LSP5526
LSP5526
LSP5526
General Description
The DIODES™ LSP5526 is a monolithic synchronous buck regulator. The device integrates 95mΩ MOSFETS
that provide 2A continuous load current over a wide operating input voltage of 4.5V to 23V. Current mode
control provides fast transient response and cycle-by-cycle current limit. An adjustable soft-start prevents
inrush current at turn on.
Features
2A Output Current
Wide 4.5V to 23V Operating Input Range
Integrated Power MOSFET Switches
Output Adjustable from 0.925V to 18V
Up to 96% Efficiency
Programmable Soft-Start
Stable with Low ESR Ceramic Output Capacitors
Fixed 340KHZ Frequency
Cycle by Cycle Over Current Protection
Input Under Voltage Lockout
Package: SOP-8L
Totally Lead-free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Applications
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3)
compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and
Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine
(<1500ppm total Br + Cl) and <1000ppm antimony compounds.
Block Diagram
CURRENT
OVP SENSE 2 VIN
COMP 6
4 GND
EN 7 EN OK
1.2V OVP
IN<4.10V
LOCKOUT
2.5V
COMPARATOR
IN
INTERNAL
REGULATORS
1.5V SHUTDOWN
COMPARATOR
Ordering Information
Packing
Part Number Package Package Code
Qty. Carrier
LSP5526-S8A SOP-8L S8 2,500pcs Tape & Reel
Pin Assignment
SOP-8L
(TOP View)
BS 1 8 SS
VIN 2 7 EN
SW 3 6 COMP
GND 4 5 FB
Pin Descriptions
Bootstrap. This pin acts as the positive rail for the high-side switch’s gate driver.
1 BS
Connect a 0.01uF capacitor between BS and SW.
Input Supply. Bypass this pin to GND with a low ESR capacitor. See Input
2 VIN
Capacitor in the Application Information section.
3 SW Switch Output. Connect this pin to the switching end of the inductor.
4 GND Ground.
Feedback Input. The voltage at this pin is regulated to 0.925V. Connect to the
5 FB
resistor divider between output and ground to set output voltage.
Enable Input. When higher than 2.7V, this pin turns the IC on. When lower than
1.1V, this pin turns the IC off. Output voltage is discharged when the IC is off.
7 EN
This pin should not be left open. Recommend to put a 200KΩ pull-up resistor to
Vin for startup.
Note: Operate over the “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to such conditions for
extended time may still affect the reliability of the device.
EN -0.3 to 8 V
Electrical Characteristics
COMP to Current
GCOMP — — 3.3 — A/V
Limit Transconductance
Input UVLO Threshold Rising UVLO VEN Rising 3.80 4.05 4.40 V
Application Circuit
VOUT
R1
FB
R2
Figure 1 shows the connections for setting the output voltage. Select the proper ratio of the two feedback
resistors R1 and R2 based on the output voltage. Typically, use R2 ≈ 10KΩ and determine R1 from the
following equation:
Table1- Recommended Resistance Values
(1) VOUT R1 R2
1.0V 1.0 KΩ 12 KΩ
1.2V 3.0 KΩ 10 KΩ
1.8V 9.53 KΩ 10 KΩ
2.5V 16.9 KΩ 10 KΩ
3.3V 26.1 KΩ 10 KΩ
5V 44.2 KΩ 10 KΩ
12V 121 KΩ 10 KΩ
Inductor Selection
The inductor maintains a continuous current to the output load. This inductor current has a ripple that is
dependent on the inductance value: higher inductance reduces the peak-to-peak ripple current. The trade off
for high inductance value is the increase in inductor core size and series resistance, and the reduction in
current handling capability. In general, select an inductance value L based on the ripple current requirement:
V OUT ( VIN V OUT )
L (2)
VIN f SW I OUTMAX K RIPPLE
where VIN is the input voltage, VOUT is the output voltage, fSW is the switching frequency, IOUTMAX is the
maximum output current, and KRIPPLE is the ripple factor. Typically, choose KRIPPLE = 30% to correspond
to the peak-to-peak ripple current being 30% of the maximum output current.
With this inductor value, the peak inductor current is IOUT • (1 + KRIPPLE / 2). Make sure that this peak
inductor current is less than the upper switch current limit. Finally, select the inductor core size so that it does
not saturate at the current limit. Typical inductor values for various output voltages are shown in Table 2.
Input Capacitor
The input capacitor needs to be carefully selected to maintain sufficiently low ripple at the supply input of the
converter. A low ESR capacitor is highly recommended. Since large current flows in and out of this capacitor
during switching, its ESR also affects efficiency.
The input capacitance needs to be higher than 10uF. The best choice is the ceramic type; however, low ESR
tantalum or electrolytic types may also be used provided that the RMS ripple current rating is higher than 50%
of the output current. The input capacitor should be placed close to the VIN and GND pins of the IC, with the
shortest traces possible. In the case of tantalum or electrolytic types, they can be further away if a small parallel
0.1uF ceramic capacitor is placed right next to the IC.
Output Capacitor
The output capacitor also needs to have low ESR to keep low output voltage ripple. In the case of ceramic
output capacitors, RESR is very small and does not contribute to the ripple. Therefore, a lower capacitance
value can be used for ceramic capacitors. In the case of tantalum or electrolytic capacitors, the ripple is
dominated by RESR multiplied by the ripple current. In that case, the output capacitor is chosen to have
sufficiently low ESR.
For ceramic output capacitors, typically choose a capacitance of about 22uF. For tantalum or electrolytic
capacitors, choose a capacitor with less than 50mΩ ESR.
Stability Compensation
COMP
CCOMP 1
RCOMP
CCOMP2
The feedback loop of the IC is stabilized by the components at the COMP pin, as shown in Figure 2. The DC
loop gain of the system is determined by the following equation:
0.925V
AVDC AVEA GCOMP (4)
I OUT
The dominant pole P1 is due to CCOMP1:
GEA
f P1 (5)
2AVEA CCOMP1
The second pole P2 is the output pole:
I OUT
f P2 (6)
2VOUT COUT
The first zero Z1 is due to RCOMP and CCOMP1:
1
f Z1 (7)
2RCOMPCCOMP1
And finally, the third pole is due to RCOMP and CCOMP2 (if CCOMP2 is used):
1
fP 3 (8)
2π R COMP C COMP 2
STEP1. Set the crossover frequency at 1/10 of the switching frequency via R COMP:
2VOUT COUT f SW
RCOMP (9)
10G EA GCOMP 0.925V
But limit RCOMP to 10KΩ maximum.
STEP2. Set the zero fZ1 at 1/4 of the crossover frequency. If R COMP is less than 10KΩ, the equation for
CCOMP is:
0.637
CCOMP1 ( F ) (10)
RCOMP fc
STEP3. If the output capacitor’s ESR is high enough to cause a zero at lower than 4 times the crossover
frequency, an additional compensation capacitor CCOMP2 is required. The condition for using C COMP2 is:
RESRCOUT
COUT RESR fs 1 (11)
C OUT R ESRCOUT
C COMP 2 (12)
R COMP
5 - 23 3.3 10 2 none 10
5 - 23 5 10 3.3 none 10
5 - 12 1.0
4.7
5 - 15 1.2
470uF/
5 - 23 1.8 6.3V/ 10 6.8 680
5 - 23 2.5 120mΩ 10
5 - 23 3.3
5 - 23 5
Typical Characteristics
Light Load Operation (No load) Heavy Load Operation (2A Load)
Vin=12V, Iin=8.2 mA, Vout=3,3V Vin=12V, Vout=3,3V
SWITCHES RdsON vs
JUNCTION TEMPERATURE (Vin=12V)
0.16
0.15
SWITCHES RdsON
0.14
0.13
0.12
0.11
0.1
0.09
0.08
10 30 50 70 90 110 130 150 170
JUNCTION TEMPERATURE (C)
Marking Information
SOP-8L
LOGO LSC
LSP5526 Part ID
VYYWWUZ
V YYWW UZ
Internal Code
Date code
YY:Year(09=2009,10=2010,11=2011,12=2012...)
WW:Week(01~53)
Output Voltage
Blank:ADJ
Mechanical Information
Unit : mm
Symbol Min Max
A - 1.75
A1 0.10 0.25
A2 1.25 1.65
b 0.33 0.51
c 0.10 0.26
D 4.70 5.10
E 5.80 6.20
E1 3.70 4.10
e 1.27 REF
L 0.40 1.27
L1 1.04 REF
Gauge Plane 0.25 BSC
θ 0o 8o
SOAK REQUIREMENTS
Accelerated Equivalent5
FLOOR LIFE
Standard eV eV
LEVEL
0.40-0.48 0.30-0.39
CONDITION
TIME TIME TIME
TIME CONDITION CONDITION
(hours) (hours) (hours)
≤30 °C /85% 168 85 °C /85%
1 Unlimited NA NA NA
RH +5/-0 RH
≤30 °C /60% 168 85 °C /60%
2 1 year NA NA NA
RH +5/-0 RH
≤30 °C /60% 6966 30 °C /60% 120 168
2a 4 weeks 60 °C/ 60% RH
RH +5/-0 RH -1/+0 -1/+0
≤30 °C /60% 1926 30 °C /60% 40 52
3 168 hours 60 °C/ 60% RH
RH +5/-0 RH -1/+0 -1/+0
≤30 °C /60% 966 30 °C /60% 20 24
4 72 hours 60 °C/ 60% RH
RH +2/-0 RH +0.5/-0 +0.5/-0
≤30 °C /60% 726 30 °C /60% 15 20
5 48 hours 60 °C/ 60% RH
RH +2/-0 RH +0.5/-0 +0.5/-0
≤30 °C /60% 486 30 °C /60% 10 13
a 24 hours 60 °C/ 60% RH
RH +2/-0 RH +0.5/-0 +0.5/-0
Time on Label ≤30 °C /60% 30 °C /60%
6 TOL NA NA NA
(TOL) RH RH
Note 5: CAUTION - To use the ‘‘accelerated equivalent’’ soak conditions, correlation of damage response (including electrical, after
soak and reflow), should be established with the ‘‘standard’’ soak conditions. Alternatively, if the known activation energy for
moisture diffusion of the package materials is in the range of 0.40 - 0.48 eV or 0.30 - 0.39 eV, the ‘‘accelerated equivalent’’
may be used. Accelerated soak times may vary due to material properties (e.g .mold compound, encapsulant, etc.). JEDEC
document JESD22-A120 provides a method for determining the diffusion coefficient.
Note 6: The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between
bake and bag and includes the maximum time allowed out of the bag at the distributor’s facility. If the actual MET is less than
24 hours the soak time may be reduced. For soak conditions of 30 °C/60% RH, the soak time is reduced by 1 hour for each
hour the MET is less than 24 hours. For soak conditions of 60 °C/60% RH, the soak time is reduced by 1 hour for each 5
hours the MET is less than 24 hours. If the actual MET is greater than 24 hours the soak time must be increased. If soak
conditions are 30 °C/60% RH, the soak time is increased 1 hour for each hour that the actual MET exceeds 24 hours. If soak
conditions are 60 °C/60% RH, the soak time is increased 1 hour for each 5 hours that the actual MET exceeds 24 hours.
Mechanical Data
Moisture Sensitivity: Level 3 per J-STD-020
Terminals: Finish – Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208
Weight: 0.076 grams (Approximate)
IMPORTANT NOTICE
1. DIODES INCORPORATED (Diodes) AND ITS SUBSIDIARIES MAKE NO WARRANTY OF ANY KIND, EXPRESS OR
IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
2. The Information contained herein is for informational purpose only and is provided only to illustrate the operation of Diodes’
products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this
document or any product described herein. This document is intended for skilled and technically trained engineering customers and users
who design with Diodes’ products. Diodes’ products may be used to facilitate safety-related applications; however, in all instances
customers and users are responsible for (a) selecting the appropriate Diodes products for their applications, (b) evaluating the suitability
of Diodes’ products for their intended applications, (c) ensuring their applications, which incorporate Diodes’ products, comply the
applicable legal and regulatory requirements as well as safety and functional-safety related standards, and (d) ensuring they design with
appropriate safeguards (including testing, validation, quality control techniques, redundancy, malfunction prevention, and appropriate
treatment for aging degradation) to minimize the risks associated with their applications.
3. Diodes assumes no liability for any application-related information, support, assistance or feedback that may be provided by
Diodes from time to time. Any customer or user of this document or products described herein will assume all risks and liabilities associated
with such use, and will hold Diodes and all companies whose products are represented herein or on Diodes’ websites, harmless against
all damages and liabilities.
4. Products described herein may be covered by one or more United States, international or foreign patents and pending patent
applications. Product names and markings noted herein may also be covered by one or more United States, international or foreign
trademarks and trademark applications. Diodes does not convey any license under any of its intellectual property rights or the rights of
any third parties (including third parties whose products and services may be described in this document or on Diodes’ website) under
this document.
5. Diodes’ products are provided subject to Diodes’ Standard Terms and Conditions of Sale
(https://www.diodes.com/about/company/terms-and-conditions/terms-and-conditions-of-sales/) or other applicable terms. This document
does not alter or expand the applicable warranties provided by Diodes. Diodes does not warrant or accept any liability whatsoever in
respect of any products purchased through unauthorized sales channel.
6. Diodes’ products and technology may not be used for or incorporated into any products or systems whose manufacture, use or
sale is prohibited under any applicable laws and regulations. Should customers or users use Diodes’ products in contravention of any
applicable laws or regulations, or for any unintended or unauthorized application, customers and users will (a) be solely responsible for
any damages, losses or penalties arising in connection therewith or as a result thereof, and (b) indemnify and hold Diodes and its
representatives and agents harmless against any and all claims, damages, expenses, and attorney fees arising out of, directly or indirectly,
any claim relating to any noncompliance with the applicable laws and regulations, as well as any unintended or unauthorized application.
7. While efforts have been made to ensure the information contained in this document is accurate, complete and current, it may
contain technical inaccuracies, omissions and typographical errors. Diodes does not warrant that information contained in this document
is error-free and Diodes is under no obligation to update or otherwise correct this information. Notwithstanding the foregoing, Diodes
reserves the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this
document and any product described herein. This document is written in English but may be translated into multiple languages for
reference. Only the English version of this document is the final and determinative format released by Diodes.
8. Any unauthorized copying, modification, distribution, transmission, display or other use of this document (or any portion hereof)
is prohibited. Diodes assumes no responsibility for any losses incurred by the customers or users or any third parties arising from any
such unauthorized use.
9. This Notice may be periodically updated with the most recent version available at https://www.diodes.com/about/company/terms-and-
conditions/important-notice
DIODES is a trademark of Diodes Incorporated in the United States and other countries.
The Diodes logo is a registered trademark of Diodes Incorporated in the United States and other countries.
© 2022 Diodes Incorporated. All Rights Reserved.
www.diodes.com