. The output driver capability is 1mA.
The signal lines should be kept as short as possible, longer lines should be shielded in order to achieve best noise performance.
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Through the programming of one bit, you have the possibility to choose between the analog Sine and Cosine outputs (SINP, COSP) and their
inverted signals (SINN, COSN). Furthermore, by programming the bits <9:10> you can enable the common mode output signals of SIN and
COS.
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The DC bias voltage is 1.5 or 2.5 V.

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AS5215
Datasheet - A p p l i c a t i o n I n f o r m a t i o n

8.9 OTP Programming and Verification

Figure 18. OTP Programming Connection

+5V
VDD

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VDD VDD

Output CS

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AS5215
Output DCLK
AS5130
100n

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I/O DIO
Micro
Controller 8.0 - 8.5V
PROG

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VSS + 10µF 100n VSS
-

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VSS
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nt
maximum
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parasitic cable VSUPPLY

inductance
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L<50nH VDD
Vzapp Vprog
PROG

C1 C2 GND

PROM Cell
100nF 10µF
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For programming of the OTP, an additional voltage has to be applied to the pin PROG. It has to be buffered by a fast 100nF capacitor (ceramic)
and a 10µF capacitor. The information to be programmed is set by command 25. The OTP bits 16 until 45 are used for AMS factory trimming and
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cannot be overwritten.
Symbol Parameter Min Max Unit Note
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VDD Supply Voltage 5 5.5 V

GND Ground level 0 0 V
V_zapp Programming Voltage 8 8.5 V At pin PROG
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T_zapp Temperature 0 85 ºC
f_clk CLK Frequency 100 kHz At pin DCLK

After programming, the programmed OTP bits must be verified in two ways:
By Digital Verification: This is simply done by sending a READ OTP command (#15). The structure of this register is the same as for the OTP
PROG or OTP WRITE commands.

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AS5215
Datasheet - A p p l i c a t i o n I n f o r m a t i o n

By Analog Verification: By switching into Extended Mode and sending an ANALOG OTP READ command (#9), pin PROG becomes an output,
sending an analog voltage with each clock representing a sequence of the bits in the OTP register (starting with D45). A voltage of <500mV
indicates a correctly programmed bit (“1”) while a voltage level between 2V and 3.5V indicates a correctly unprogrammed bit (“0”). Any voltage
level in between indicates incorrect programming.

Figure 19. Analog OTP Verification

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+5V
VDD

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VDD VDD

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Output CS

AS5215

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Output DCLK
AS5130
100n
I/O DIO
Micro

st
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PROG
VSS VSS
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V
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VSS
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AS5215
Datasheet - P a c k a g e D r a w i n g s a n d M a r k i n g s

9 Package Drawings and Markings

The devices are available in a 32-pin QFN (7x7mm) package.

Figure 20. Package Drawings and Dimensions

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18085-002

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YYWWVZZ Symbol Min Nom Max
AS5215OM A 0.80 0.90 1.00
B2P0 A1 0 0.02 0.05

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A2 - 0.65 1.00
A3 0.20 REF

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L 0.50 0.60 0.75
te G Θ 0º - 14º
b 0.23 0.28 0.35
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D 7.00 BSC
nt E 7.00 BSC
e 0.65 BSC
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D1 6.75 BSC
E1 6.75 BSC
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D2 4.70 4.80 4.90

E2 4.70 4.80 4.90
aaa - 0.15 -
bbb - 0.10 -
ccc - 0.10 -
ddd - 0.05 -
eee - 0.08 -
fff - 0.10 -
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N 32
ni
ch

Notes:
1. Dimensions and tolerancing conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters. Angles are in degrees.
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3. Bilateral coplanarity zone applies to the exposed pad as well as the terminal.
4. Radius on terminal is optional.
5. N is the total number of terminals.

Marking: YYWWVZZ.

YY WW V ZZ
Last two digits of the manufacturing year Manufacturing week Plant identifier Assembly traceability code

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AS5215
Datasheet - R e v i s i o n H i s t o r y

Revision History

Revision Date Owner Description

April 29, 2008 Initial revision
1.0
July 03, 2008 Redundancy Coding topic deleted.
Updated Key Features, Table 1 - Pin Descriptions, Figure 1 and
1.1 July 15, 2008
Figure 17.
1.2 July 14, 2009 Updated min, typ, max values for ‘Power up time’ parameter in Table 6.

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Updated the following parameters in Table 6:
- Values and conditions updated for

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1. Propagation delay
July 31, 2009
2. Amplitude ratio tracking accuracy over temperature
1.3
3. DC Offset Drift

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- Deleted the ‘Output Offset’ parameter from the table.
Updated following bits related information on page 16 - invert_channel,
Aug 24, 2009

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cm_sin, cm_cos, gain, dc_offset, Hall_b
apg
1.4 Aug 26, 2009 Inserted Figure 12 and updated Applications and Figure 17.

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1.5 Sept 01, 2009 Inserted Figure 13, Added a note in Revision History.
1.6
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Sept 02, 2009 Deleted ‘Displacement’ parameter from Table 5.
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Hall Array Radius value updated from 1.1mm to 1mm
1.7 Nov 26, 2009
Updated Figure 13
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Dec 11, 2009 Updated values for ‘Magnetic Sensitivity’ parameter in Table 6.
1.8
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Dec 15, 2009 Ordering code updated.

Jan 27, 2010 Updated ‘Interface General at extended mode’ (see Table 9)
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1.9 Feb 10, 2010 Updated values for ‘Power up time’ parameter in Table 6.
Mar 19, 2010 Added ‘Current Consumption’ parameter in Table 6.
Updated Package Drawings and Markings (page 23) and Ordering
1.10 Sep 06, 2010
Information (page 25).
Updated Absolute Maximum Ratings (page 5), Table 4, OTP
1.11 Jun 27, 2011 mub Programming and Verification (page 21), Package Drawings and
Markings (page 23).
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Note: Typos may not be explicitly mentioned under revision history.

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AS5215
Datasheet - O r d e r i n g I n f o r m a t i o n

10 Ordering Information
The devices are available as the standard products shown in Table 13.
Table 13. Ordering Information
Ordering Code Description Delivery Form Package
AS5215OM-HMFP, -HMFM Sine and cosine analog output magnetic rotary encoder Tape & Reel 32-pin QFN (7x7mm)

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Note: All products are RoHS compliant and austriamicrosystems green.
Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect

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Technical Support is available at http://www.austriamicrosystems.com/Technical-Support

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For further information and requests, please contact us mailto: sales@austriamicrosystems.com
or find your local distributor at http://www.austriamicrosystems.com/distributor

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AS5215
Datasheet - C o p y r i g h t s

Copyrights
Copyright © 1997-2011, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®.
All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of
the copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.

Disclaimer

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Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale.
austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding

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the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at
any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for
current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range,

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unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are
specifically not recommended without additional processing by austriamicrosystems AG for each application. For shipments of less than 100
parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location.

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The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However, austriamicrosystems AG shall not
be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use,

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interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of
austriamicrosystems AG rendering of technical or other services.
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Contact Information
Headquarters
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austriamicrosystems AG
Tobelbaderstrasse 30
A-8141 Unterpremstaetten, Austria
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Tel: +43 (0) 3136 500 0

Fax: +43 (0) 3136 525 01
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For Sales Offices, Distributors and Representatives, please visit:

http://www.austriamicrosystems.com/contact
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www.austriamicrosystems.com/AS5215 Revision 1.11 26 - 26

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

ams:
AS5215 AB AS5215 DB AS5215OM-HMFP-500 AS5215OM-HMFP AS5215-QF_EK_DB AS5215-QF_EK_AB