Numericals Part 4
Numericals Part 4
Numericals Part 4
P-region N-region
Xn
NA ND 10th/cm2
Nd+ = 1017 cm 3
X=0 X=L
Given q = 1.6 10 19 coulomb, 0 = 8.85 1014 F/cm, r = 11.7 for
silicon, the value of L in nm is
Q. An abrupt pn junction (located at x = 0) is uniformly doped on both
p and n sides. The width of the depletion region is W and the
electric field variation in the x-direction is E(x). Which of the
following figures represents the electric field profile near the pn
junction.
E(x) (b)
(a)
n-sides n-sides
N-sides P-sides
x
W
E(x)
(c) P-sides
n-sides W (d)
E(x)
x
n-sides W P-sides
x
(0, 0)
p- side n- side
Q. A junction is made between p Si with doping density NA1 = 1015
cm3 and p Si with doping density NA2 = 1017 cm3
Given: Boltzmann constant k = 1.38 10-23 JK1 , electronic
charge q = 1.6 1019 C. Assume 100% acceptor ionization.
At room temperature (T = 300 K), the magnitude of the built-in
potential (in volts, correct to two decimal places) across this
junction will be _____.
Q. A silicon P-N junction is shown in the figure. The doping in the P
region is 5 1016 cm3 and doping in the N region is 10 1016
cm3. The parameters given are
Bulit-in voltage (bi) = 0.8V
Electron charge (q) = 1.6 1019 C
Vaccum permittivity (0) = 8.85 1012 F/m
Relative permittivity of silicon (si) = 12
P N
1.2m 0.2m
Metal Metal
t2 2 teq 2
t1 1
Si Si
Figure I Figure II
Q. A voltage VG is applied across a MOS capacitor with metal gate
and p-type silicon substrate at T = 300 K. The inversion carrier
density (in number of carriers per unit area) for VG = 0.8V is 2 1011
cm2, For VG = 1.3 V, the inversion carrier density is 4 1011 cm2.
What is the value of the inversion carrier density for VG = 1.8 V?
(a) 4.5 1011 cm2
(b) 6.0 1011 cm2
(c) 7.2 1011 cm2
(d) 8.4 1011 cm2
Q. In a MOS capacitor with an oxide layer thickness of 10 nm, the
maximum depletion layer thickness is 100 nm. The permittivities of
the semiconductor and the oxide layer are s and ox respectively.
Assuming s/ ox = 3, the ratio of the maximum capacitance to the
minimum capacitor is _________
Q. An ideal MOS capacitor has boron doping concentration of 1015
cm3 in the substrate. When a gate voltage is applied, a depletion
region of width 0.5 m is formed with a surface (channel) potential
of 0.2V. Given that 0 = 8.854 1014 F/cm and the relative
permittivities of silicon and silicon dioxide are 12 and 4,
respectively, the peak electric field (in V/m) in the oxide region is
Q. If NA = 1016/cm3, then for MOS structure, if semi conductor is of p-
type, then find maximum space charge density?
(a) 2.19 10-4 c/cm2
(b) 1.6 107 c/cm2
(c) 4 103 c/cm2
(d) 4.8 108 c/cm2
Q. An Ideal MOS diode is fabricated on a P-type substrate having a
doping concentration NA= 1016/cm3. If gate oxide thickness
tox = 1000 , calculate the maximum depletion width?
Q. An Ideal MOS capacitor has boron doping of 1015/cm3 in the
substrate. When a gate voltage is applied, a depletion region of
width 0.5 m is formed with a surfaces potential of 0.2V. If r for Si
& SiO2 are 12 & 4 respectively, then find peak electric field in the
oxide region is _______ V/m?
Q. An Ideal MOS diode is fabricated on a p-type Si substrate having a
doping concentration NA = 1016/cm3. What is the work function of
silicon substrate at T = 300oK, Given EG = 1.1eV, = 4.05 V,
operating temperature is at 300oK ________ volts?
Q. Consider MOS structure, NA = 6 1015/cm3, for Aluminium SiO2
junction, m = 3.2 ov & for Si SiO2 junction = 3.25 V, EG = 1.1eV,
if GATE is aluminium, then ms [Metal –semiconductor work
function different for the MOS structure is : ____ volt?
Q. If EG = 1.1eV & NC = NV for a semiconductor. Where it is doped with
1015/cm3 donars, where donar lenth is 0.2 eV below EC, where EF is
0.25 eV below EC @ 300o then find value of effective density states
NC.
(a) 1.97 1018/cm3
(b) 1.359 1019/cm3
(c) 4.82 1018/cm3
(d) 2.85 1019/cm3
Q. If a semiconductor is in thermal equilibrium, where ND (x) =
over the range 0 x 1/, where . Then find the
potential difference between x = 0 & x = 1/ will be