IKW50N60T

TRENCHSTOP™ Series q
Low Loss DuoPack : IGBT in TRENCHSTOP™ and Fieldstop technology with soft,
fast recovery anti-parallel Emitter Controlled HE diode

Features:
C
 Very low VCE(sat) 1.5V (typ.)
 Maximum Junction Temperature 175°C
 Short circuit withstand time 5s
 Designed for : G
- Frequency Converters E
- Uninterrupted Power Supply
 TRENCHSTOP™ and Fieldstop technology for 600V applications offers :
- very tight parameter distribution
- high ruggedness, temperature stable behavior
- very high switching speed
 Positive temperature coefficient in VCE(sat)
 Low EMI PG-TO247-3
 Low Gate Charge
 Very soft, fast recovery anti-parallel Emitter Controlled HE diode
 Qualified according to JEDEC1 for target applications
 Pb-free lead plating; RoHS compliant
 Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/

Type VCE IC VCE(sat),Tj=25°C Tj,max Marking Package

IKW50N60T 600V 50A 1.5V 175C K50T60 PG-TO247-3

Maximum Ratings
Parameter Symbol Value Unit

Collector-emitter voltage, Tj ≥ 25C VCE 600 V

DC collector current, limited by Tjmax
2)
TC = 25C IC 80
TC = 100C 50
Pulsed collector current, tp limited by Tjmax ICpuls 150
A
Turn off safe operating area, VCE = 600V, Tj = 175C, tp = 1µs - 150
Diode forward current, limited by Tjmax
TC = 25C IF 100
TC = 100C 50
Diode pulsed current, tp limited by Tjmax IFpuls 150
Gate-emitter voltage VGE 20 V
3)
Short circuit withstand time
tSC 5 s
VGE = 15V, VCC  400V, Tj  150C
Power dissipation TC = 25C Ptot 333 W
Operating junction temperature Tj -40...+175
Storage temperature Tstg -55...+150 C
Soldering temperature, 1.6mm (0.063 in.) from case for 10s - 260

1
J-STD-020 and JESD-022
2)
Value limited by bond wire
3)
Allowed number of short circuits: <1000; time between short circuits: >1s.

IFAG IPC TD VLS 1 Rev. 2.6 20.09.2013

 IKW50N60T
TRENCHSTOP™ Series q
Thermal Resistance
Parameter Symbol Conditions Max. Value Unit
Characteristic
IGBT thermal resistance, RthJC 0.45 K/W
junction – case
Diode thermal resistance, RthJCD 0.8
junction – case
Thermal resistance, RthJA 40
junction – ambient

Electrical Characteristic, at Tj = 25 C, unless otherwise specified

Value
Parameter Symbol Conditions Unit
min. Typ. max.
Static Characteristic
Collector-emitter breakdown voltage V ( B R ) C E S V G E = 0V , I C = 0 .2m A 600 - - V
Collector-emitter saturation voltage VCE(sat) V G E = 15 V , I C = 50 A
T j =2 5 C - 1.5 2
T j =1 7 5 C - 1.9 -
Diode forward voltage VF V G E = 0V , I F = 5 0 A
T j =2 5 C - 1.65 2.05
T j =1 7 5 C - 1.6 -
Gate-emitter threshold voltage VGE(th) I C = 0. 8m A, V C E = V G E 4.1 4.9 5.7
Zero gate voltage collector current ICES V C E = 60 0 V , µA
V G E = 0V
T j =2 5 C - - 40
T j =1 7 5 C - - 3500
Gate-emitter leakage current IGES V C E = 0V , V G E =2 0 V - - 100 nA
Transconductance gfs V C E = 20 V , I C = 50 A - 31 - S
Integrated gate resistor RGint - Ω

Dynamic Characteristic
Input capacitance Ciss V C E = 25 V , - 3140 - pF
Output capacitance Coss V G E = 0V , - 200 -
Reverse transfer capacitance Crss f= 1 MH z - 93 -
Gate charge QGate V C C = 48 0 V, I C =5 0 A - 310 - nC
V G E = 15 V
Internal emitter inductance LE - 13 - nH
measured 5mm (0.197 in.) from case
1)
Short circuit collector current IC(SC) V G E = 15 V ,t S C  5 s - 458.3 - A
V C C = 4 0 0 V,
T j  1 50  C

1)
Allowed number of short circuits: <1000; time between short circuits: >1s.

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 IKW50N60T
TRENCHSTOP™ Series q
Switching Characteristic, Inductive Load, at Tj=25 C
Value
Parameter Symbol Conditions Unit
min. Typ. max.
IGBT Characteristic
Turn-on delay time td(on) T j=25 C, - 26 - ns
VCC=400V,IC=50A,
Rise time tr VGE=0/15V,rG=7, - 29 -
Turn-off delay time td(off) L =103nH,C=39pF - 299 -
L , C f rom Fig. E
Fall time tf Energy losses include - 29 -
Turn-on energy Eon “tail” and diode reverse - 1.2 - mJ
recovery.
Turn-off energy Eoff - 1.4 -
Total switching energy Ets - 2.6 -
Anti-Parallel Diode Characteristic
Diode reverse recovery time trr T j =2 5 C , - 143 - ns
Diode reverse recovery charge Qrr V R = 4 00 V , I F = 5 0 A, - 1.8 - µC
Diode peak reverse recovery current Irrm d i F / d t =1 2 80 A / s - 27.7 - A
Diode peak rate of fall of reverse d i r r /d t - 671 - A/s
recovery current during t b

Switching Characteristic, Inductive Load, at Tj=175 C

Value
Parameter Symbol Conditions Unit
min. Typ. max.
IGBT Characteristic
Turn-on delay time td(on) T j=175 C, - 27 - ns
VCC=400V,IC=50A,
Rise time tr VGE=0/15V,rG=7, - 33 -
Turn-off delay time td(off) L =103nH,C=39pF - 341 -
L , C f rom Fig. E
Fall time tf Energy losses include - 55 -
Turn-on energy Eon “tail” and diode reverse - 1.8 - mJ
recovery.
Turn-off energy Eoff - 1.8 -
Total switching energy Ets - 3.6 -
Anti-Parallel Diode Characteristic
Diode reverse recovery time trr T j =1 7 5 C - 205 - ns
Diode reverse recovery charge Qrr V R = 4 00 V , I F = 5 0 A, - 4.3 - µC
Diode peak reverse recovery current Irrm d i F / d t =1 2 80 A / s - 40.7 - A
Diode peak rate of fall of reverse d i r r /d t - 449 - A/s
recovery current during t b

IFAG IPC TD VLS 3 Rev. 2.6 20.09.2013

 IKW50N60T
TRENCHSTOP™ Series q
t p=2µs
140A 100A

120A
10µs
IC, COLLECTOR CURRENT

IC, COLLECTOR CURRENT

100A
T C =80°C
80A 10A 50µs
T C =110°C
60A

40A Ic
1ms
20A Ic 1A DC 10ms
0A
100H z 1kH z 10kHz 100kH z
1V 10V 100V 1000V

f, SWITCHING FREQUENCY VCE, COLLECTOR-EMITTER VOLTAGE

Figure 1. Collector current as a function of Figure 2. Safe operating area
switching frequency (D = 0, TC = 25C, Tj 175C;
(Tj  175C, D = 0.5, VCE = 400V, VGE=0/15V)
VGE = 0/15V, rG = 7)

300W
80A
Ptot, POWER DISSIPATION

IC, COLLECTOR CURRENT

250W

60A
200W

150W 40A

100W
20A
50W

0A
0W
25°C 50°C 75°C 100°C 125°C 150°C 25°C 75°C 125°C

TC, CASE TEMPERATURE TC, CASE TEMPERATURE

Figure 3. Power dissipation as a function of Figure 4. Collector current as a function of
case temperature case temperature
(Tj  175C) (VGE  15V, Tj  175C)

IFAG IPC TD VLS 4 Rev. 2.6 20.09.2013

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TRENCHSTOP™ Series q

120A 120A

V G E =20V V G E =20V
100A 100A
IC, COLLECTOR CURRENT

IC, COLLECTOR CURRENT

15V 15V
80A 13V 13V
80A
11V 11V
60A 9V 60A 9V
7V 7V
40A 40A

20A 20A

0A 0A
0V 1V 2V 3V 0V 1V 2V 3V 4V

VCE, COLLECTOR-EMITTER VOLTAGE VCE, COLLECTOR-EMITTER VOLTAGE

Figure 5. Typical output characteristic Figure 6. Typical output characteristic
(Tj = 25°C) (Tj = 175°C)
VCE(sat), COLLECTOR-EMITT SATURATION VOLTAGE

2.5V IC =100A
80 A
IC, COLLECTOR CURRENT

2.0V

60 A
IC =50A
1.5V

40 A
1.0V IC =25A

20 A T J = 17 5 °C
0.5V
2 5 °C

0A 0.0V
0V 2V 4V 6V 8V 0°C 50°C 100°C 150°C

VGE, GATE-EMITTER VOLTAGE TJ, JUNCTION TEMPERATURE

Figure 7. Typical transfer characteristic Figure 8. Typical collector-emitter
(VCE=10V) saturation voltage as a function of
junction temperature
(VGE = 15V)

IFAG IPC TD VLS 5 Rev. 2.6 20.09.2013

 IKW50N60T
TRENCHSTOP™ Series q

t d(off)
t d(off)
t, SWITCHING TIMES

t, SWITCHING TIMES
100ns tr
tf
100ns
tf

t d(on)
tr

10ns t d(on )

10ns
0A 20A 40 A 60A 80 A      

IC, COLLECTOR CURRENT RG, GATE RESISTOR

Figure 9. Typical switching times as a Figure 10. Typical switching times as a
function of collector current function of gate resistor
(inductive load, TJ=175°C, (inductive load, TJ = 175°C,
VCE = 400V, VGE = 0/15V, rG = 7Ω, VCE= 400V, VGE = 0/15V, IC = 50A,
Dynamic test circuit in Figure E) Dynamic test circuit in Figure E)

7V

t d (off) 6V
VGE(th), GATE-EMITT TRSHOLD VOLTAGE

m ax.
typ.
5V
t, SWITCHING TIMES

100n s
4V m in.
tf
3V
tr

2V
t d(on)
1V

10 ns 0V
25°C 50 °C 75°C 100°C 12 5°C 150°C -50°C 0°C 50°C 100°C 150°C

TJ, JUNCTION TEMPERATURE TJ, JUNCTION TEMPERATURE

Figure 11. Typical switching times as a Figure 12. Gate-emitter threshold voltage as
function of junction temperature a function of junction temperature
(inductive load, VCE = 400V, (IC = 0.8mA)
VGE = 0/15V, IC = 50A, rG=7Ω,
Dynamic test circuit in Figure E)

IFAG IPC TD VLS 6 Rev. 2.6 20.09.2013

 IKW50N60T
TRENCHSTOP™ Series q
*) Eon and Ets include losses *) E on a nd E ts in clu d e lo ss e s
Ets*
due to diode recovery
6 .0m J d u e to d io d e rec o v e ry
8.0mJ
E ts *
E, SWITCHING ENERGY LOSSES

E, SWITCHING ENERGY LOSSES

5 .0m J

6.0mJ
Eon* 4 .0m J

4.0mJ 3 .0m J

Eoff E off
2 .0m J
2.0mJ
E on *
1 .0m J

0.0mJ 0 .0m J
0A 20A 40A 60A 80A   

IC, COLLECTOR CURRENT RG, GATE RESISTOR

Figure 13. Typical switching energy losses Figure 14. Typical switching energy losses
as a function of collector current as a function of gate resistor
(inductive load, TJ = 175°C, (inductive load, TJ = 175°C,
VCE = 400V, VGE = 0/15V, rG = 7Ω, VCE = 400V, VGE = 0/15V, IC = 50A,
Dynamic test circuit in Figure E) Dynamic test circuit in Figure E)

*) Eon and Ets include losses *) E on and E ts include losses

due to diode recovery due to diode recovery
Ets* 4m J
E, SWITCHING ENERGY LOSSES

E, SWITCHING ENERGY LOSSES

3.0mJ

3m J E on *

E ts *
2.0mJ
Eoff
2m J
E off
1.0mJ
Eon*
1m J

0.0mJ 0m J
25°C 50°C 75°C 100°C 125°C 150°C 300V 350V 400V 450V 500V 550V
TJ, JUNCTION TEMPERATURE VCE, COLLECTOR-EMITTER VOLTAGE
Figure 15. Typical switching energy losses Figure 16. Typical switching energy losses
as a function of junction as a function of collector emitter
temperature voltage
(inductive load, VCE = 400V, (inductive load, TJ = 175°C,
VGE = 0/15V, IC = 50A, rG = 7Ω, VGE = 0/15V, IC = 50A, rG = 7Ω,
Dynamic test circuit in Figure E) Dynamic test circuit in Figure E)

IFAG IPC TD VLS 7 Rev. 2.6 20.09.2013

 IKW50N60T
TRENCHSTOP™ Series q

C iss
VGE, GATE-EMITTER VOLTAGE

15V 1nF

c, CAPACITANCE
120V

480V
10V

C oss

5V 100pF

C rss

0V 0V 10V 20V 30V 40V

0nC 100nC 200nC 300nC

QGE, GATE CHARGE VCE, COLLECTOR-EMITTER VOLTAGE

Figure 17. Typical gate charge Figure 18. Typical capacitance as a function
(IC=50 A) of collector-emitter voltage
(VGE=0V, f = 1 MHz)

12µs
800A
IC(sc), short circuit COLLECTOR CURRENT

tSC, SHORT CIRCUIT WITHSTAND TIME

700A 10µs

600A
8µs

500A
6µs
400A

300A 4µs

200A
2µs
100A
0µs
0A 10V 11V 12V 13V 14V
12V 14V 16V 18V

VGE, GATE-EMITTETR VOLTAGE VGE, GATE-EMITETR VOLTAGE

Figure 19. Typical short circuit collector Figure 20. Short circuit withstand time as a
current as a function of gate- function of gate-emitter voltage
emitter voltage (VCE=400V, start at TJ=25°C,
(VCE  400V, Tj  150C) TJmax<150°C)

IFAG IPC TD VLS 8 Rev. 2.6 20.09.2013

 IKW50N60T
TRENCHSTOP™ Series q
10 K/W

D=0.5 D=0.5
ZthJC, TRANSIENT THERMAL IMPEDANCE

ZthJC, TRANSIENT THERMAL IMPEDANCE

-1 0.2 0.2
10 K/W

0.1 -1 0.1
10 K/W
R,(K/W) , (s)
0.18355 7.425*10-2 R,(K/W) , (s)
0.05
0.12996 8.34*10-3 0.2441 7.037*10-2 6.53*10
0.05
0.09205 7.235*10-4 0.2007 7.312*10-3
0.03736 1.035*10-4 0.1673 6.431*10-4
0.00703 4.45*10-5 0.02 0.1879 4.79*10-5
-2 0.02 R1 R2 R1 R2
10 K/W
0.01
0.01 -2
10 K/W
C 1 =  1 /R 1 C 2 =  2 /R 2 C1= 1/ R1 C 2 =  2 /R 2
single pulse single pulse

1µs 10µs 100µs 1ms 10ms 100ms 1µs 10µs 100µs 1ms 10ms 100ms
tP, PULSE WIDTH tP, PULSE WIDTH
Figure 21. IGBT transient thermal Figure 22. Diode transient thermal
impedance impedance as a function of pulse
(D = tp / T) width
(D=tP/T)

300ns 4.0µC
TJ=175°C T J =175°C
Qrr, REVERSE RECOVERY CHARGE

3.5µC
trr, REVERSE RECOVERY TIME

250ns
3.0µC

200ns 2.5µC

2.0µC
150ns
TJ=25°C 1.5µC
100ns T J=25°C
1.0µC

50ns 0.5µC

0.0µC
0ns 700A/µs 800A/µs 900A/µs 1000A/µs
700A/µs 800A/µs 900A/µs 1000A/µs
diF/dt, DIODE CURRENT SLOPE diF/dt, DIODE CURRENT SLOPE
Figure 23. Typical reverse recovery time as Figure 24. Typical reverse recovery charge
a function of diode current slope as a function of diode current
(VR=400V, IF=50A, slope
Dynamic test circuit in Figure E) (VR = 400V, IF = 50A,
Dynamic test circuit in Figure E)

IFAG IPC TD VLS 9 Rev. 2.6 20.09.2013

 IKW50N60T
TRENCHSTOP™ Series q

40A T J =175°C
-750A/µs
Irr, REVERSE RECOVERY CURRENT

OF REVERSE RECOVERY CURRENT

T J=25°C

dirr/dt, DIODE PEAK RATE OF FALL

30A -600A/µs
T J =25°C

-450A/µs
20A T J=175°C

-300A/µs

10A
-150A/µs

0A/µs
0A 700A/µs 800A/µs 900A/µs 1000A/µs
700A/µs 800A/µs 900A/µs 1000A/µs

diF/dt, DIODE CURRENT SLOPE diF/dt, DIODE CURRENT SLOPE

Figure 25. Typical reverse recovery current Figure 26. Typical diode peak rate of fall of
as a function of diode current reverse recovery current as a
slope function of diode current slope
(VR = 400V, IF = 50A, (VR=400V, IF=50A,
Dynamic test circuit in Figure E) Dynamic test circuit in Figure E)

120A I F =100A
2.0V

100A
VF, FORWARD VOLTAGE
IF, FORWARD CURRENT

T J =25°C
1.5V 50A
80A 175°C

25A
60A 1.0V

40A
0.5V
20A

0A 0.0V
0V 1V 2V 0°C 50°C 100°C 150°C

VF, FORWARD VOLTAGE TJ, JUNCTION TEMPERATURE

Figure 27. Typical diode forward current as Figure 28. Typical diode forward voltage as a
a function of forward voltage function of junction temperature

IFAG IPC TD VLS 10 Rev. 2.6 20.09.2013

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TRENCHSTOP™ Series q

IFAG IPC TD VLS 11 Rev. 2.6 20.09.2013

 IKW50N60T
TRENCHSTOP™ Series q
i,v

diF /dt tr r =tS +tF

Qr r =QS +QF

tr r
IF tS tF

QS 10% Ir r m t
QF
Ir r m
dir r /dt VR
90% Ir r m

Figure C. Definition of diodes

switching characteristics

1 2 n
r1 r2 rn
Tj (t)

p(t)
r1 r2 rn

Figure A. Definition of switching times

TC

Figure D. Thermal equivalent

circuit

Figure B. Definition of switching losses

IFAG IPC TD VLS 12 Rev. 2.6 20.09.2013

 IKW50N60T
TRENCHSTOP™ Series q
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2013 Infineon Technologies AG
All Rights Reserved.

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characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or
any information regarding the application of the device, Infineon Technologies hereby disclaims any and all
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party.

Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements, components may contain dangerous substances. For information on the
types in question, please contact the nearest Infineon Technologies Office.
The Infineon Technologies component described in this Data Sheet may be used in life-support devices or
systems and/or automotive, aviation and aerospace applications or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the
failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be implanted in the
human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable
to assume that the health of the user or other persons may be endangered.

IFAG IPC TD VLS 13 Rev. 2.6 20.09.2013