SN65HVD147x 3.3-V Full-Duplex RS-485 Transceivers With 16-kV IEC ESD

Product
Folder
Sample &
Buy
Support &
Community
Tools &
Software
Technical
Documents
SN65HVD1470, SN65HVD1471, SN65HVD1473

SLLSEJ8D JUNE 2014 REVISED OCTOBER 2014
SN65HVD147x 3.3-V Full-Duplex RS-485 Transceivers With 16-kV IEC ESD

1 Features
1/8 Unit-Load Options Available

Up to 256 Nodes on the Bus
Bus I/O Protection
> 30 kV HBM protection
> 16 kV IEC61000-4-2 Contact Discharge
> 4 kV IEC61000-4-4 Fast Transient Burst
Extended Industrial Temperature Range:
40C to 125C
Large Receiver Hysteresis (70 mV) for Noise
Rejection
Low Power Consumption
< 1.1 mA Quiescent Current During Operation
Low Standby Supply Current: 10 nA Typical,
< 5 A (maximum)
Glitch-Free Power-Up and Power-Down Protection
for Hot-Plugging Applications
5-V Tolerant Logic Inputs Compatible With 3.3-V
or 5-V Controllers
Signaling Rate Options Optimized for:
400 kbps (1470, 1471), 20 Mbps (1473, 1474), 50
Mbps (1476, 1477)
2 Applications
Industrial Automation
Encoders and Decoders
Building Automation
Security and Surveillance Networks
Telecommunications
These devices each combine a differential driver and

a differential receiver, which operate from a single
3.3-V power supply. Each driver and receiver has
separate input and output pins for full-duplex bus
communication designs. These devices all feature a
wide common-mode voltage range which makes the
devices suitable for multi-point applications over long
cable runs.
The
SN65HVD1471,
SN65HVD1474,
and
SN65HVD1477 devices are fully enabled with no
external enabling pins.
The
SN65HVD1470,
SN65HVD1473,
and
SN65HVD1476 devices have active-high driver
enables and active-low receiver enables. A low, less
than 5-A standby current can be achieved by
disabling both the driver and receiver.
These devices are characterized from 40C to
125C.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
SN65HVD1471
SN65HVD1474
SN65HVD1477
MSOP (8)
3.00 mm 3.00 mm
SOIC (8)
4.90 mm 3.91 mm
SN65HVD1470
SN65HVD1473
SN65HVD1476
MSOP (10)
3.00 mm 3.00 mm
SOIC (14)
8.65 mm 3.91 mm
(1) For all available packages, see the orderable addendum at

the end of the datasheet.
Block Diagram
VCC
VCC
A
3 Description
RE
The SN65HVD147x family of full-duplex transceivers

feature the highest ESD protection in the RS-485
portfolio, supporting 16-kV IEC61000-4-2 contact
discharge and > 30-kV HBM ESD protection. These
RS-485 transceivers have robust 3.3-V drivers and
receivers and are offered in a standard SOIC
package as well as in a small-footprint MSOP
package. The large receiver hysteresis of the
SN65HVD147x devices provides immunity to
conducted differential noise and the wide operating
temperature enables reliability in harsh operating
environments.
DE
D
R
B
R
B
VCC
Z
D
Y
Z
D
Y
GND
GND
SN65HVD1470,
SN65HVD1473, and
SN65HVD1476
SN65HVD1471,
SN65HVD1474, and
SN65HVD1477
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
1
1
1
2
3
3
6
Absolute Maximum Ratings ...................................... 6

Handling Ratings....................................................... 6
Recommended Operating Conditions....................... 7
Thermal Information D Packages......................... 7
Thermal Information DGS and DGK Packages.... 7
Power Dissipation ..................................................... 8
Electrical Characteristics........................................... 8
Switching Characteristics 400 kbps...................... 9
Switching Characteristics 20 Mbps .................... 10
Switching Characteristics 50 Mbps .................. 10
Typical Characteristics .......................................... 11
Parameter Measurement Information ................ 13
Detailed Description ............................................ 17

9.1
9.2
9.3
9.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
17
17
17
17
10 Application and Implementation........................ 20

10.1 Application Information.......................................... 20
10.2 Typical Application ................................................ 20
11 Power Supply Recommendations ..................... 26

12 Layout................................................................... 26
12.1 Layout Guidelines ................................................. 26
12.2 Layout Example .................................................... 27
13 Device and Documentation Support ................. 28

13.1
13.2
13.3
13.4
13.5
Device Support......................................................
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
28
28
28
28
28
14 Mechanical, Packaging, and Orderable

Information ........................................................... 28
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (August 2014) to Revision D
Page
Updated the MSOP10 logic diagram ................................................................................................................................... 4
Changes from Revision B (July 2014) to Revision C
Page
Updated the Device Comparison Table.................................................................................................................................. 3
Changes from Revision A (June 2014) to Revision B
Page
Updated SN65HVD1470 and SN65HVD1471 specifications to production values ............................................................... 3
Changes from Original (May 2014) to Revision A
Page
Changed device status from Product Preview to Production Data (mixed status) ................................................................ 1
Submit Documentation Feedback
Copyright 2014, Texas Instruments Incorporated
Product Folder Links: SN65HVD1470 SN65HVD1471 SN65HVD1473 SN65HVD1474 SN65HVD1476 SN65HVD1477

www.ti.com
5 Device Comparison Table

PART NUMBER (1)
(1)
SIGNALING RATE
DUPLEX
ENABLES
PACKAGE
NODES
256
SN65HVD1470
up to 400 kbps
Full
DE, RE
SOIC-14
MSOP-10
SN65HVD1471
up to 400 kbps
Full
None
SOIC-8
MSOP-8
256
SN65HVD1473
up to 20 Mbps
Full
DE, RE
SOIC-14
MSOP-10
256
SN65HVD1474
up to 20 Mbps
Full
None
SOIC-8
MSOP-8
256
SN65HVD1476
up to 50 Mbps
Full
DE, RE
SOIC-14
MSOP-10
96
SN65HVD1477
up to 50 Mbps
Full
None
SOIC-8
MSOP-8
96
For device status, see the Mechanical, Packaging, and Orderable Information section.
6 Pin Configuration and Functions

8-Pin SOIC, D Package, and 8-Pin MSOP, DGK Package
(Top View)
VCC
R
D
GND
A
B
Z
Y
8
2
R
A
7
B
5
3
D
Y
6
Z
Pin Functions SOIC-8 and MSOP-8

PIN
NAME
NO.
TYPE
DESCRIPTION
VCC
Supply
3-V to 3.6-V supply
Digital output
Receive data output
Digital input
GND
Reference potential
Bus output
Digital bus output, Y (Complementary to Z)
Bus output
Digital bus output, Z (Complementary to Y)
Bus input
Digital bus input, B (Complementary to A)
Bus input
Digital bus input, A (Complementary to B)
Driver data input

Local device ground

www.ti.com

10-Pin MSOP, DGS Package
(Top View)
R
10
VCC
RE
DE
GND
3
6
4
7
2
9
1
8
Pin Functions MSOP10

PIN
NAME
NO.
TYPE
DESCRIPTION
Digital output
Receive data output
RE
Digital input
Receive enable Low
DE
Digital input
Driver enable High
Digital input
Driver data input
GND
Reference potential
Bus output
Bus output
Bus input
Bus input
VCC
10
Supply
Local device ground
3-V to 3.6-V supply

www.ti.com

14-Pin SOIC, D Package
(Top View)
NC
R
RE
DE
D
GND
GND
14
13
12
11
10
VCC
VCC
A
B
Z
Y
NC
NC = no internal connection
Pin Functions SOIC-14

PIN
NAME
NO.
1
NC
TYPE
DESCRIPTION
No connect
Not connected
Digital output
Receive data output
RE
Digital input
Receive enable Low
DE
Digital input
Driver enable High
Digital input
Driver data input
GND
(1)
7 (1)
Reference potential
Local device ground
Bus output
10
Bus output
11
Bus input
12
Bus input
VCC
(1)
(2)
13 (2)
14 (2)
Supply
3-V to 3.6-V supply
Pin 6 and pin 7 are connected internally.

Pin 13 and pin 14 are connected internally.

www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
0.5
5.5
Range at any bus pin (A, B, Y, or Z)
13
16.5
Range at any logic pin (D, DE, or RE)
0.3
5.7
Voltage input range, transient pulse, any bus pin (A, B, Y, or Z) through 100
100
100
Receiver output
24
24
mA
170
Supply voltage
VCC
Voltage
Input voltage
Output current
Junction temperature, TJ
Continuous total power dissipation

(1)
See the Thermal

Information table
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings

Tstg
Storage temperature range
V(ESD)
(1)
(2)
(3)
Electrostatic discharge
MIN
MAX UNIT
65
150
IEC 61000-4-2 ESD (Contact Discharge), bus pins and GND
16
16
kV
IEC 61000-4-2 ESD (Air-Gap Discharge), bus pins and GND (1) (2)
16
16
kV
IEC 61000-4-4 EFT (Fast transient or burst), bus pins and GND
kV
IEC 60749-26 ESD (Human Body Model), bus pins and GND
(2)
30
30
kV
Human body model (HBM), bus pins and GND (3)
40
40
kV
Human body model (HBM), per JEDEC specification JESD22-A114, all pins
kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins
1.5
1.5
kV
Machine model (MM), all pins
300
300
kV
By inference from contact-discharge results, see the Application and Implementation section
Limited by tester capability.
Modeled performance only; based on measured IEC ESD (Contact) capability.

www.ti.com
7.3 Recommended Operating Conditions

IEC 61000-4-2 ESD (Contact Discharge), bus pins and GND
VCC
MIN
Supply voltage
NOM MAX
3
(1)
3.3
UNIT
3.6
VI
Input voltage at any bus pin (separately or common mode)
12
VIH
High-level input voltage (Driver, driver enable, and receiver enable inputs)
VCC
VIL
Low-level input voltage (Driver, driver enable, and receiver enable inputs)
0.8
VID
Differential input voltage
12
12
IO
Output current, Driver
60
60
mA
IO
Output current, Receiver
mA
RL
Differential load resistance
54
CL
Differential load capacitance
1/tUI
Signaling rate
60
50
pF
HVD1470, HVD1471
400
HVD1473, HVD1474
20
HVD1476, HVD1477
50
kbps
Mbps
TA (2)
Operating free-air temperature (See the Application and Implementation for thermal
information)
40
125
TJ
Junction Temperature
40
150
(1)
(2)
The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
Operation is specified for internal (junction) temperatures up to 150C. Self-heating because of internal power dissipation should be
considered for each application. Maximum junction temperature is internally limited by the thermal shut-down (TSD) circuit which
disables the driver outputs when the junction temperature reaches 170C.
7.4 Thermal Information D Packages

THERMAL METRIC
D
(8 PINS)
D
(14 PINS)
UNIT
C/W
RJA
Junction-to-ambient thermal resistance
110.7
83.3
RJC(top)
Junction-to-case (top) thermal resistance
54.7
42.9
RJB
Junction-to-board thermal resistance
51.3
37.8
JT
Junction-to-top characterization parameter
9.2
9.3
JB
Junction-to-board characterization parameter
50.7
37.5
TJ(TSD)
Thermal shut-down junction temperature
170
7.5 Thermal Information DGS and DGK Packages

THERMAL METRIC
DGS
(10 PINS)
DGK
(8 PINS)
UNIT
C/W
RJA
Junction-to-ambient thermal resistance
165.5
168.7
RJC(top)
Junction-to-case (top) thermal resistance
37.7
62.2
RJB
Junction-to-board thermal resistance
86.4
89.5
JT
Junction-to-top characterization parameter
1.4
7.4
JB
Junction-to-board characterization parameter
84.8
87.9
TJ(TSD)
Thermal shut-down junction temperature
170

www.ti.com
7.6 Power Dissipation

PARAMETER
TEST CONDITIONS
Unterminated
Power Dissipation
driver and receiver enabled,
VCC = 3.6 V, TJ = 150C
50% duty cycle square-wave signal at
signaling rate:
HVD1470 and HVD1471 at 400 kbps
HVD1473 and HVD1474 at 20 Mbps
HVD1476 and HVD1477 at 50 Mbps
PD
RS-422 load
RS-485 load
RL = 300 ,
CL = 50 pF (driver)
RL = 100 ,
CL = 50 pF (driver)
RL = 54 ,
CL = 50 pF (driver)
VALUE
HVD1470,
HVD1471
150
HVD1473,
HVD1474
180
HVD1476,
HVD1477
220
HVD1470,
HVD1471
190
HVD1473,
HVD1474
220
HVD1476,
HVD1477
250
HVD1470,
HVD1471
230
HVD1473,
HVD1474
255
HVD1476,
HVD1477
285
UNIT
mW
mW
mW
7.7 Electrical Characteristics

over recommended operating range (unless otherwise specified)
PARAMETER
|VOD|
TEST CONDITIONS
Driver differential output voltage magnitude
MIN
TYP
RL = 60 , 375 on each
output to 7 V to 12 V, See Figure 15
1.5
RL = 54 (RS-485), See Figure 16
1.5
RL = 100 (RS-422) TJ 0C,

VCC 3.2 V, See Figure 16
|VOD|
Change in magnitude of driver differential output voltage
VOC(SS)
Steady-state common-mode output voltage
VOC
Change in differential driver output common-mode voltage
VOC(PP)
Peak-to-peak driver common-mode output voltage
COD
Differential output capacitance
VIT+
Positive-going receiver differential input voltage threshold
VIT
Negative-going receiver differential input voltage threshold
Vhys
Receiver differential input voltage threshold hysteresis

(VIT+ VIT)
VOH
Receiver high-level output voltage
IOH = 8 mA
VOL
Receiver low-level output voltage
IOL = 8 mA
II
Driver input, driver enable, and receiver enable input current
IOZ
Receiver output high-impedance

current
IOS
Driver short-circuit output current
II
RL = 54 , CL = 50 pF, See Figure 16

Center of two 27- load resistors,
See Figure 16
50
50
VCC / 2
50
50
mV
Bus input current (disabled driver)
(1)
-70
200
-140
40
70
2.4
VCC0.3
See
0.2
VO = 0 V or VCC, RE = VCC
VCC = 0 to ROC (max),

DE = GND
(1)
mV
See
mV
V
150
mA
75
100
VI = 12 V
VI = 7 V
mV
VI = 12 V
VI = 7 V
pF
20
0.4
150
HVD1470,
HVD1473
mV
mV
15
HVD1470, HVD1473,
HVD1476
UNIT
500
HVD1476
(1)
MAX
40
240
267
125
333
180
Under any specific conditions, VIT+ is assured to be at least Vhys higher than VIT.

www.ti.com
Electrical Characteristics (continued)

over recommended operating range (unless otherwise specified)
PARAMETER
ICC
TEST CONDITIONS
Supply current (quiescent)
Supply current (dynamic)

Tsd
TYP
MAX
UNIT
Driver and Receiver

enabled
DE = VCC,
RE = GND, No load
MIN
750
1100
Driver enabled,
receiver disabled
DE = VCC, RE = VCC,
No load
350
650
Driver disabled,
receiver enabled
DE = GND,
RE = GND, No load
650
800
Driver and receiver

disabled
DE = GND, D = open,
RE = VCC, No load
0.1
170
See the Typical Characteristics section
Thermal Shut-down junction temperature
7.8 Switching Characteristics 400 kbps

400-kbps devices (SN65HVD1470, SN65HVD1471) bit time 2 s (over recommended operating conditions)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
100
400
750
ns
350
550
ns
40
ns
50
200
ns
300
750
ns
13
25
ns
70
110
ns
ns
45
60
ns
20
115
ns
DRIVER
tr, tf
Driver differential output rise/fall time
tPHL, tPLH
Driver propagation delay
tSK(P)
Driver pulse skew, |tPHL tPLH|
tPHZ, tPLZ
Driver disable time
tPZH, tPZL
Driver enable time
RL = 54 , CL = 50 pF
HVD1470
Receiver enabled
See Figure 17
See Figure 18
and Figure 19
Receiver disabled
RECEIVER
tr, tf
Receiver output rise/fall time
tPHL, tPLH
Receiver propagation delay time
tSK(P)
Receiver pulse skew, |tPHL tPLH|
tPLZ, tPHZ
Receiver disable time
tPZL(1),
tPZH(1)
tPZL(2),
tPZH(2)
Receiver enable time
CL = 15 pF
HVD1470
Driver enabled
Driver disabled
See Figure 20
See Figure 21
See Figure 22

www.ti.com
7.9 Switching Characteristics 20 Mbps

20-Mbps devices (SN65HVD1473, SN65HVD1474) bit time 50 ns (over recommended operating conditions)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
DRIVER
tr, tf
tPHL, tPLH
tSK(P)
tPHZ, tPLZ
Driver disable time
tPZH, tPZL
Driver enable time
RL = 54 , CL = 50 pF
HVD1473
Receiver enabled
See Figure 17
14
ns
10
20
ns
ns
12
25
ns
10
20
ns
10
ns
60
90
ns
See Figure 18 and

Figure 19
Receiver disabled
RECEIVER
tr, tf
tPHL, tPLH
tSK(P)
tPLZ, tPHZ
tpZL(1), tPZH(1)
tPZL(2), tPZH(2)
CL = 15 pF
HVD1473
See Figure 20
ns
17
25
ns
Driver enabled
See Figure 21
12
90
ns
Driver disabled
See Figure 22
7.10 Switching Characteristics 50 Mbps

50-Mbps devices (SN65HVD1476, SN65HVD1477) bit time 20 ns (over recommended operating conditions)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
DRIVER
tr, tf
tPHL, tPLH
tSK(P)
tPHZ, tPLZ
Driver disable time
tPZH, tPZL
Driver enable time
RL = 54 , CL = 50 pF
HVD1476
Receiver enabled
See Figure 17
ns
10
16
ns
3.5
ns
10
20
ns
10
20
ns
See Figure 18 and

Figure 19
Receiver disabled
RECEIVER
tr, tf
tPHL, tPLH
tSK(P)
tPLZ, tPHZ
tpZL(1), tPZH(1)
tPZL(2), tPZH(2)
10
1
CL = 15 pF
HVD1476
See Figure 20
ns
25
40
ns
ns
ns
15
Driver enabled
See Figure 21
90
ns
Driver disabled
See Figure 22

www.ti.com
7.11 Typical Characteristics

3.5
3.6
Driver Output Voltage (V)
Driver Differential-Output Voltage (V)
VOH
VOL
3.3
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
10
20
30
40
50
60
70
Driver Output Current (mA)
80
90
2
1.5
1
0.5
100
10
20
30
40
50
60
70
D001
Figure 1. Driver Output Voltage vs Driver Output Current
80
90
100
D002
Figure 2. Driver Differential-Output Voltage vs Driver Output

Current
50
2.2
45
2.15
Driver Differential-Output Voltage (V)
2.5
2.1
2.05
2
1.95
40
35
30
25
20
15
10
5
1.9
-7
0
-5
-3
-1
1
3
5
7
Driver Common-Mode Voltage (V)
11
0.5
D003
Figure 3. Driver Differential-Output Voltage vs Driver

Common-Mode Voltage
360
360
355
355
350
345
340
335
330
325
320
1.5
2
2.5
Supply Voltage (V)
3.5
D004
Figure 4. Driver Output Current vs Supply Voltage
Driver Propagation Delay (ns)
Driver Rise and Fall Time (ns)
Differential Driver Output Voltage (V)

100 : Load Line
60 : Load Line
350
345
340
335
330
325
320
315
-40
-20
20
40
60
Temperature (qC)
80
100
120
D009
Figure 5. SN65HVD1470, SN65HVD1471 Driver Rise and Fall

Time vs Temperature
315
-40
-20
20
40
60
Temperature (qC)
80
100
120
D010
Figure 6. SN65HVD1470, SN65HVD1471 Driver Propagation

Delay vs Temperature
11

www.ti.com
Typical Characteristics (continued)

10
14
9
8
7
6
5
4
3
2
1
0
-40
-20
20
40
60
Temperature (qC)
80
100
12
10
8
6
4
2
0
-40
120
-20
20
40
60
Temperature (qC)
D005

Time vs Temperature
80
100
120
D006

12
Series1
3.5
3
2.5
2
1.5
1
0.5
0
-40
-20
20
40
60
Temperature (qC)
80
100
10
8
6
4
2
0
-40
120
-20
20
40
60
Temperature (qC)
D011

Time vs Temperature
80
100
120
D012

80
42
70
Supply Current (mA)
Supply Current (mA)
41.8
41.6
41.4
60
50
40
30
20
41.2
10
0
41
0
0.05
0.1
0.15
0.2
0.25
Signaling Rate (Mbps)
0.3
0.35
0.4
D013
VCC = 3.3 V
Figure 11. SN65HVD1470, SN65HVD1471 Supply Current vs
Signal Rate
12
8
10
12
14
16
18
20
D007
TA = 25C

Signal Rate

www.ti.com
80
70
3.5
60
Receiver output, R (V)
Supply Current (mA)
Typical Characteristics (continued)
50
40
30
20
10
2.5
2
1.5
1
VCM = 12 V
VCM = 0 V
VCM = -7 V
0.5
0
0
10
15
20
25
30
35
40
45
0
-150
50
-130
D014
VCC = 3.3 V
Signal Rate
-110
-90
-70
Differential Input Voltage (mV)
-50
D008
TA = 25C
Figure 14. Receiver Output vs Input
8 Parameter Measurement Information

The input generator rate is 100 kbps with 50% duty cycle, than 6-ns rise and fall times, and 50- output
impedance.
375 W 1%
VCC
DE
0 V or 3 V
Y
VOD
60 W 1%
+
_
7 V < V (test) < 12 V
375 W 1%
S0301-01
Figure 15. Measurement of Driver Differential Output Voltage With Common-Mode Load
0 V or 3 V
V(Y)
V(Z)
RL / 2
Y
D
VOD
Z
VOC(PP)
RL / 2
CL
DVOC(SS)
VOC
VOC
S0302-01
Figure 16. Measurement of Driver Differential and Common-Mode Output With RS-485 Load
13

www.ti.com
Parameter Measurement Information (continued)

50%
50%
Y
Figure 17. Measurement of Driver Differential Output Rise and Fall Times and Propagation Delays
Y
3V
50 W
VI
VO
VI
Z
CL = 50 pF 20%
DE
Input
Generator
3V
S1
50%
50%
0V
RL = 110 W
1%
CL Includes Fixture
and Instrumentation
Capacitance
tPZH
VOH
90%
VO
50%
0V
tPHZ
S0304-01
D at 3 V to test non-inverting output, D at 0 V to test inverting output.
Figure 18. Measurement of Driver Enable and Disable Times with Active-High Output and Pulldown Load
3V
Y
D
3V
S1
VO
3V
VI
50%
50%
0V
DE
Input
Generator
RL = 110 W
1%
tPZL
tPLZ
CL = 50 pF 20%
VI
50 W
3V
CL Includes Fixture
and Instrumentation
Capacitance
VO
50%
10%
VOL
S0305-01
D at 0 V to test non-inverting output, D at 3 V to test inverting output.
Figure 19. Measurement of Driver Enable and Disable Times with Active-Low Output and Pullup Load
3V
A
Input
Generator
R
VI
50 W
1.5 V
0V
VI
VO
50%
50%
0V
B
RE
tPLH
CL = 15 pF 20%
VO
CL Includes Fixture
and Instrumentation
Capacitance
tPHL
90% 90%
50%
10%
50%
10%
tr
VOH
VOL
tf
S0306-01
Figure 20. Measurement of Receiver Output Rise and Fall Times and Propagation Delays
14

www.ti.com

3V
VCC
DE
0 V or 3 V D
B
RE
Input
Generator
VI
1 kW 1%
R VO
S1
CL = 15 pF 20%
CL Includes Fixture
and Instrumentation
Capacitance
50 W
3V
VI
50%
50%
0V
tPZH(1)
tPHZ
VOH
90%
VO
50%
D at 3 V
S1 to GND
0V
tPZL(1)
tPLZ
VCC
VO
50%
D at 0 V
S1 to VCC
10%
VOL
S0307-01
Figure 21. Measurement of Receiver Enable and Disable Times With Driver Enabled
15

www.ti.com

VCC
A
0 V or 1.5 V
R VO
S1
1.5 V or 0 V
RE
Input
Generator
VI
1 kW 1%
CL = 15 pF 20%
CL Includes Fixture
and Instrumentation
Capacitance
50 W
3V
VI
50%
0V
tPZH(2)
VOH
VO
A at 1.5 V
B at 0 V
S1 to GND
50%
GND
tPZL(2)
VCC
VO
50%
VOL
A at 0 V
B at 1.5 V
S1 to VCC
S0308-01
Figure 22. Measurement of Receiver Enable Times With Driver Disabled
16

www.ti.com
9 Detailed Description
9.1 Overview
The SN65HVD1470, SN65HVD1471, SN65HVD1473, SN65HVD1474, SN65HVD1476, and SN65HVD1477
devices are low-power, full-duplex RS-485 transceivers available in three speed grades suitable for data
transmission up to 400 kbps, 20 Mbps, and 50 Mbps.
The SN65HVD1471, SN65HVD1474, and SN65HVD1477 are fully enabled with no external enabling pins. The
SN65HVD1470, SN65HVD1473, and SN65HVD1476 have active-high driver enables and active-low receiver
enables. A standby current of less than 5 A can be achieved by disabling both driver and receiver.
9.2 Functional Block Diagram

VCC
VCC
A
R
B
R
B
RE
VCC
DE
D
D
Y
Z
D
Y
GND
GND
Figure 23. Block Diagram

SN65HVD1470, SN65HVD1473, and SN65HVD1476
Figure 24. Block Diagram

SN65HVD1471, SN65HVD1474, and SN65HVD1477
9.3 Feature Description

Internal ESD protection circuits protect the transceiver against Electrostatic Discharges (ESD) according to
IEC61000-4-2 of up to 16 kV, and against electrical fast transients (EFT) according to IEC61000-4-4 of up to 4
kV.
The SN65HVD147x full-duplex family provides internal biasing of the receiver input thresholds in combination
with large input-threshold hysteresis. At a positive input threshold of VIT+ = 20 mV and an input hysteresis of
Vhys = 40 mV, the receiver output remains logic high under a bus-idle or bus-short condition even in the presence
of 120 mVPP differential noise without the need for external failsafe biasing resistors.
Device operation is specified over a wide temperature range from 40C to 125C.
9.4 Device Functional Modes

For the SN65HVD1470, SN65HVD1473, and SN65HVD1476, when the driver enable pin, DE, is logic high, the
differential outputs Y and Z follow the logic states at data input D. A logic high at D causes Y to turn high and Z
to turn low. In this case the differential output voltage defined as VOD = V(Y) V(Z) is positive. When D is low, the
output states reverse, Z turns high, Y becomes low, and VOD is negative.
When DE is low, both outputs turn high-impedance. In this condition the logic state at D is irrelevant. The DE pin
has an internal pulldown resistor to ground, thus when left open the driver is disabled (high-impedance) by
default. The D pin has an internal pullup resistor to VCC, thus, when left open while the driver is enabled, output Y
turns high and Z turns low.
Table 1. Driver Function Table SN65HVD1470, SN65HVD1473, SN65HVD1476
INPUT
ENABLE
DE
Actively drives the bus high
Actively drives the bus low
Driver disabled
OPEN
Driver disabled by default
OPEN
Actively drives the bus high by default
OUTPUTS
FUNCTION
17

www.ti.com
When the receiver enable pin, RE, is logic low, the receiver is enabled. When the differential input voltage
defined as VID = V(A) V(B) is positive and higher than the positive input threshold, VIT+, the receiver output, R,
turns high. When VID is negative and less than the negative and lower than the negative input threshold, VIT, the
receiver output, R, turns low. If VID is between VIT+ and VIT the output is indeterminate.
When RE is logic high or left open, the receiver output is high-impedance and the magnitude and polarity of VID
are irrelevant. Internal biasing of the receiver inputs causes the output to go failsafe-high when the transceiver is
disconnected from the bus (open-circuit), the bus lines are shorted (short-circuit), or the bus is not actively driven
(idle bus).
Table 2. Receiver Function Table SN65HVD1470, SN65HVD1473, SN65HVD1476
DIFFERENTIAL INPUT
ENABLE
OUTPUT
FUNCTION
VID = V(A) V(B)
RE
VIT+ < VID
Receives valid bus High
VIT < VID < VIT+
Indeterminate bus state
VID < VIT
Receives valid bus Low
Receiver disabled
OPEN
Receiver disabled by default
Open-circuit bus
Fail-safe high output
Short-circuit bus
Idle (terminated) bus
For the SN65HVD1471, HVD1474, and HVD1477, the driver and receiver are fully enabled, thus the differential
outputs Y and Z follow the logic states at data input D at all times. A logic high at D causes Y to turn high and Z
to turn low. In this case the differential output voltage defined as VOD = V(Y) V(Z) is positive. When D is low, the
output states reverse, Z turns high, Y becomes low, and VOD is negative. The D pin has an internal pullup
resistor to VCC, thus, when left open while the driver is enabled, output Y turns high and Z turns low.
Table 3. Driver Function Table SN65HVD1471, SN65HVD1474, SN65HVD1477
INPUT
OUTPUTS
FUNCTION
Actively drives the bus High
Actively drives the bus Low
OPEN
Actively drives the bus High by default
When the differential input voltage defined as VID = V(A) V(B) is positive and higher than the positive input
threshold, VIT+, the receiver output, R, turns high. When VID is negative and less than the negative input
threshold, VIT, the receiver output, R, turns low. If VID is between VIT+ and VIT the output is indeterminate.
Internal biasing of the receiver inputs causes the output to go failsafe-high when the transceiver is disconnected
from the bus (open-circuit), the bus lines are shorted (short-circuit), or the bus is not actively driven (idle bus).
Table 4. Receiver Function Table SN65HVD1471, SN65HVD1474, SN65HVD1477
18
DIFFERENTIAL INPUT
OUTPUT
VID = V(A) V(B)
VIT+ < VID
Receives valid bus High
VIT < VID < VIT+
Indeterminate bus state
VID < VIT
Receives valid bus Low
Open-circuit bus
Short-circuit bus
Idle (terminated) bus
FUNCTION

www.ti.com
9.4.1 Equivalent Circuits

VCC
VCC
1 M
1.5 k
1.5 k
D, RE
DE
9V
9V
Figure 25. D and RE Inputs
1 M
Figure 26. DE Input
VCC
VCC
R2
R2
R1
A
R
R1
B
9V
16 V
Figure 27. R Output
R3
R3
Figure 28. Receiver Inputs

VCC
Y
Z
16 V
Figure 29. Driver Outputs
19

www.ti.com
10 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information

The SN65HVD147x family consists of full-duplex RS-485 transceivers commonly used for asynchronous data
transmissions. Full-duplex implementation requires two signal pairs (four wires), and allows each node to
transmit data on one pair while simultaneously receiving data on the other pair.
To eliminate line reflections, each cable end is terminated with a termination resistor, R(T), whose value matches
the characteristic impedance, Z0, of the cable. This method, known as parallel termination, allows for higher data
rates over longer cable length.
Y
R
A
R(T)
R(T)
DE
RE
Master
Slave
RE
DE
Z
R(T)
R(T)
A
R Slave
D
R RE DE D
Figure 30. Typical RS-485 Network With SN65HVD147x Full-Duplex Transceivers
10.2 Typical Application

A full-duplex RS-485 network consists of multiple transceivers connecting in parallel to two bus cables. On one
signal pair, a master driver transmits data to multiple slave receivers. The master driver and slave receivers may
remain fully enabled at all times. On the other signal pair, multiple slave drivers transmit data to the master
receiver. To avoid bus contention, the slave drivers must be intermittently enabled and disabled such that only
one driver is enabled at any time, as in half-duplex communication. The master receiver may remain fully
enabled at all times.
Because the driver may not be disabled, only one driver should be connected to the bus when using the
SN65HVD1471, SN65HVD1474, or SN65HVD1477 device.
Master Enable Control
Slave Enable Control
VCC
R
VCC
A
R
RE
VCC
R
B
DE
RE
DE
Z
D
GND
GND
Figure 31. Full-Duplex Transceiver Configurations

20

www.ti.com
Typical Application (continued)

10.2.1 Design Requirements
RS-485 is a robust electrical standard suitable for long-distance networking that may be used in a wide range of
applications with varying parameter requirements, such as distance, data rate, and number of nodes.
10.2.1.1 Data Rate and Bus Length
There is an inverse relationship between data rate and cable length, which means the higher the data rate, the
short the cable length; and conversely, the lower the data rate, the longer the cable length. While most RS-485
systems use data rates between 10 kbps and 100 kbps, some applications require data rates up to 250 kbps at
distances of 4000 ft and longer. Longer distances are possible by allowing for small signal jitter of up to 5 or
10%.
10000
Cable Length (ft)
5%, 10%, and 20% Jitter

1000
Conservative
Characteristics
100
10
100
1k
10k
100k
1M
10M
100M
Data Rate (bps)
Figure 32. Cable Length vs Data Rate Characteristic

10.2.1.2 Stub Length
When connecting a node to the bus, the distance between the transceiver inputs and the cable trunk, known as
the stub, should be as short as possible. Stubs present a non-terminated piece of bus line which can introduce
reflections as the length of the stub increases. As a general guideline, the electrical length, or round-trip delay, of
a stub should be less than one-tenth of the rise time of the driver, thus giving a maximum physical stub length as
shown in Equation 1.
L(STUB) 0.1 tr v c
where
tr is the 10/90 rise time of the driver

v is the signal velocity of the cable or trace as a factor of c
c is the speed of light (3 108 m/s)
(1)
Per Equation 1, Table 5 lists the maximum cable-stub lengths for the minimum-driver output rise-times of the
SN65HVD147x full-duplex family of transceivers for a signal velocity of 78%.
Table 5. Maximum Stub Length
DEVICE
MINIMUM DRIVER OUTPUT

RISE TIME (ns)
MAXIMUM STUB LENGTH

(m)
(ft)
SN65HVD1470
100
2.34
7.7
SN65HVD1471
100
2.34
7.7
SN65HVD1473
0.1
0.3
SN65HVD1474
0.1
0.3
SN65HVD1476
0.05
0.15
SN65HVD1477
0.05
0.15
21

www.ti.com
10.2.1.3 Bus Loading

The RS-485 standard specifies that a compliant driver must be able to driver 32 unit loads (UL), where 1 unit
load represents a load impedance of approximately 12 k. Because the SN65HVD147x family consists of 1/8 UL
transceivers, connecting up to 256 receivers to the bus is possible.
10.2.1.4 Receiver Failsafe
The differential receivers of the SN65HVD147x family are failsafe to invalid bus states caused by the following:
Open bus conditions, such as a disconnected connector
Shorted bus conditions, such as cable damage shorting the twisted-pair together
Idle bus conditions that occur when no driver on the bus is actively driving
In any of these cases, the differential receiver will output a failsafe logic high state so that the output of the
receiver is not indeterminate.
Receiver failsafe is accomplished by offsetting the receiver thresholds such that the input indeterminate range
does not include zero volts differential. In order to comply with the RS-422 and RS-485 standards, the receiver
output must output a high when the differential input VID is more positive than 200 mV, and must output a Low
when VID is more negative than 200 mV. The receiver parameters which determine the failsafe performance are
VIT+, VIT, and Vhys (the separation between VIT+ and VIT). As shown in the Electrical Characteristics table,
differential signals more negative than 200 mV will always cause a low receiver output, and differential signals
more positive than 200 mV will always cause a high receiver output.
When the differential input signal is close to zero, it is still above the VIT+ threshold, and the receiver output will
be High. Only when the differential input is more than Vhys below VIT+ will the receiver output transition to a Low
state. Therefore, the noise immunity of the receiver inputs during a bus fault conditions includes the receiver
hysteresis value, Vhys, as well as the value of VIT+.
R
Vhysmin
40 mV
60
20
20
60
VID (mV)
Vnmax = 120 mVpp
Figure 33. SN65HVD147x Noise Immunity Under Bus Fault Conditions

10.2.1.5 Transient Protection
The bus pins of the SN65HVD147x full-duplex transceiver family include on-chip ESD protection against 30-kV
HBM and 16-kV IEC 61000-4-2 contact discharge. The International Electrotechnical Commission (IEC) ESD
test is far more severe than the HBM ESD test. The 50% higher charge capacitance, C(S), and 78% lower
discharge resistance, R(D), of the IEC model produce significantly higher discharge currents than the HBM model.
As stated in the IEC 61000-4-2 standard, contact discharge is the preferred transient protection test method.
Although IEC air-gap testing is less repeatable than contact testing, air discharge protection levels are inferred
from contact discharge test results.
22

www.ti.com
R(C)
R(D)
High-Voltage
Pulse
Generator
330
(1.5 k)
Device
Under
Test
150 pF
(100 pF)
C(S)
Current (A)
50 M
(1 M)
40
35
30 10-kV IEC
25
20
15
10
5
0
0
50
100
10-kV HBM
150
200
250
300
Time (ns)
Figure 34. HBM and IEC ESD Models and Currents in Comparison (HBM Values in Parenthesis)
The on-chip implementation of IEC ESD protection significantly increases the robustness of equipment. Common
discharge events occur because of human contact with connectors and cables. Designers may choose to
implement protection against longer duration transients, typically referred to as surge transients.
EFTs are generally caused by relay-contact bounce or the interruption of inductive loads. Surge transients often
result from lightning strikes (direct strike or an indirect strike which induce voltages and currents), or the
switching of power systems, including load changes and short circuit switching. These transients are often
encountered in industrial environments, such as factory automation and power-grid systems.
Figure 35 compares the pulse-power of the EFT and surge transients with the power caused by an IEC ESD
transient. The left hand diagram shows the relative pulse-power for a 0.5kV surge transient and 4-kV EFT
transient, both of which dwarf the 10-kV ESD transient visible in the lower-left corner. 500-V surge transients are
representative of events that may occur in factory environments in industrial and process automations.
22
20
18
16
14
12
10
8
6
4
2
0
Pulse Power (MW)
Pulse Power (kW)
The right hand diagram shows the pulse-power of a 6-kV surge transient, relative to the same 0.5-kV surge
transient. 6-kV surge transients are most likely to occur in power generation and power-grid systems.
0.5-kV Surge
4-kV EFT
10-kV ESD
0
10
15
20
25
Time (s)
30
35
40
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
6-kV Surge
0.5-kV Surge
0
10
15
20
25
30
35
40
Time (s)
Figure 35. Power Comparison of ESD, EFT, and Surge Transients

In the case of surge transients, high-energy content is characterized by long pulse duration and slow decaying
pulse power. The electrical energy of a transient that is dumped into the internal protection cells of a transceiver
is converted into thermal energy, which heats and destroys the protection cells, thus destroying the transceiver.
Figure 36 shows the large differences in transient energies for single ESD, EFT, surge transients, and an EFT
pulse train that is commonly applied during compliance testing.
23

www.ti.com
1000
100
Surge
10
Pulse Energy (J)
EFT Pulse Train

0.1
0.01
EFT
10-3
10-4
ESD
10-5
10-6
0.5
8 10
15
Peak Pulse Voltage (kV)
Figure 36. Comparison of Transient Energies

10.2.2 Detailed Design Procedure
In order to protect bus nodes against high-energy transients, the implementation of external transient protection
devices is therefore necessary. Figure 37 shows a protection circuit against 16-kV ESD, 4-kV EFT, and 1-kV
surge transients.
3.3 V
100 nF
R1
VCC
10 k
10 k
TVS
RxD
B
RE
DIR
MCU/
UART
R2
R1
SN65HVD147x
DE
DIR
TVS
D
TxD
Y
10 k
GND
R2
Figure 37. Transient Protection Against ESD, EFT, and Surge transients
24

www.ti.com
Table 6. Bill of Materials

DEVICE
FUNCTION
ORDER NUMBER
MANUFACTURER
XCVR
3.3-V, full-duplex RS-485

transceiver
SN65HVD147xD
TI
R1
10-, pulse-proof thick-film

resistor
CRCW0603010RJNEAHP
Vishay
Bidirectional 400-W
transient suppressor
CDSOT23-SM712
Bourns
R2
TVS
10.2.3 Application Curves
VOD
VOD
RL = 60
RL = 60
Figure 38. SN65HVD1470 and SN65HVD1471, 500 kbps
Figure 39. SN65HVD1473 and SN65HVD1474, 20 Mbps
VOD
RL = 60
Figure 40. SN65HVD1476 and SN65HVD1477, 50 Mbps
25

www.ti.com
11 Power Supply Recommendations

To ensure reliable operation at all data rates and supply voltages, each supply should be buffered with a 100-nF
ceramic capacitor located as close to the supply pins as possible. The TPS76333 is a linear voltage regulator
suitable for the 3.3-V supply.
12 Layout
12.1 Layout Guidelines
On-chip IEC-ESD protection is good for laboratory and portable equipment but never sufficient for EFT and surge
transients occurring in industrial environments. Therefore robust and reliable bus node design requires the use of
external transient protection devices.
Because ESD and EFT transients have a wide frequency bandwidth from approximately 3-MHz to 3-GHz, highfrequency layout techniques must be applied during PCB design.
For successful PCB design, begin with the design of the protection circuit (see Figure 41).
1. Place the protection circuitry close to the bus connector to prevent noise transients from penetrating your
board.
2. Use VCC and ground planes to provide low-inductance. Note that high-frequency currents follow the path of
least inductance and not the path of least impedance.
3. Design the protection components into the direction of the signal path. Do not force the transient currents to
divert from the signal path to reach the protection device.
4. Apply 100-nF to 220-nF bypass capacitors as close as possible to the VCC-pins of transceiver, UART,
controller ICs on the board (see Figure 41).
5. Use at least two vias for VCC and ground connections of bypass capacitors and protection devices to
minimize effective via-inductance (see Figure 41).
6. Use 1-k to 10-k pullup and pulldown resistors for enable lines to limit noise currents in theses lines during
transient events (see Figure 41).
7. Insert pulse-proof resistors into the A and B bus lines if the TVS clamping voltage is higher than the specified
maximum voltage of the transceiver bus pins. These resistors limit the residual clamping current into the
transceiver and prevent it from latching up (see Figure 41).
8. While pure TVS protection is sufficient for surge transients up to 1 kV, higher transients require metal-oxide
varistors (MOVs) which reduce the transients to a few hundred volts of clamping voltage, and transient
blocking units (TBUs) that limit transient current to less than 1 mA.
26

www.ti.com
12.2 Layout Example

GND
5
VCC or GND
MCU
SN65HVD147x
R
TVS
5
R
7
R
R
VCC or GND
1
R
GND
TVS
JMP
JMP
GND
GND
GND
Figure 41. SN65HVD147x Layout Example
27

www.ti.com
13 Device and Documentation Support

13.1 Device Support
13.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
13.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 7. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
SN65HVD1470
Click here
Click here
Click here
Click here
Click here
SN65HVD1471
Click here
Click here
Click here
Click here
Click here
SN65HVD1473
Click here
Click here
Click here
Click here
Click here
SN65HVD1474
Click here
Click here
Click here
Click here
Click here
SN65HVD1476
Click here
Click here
Click here
Click here
Click here
SN65HVD1477
Click here
Click here
Click here
Click here
Click here
13.3 Trademarks
All trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
13.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
28
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package

Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
SN65HVD1470D
ACTIVE
SOIC
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
HVD1470
SN65HVD1470DGS
ACTIVE
VSSOP
DGS
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
1470
SN65HVD1470DGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
1470
SN65HVD1470DR
ACTIVE
SOIC
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
HVD1470
SN65HVD1471D
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VD1471
SN65HVD1471DGK
ACTIVE
VSSOP
DGK
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
1471
SN65HVD1471DGKR
ACTIVE
VSSOP
DGK
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
1471
SN65HVD1471DR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VD1471
SN65HVD1473D
ACTIVE
SOIC
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
HVD1473
SN65HVD1473DGS
ACTIVE
VSSOP
DGS
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
1473
SN65HVD1473DGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
1473
SN65HVD1473DR
ACTIVE
SOIC
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
HVD1473
SN65HVD1474D
ACTIVE
SOIC
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VD1474
SN65HVD1474DGK
ACTIVE
VSSOP
DGK
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
1474
SN65HVD1474DGKR
ACTIVE
VSSOP
DGK
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
1474
SN65HVD1474DR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VD1474
SN65HVD1476D
ACTIVE
SOIC
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
HVD1476
Addendum-Page 1
Samples
www.ti.com
Orderable Device
14-Oct-2014
Status
(1)
Package Type Package Pins Package

Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
SN65HVD1476DGS
ACTIVE
VSSOP
DGS
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
1476
SN65HVD1476DGSR
ACTIVE
VSSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
1476
SN65HVD1476DR
ACTIVE
SOIC
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
HVD1476
SN65HVD1477D
ACTIVE
SOIC
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VD1477
SN65HVD1477DGK
ACTIVE
VSSOP
DGK
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
1477
SN65HVD1477DGKR
ACTIVE
VSSOP
DGK
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
1477
SN65HVD1477DR
ACTIVE
SOIC
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
VD1477
(1)
The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 2
Samples
www.ti.com
14-Oct-2014
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION

www.ti.com
13-Nov-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins

Type Drawing
SN65HVD1470DGSR
VSSOP
DGS
SN65HVD1471DGKR
VSSOP
SN65HVD1473DGSR
VSSOP
SN65HVD1474DGKR
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
DGK
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
DGS
10
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
VSSOP
DGK
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
SN65HVD1474DR
SOIC
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN65HVD1476DGSR
VSSOP
DGS
10
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
SN65HVD1477DGKR
VSSOP
DGK
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION

www.ti.com
13-Nov-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN65HVD1470DGSR
VSSOP
DGS
10
2500
364.0
364.0
27.0
SN65HVD1471DGKR
VSSOP
DGK
2500
364.0
364.0
27.0
SN65HVD1473DGSR
VSSOP
DGS
10
2500
364.0
364.0
27.0
SN65HVD1474DGKR
VSSOP
DGK
2500
364.0
364.0
27.0
SN65HVD1474DR
SOIC
2500
340.5
338.1
20.6
SN65HVD1476DGSR
VSSOP
DGS
10
2500
364.0
364.0
27.0
SN65HVD1477DGKR
VSSOP
DGK
2500
364.0
364.0
27.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

SN65HVD147x 3.3-V Full-Duplex RS-485 Transceivers With 16-kV IEC ESD

Uploaded by

Copyright:

Available Formats

SN65HVD147x 3.3-V Full-Duplex RS-485 Transceivers With 16-kV IEC ESD

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

SN65HVD147x 3.3-V Full-Duplex RS-485 Transceivers With 16-kV IEC ESD

Uploaded by

Copyright:

Available Formats

Product

SN65HVD1470, SN65HVD1471, SN65HVD1473