MIC5209

500 mA Low-Noise LDO Regulator

Features General Description

• Output Voltage Range: 1.8V – 15V The MIC5209 is an efficient linear voltage regulator
• Meets Intel® Slot 1 and Slot 2 Requirements with very low dropout voltage, typically 10 mV at light
• Guaranteed 500 mA Output Over the Full loads and less than 500 mV at full load, with better than
Operating Temperature Range 1% output voltage accuracy.
• Low 500 mV Maximum Dropout Voltage at Full Designed especially for hand-held, battery-powered
Load devices, the MIC5209 features low ground current to
• Extremely Tight Load and Line Regulation help prolong battery life. An enable/shutdown pin on
the SOIC-8 and DDPAK versions can further improve
• Thermally Efficient Surface-Mount Package
battery life with near-zero shutdown current.
• Low Temperature Coefficient
Key features include reversed-battery protection,
• Current and Thermal Limiting
current limiting, overtemperature shutdown,
• Reversed-Battery Protection ultra-low-noise capability (SOIC-8 and DDPAK
• No-Load Stability versions), and is available in thermally efficient
• 1% Output Accuracy packaging. The MIC5209 is available in adjustable or
• Ultra-Low-Noise Capability in SOIC-8 and DDPAK fixed output voltages.
• Ultra-Small 3 mm × 3 mm DFN Package

Applications
• Pentium II Slot 1 and Slot 2 Support Circuits
• Laptop, Notebook, and Palmtop Computers
• Cellular Telephones
• Consumer and Personal Electronics
• SMPS Post-Regulator and DC/DC Modules
• High-Efficiency Linear Power Supplies

Typical Application Circuits

3.3V NOMINAL INPUT SLOT 1 ULTRA-LOW NOISE

POWER SUPPLY 5V REGULATOR

MIC5209-2.5YS ENABLE MIC5209-5.0YM

SHUTDOWN 1 8
VIN 2 7
6.0V
VOUT 3 6
1 2 3 5.0V 4 5
VIN VOUT
22μF
• 3.0V 2.5V ±1% 470pF
TANTALUM
0.1μF (OPTIONAL)
22μF
TANTALUM

 2017 Microchip Technology Inc. DS20005720A-page 1

MIC5209
Package Types

MIC5209-X.XYS MIC5209YML
SOT-223 (S) 8-PIN 3X3 DFN (ML)
FIXED VOLTAGES (TOP VIEW) ADJUSTABLE VOLTAGES (TOP VIEW)

GND
TAB IN 1 8 EN PART
IDENTIFICATION
IN 2 Y 7 GND
5209
OUT 3 YWW 6 ADJ
OUT 4 5 NC
1 2 3
EP
IN GND OUT

MIC5209-X.XYM MIC5209-X.XYU
SOIC-8 (M) DDPAK (U)
FIXED VOLTAGES (TOP VIEW) FIXED VOLTAGES (TOP VIEW)

5 BYP
EN 1 8 GND
GND 4 OUT
IN 2 7 GND TAB 3 GND
2 IN
OUT 3 6 GND 1 EN
BYP 4 5 GND

MIC5209YM MIC5209YU
SOIC-8 (M) DDPAK (U)
ADJUSTABLE VOLTAGES (TOP VIEW) ADJUSTABLE VOLTAGES (TOP VIEW)

5 ADJ
EN 1 8 GND 4 OUT
GND
AB

3 GND
TA

IN
N 2 7 GND
2 IN
OUT
OUT 3 6 GND 1 EN
ADJ
J 4 5 GND

DS20005720A-page 2  2017 Microchip Technology Inc.

 MIC5209
Functional Diagrams

LOW-NOISE
FIXED REGULATOR
(SOT-223 VERSION ONLY)
IN OUT
VIN VOUT

COUT

~2.0V – 2.1V
EN –40ºC
BANDGAP
REFERENCE

CURRENT-LIMIT
THERMAL SHUTDOWN

MIC5209-x.xYS

GND

ULTRA-LOW-NOISE
FIXED REGULATOR

IN OUT
VIN VOUT

COUT
BYP

CBYP
(OPTIONAL)

BANDGAP
REFERENCE

EN

CURRENT-LIMIT
THERMAL SHUTDOWN

MIC5209-x.xYM/U
GND

ULTRA-LOW-NOISE
ADJUSTABLE REGULATOR

IN OUT
VIN VOUT

R1 COUT
ADJ

R2 CBYP
BANDGAP (OPTIONAL)
REFERENCE

EN

CURRENT-LIMIT
THERMAL SHUTDOWN

MIC5209YM/U (ADJUSTABLE)

GND

 2017 Microchip Technology Inc. DS20005720A-page 3

MIC5209
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN).................................................................................................................................... –20V to +20V
Power Dissipation (PD) (Note 1).............................................................................................................Internally Limited
ESD Rating (SOT-223)..................................................................................................................... 2 kV HBM/300V MM
ESD Rating (DFN, SOIC-8).............................................................................................................. 5 kV HBM/100V MM

Operating Ratings ‡
Supply Voltage (VIN)................................................................................................................................... +2.5V to +16V
Adjustable Output Voltage Range (VOUT) .................................................................................................. +1.8V to +15V

† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) – TA) x θJA.
Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regula-
tor will go into thermal shutdown. See Table 4-1 and the Thermal Considerations sub-section in Applications
Information for details.

DS20005720A-page 4  2017 Microchip Technology Inc.

 MIC5209
TABLE 1-1: ELECTRICAL CHARACTERISTICS (Note 1)
Electrical Characteristics: VIN = VOUT + 1V; IL = 100 μA; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C
except 0°C ≤ TJ ≤ +125°C for 1.8V ≤ VOUT ≤ 2.5V, unless noted.
Parameter Symbol Min. Typ. Max. Units Conditions
–1 — 1
Output Voltage Accuracy VOUT % Variation from nominal VOUT
–2 — 2
Output Voltage ∆VOUT/
— 40 — ppm/°C Note 2
Temperature Coefficient ∆T
∆VOUT/ — 0.009 0.05
Line Regulation % VIN = VOUT + 1V to 16V
VOUT — — 0.10
∆VOUT/ — 0.05 0.5
Load Regulation % IL = 100 µA to 500 mA, Note 3
VOUT — — 0.7
— 10 60
IL = 100 µA
— — 80
— 115 175
IL = 50 mA
VIN – — — 250
Dropout Voltage, (Note 4) mV
VOUT — 165 300
IL = 150 mA
— — 400
— 350 500
IL = 500 mA
— — 600
— 80 130
VEN ≥ 3.0V, IOUT = 100 µA
— — 170
µA
— 350 650
VEN ≥ 3.0V, IOUT = 50 mA
Ground Pin Current — — 900
IGND
(Note 5, Note 6) — 1.8 2.5
VEN ≥ 3.0V, IOUT = 150 mA
— — 3.0
mA
— 8 20
VEN ≥ 3.0V, IOUT = 500 mA
— — 25
Ground Pin Quiescent — 0.05 3 VEN ≤ 0.4V (shutdown)
IGND µA
Current, (Note 6) — 0.10 8 VEN ≤ 0.18V (shutdown)
Ripple Rejection PSRR — 75 — dB f = 120 Hz
— 700 900
Current Limit ILIMIT mA VOUT = 0V
— — 1000
∆VOUT/
Thermal Regulation — 0.05 — %/W Note 7
∆PD
VOUT = 2.5V, IOUT = 50 mA
— 500 —
COUT = 2.2 µF, CBYP = 0
Output Noise, (Note 8) en nV √Hz
IOUT = 50 mA, COUT = 2.2 µF
— 300 —
CBYP = 470 pF

 2017 Microchip Technology Inc. DS20005720A-page 5

MIC5209
TABLE 1-1: ELECTRICAL CHARACTERISTICS (Note 1) (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1V; IL = 100 μA; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C
except 0°C ≤ TJ ≤ +125°C for 1.8V ≤ VOUT ≤ 2.5V, unless noted.
Parameter Symbol Min. Typ. Max. Units Conditions
Enable Input
— — 0.4
Enable Input Logic-Low V VEN = Logic-low (Regulator shutdown)
VENL — — 0.18
Voltage
2.0 — — V VEN = Logic-high (Regulator enabled)
— 0.01 –1 VENL ≤ 0.4V
Enable Input Current IENL µA
— 0.01 –2 VENL ≤ 0.18V
— 5 20
VENH ≥ 2.0V
— — 25
— IENH µA
— — 30
VENH ≥ 16V
— — 50
Note 1: Specification for packaged product only.
2: Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total
temperature range.
3: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are
tested for load regulation in the load range from 100 µA to 500 mA. Changes in output voltage due to heat-
ing effects are covered by the thermal regulation specification.
4: Dropout Voltage is defined as the input to output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential.
5: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
6: VEN is the voltage externally applied to devices with the EN (enable) input pin. SOIC-8 (M) and DDPAK (U)
packages only.
7: Thermal regulation is the change in output voltage at a time “t” after a change in power dissipation is
applied, excluding load or line regulation effects. Specifications are for a 500 mA load pulse at VIN = 16V
for t = 10 ms.
8: CBYP is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust)
pin. SOIC-8 (M) and DDPAK (U) packages only.

DS20005720A-page 6  2017 Microchip Technology Inc.

 MIC5209
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Storage Temperature Range TS –65 — +150 °C —
Lead Temperature — — — +260 °C Soldering, 5 sec.
Junction Temperature TJ –40 — +125 °C 2.5V ≤ VOUT ≤ 15V
Junction Temperature TJ 0 — +125 °C 1.8V ≤ VOUT < 2.5V
Package Thermal Resistance
θJA — 62 — °C/W EIA/JEDEC
Thermal Resistance SOT-223 JES51-751-7,
θJC — 15 — °C/W 4 Layer Board
θJA — 50 — °C/W See Thermal
Thermal Resistance SOIC-8 Considerations for more
θJC — 25 — °C/W information.
θJA — 31.4 — °C/W EIA/JEDEC
Thermal Resistance DDPAK JES51-751-7,
θJC — 3 — °C/W 4 Layer Board
θJA — 64 — °C/W EIA/JEDEC
Thermal Resistance 3 mm x 3 mm
JES51-751-7,
DFN θJC — 12 — °C/W 4 Layer Board
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

 2017 Microchip Technology Inc. DS20005720A-page 7

MIC5209
2.0 TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

FIGURE 2-1: Power Supply Rejection FIGURE 2-4: Power Supply Rejection
Ratio. Ratio.

FIGURE 2-2: Power Supply Rejection FIGURE 2-5: Power Supply Rejection
Ratio. Ratio.

FIGURE 2-3: Power Supply Rejection FIGURE 2-6: Power Supply Rejection
Ratio. Ratio.

DS20005720A-page 8  2017 Microchip Technology Inc.

 MIC5209

FIGURE 2-7: Power Supply Ripple FIGURE 2-10: Noise Performance.

Rejection vs. Voltage Drop.

FIGURE 2-8: Power Supply Ripple FIGURE 2-11: Noise Performance.

Rejection vs. Voltage Drop.

FIGURE 2-9: Noise Performance. FIGURE 2-12: Dropout Voltage vs. Output
Current.

 2017 Microchip Technology Inc. DS20005720A-page 9

MIC5209

FIGURE 2-13: Ground Current vs. Output

Current.

FIGURE 2-14: Ground Current vs. Supply

Voltage.

FIGURE 2-15: Ground Current vs. Supply

Voltage.

DS20005720A-page 10  2017 Microchip Technology Inc.

 MIC5209
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

Pin Number Pin Number Pin Number Pin Number
Pin Name Description
8-Pin DFN SOT-223 SOIC-8 DDPAK
1, 2 1 2 2 IN Supply Input.
7 2, TAB 5, 6, 7, 8 3, TAB GND Ground: SOT-223 Pin 2 and TAB are
internally connected. SOIC-8 Pins 5
through 8 are internally connected.
3, 4 3 3 4 OUT Regulator Output: Pins 3 and 4 must
be tied together.
5 — — — NC Not Connected.
8 — 1 1 EN Enable (Input): CMOS-compatible
control input. Logic-High = Enable;
Logic-Low = Shutdown.
— — 4 (Fixed) 5 (Fixed) BYP Reference Bypass: Connect external
470 pF capacitor to GND to reduce
output noise. Can be left open. For
1.8V or 2.5V operation, see Application
Information.
6 — 4 (Adjustable) 5 (Adjustable) ADJ Adjust (Input): Feedback input.
Connect to resistive voltage-divider
network.
EP — — — ePad Exposed Thermal Pad: Connect to
GND for best thermal performance.

 2017 Microchip Technology Inc. DS20005720A-page 11

MIC5209
4.0 APPLICATIONS INFORMATION CBYP reduces the phase margin, the output capacitor
should be increased to at least 2.2 µF to maintain
stability.
4.1 Enable/Shutdown
The start-up speed of the MIC5209 is inversely
Enable is not available on devices in the SOT-223 (S) proportional to the size of the reference bypass
package. capacitor. Applications requiring a slow ramp-up of
Forcing EN (enable/shutdown) high (> 2V) enables the output voltage should consider larger values of CBYP.
regulator. EN is compatible with CMOS logic. If the Likewise, if rapid turn-on is necessary, consider
enable/shutdown feature is not required, connect EN to omitting CBYP.
IN (supply input). If output noise is not a major concern, omit CBYP and
leave BYP open.
4.2 Input Capacitor
A 1 µF capacitor should be placed from IN to GND if 4.6 Thermal Considerations
there is more than 10 inches of wire between the input The SOT-223 has a ground tab that allows it to
and the AC filter capacitor or if a battery is used as the dissipate more power than the SOIC-8 (refer to the
input. Slot-1 Power Supply sub-section for details). At +25°C
ambient, it will operate reliably at 1.6W dissipation with
4.3 Output Capacitor “worst-case” mounting (no ground plane, minimum
trace widths, and FR4 printed circuit board).
An output capacitor is required between OUT and GND
to prevent oscillation. The minimum size of the output Thermal resistance values for the SOIC-8 represent
capacitor is dependent upon whether a reference typical mounting on a 1”-square, copper-clad, FR4
bypass capacitor is used. 1 µF minimum is circuit board. For greater power dissipation, SOIC-8
recommended when CBYP is not used (see Figure 4-1). versions of the MIC5209 feature a fused internal lead
2.2 µF minimum is recommended when CBYP is 470 pF frame and die bonding arrangement that reduces
(see Figure 4-2). Larger values improve the regulator’s thermal resistance when compared to standard SOIC-8
transient response. packages.
The output capacitor should have an ESR (equivalent TABLE 4-1: MIC5209 THERMAL
series resistance) of about 1Ω and a resonant RESISTANCE
frequency above 1 MHz. Ultra-low-ESR and ceramic
capacitors can cause a low amplitude oscillation on the Package θJA θJC
output and/or underdamped transient response. Most SOT-223 (S) 62°C/W 15°C/W
tantalum or aluminum electrolytic capacitors are
SOIC-8 (M) 50°C/W 25°C/W
adequate; film types will work, but are more expensive.
Since many aluminum electrolytics have electrolytes DDPAK (U) 31.4°C/W 3°C/W
that freeze at about –30°C, solid tantalums are 3x3 DFN (ML) 64°C/W 12°C/W
recommended for operation below –25°C. Multilayer boards with a ground plane, wide traces near
At lower values of output current, less output the pads, and large supply-bus lines will have better
capacitance is needed for output stability. The thermal conductivity and will also allow additional
capacitor can be reduced to 0.47 µF for current below power dissipation.
10 mA or 0.33 µF for currents below 1 mA. For additional heat sink characteristics, refer to
Application Hint 17. For a full discussion of heat sinking
4.4 No-Load Stability and thermal effects on voltage regulators, refer to the
“Regulator Thermals” section of the Designing with
The MIC5209 will remain stable and in regulation with Low-Dropout Voltage Regulators handbook.
no load (other than the internal voltage divider) unlike
many other voltage regulators. This is especially
important in CMOSRAM keep-alive applications.
4.7 Low-Voltage Operation
The MIC5209-1.8 and MIC5209-2.5 require special
4.5 Reference Bypass Capacitor consideration when used in voltage-sensitive systems.
They may momentarily overshoot their nominal output
Reference bypass (BYP) is available only on devices in voltages unless appropriate output and bypass
SOIC-8 and DDPAK packages. capacitor values are chosen.
BYP is connected to the internal voltage reference. A During regulator power up, the pass transistor is fully
470 pF capacitor (CBYP) connected from BYP to GND saturated for a short time, while the error amplifier and
quiets this reference, providing a significant reduction voltage reference are being powered up more slowly
in output noise (ultra-low-noise performance). Because from the output (see Functional Diagrams). Selecting

DS20005720A-page 12  2017 Microchip Technology Inc.

 MIC5209
larger output and bypass capacitors allows additional 4.9 Adjustable Regulator Applications
time for the error amplifier and reference to turn on and
prevent overshoot. The MIC5209YM, MIC5209YU, and MIC5209YML can
be adjusted to a specific output voltage by using two
To ensure that no overshoot is present when starting up external resistors (Figure 4-3). The resistors set the
into a light load (100 µA), use a 4.7 µF output output voltage based on the equation:
capacitance and 470 pF bypass capacitance. This
slows the turn-on enough to allow the regulator to react
EQUATION 4-1:
and keep the output voltage from exceeding its nominal
value. At heavier loads, use a 10 µF output
capacitance and 470 pF bypass capacitance. Lower
V OUT = 1.242V   1 + -------
values of output and bypass capacitance can be used, R2
depending on the sensitivity of the system. R1

Applications that can withstand some overshoot on the

output of the regulator can reduce the output capacitor
and/or reduce or eliminate the bypass capacitor. This equation is correct due to the configuration of the
Applications that are not sensitive to overshoot due to bandgap reference. The bandgap voltage is relative to
power-on reset delays can use normal output and the output, as seen in the Functional Diagrams.
bypass capacitor configurations. Traditional regulators normally have the reference
Please note the junction temperature range of the voltage relative to ground; therefore, their equations
regulator with an output less than 2.5V (fixed and are different from the equation for the MIC5209Y.
adjustable) is 0°C to +125°C. Although ADJ is a high-impedance input and, for best
performance, R2 should not exceed 470 kΩ.
4.8 Fixed Regulator Applications
MIC5209YM
Figure 4-1 shows a basic MIC5209-x.xYM (SOIC-8)
VIN 2 3 VOUT
fixed-voltage regulator circuit. See Figure 5 for a similar IN OUT
configuration using the more thermally-efficient 1 4 R1
EN ADJ
MIC5209-x.xYS (SOT-223). A 1 µF minimum output
1μF
capacitor is required for basic fixed-voltage GND
applications. 5-8
R2

MIC5209-x.xYM
VIN 2 3 VOUT
IN OUT FIGURE 4-3: Low-Noise
1 4 Adjustable-Voltage Application.
EN BYP
1μF Figure 4-4 includes the optional 470 pF bypass
GND capacitor from ADJ to GND to reduce output noise.
5-8

MIC5209YM
VIN 2 3 VOUT
IN OUT
FIGURE 4-1: Low-Noise Fixed-Voltage
Application. 1
EN ADJ
4 R1

Figure 4-2 includes the optional 470 pF noise bypass GND

2.2μF
capacitor between BYP and GND to reduce output 5-8
noise. Note that the minimum value of COUT must be R2
470pF
increased when the bypass capacitor is used.

MIC5209-x.xYM
2 3
FIGURE 4-4: Ultra-Low-Noise Adjustable
VIN IN OUT VOUT
Application.
1 4
EN BYP
2.2μF 4.10 Slot-1 Power Supply
GND
5-8 Intel’s Pentium II processors have a requirement for a
470pF
2.5V ±5% power supply for a clock synthesizer and its
associated loads. The current requirement for the 2.5V
FIGURE 4-2: Ultra-Low-Noise supply is dependent upon the clock synthesizer used,
Fixed-Voltage Application.

 2017 Microchip Technology Inc. DS20005720A-page 13

MIC5209
the number of clock outputs, and the type of level So:
shifter (from core logic levels to 2.5V levels). Intel
estimates a “worst-case” load of 320 mA. EQUATION 4-3:
The MIC5209 was designed to provide the 2.5V power
requirement for Slot-1 applications. Its guaranteed
performance of 2.5V ±3% at 500 mA allows adequate   3.6V – 2.375V   320mA  +  3.6V  4mA 
margin for all systems, and the dropout voltage of
500 mV means that it operates from a “worst-case”
3.3V supply where the voltage can be as low as 3.0V.

Resulting in:
MIC5209-x.xYS
VIN 1 3 VOUT
IN OUT EQUATION 4-4:

CIN COUT
GND P D = 407mW
0.1μF 22μF
2, TAB

FIGURE 4-5: Slot-1 Power Supply. Using the maximum junction temperature of +125°C
and a θJC of 15°C/W for the SOT-223, 25°C/W for the
A Slot-1 power supply (Figure 4-5) is easy to SOIC-8, or 3°C/W for the DDPAK package, the
implement. Only two capacitors are necessary, and following worst-case heat-sink thermal resistance (θSA)
their values are not critical. CIN bypasses the internal requirements are:
circuitry and should be at least 0.1 µF. COUT provides
output filtering, improves transient response, and
EQUATION 4-5:
compensates the internal regulator control loop. Its
value should be at least 22 µF. CIN and COUT can be
increased as much as desired.
T J  MAX  – T A
 JA = -------------------------------
-
4.10.1 SLOT-1 POWER SUPPLY POWER PD
DISSIPATION Where: θSA = θJA - θJC
Powered from a 3.3V supply, the Slot-1 power supply
illustrated in Figure 4-5 has a nominal efficiency of
Table 4-2 and Figure 4-6 show that the Slot-1 power
75%. At the maximum anticipated Slot-1 load
supply application can be implemented with a minimum
(320 mA), the nominal power dissipation is only
footprint layout.
256 mW.
The SOT-223 package has sufficient thermal TABLE 4-2: MAXIMUM ALLOWABLE
characteristics for wide design margins when mounted THERMAL RESISTANCE
on a single-layer copper-clad printed circuit board. The
TA +40°C +50°C +60°C +70°C
power dissipation of the MIC5209 is calculated using
the voltage drop across the device output current plus θJA Limit 209°C/W 184°C/W 160°C/W 135°C/W
supply voltage ground current. θSA 194°C/W 169°C/W 145°C/W 120°C/W
Considering “worst-case” tolerances, the power SOT-223
dissipation could be as high as: θSA 184°C/W 159°C/W 135°C/W 110°C/W
SOIC-8
EQUATION 4-2: θSA 206°C/W 181°C/W 157°C/W 132°C/W
DDPAK
Figure 4-6 shows the necessary copper pad area to
 V IN  MAX  – V OUT  MAX    I OUT + V IN  MAX   I GND obtain specific heatsink thermal resistance (θSA)
values. The θSA values highlighted in Table 4-2 require
much less than 500 mm2 of copper and, per Figure 4-6,
can be easily accomplished with the minimum footprint.

DS20005720A-page 14  2017 Microchip Technology Inc.

 MIC5209

70

THERMAL RESISTANCE (ºC/W)

60

50

40

30

20

10

0
0 2000 4000 6000

COPPER HEAT SINK AREA (mm2)

FIGURE 4-6: PCB Heatsink Thermal

Resistance.

 2017 Microchip Technology Inc. DS20005720A-page 15

MIC5209
5.0 PACKAGING INFORMATION
5.1 Package Marking Information

5-Pin SOT-223* Example

XXXX 5209
XXXXYWWP 25YS722P

SOIC-8 (Fixed)* Example

XXXX 5209
-X.XXX -3.3YM
WNNN 9651

SOIC-8 (Adj.)* Example

XXX MIC
XXXXXX 5209YM
WNNN 1312

5-Pin DDPAK (Fixed)* Example

XXXX 5209
-X.XXX -3.3YU
WNNNP 5492P

5-Pin DDPAK (Adj)* Example

XXX MIC
XXXXXX 5209YU
WNNNP 1975P

8-Pin DFN* Example

X Y
XXXX 5209
NNN 916

DS20005720A-page 16  2017 Microchip Technology Inc.

 MIC5209

Legend: XX...X Product code or customer-specific information

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
e3 Pb-free JEDEC® designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.

 2017 Microchip Technology Inc. DS20005720A-page 17

MIC5209
3-Lead SOT-223 Package Outline and Recommended Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.

DS20005720A-page 18  2017 Microchip Technology Inc.

 MIC5209
5-Lead DDPAK Package Outline and Recommended Land Pattern

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E E1

L1

D1

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TOP VIEW
CHAMFER
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 2017 Microchip Technology Inc. DS20005720A-page 19

MIC5209

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

DS20005720A-page 20  2017 Microchip Technology Inc.

 MIC5209
8-Lead 3 mm x 3 mm DFN Package Outline and Recommended Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.

 2017 Microchip Technology Inc. DS20005720A-page 21

MIC5209

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.

DS20005720A-page 22  2017 Microchip Technology Inc.

 MIC5209
8-Lead SOIC Package Outline and Recommended Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.

 2017 Microchip Technology Inc. DS20005720A-page 23

MIC5209
NOTES:

DS20005720A-page 24  2017 Microchip Technology Inc.

 MIC5209
APPENDIX A: REVISION HISTORY

Revision A (February 2017)

• Converted Micrel document MIC5209 to Micro-
chip data sheet DS20005720A.
• Minor text changes throughout.
• Updated TO-263-5 packaging spec to DDPAK.
• Updated Thermal Resistance values to be current
with Microchip packaging.

 2017 Microchip Technology Inc. DS20005720A-page 25

MIC5209
NOTES:

DS20005720A-page 26  2017 Microchip Technology Inc.

 MIC5209
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
PART NO. – X.X X X – XX
a) MIC5209-1.8YM-TR: 500 mA Low-Noise LDO
Device Voltage Temperature Package Media Type Regulator, 1.8V Voltage,
–40°C to +125°C Temp. Range,
8-Lead SOIC, 2,500/Reel
Device: MIC5209: 500 mA Low Noise LDO Regulator b) MIC5209-1.8YM: 500 mA Low-Noise LDO
Regulator, 1.8V Voltage,
–40°C to +125°C Temp. Range,
Voltage: (blank) = Adjustable
1.8 = 1.8V 8-Lead SOIC, 95/Tube
2.5 = 2.5V c) MIC5209-2.5YU-TR: 500 mA Low-Noise LDO
3.0 = 3.0V Regulator, 2.5V Voltage,
3.3 = 3.3V
–40°C to +125°C Temp. Range,
3.6 = 3.6V
4.2 = 4.2V 5-Lead DDPAK, 750/Reel
5.0 = 5.0V d) MIC5209-2.5YU: 500 mA Low-Noise LDO
Regulator, 2.5V Voltage,
Temperature: Y = –40°C to +125°C –40°C to +125°C Temp. Range,
5-Lead DDPAK, 50/Tube
e) MIC5209-3.0YS-TR: 500 mA Low-Noise LDO
Package: M = 8-Lead SOIC
ML = 8-Lead DFN Regulator, 3.0V Voltage,
S = 3-Lead SOT-223 –40°C to +125°C Temp. Range,
U = 5-Lead DDPAK 3-Lead SOT-223, 2,500/Reel
f) MIC5209-3.0YS: 500 mA Low-Noise LDO
Media Type: TR = 2,500/Reel (SOIC, SOT-223) Regulator, 3.0V Voltage,
TR = 750/Reel (DDPAK) –40°C to +125°C Temp. Range,
TR = 5,000/Reel (DFN)
3-Lead SOT-223, 78/Tube
T5 = 500/Reel (DFN)
(blank)= 50/Tube (DDPAK) g) MIC5209YML-TR: 500 mA Low-Noise LDO
(blank)= 78/Tube (SOT-223) Regulator, Adj. Voltage,
(blank)= 95/Tube (SOIC) –40°C to +125°C Temp. Range,
8-Lead DFN, 5,000/Reel
h) MIC5209YML-T5: 500 mA Low-Noise LDO
Regulator, Adj. Voltage,
–40°C to +125°C Temp. Range,
8-Lead DFN, 500/Reel

Note 1: Tape and Reel identifier only appears in the

catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.

 2017 Microchip Technology Inc. DS20005720A-page 27

MIC5209
NOTES:

DS20005720A-page 28  2017 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device Trademarks

applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, AnyRate, AVR,
and may be superseded by updates. It is your responsibility to AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
ensure that your application meets with your specifications. CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
MICROCHIP MAKES NO REPRESENTATIONS OR KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
WARRANTIES OF ANY KIND WHETHER EXPRESS OR maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
IMPLIED, WRITTEN OR ORAL, STATUTORY OR OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
OTHERWISE, RELATED TO THE INFORMATION, Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
INCLUDING BUT NOT LIMITED TO ITS CONDITION, Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
QUALITY, PERFORMANCE, MERCHANTABILITY OR trademarks of Microchip Technology Incorporated in the U.S.A.
FITNESS FOR PURPOSE. Microchip disclaims all liability and other countries.
arising from this information and its use. Use of Microchip ClockWorks, The Embedded Control Solutions Company,
devices in life support and/or safety applications is entirely at EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
the buyer’s risk, and the buyer agrees to defend, indemnify and mTouch, Precision Edge, and Quiet-Wire are registered
hold harmless Microchip from any and all damages, claims, trademarks of Microchip Technology Incorporated in the U.S.A.
suits, or expenses resulting from such use. No licenses are Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
conveyed, implicitly or otherwise, under any Microchip Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
intellectual property rights unless otherwise stated. CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
Microchip received ISO/TS-16949:2009 certification for its worldwide the U.S.A.
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California Silicon Storage Technology is a registered trademark of Microchip
and India. The Company’s quality system processes and procedures Technology Inc. in other countries.
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and GestIC is a registered trademark of Microchip Technology
analog products. In addition, Microchip’s quality system for the design Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
and manufacture of development systems is ISO 9001:2000 certified.
Inc., in other countries.
All other trademarks mentioned herein are property of their

QUALITY MANAGEMENT SYSTEM respective companies.

© 2017, Microchip Technology Incorporated, All Rights Reserved.
CERTIFIED BY DNV ISBN: 978-1-5224-1417-9

== ISO/TS 16949 ==

 2017 Microchip Technology Inc. DS20005720A-page 29

 Worldwide Sales and Service
AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
Corporate Office Asia Pacific Office China - Xiamen Austria - Wels
2355 West Chandler Blvd. Suites 3707-14, 37th Floor Tel: 86-592-2388138 Tel: 43-7242-2244-39
Chandler, AZ 85224-6199 Tower 6, The Gateway Fax: 86-592-2388130 Fax: 43-7242-2244-393
Tel: 480-792-7200 Harbour City, Kowloon China - Zhuhai Denmark - Copenhagen
Fax: 480-792-7277 Hong Kong Tel: 86-756-3210040 Tel: 45-4450-2828
Technical Support: Tel: 852-2943-5100 Fax: 86-756-3210049 Fax: 45-4485-2829
http://www.microchip.com/ Fax: 852-2401-3431 India - Bangalore Finland - Espoo
support
Australia - Sydney Tel: 91-80-3090-4444 Tel: 358-9-4520-820
Web Address:
Tel: 61-2-9868-6733 Fax: 91-80-3090-4123 France - Paris
www.microchip.com Fax: 61-2-9868-6755 India - New Delhi Tel: 33-1-69-53-63-20
Atlanta Tel: 91-11-4160-8631 Fax: 33-1-69-30-90-79
China - Beijing
Duluth, GA
Tel: 86-10-8569-7000 Fax: 91-11-4160-8632 France - Saint Cloud
Tel: 678-957-9614
Fax: 86-10-8528-2104 India - Pune Tel: 33-1-30-60-70-00
Fax: 678-957-1455
China - Chengdu Tel: 91-20-3019-1500 Germany - Garching
Austin, TX Tel: 86-28-8665-5511
Tel: 512-257-3370 Japan - Osaka Tel: 49-8931-9700
Fax: 86-28-8665-7889 Tel: 81-6-6152-7160 Germany - Haan
Boston Fax: 81-6-6152-9310 Tel: 49-2129-3766400
China - Chongqing
Westborough, MA
Tel: 86-23-8980-9588 Japan - Tokyo Germany - Heilbronn
Tel: 774-760-0087 Fax: 86-23-8980-9500
Fax: 774-760-0088 Tel: 81-3-6880- 3770 Tel: 49-7131-67-3636
China - Dongguan Fax: 81-3-6880-3771 Germany - Karlsruhe
Chicago Tel: 86-769-8702-9880 Korea - Daegu Tel: 49-721-625370
Itasca, IL
China - Guangzhou Tel: 82-53-744-4301 Germany - Munich
Tel: 630-285-0071
Fax: 630-285-0075 Tel: 86-20-8755-8029 Fax: 82-53-744-4302 Tel: 49-89-627-144-0
China - Hangzhou Korea - Seoul Fax: 49-89-627-144-44
Dallas
Tel: 86-571-8792-8115 Tel: 82-2-554-7200 Germany - Rosenheim
Addison, TX
Fax: 86-571-8792-8116 Fax: 82-2-558-5932 or Tel: 49-8031-354-560
Tel: 972-818-7423
Fax: 972-818-2924 China - Hong Kong SAR 82-2-558-5934
Israel - Ra’anana
Tel: 852-2943-5100 Malaysia - Kuala Lumpur Tel: 972-9-744-7705
Detroit
Fax: 852-2401-3431 Tel: 60-3-6201-9857
Novi, MI Italy - Milan
China - Nanjing Fax: 60-3-6201-9859
Tel: 248-848-4000 Tel: 39-0331-742611
Tel: 86-25-8473-2460 Malaysia - Penang Fax: 39-0331-466781
Houston, TX
Tel: 281-894-5983 Fax: 86-25-8473-2470 Tel: 60-4-227-8870
Italy - Padova
China - Qingdao Fax: 60-4-227-4068
Indianapolis Tel: 39-049-7625286
Tel: 86-532-8502-7355 Philippines - Manila
Noblesville, IN Netherlands - Drunen
Fax: 86-532-8502-7205 Tel: 63-2-634-9065
Tel: 317-773-8323 Tel: 31-416-690399
Fax: 317-773-5453 China - Shanghai Fax: 63-2-634-9069 Fax: 31-416-690340
Tel: 317-536-2380 Tel: 86-21-3326-8000 Singapore
Norway - Trondheim
Fax: 86-21-3326-8021 Tel: 65-6334-8870
Los Angeles Tel: 47-7289-7561
China - Shenyang Fax: 65-6334-8850
Mission Viejo, CA Poland - Warsaw
Tel: 949-462-9523 Tel: 86-24-2334-2829 Taiwan - Hsin Chu
Tel: 48-22-3325737
Fax: 949-462-9608 Fax: 86-24-2334-2393 Tel: 886-3-5778-366
Fax: 886-3-5770-955 Romania - Bucharest
Tel: 951-273-7800 China - Shenzhen
Tel: 40-21-407-87-50
Raleigh, NC Tel: 86-755-8864-2200 Taiwan - Kaohsiung
Tel: 919-844-7510 Fax: 86-755-8203-1760 Tel: 886-7-213-7830 Spain - Madrid
Tel: 34-91-708-08-90
New York, NY China - Wuhan Taiwan - Taipei
Fax: 34-91-708-08-91
Tel: 631-435-6000 Tel: 86-27-5980-5300 Tel: 886-2-2508-8600
Fax: 86-27-5980-5118 Fax: 886-2-2508-0102 Sweden - Gothenberg
San Jose, CA Tel: 46-31-704-60-40
Tel: 408-735-9110 China - Xian Thailand - Bangkok
Tel: 408-436-4270 Tel: 86-29-8833-7252 Tel: 66-2-694-1351 Sweden - Stockholm
Fax: 86-29-8833-7256 Fax: 66-2-694-1350 Tel: 46-8-5090-4654
Canada - Toronto
Tel: 905-695-1980 UK - Wokingham
Fax: 905-695-2078 Tel: 44-118-921-5800
Fax: 44-118-921-5820

DS20005720A-page 30  2017 Microchip Technology Inc.

11/07/16
Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Microchip:
MIC5209-3.3YM MIC5209-4.2YS MIC5209-3.3YU MIC5209YM MIC5209YU MIC5209-5.0YS MIC5209-5.0YM
MIC5209-2.5YS MIC5209-5.0YU MIC5209-3.3YS MIC5209-1.8YM MIC5209-2.5YM MIC5209-3.0YS MIC5209-
3.6YS MIC5209-3.6YM MIC5209-1.8YU MIC5209-2.5YU MIC5209-3.0YM MIC5209-3.0YU MIC5209-5.0YU-TR
MIC5209-2.5YU-TR MIC5209YM-TR MIC5209-3.3YS-TR MIC5209-3.3YM-TR MIC5209-3.3YU-TR MIC5209-5.0YS-
TR MIC5209-2.5YM-TR MIC5209-4.2YS-TR MIC5209-5.0YM-TR MIC5209-3.0YS-TR MIC5209-3.6YS-TR MIC5209-
3.6YM-TR MIC5209-3.0YU-TR MIC5209-1.8YU-TR MIC5209-1.8YM-TR MIC5209-3.0YM-TR MIC5209-3.6YU-TR
MIC5209YML-TR MIC5209YU-TR MIC5209-2.5YS-TR