LMC6462 Dual/LMC6464 Quad Micropower, Rail-to-Rail Input and Output CMOS Operational Amplifier
LMC6462 Dual/LMC6464 Quad Micropower, Rail-to-Rail Input and Output CMOS Operational Amplifier
LMC6462 Dual/LMC6464 Quad Micropower, Rail-to-Rail Input and Output CMOS Operational Amplifier
1FEATURES DESCRIPTION
Figure 1. 8-Pin PDIP/SOIC Top View Figure 2. 14-Pin PDIP/SOIC Top View
(See Package Number P or D) (See Package Number NFF0014A or D)
10:
Gain
191: Trim
10k,
9.95k 0.1%
10k, 0.1%
10k,
50: - 0.1%
A1
CMRR VCM + 1/2VD -
A2
Trim
+ VOUT = 100VD
VCM - 1/2VD +
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright 19992013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMC6462, LMC6464
SNOS725D MAY 1999 REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) For specified Military Temperature Range parameters see RETSMC6462/4X.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4) Human body model, 1.5 k in series with 100 pF. All pins rated per method 3015.6 of MIL-STD-883. This is a class 2 device rating.
(5) Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.
(6) Applies to both single supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150C. Output currents in excess of 30 mA over long term may adversely
affect reliability.
(7) Do not short circuit output to V+, when V+ is greater than 13V or reliability will be adversely affected.
(8) The maximum power dissipation is a function of TJ(MAX), JA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) TA)/JA. All numbers apply for packages soldered directly into a PC board.
Operating Ratings
Supply Voltage 3.0V V+ 15.5V
Junction Temperature LMC6462AM, LMC6464AM 55C TJ +125C
Range
LMC6462AI, LMC6464AI 40C TJ +85C
LMC6462BI, LMC6464BI 40C TJ +85C
Thermal Resistance (JA) P Package, 8-Pin PDIP 115C/W
D Package, 8-Pin SOIC 193C/W
NFF Package, 14-Pin PDIP 81C/W
D Package, 14-Pin SOIC 126C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
5V DC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ = 25C, V+ = 5V, V = 0V, VCM = VO = V+/2 and RL > 1M. Boldface limits
apply at the temperature extremes.
Typ (1) LMC6462AI LMC6462BI LMC6462AM
Symbol Parameter Conditions LMC6464AI LMC6464BI LMC6464AM Units
Limit (2) Limit (2) Limit (2)
VOS Input Offset Voltage 0.25 0.5 3.0 0.5 mV
1.2 3.7 1.5 max
TCVOS Input Offset Voltage
1.5 V/C
Average Drift
IB Input Current See (3) 0.15 10 10 200 pA max
(4) V+ = 15V, VCM = 7.5V and RL connected to 7.5V. For Sourcing tests, 7.5V VO 11.5V. For Sinking tests, 3.5V VO 7.5V.
Copyright 19992013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LMC6462 LMC6464
LMC6462, LMC6464
SNOS725D MAY 1999 REVISED MARCH 2013 www.ti.com
(5) Do not short circuit output to V+, when V+ is greater than 13V or reliability will be adversely affected.
5V AC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ = 25C, V+ = 5V, V = 0V, VCM = VO = V+/2 and RL > 1M. Boldface limits
apply at the temperature extremes.
Typ (1) LMC6462AI LMC6462BI LMC6462AM
Symbol Parameter Conditions LMC6464AI LMC6464BI LMC6464AM Units
Limit (2) Limit (2) Limit (2)
SR Slew Rate See (3) 15 15 15 V/ms
28 min
8 8 8
GBW Gain-Bandwidth Product V+ = 15V 50 kHz
m Phase Margin 50 Deg
Gm Gain Margin 15 dB
Amp-to-Amp Isolation See (4) 130 dB
en Input-Referred f = 1 kHz
80 nV/Hz
Voltage Noise VCM = 1V
in Input-Referred Current Noise f = 1 kHz 0.03 pA/Hz
3V DC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ = 25C, V+ = 3V, V = 0V, VCM = VO = V+/2 and RL > 1M. Boldface limits
apply at the temperature extremes.
Typ (1) LMC6462AI LMC6462BI LMC6462AM
Symbol Parameter Conditions LMC6464AI LMC6464BI LMC6464AM Units
Limit (2) Limit (2) Limit (2)
VOS Input Offset Voltage 2.0 3.0 2.0 mV
0.9 max
2.7 3.7 3.0
TCVOS Input Offset Voltage
2.0 V/C
Average Drift
IB Input Current See (3) 0.15 10 10 200 pA
IOS Input Offset Current See (3) 0.075 5 5 100 pA
CMRR Common Mode 0V VCM 3V dB
74 60 60 60
Rejection Ratio min
PSRR Power Supply 3V V+ 15V, V = 0V dB
80 60 60 60
Rejection Ratio min
VCM Input Common-Mode For CMRR 50 dB V
0.10 0.0 0.0 0.0
Voltage Range max
3.0 3.0 3.0 3.0 V
min
VO Output Swing RL = 25 k to V+/2 V
2.95 2.9 2.9 2.9
min
V
0.15 0.1 0.1 0.1
max
IS Supply Current Dual, LMC6462 40 55 55 55 A
VO = V+/2
70 70 70
Quad, LMC6464 80 110 110 110 A
VO = V+/2 max
140 140 140
3V AC Electrical Characteristics
Unless otherwise specified, V+ = 3V, V = 0V, VCM = VO = V+/2 and RL > 1M. Boldface limits apply at the temperature
extremes.
Typ (1) LMC6462AI LMC6462BI LMC6462AM
Symbol Parameter Conditions LMC6464AI LMC6464BI LMC6464AM Units
Limit (2) Limit (2) Limit (2)
SR Slew Rate See (3) 23 V/ms
GBW Gain-Bandwidth Product 50 kHz
Figure 4. Figure 5.
Figure 6. Figure 7.
Figure 8. Figure 9.
Slew Rate
vs.
Supply Voltage Non-Inverting Large Signal Pulse Response
Non-Inverting Small Signal Pulse Response Non-Inverting Small Signal Pulse Response
Non-Inverting Small Signal Pulse Response Inverting Large Signal Pulse Response
Inverting Small Signal Pulse Response Inverting Small Signal Pulse Response
Figure 32.
APPLICATION INFORMATION
Figure 33. An Input Voltage Signal Exceeds the LMC6462/4 Power Supply Voltage with No Output Phase
Inversion
The absolute maximum input voltage at V+ = 3V is 300 mV beyond either supply rail at room temperature.
Voltages greatly exceeding this absolute maximum rating, as in Figure 34, can cause excessive current to flow in
or out of the input pins, possibly affecting reliability. The input current can be externally limited to 5 mA, with an
input resistor, as shown in Figure 35.
Figure 34. A 7.5V Input Signal Greatly Exceeds the 3V Supply in Figure 35 Causing No Phase Inversion
Due to RI
Figure 35. Input Current Protection for Voltages Exceeding the Supply Voltage
Rail-to-Rail Output
The approximated output resistance of the LMC6462/4 is 180 sourcing, and 130 sinking at VS = 3V, and
110 sourcing and 83 sinking at VS = 5V. The maximum output swing can be estimated as a function of load
using the calculated output resistance.
Figure 37 displays the pulse response of the LMC6462/4 circuit in Figure 36.
Another circuit, shown in Figure 38, is also used to indirectly drive capacitive loads. This circuit is an
improvement to the circuit shown in Figure 36 because it provides DC accuracy as well as AC stability. R1 and
C1 serve to counteract the loss of phase margin by feeding the high frequency component of the output signal
back to the amplifiers inverting input, thereby preserving phase margin in the overall feedback loop. The values
of R1 and C1 should be experimentally determined by the system designer for the desired pulse response.
Increased capacitive drive is possible by increasing the value of the capacitor in the feedback loop.
Figure 38. LMC6462 Non-Inverting Amplifier, Compensated to Handle a 300 pF Capacitive and 100 k
Resistive Load
The effect of input capacitance can be compensated for by adding a feedback capacitor. The feedback capacitor
(as in Figure 40 ), CF, is first estimated by:
(1)
or
R1 CIN R2 CF (2)
which typically provides significant overcompensation.
Printed circuit board stray capacitance may be larger or smaller than that of a breadboard, so the actual optimum
value for CF may be different. The values of CF should be checked on the actual circuit. (Refer to the LMC660
quad CMOS amplifier data sheet for a more detailed discussion.)
SPICE Macromodel
A Spice macromodel is available for the LMC6462/4. This model includes a simulation of:
Input common-mode voltage range
Copyright 19992013, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LMC6462 LMC6464
LMC6462, LMC6464
SNOS725D MAY 1999 REVISED MARCH 2013 www.ti.com
The designer should be aware that when it is inappropriate to lay out a PC board for the sake of just a few
circuits, there is another technique which is even better than a guard ring on a PC board: Don't insert the
amplifier's input pin into the board at all, but bend it up in the air and use only air as an insulator. Air is an
excellent insulator. In this case you may have to forego some of the advantages of PC board construction, but
the advantages are sometimes well worth the effort of using point-to-point up-in-the-air wiring. See Figure 47.
(Input pins are lifted out of PC board and soldered directly to components. All other pins connected to PC board.)
Instrumentation Circuits
The LMC6464 has the high input impedance, large common-mode range and high CMRR needed for designing
instrumentation circuits. Instrumentation circuits designed with the LMC6464 can reject a larger range of
common-mode signals than most in-amps. This makes instrumentation circuits designed with the LMC6464 an
excellent choice for noisy or industrial environments. Other applications that benefit from these features include
analytic medical instruments, magnetic field detectors, gas detectors, and silicon-based transducers.
A small valued potentiometer is used in series with RG to set the differential gain of the three op-amp
instrumentation circuit in Figure 48. This combination is used instead of one large valued potentiometer to
increase gain trim accuracy and reduce error due to vibration.
A two op-amp instrumentation amplifier designed for a gain of 100 is shown in Figure 49. Low sensitivity
trimming is made for offset voltage, CMRR and gain. Low cost and low power consumption are the main
advantages of this two op-amp circuit.
Higher frequency and larger common-mode range applications are best facilitated by a three op-amp
instrumentation amplifier.
10:
Gain
191: Trim
10k,
9.95k 0.1%
10k, 0.1%
10k,
50: - 0.1%
A1
CMRR VCM + 1/2VD -
A2
Trim
+ VOUT = 100VD
VCM - 1/2VD +
Photocells can be used in portable light measuring instruments. The LMC6462, which can be operated off a
battery, is an excellent choice for this circuit because of its very low input current and offset voltage.
LMC6462 as a Comparator
Figure 51 shows the application of the LMC6462 as a comparator. The hysteresis is determined by the ratio of
the two resistors. The LMC6462 can thus be used as a micropower comparator, in applications where the
quiescent current is an important parameter.
In Figure 52 Figure 53, RI limits current into the amplifier since excess current can be caused by the input
voltage exceeding the supply voltage.
(3)
Oscillators
For single supply 5V operation, the output of the circuit will swing from 0V to 5V. The voltage divider set up R2,
R3 and R4 will cause the non-inverting input of the LMC6462 to move from 1.67V ( of 5V) to 3.33V ( of 5V).
This voltage behaves as the threshold voltage.
R1 and C1 determine the time constant of the circuit. The frequency of oscillation, fOSC is
(4)
where t is the time the amplifier input takes to move from 1.67V to 3.33V. The calculations are shown below.
(5)
where = RC = 0.68 seconds
t1 = 0.27 seconds.
and
(6)
t2 = 0.75 seconds
Then,
(7)
(8)
= 1 Hz
Output offset voltage is the error introduced in the output voltage due to the inherent input offset voltage VOS, of
an amplifier.
Output Offset Voltage = (Input Offset Voltage) (Gain)
In the above configuration, the resistors R5 and R6 determine the nominal voltage around which the input signal,
VIN should be symmetrical. The high frequency component of the input signal VIN will be unaffected while the low
frequency component will be nulled since the DC level of the output will be the input offset voltage of the
LMC6462 plus the bias voltage. This implies that the output offset voltage due to the top amplifier will be
eliminated.
REVISION HISTORY
www.ti.com 27-Jul-2016
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 27-Jul-2016
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2014
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Dec-2014
Pack Materials-Page 2
MECHANICAL DATA
N0014A
NFF0014A
N14A (Rev G)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2016, Texas Instruments Incorporated