Dmn66D0Ldw: Dual N-Channel Enhancement Mode Mosfet
Dmn66D0Ldw: Dual N-Channel Enhancement Mode Mosfet
Dmn66D0Ldw: Dual N-Channel Enhancement Mode Mosfet
• Small Surface Mount Package (Lead Free Plating). Solderable per MIL-STD-202, Method 208
• ESD Protected Gate, 1KV (HBM) • Terminal Connections: See Diagram
• Lead Free/RoHS Compliant (Note 1) • Weight: 0.006 grams (approximate)
• Qualified to AEC-Q101 Standards for High Reliability
SOT363 D2 G1 S1
S2 G2 D1
Marking Information
0.6 1
VDS = 5V
0.5 Pulsed
0.3 0.1
0.2
TA = 150°C
T A = -55°C
0 0.01
1 2 3 4 5
VGS, GATE SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristics
9 2.5
8
RDS(ON), STATIC DRAIN-SOURCE
2.0
7
ON-RESISTANCE (Ω)
6
1.5
4 VGS = 5V 1.0
3
VGS = 10V 0.5
2
1 0
0 0.1 0.2 0.3 0.4 0.5 0.6
ID, DRAIN-SOURCE CURRENT (A)
Fig. 3 On-Resistance vs. Drain Current & Gate Voltage
2.0 100
1.9
VGS(TH), GATE THRESHOLD VOLTAGE (V)
1.8 ID = 250µA
CT, CAPACITANCE (pF)
1.7
Ciss
1.6
1.5 10
1.4
1.3
Coss
1.2
1.1
Crss
1.0 1
-50 -25 0 25 50 75 100 125 150 0 5 10 15 20 25 30 35 40
TA, AMBIENT TEMPERATURE (°C) VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 5 Gate Threshold Variation vs. Ambient Temperature Fig. 6 Typical Total Capacitance
1
IS, SOURCE CURRENT (A)
0.1
TA = 150°C
NEW PRODUCT
T A = 125°C
0.01 TA = 85°C
0.001 TA = 25°C
TA = -55°C
0.0001
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 7 Reverse Drain Current vs. Source-Drain Voltage
SOT363
Dim Min Max
B C A 0.10 0.30
B 1.15 1.35
C 2.00 2.20
D 0.65 Typ
H F 0.40 0.45
H 1.80 2.20
K M J 0 0.10
K 0.90 1.00
L 0.25 0.40
J
D F L M 0.10 0.22
α 0° 8°
All Dimensions in mm
C2 C2
Dimensions Value (in mm)
Z 2.5
G 1.3
X 0.42
G C1
Z Y 0.6
C1 1.9
C2 0.65
Y
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