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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers
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Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
 FQP8P10 P-Channel MOSFET
March 2013

FQP8P10
P-Channel QFET MOSFET
-100 V, -8 A, 530 m

Description Features
This P-Channel enhancement mode power MOSFET is -8 A, -100 V, RDS(on)=530 m(Max.) @VGS=-10 V, ID=-4 A
produced using Fairchild Semiconductors proprietary Low Gate Charge (Typ. 12 nC)
planar stripe and DMOS technology. This advanced
MOSFET technology has been especially tailored to Low Crss (Typ. 30 pF)
reduce on-state resistance, and to provide superior 100% Avalanche Tested
switching performance and high avalanche energy 175C Maximum Junction Temperature Rating
strength. These devices are suitable for switched mode
power supplies, audio amplifier, DC motor control, and
variable switching power applications.

G
G
DS TO-220
S

Absolute Maximum Ratings TC = 25C unless otherwise noted

Symbol Parameter FQP8P10 Unit

VDSS Drain-Source Voltage -100 V
ID Drain Current - Continuous (TC = 25C) -8.0 A
- Continuous (TC = 100C) -5.7 A
IDM Drain Current - Pulsed (Note 1) -32 A
VGSS Gate-Source Voltage 30 V
EAS Single Pulsed Avalanche Energy (Note 2) 150 mJ
IAR Avalanche Current (Note 1) -8.0 A
EAR Repetitive Avalanche Energy (Note 1) 6.5 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) -6.0 V/ns
PD Power Dissipation (TC = 25C) 65 W
- Derate above 25C 0.43 W/C
TJ, TSTG Operating and Storage Temperature Range -55 to +175 C
Maximum lead temperature for soldering purposes,
TL 300 C
1/8" from case for 5 seconds

Thermal Characteristics
Symbol Parameter Typ Max Unit
RJC Thermal Resistance, Junction-to-Case -- 2.31 C/W
RCS Thermal Resistance, Case-to-Sink 0.5 -- C/W
RJA Thermal Resistance, Junction-to-Ambient -- 62.5 C/W

2002 Fairchild Semiconductor Corporation www.fairchildsemi.com

FQP8P10 Rev. C0
 FQP8P10 P-Channel MOSFET
Electrical Characteristics TC = 25C unless otherwise noted

Symbol Parameter Test Conditions Min Typ Max Unit

Off Characteristics
BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = -250 A -100 -- -- V
BVDSS Breakdown Voltage Temperature
ID = -250 A, Referenced to 25C -- -0.1 -- V/C
/ TJ Coefficient
IDSS VDS = -100 V, VGS = 0 V -- -- -1 A
Zero Gate Voltage Drain Current
VDS = -80 V, TC = 150C -- -- -10 A
IGSSF Gate-Body Leakage Current, Forward VGS = -30 V, VDS = 0 V -- -- -100 nA
IGSSR Gate-Body Leakage Current, Reverse VGS = 30 V, VDS = 0 V -- -- 100 nA

On Characteristics
VGS(th) Gate Threshold Voltage VDS = VGS, ID = -250 A -2.0 -- -4.0 V
RDS(on) Static Drain-Source
VGS = -10 V, ID = -4.0 A -- 0.41 0.53
On-Resistance
gFS Forward Transconductance VDS = -40 V, ID = -4.0 A (Note 4) -- 4.3 -- S

Dynamic Characteristics
Ciss Input Capacitance VDS = -25 V, VGS = 0 V, -- 360 470 pF
Coss Output Capacitance f = 1.0 MHz -- 120 155 pF
Crss Reverse Transfer Capacitance -- 30 40 pF

Switching Characteristics
td(on) Turn-On Delay Time -- 11 30 ns
VDD = -50 V, ID = -8.0 A,
tr Turn-On Rise Time -- 110 230 ns
RG = 25
td(off) Turn-Off Delay Time -- 20 50 ns
(Note 4, 5)
tf Turn-Off Fall Time -- 35 80 ns
Qg Total Gate Charge VDS = -80 V, ID = -8.0 A, -- 12 15 nC
Qgs Gate-Source Charge VGS = -10 V -- 3.0 -- nC
Qgd Gate-Drain Charge (Note 4, 5) -- 6.4 -- nC

Drain-Source Diode Characteristics and Maximum Ratings

IS Maximum Continuous Drain-Source Diode Forward Current -- -- -8.0 A
ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- -32 A
VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = -8.0 A -- -- -4.0 V
trr Reverse Recovery Time VGS = 0 V, IS = -8.0 A, -- 98 -- ns
Qrr Reverse Recovery Charge dIF / dt = 100 A/s (Note 4)
-- 0.35 -- C

Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 3.5mH, IAS = -8.0A, VDD = -25V, RG = 25 , Starting TJ = 25C
3. ISD -8.0A, di/dt 300A/s, VDD BVDSS, Starting TJ = 25C
4. Pulse Test : Pulse width 300s, Duty cycle 2%
5. Essentially independent of operating temperature

2002 Fairchild Semiconductor Corporation www.fairchildsemi.com

FQP8P10 Rev. C0
 FQP8P10 P-Channel MOSFET
Typical Characteristics

VGS
Top : -15.0 V
1 -10.0 V
10 1
-8.0 V 10
-7.0 V
-6.5 V
-5.5 V

-I D , Drain Current [A]

-ID, Drain Current [A]

-5.0 V
0 Bottom : -4.5 V
10 175

0
10
25
-1
10
-55
Notes :
Notes :
1. VDS = -40V
1. 250 s Pulse Test
2. 250 s Pulse Test
2. TC = 25
-2 -1
10 10
10
-1
10
0
10
1 2 4 6 8 10

-VDS, Drain-Source Voltage [V] -VGS , Gate-Source Voltage [V]

Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics

1.5

1.2 VGS = - 10V 1

10
Drain-Source On-Resistance

-I DR , Reverse Drain Current [A]

RDS(on) [ ],

0.9 VGS = - 20V

0.6 0
10

175 25
0.3 Notes :
1. VGS = 0V
Note : TJ = 25
2. 250 s Pulse Test

0.0 10
-1

0 5 10 15 20 25 0.0 0.5 1.0 1.5 2.0 2.5 3.0

-ID , Drain Current [A] -VSD , Source-Drain Voltage [V]

Figure 3. On-Resistance Variation vs. Figure 4. Body Diode Forward Voltage

Drain Current and Gate Voltage Variation vs. Source Current
and Temperature

900 12
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
800
Coss Crss = Cgd VDS = -20V
10
700 Ciss VDS = -50V
-V GS , Gate-Source Voltage [V]

VDS = -80V
600 Notes : 8
Capacitance [pF]

1. VGS = 0 V
500 2. f = 1 MHz
6
400
Crss
300 4

200
2
100 Note : ID = -8.0 A

0 0
10
-1
10
0
10
1 0 2 4 6 8 10 12 14

-VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC]

Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics

2002 Fairchild Semiconductor Corporation www.fairchildsemi.com

FQP8P10 Rev. C0
 FQP8P10 P-Channel MOSFET
Typical Characteristics (Continued)

1.2 3.0

2.5
Drain-Source Breakdown Voltage

1.1

Drain-Source On-Resistance
-BV DSS , (Normalized)

RDS(ON) , (Normalized)
2.0

1.0 1.5

1.0

0.9 Notes :
1. VGS = 0 V Notes :
2. ID = -250 A 0.5 1. VGS = -10 V
2. ID = -4.0 A

0.8 0.0
-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200
o o
TJ, Junction Temperature [ C] TJ, Junction Temperature [ C]

Figure 7. Breakdown Voltage Variation Figure 8. On-Resistance Variation

vs. Temperature vs. Temperature

10
2
10
Operation in This Area
is Limited by R DS(on)
8
100 s
1 ms
-I D, Drain Current [A]

-I D, Drain Current [A]

1
10
6
10 ms
DC

4
0
10
Notes :
o 2
1. TC = 25 C
o
2. TJ = 175 C
3. Single Pulse
-1
10 0
10
0
10
1
10
2 25 50 75 100 125 150 175

-VDS, Drain-Source Voltage [V] TC, Case Temperature []

Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current
vs. Case Temperature
( t) , T h e r m a l R e s p o n s e

0 D = 0 .5
10
N o te s :
0 .2 1 . Z J C ( t ) = 2 . 3 1 /W M a x .
2 . D u ty F a c t o r , D = t 1 /t 2
0 .1 3 . T J M - T C = P D M * Z J C( t )

0 .0 5
-1
10
0 .0 2
PDM
0 .0 1
JC

t1
s in g le p u ls e

t2
Z

-2
10
-5 -4 -3 -2 -1 0 1
10 10 10 10 10 10 10

t 1 , S q u a r e W a v e P u ls e D u r a t io n [ s e c ]

Figure 11. Transient Thermal Response Curve

2002 Fairchild Semiconductor Corporation www.fairchildsemi.com

FQP8P10 Rev. C0
 FQP8P10 P-Channel MOSFET
Gate Charge Test Circuit & Waveform

VGS
Same Type
50K
as DUT Qg
12V 200nF
300nF -10V
VDS
VGS Qgs Qgd

DUT
-3mA

Charge

Resistive Switching Test Circuit & Waveforms

RL
VDS t on t off

td(on) tr td(off)
VGS VDD tf

RG VGS
10%

-10V DUT

90%
VDS

Unclamped Inductive Switching Test Circuit & Waveforms

L 1 BVDSS
VDS EAS = ---- L IAS2 --------------------
2 BVDSS - VDD
tp Time
ID

RG VDD VDS (t)

VDD
ID (t)
-10V DUT
IAS
tp BVDSS

2002 Fairchild Semiconductor Corporation www.fairchildsemi.com

FQP8P10 Rev. C0
 FQP8P10 P-Channel MOSFET
Peak Diode Recovery dv/dt Test Circuit & Waveforms

VDS

DUT _

I SD
L

Driver
RG
Compliment of DUT
(N-Channel) VDD

VGS dv/dt controlled by RG

ISD controlled by pulse period

Gate Pulse Width

VGS D = --------------------------
Gate Pulse Period 10V
( Driver )

Body Diode Reverse Current

I SD
( DUT ) IRM

di/dt

IFM , Body Diode Forward Current

VDS VSD
( DUT )

Body Diode VDD

Forward Voltage Drop

Body Diode Recovery dv/dt

2002 Fairchild Semiconductor Corporation www.fairchildsemi.com

FQP8P10 Rev. C0
 FQP8P10 P-Channel MOSFET
Mechanical Dimensions

TO-220

Dimensions in Millimeters

2002 Fairchild Semiconductor Corporation www.fairchildsemi.com

FQP8P10 Rev. C0
 FQP8P10 P-Channel MOSFET
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
2Cool FPS Sync-Lock
AccuPower F-PFS
*

AX-CAP * FRFET PowerTrench
BitSiC Global Power Resource SM PowerXS
TinyBoost
Build it Now Green Bridge Programmable Active Droop
TinyBuck
CorePLUS Green FPS QFET
TinyCalc
CorePOWER Green FPS e-Series QS
TinyLogic
CROSSVOLT Gmax Quiet Series
TINYOPTO
CTL GTO RapidConfigure
TinyPower
Current Transfer Logic IntelliMAX
TinyPWM
DEUXPEED ISOPLANAR
TinyWire
Dual Cool Marking Small Speakers Sound Louder Saving our world, 1mW/W/kW at a time
TranSiC
EcoSPARK and Better SignalWise
TriFault Detect
EfficentMax MegaBuck SmartMax
TRUECURRENT*
ESBC MICROCOUPLER SMART START
SerDes
MicroFET Solutions for Your Success
MicroPak SPM
Fairchild MicroPak2 STEALTH
MillerDrive SuperFET UHC
Fairchild Semiconductor
MotionMax SuperSOT-3 Ultra FRFET
FACT Quiet Series
mWSaver SuperSOT-6 UniFET
FACT
OptoHiT SuperSOT-8 VCX
FAST
OPTOLOGIC SupreMOS VisualMax
FastvCore
OPTOPLANAR SyncFET VoltagePlus
FETBench
XS

*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
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FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
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As used here in:
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PRODUCT STATUS DEFINITIONS

Definition of Terms
Datasheet Identification Product Status Definition
Datasheet contains the design specifications for product development. Specifications
Advance Information Formative / In Design may change in any manner without notice.

Datasheet contains preliminary data; supplementary data will be published at a later

Preliminary First Production date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to

No Identification Needed Full Production make changes at any time without notice to improve the design.

Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I64

2002 Fairchild Semiconductor Corporation www.fairchildsemi.com

FQP8P10 Rev. C0
 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductors product/patent
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. Typical parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer
application by customers technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
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