DS75176B, DS75176BT

www.ti.com SNLS381C JULY 1998 REVISED APRIL 2013

DS75176B/DS75176BT Multipoint RS-485/RS-422 Transceivers

Check for Samples: DS75176B, DS75176BT
1

FEATURES
Meets EIA Standard RS485 for Multipoint Bus Transmission and is Compatible with RS-422. Small Outline (SOIC) Package Option Available for Minimum Board Space. 22 ns Driver Propagation Delays. Single +5V Supply. 7V to +12V Bus Common Mode Range Permits 7V Ground Difference Between Devices on the Bus. Thermal Shutdown Protection. High Impedance to Bus with Driver in TRISTATE or with Power Off, Over the Entire Common Mode Range Allows the Unused Devices on the Bus to be Powered Down. Pin Out Compatible with DS3695/A and SN75176A/B. Combined Impedance of a Driver Output and Receiver Input is Less Than One RS485 Unit Load, Allowing up to 32 Transceivers on the Bus. 70 mV Typical Receiver Hysteresis.

DESCRIPTION
The DS75176B is a high speed differential TRISTATEbus/line transceiver designed to meet the requirements of EIA standard RS485 with extended common mode range (+12V to 7V), for multipoint data transmission. In addition, it is compatible with RS-422. The driver and receiver outputs feature TRI-STATE capability, for the driver outputs over the entire common mode range of +12V to 7V. Bus contention or fault situations that cause excessive power dissipation within the device are handled by a thermal shutdown circuit, which forces the driver outputs into the high impedance state. DC specifications are guaranteed over the 0 to 70C temperature and 4.75V to 5.25V supply voltage range.

23

Connection and Logic Diagram

Figure 1. Top View See Package Number P0008E or D0008A

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TRI-STATE is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners.
Copyright 19982013, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

DS75176B, DS75176BT
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Absolute Maximum Ratings

Supply Voltage, VCC Control Input Voltages Driver Input Voltage Driver Output Voltages Receiver Input Voltages (DS75176B) Receiver Output Voltage Continuous Power Dissipation @ 25C Storage Temperature Range Lead Temperature (Soldering, 4 seconds) ESD Rating (HBM) (1) (2) (3) (4)

7V 7V 7V +15V/ 10V +15V/ 10V 5.5V for SOIC Package for PDIP Package 675 mW 900 mW
(3) (4)

65C to +150C 260C 500V

Absolute Maximum Ratings are those beyond which the safety of the device cannot be verified. They are not meant to imply that the device should be operated at these limits. The tables of Electrical Characteristics provide conditions for actual device operation. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Derate linearly @ 6.11 mW/C to 400 mW at 70C. Derate linearly at 5.56 mW/C to 650 mW at 70C.

Recommended Operating Conditions

Min Supply Voltage, VCC Voltage at Any Bus Terminal (Separate or Common Mode) Operating Free Air Temperature TA DS75176B DS75176BT Differential Input Voltage, VID (1)
(1)

Max 5.25 +12

Units V V

4.75 7

0 40 12

+70 +85 +12

C C V

Differential - Input/Output bus voltage is measured at the noninverting terminal A with respect to the inverting terminal B.
(1) (2)

Electrical Characteristics
Symbol VOD1 VOD2 VOD

0C TA 70C, 4.75V < VCC< 5.25V unless otherwise specified

Parameter Differential Driver Output Voltage (Unloaded) Differential Driver Output Voltage (with Load) Change in Magnitude of Driver Differential Output Voltage For Complementary Output States VOC |VOC| Driver Common Mode Output Voltage Change in Magnitude of Driver Common Mode Output Voltage For Complementary Output States See (Figure 2) R = 27 3.0 0.2 V V 0.2 V IO = 0 See (Figure 2) R = 50; (RS-422) R = 27; (RS-485)
(3)

Conditions

Min Typ Max 5 2 1.5

Units V V V

(1) (2) (3) 2

All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. All typicals are given for VCC = 5V and TA = 25C. All worst case parameters for which this note is applied, must be increased by 10% for DS75176BT. The other parameters remain valid for 40C < TA < +85C. Submit Documentation Feedback
Copyright 19982013, Texas Instruments Incorporated

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Electrical Characteristics (1) (2) (continued)

0C TA 70C, 4.75V < VCC< 5.25V unless otherwise specified
Symbol VIH VIL VCL IIL IIH IIN VTH VTH VOH VOL IOZR RIN ICC IOSD IOSR Parameter Input High Voltage Input Low Voltage Input Clamp Voltage Input Low Current Input High Current Input Current DO/RI, DO/RI VCC = 0V or 5.25V DE = 0V Differential Input Threshold Voltage for Receiver Receiver Input Hysteresis Receiver Output High Voltage Output Low Voltage OFF-State (High Impedance) Output Current at Receiver Receiver Input Resistance Supply Current Driver Short-Circuit Output Current Receiver Short-Circuit Output Current RO 7V VCM + 12V VCM = 0V IOH = 400 A IOL = 16 mA VCC = Max 0.4V VO 2.4V 7V VCM +12V No Load (3) VO = 7V VO = 0V
(3) (3) (3)

Conditions

Min Typ Max 2 0.8

Units V

DI, DE, RE , E

IIN = 18 mA VIL = 0.4V VIH = 2.4V VIN = 12V VIN = 7V 0. 2 70 2.7

1.5 200 20 +1.0 0.8 +0.2 A A mA mA V mV V 0.5 20 12 V A k 55 35 250 +250 15 85 mA mA mA mA mA

Driver Outputs Enabled Driver Outputs Disabled

VO = +12V

Switching Characteristics
VCC = 5.0V, TA = 25C
Symbol tPLH tPHL tr tf tZH tZL tLZ tHZ tPLH tPHL tZL tZH tLZ tHZ Parameter Driver Input to Output Driver Input to Output Driver Rise Time Driver Fall Time Driver Enable to Output High Driver Enable to Output Low Driver Disable Time from Low Driver Disable Time from High Receiver Input to Output Receiver Input to Output Receiver Enable to Output Low Receiver Enable to Output High Receiver Disable from Low Receiver Disable from High RLDIFF = 60 CL1 = CL2 = 100 pF RLDIFF = 60 CL1 =CL2 = 100 pF (Figure 4 and Figure 6) CL = 100 pF (Figure 5 and Figure 7) S1 Open CL = 100 pF (Figure 5 and Figure 7) S2 Open CL = 15 pF (Figure 5 and Figure 7) S2 Open CL = 15 pF (Figure 5 and Figure 7) S1 Open CL = 15 pF (Figure 3 and Figure 8) S1 and S2 Closed CL = 15 pF (Figure 3 and Figure 9) S2 Open CL = 15 pF (Figure 3 and Figure 9) S1 Open CL = 15 pF (Figure 3 and Figure 9) S2 Open CL = 15 pF (Figure 3 and Figure 9) S1 Open 29 31 13 19 30 32 15 11 28 13 100 60 30 200 37 37 20 20 32 35 ns ns ns ns ns ns ns ns ns ns Conditions Min Typ 12 17 Max 22 22 18 18 Units ns ns ns ns

Copyright 19982013, Texas Instruments Incorporated

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AC TEST CIRCUITS

Note: S1 and S2 of load circuit are closed except as otherwise mentioned.

Figure 2.

Figure 3.

Note: Unless otherwise specified the switches are closed.

Figure 4.

Figure 5.

Switching Time Waveforms

Figure 6. Driver Propagation Delays and Transition Times

Figure 7. Driver Enable and Disable Times

4 Submit Documentation Feedback
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Note: Differential input voltage may may be realized by grounding RI and pulsing RI between +2.5V and 2.5V

Figure 8. Receiver Propagation Delays

Figure 9. Receiver Enable and Disable Times

Function Tables
Table 1. DS75176B Transmitting (1)
Inputs RE X X X X (1) DE 1 1 0 1 DI 1 0 X X No Fault No Fault X Fault Line Condition 0 1 Z Z Outputs DO DO 1 0 Z Z

X Don't care condition Z High impedance state Fault Improper line conditons causing excessive power dissipation in the driver, such as shorts or bus contention situations **This is a fail safe condition

Copyright 19982013, Texas Instruments Incorporated

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Table 2. DS75176B Receiving (1)

Inputs RE 0 0 0 1 (1) DE 0 0 0 0 RI-RI +0.2V 0.2V Inputs Open** X Outputs RO 1 0 1 Z

X Don't care condition Z High impedance state Fault Improper line conditons causing excessive power dissipation in the driver, such as shorts or bus contention situations **This is a fail safe condition

TYPICAL APPLICATION

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www.ti.com SNLS381C JULY 1998 REVISED APRIL 2013

REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page

Changed layout of National Data Sheet to TI format ............................................................................................................ 6

Copyright 19982013, Texas Instruments Incorporated

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PACKAGE OPTION ADDENDUM

www.ti.com

1-Nov-2013

PACKAGING INFORMATION
Orderable Device DS75176BM DS75176BM/NOPB DS75176BMX DS75176BMX/NOPB DS75176BN DS75176BN/NOPB DS75176BTM DS75176BTM/NOPB DS75176BTMX DS75176BTMX/NOPB DS75176BTN DS75176BTN/NOPB Status
(1)

Package Type Package Pins Package Drawing Qty SOIC SOIC SOIC SOIC PDIP PDIP SOIC SOIC SOIC SOIC PDIP PDIP D D D D P P D D D D P P 8 8 8 8 8 8 8 8 8 8 8 8 95 95 2500 2500 40 40 95 95 2500 2500 40 40

Eco Plan
(2)

Lead/Ball Finish
(6)

MSL Peak Temp

(3)

Op Temp (C) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85

Device Marking
(4/5)

Samples

NRND ACTIVE NRND ACTIVE NRND ACTIVE NRND ACTIVE NRND ACTIVE NRND ACTIVE

TBD Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br)

Call TI CU SN Call TI CU SN Call TI SN | CU SN Call TI CU SN Call TI CU SN Call TI SN | CU SN

Call TI Level-1-260C-UNLIM Call TI Level-1-260C-UNLIM Call TI Level-1-NA-UNLIM Call TI Level-1-260C-UNLIM Call TI Level-1-260C-UNLIM Call TI Level-1-NA-UNLIM

DS751 76BM DS751 76BM DS751 76BM DS751 76BM DS75176BN DS75176BN DS751 76BTM DS751 76BTM DS751 76BTM DS751 76BTM DS75176 BTN DS75176 BTN

(1)

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

1-Nov-2013

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(4)

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com 11-Oct-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing SOIC SOIC SOIC SOIC D D D D 8 8 8 8

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 330.0 12.4 12.4 12.4 12.4 6.5 6.5 6.5 6.5

B0 (mm) 5.4 5.4 5.4 5.4

K0 (mm) 2.0 2.0 2.0 2.0

P1 (mm) 8.0 8.0 8.0 8.0

W Pin1 (mm) Quadrant 12.0 12.0 12.0 12.0 Q1 Q1 Q1 Q1

DS75176BMX DS75176BMX/NOPB DS75176BTMX DS75176BTMX/NOPB

2500 2500 2500 2500

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 11-Oct-2013

*All dimensions are nominal

Device DS75176BMX DS75176BMX/NOPB DS75176BTMX DS75176BTMX/NOPB

Package Type SOIC SOIC SOIC SOIC

Package Drawing D D D D

Pins 8 8 8 8

SPQ 2500 2500 2500 2500

Length (mm) 367.0 367.0 367.0 367.0

Width (mm) 367.0 367.0 367.0 367.0

Height (mm) 35.0 35.0 35.0 35.0

Pack Materials-Page 2

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