MSP430FR2355 etcTI

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MSP430FR2355, MSP430FR2353, MSP430FR2155, MSP430FR2153

SLASEC4D – MAY 2018 – REVISED DECEMBER 2019
MSP430FR235x, MSP430FR215x Mixed-Signal Microcontrollers

1 Device Overview
1.1
1
Features
• Embedded microcontroller – Configurable high-power and low-power
– 16-bit RISC architecture up to 24 MHz modes
– Extended temperature: –40°C to 105°C – Configurable PGA mode supports
– Wide supply voltage range from 3.6 V down to – Noninverting mode: ×1, ×2, ×3, ×5, ×9,
1.8 V (operational voltage is restricted by SVS ×17, ×26, ×33
levels, see VSVSH- and VSVSH+ in PMM, SVS and – Inverting mode: ×1, ×2, ×4, ×8, ×16, ×25,
BOR) ×32
• Optimized low-power modes (at 3 V) – Built-in 12-bit reference DAC for offset and
– Active mode: 142 µA/MHz bias settings
– Standby: – 12-bit voltage DAC mode with optional
– LPM3 with 32768-Hz crystal: 1.43 µA (with references
SVS enabled) • Intelligent digital peripherals
– LPM3.5 with 32768-Hz crystal: 620 nA (with – Three 16-bit timers with three capture/compare
SVS enabled) registers each (Timer_B3)
– Shutdown (LPM4.5): 42 nA (with SVS disabled) – One 16-bit timer with seven capture/compare
• Low-power ferroelectric RAM (FRAM) registers each (Timer_B7)
– Up to 32KB of nonvolatile memory – One 16-bit counter-only real-time clock counter
(RTC)
– Built-in error correction code (ECC)
– 16-bit cyclic redundancy checker (CRC)
– Configurable write protection
– Interrupt compare controller (ICC) enabling
– Unified memory of program, constants, and nested hardware interrupts
storage
– 32-bit hardware multiplier (MPY32)
– 1015 write cycle endurance
– Manchester codec (MFM)
– Radiation resistant and nonmagnetic
• Enhanced serial communications
• Ease of use
– Two enhanced USCI_A (eUSCI_A) modules
– 20KB ROM library includes driver libraries and support UART, IrDA, and SPI
FFT libraries
– Two enhanced USCI_B (eUSCI_B) modules
• High-performance analog support SPI and I2C
– One 12-channel 12-bit analog-to-digital • Clock system (CS)
converter (ADC)
– On-chip 32-kHz RC oscillator (REFO)
– Internal shared reference (1.5, 2.0, or 2.5 V)
– On-chip 24-MHz digitally controlled oscillator
– Sample-and-hold 200 ksps (DCO) with frequency locked loop (FLL)
– Two enhanced comparators (eCOMP) – ±1% accuracy with on-chip reference at room
– Integrated 6-bit digital-to-analog converter temperature
(DAC) as reference voltage – On-chip very low-frequency 10-kHz oscillator
– Programmable hysteresis (VLO)
– Configurable high-power and low-power – On-chip high-frequency modulation oscillator
modes (MODOSC)
– One with fast 100-ns response time – External 32-kHz crystal oscillator (LFXT)
– One with 1-µs response time with 1.5-µA low – External high-frequency crystal oscillator up to
power 24 MHz (HFXT)
– Four smart analog combo (SAC-L3) – Programmable MCLK prescaler of 1 to 128
(MSP430FR235x devices only) – SMCLK derived from MCLK with programmable
– Supports General-Purpose Operational prescaler of 1, 2, 4, or 8
Amplifier (OA)
– Rail-to-rail input and output
– Multiple input selections
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SLASEC4D – MAY 2018 – REVISED DECEMBER 2019 www.ti.com
• General input/output and pin functionality • Family members (also see Device Comparison)
– 44 I/Os on 48-pin package – MSP430FR2355: 32KB of program FRAM,
– 32 interrupt pins (P1, P2, P3, and P4) can wake 512 bytes of data FRAM, 4KB of RAM
MCU from LPMs – MSP430FR2353: 16KB of program FRAM,
• Development tools and software (also see Tools 512 bytes of data FRAM, 2KB of RAM
and Software) – MSP430FR2155: 32KB of program FRAM,
– LaunchPad™ development kit 512 bytes of data FRAM, 4KB of RAM
(MSP‑EXP430FR2355) – MSP430FR2153: 16KB of program FRAM,
– Target development board (MSP‑TS43048PT) 512 bytes of data FRAM, 2KB of RAM
– Free professional development environments • Package options
– 48-pin: LQFP (PT)
– 40-pin: VQFN (RHA)
– 38-pin: TSSOP (DBT)
– 32-pin: VQFN (RSM)
1.2 Applications
• Smoke and heat detectors • Wired industrial communications
• Sensor transmitters • Optical modules
• Circuit breakers • Battery pack management
• Sensor signal conditioning • Toll tags
1.3 Description
MSP430FR215x and MSP430FR235x microcontrollers (MCUs) are part of the MSP430™ MCU value line
portfolio of ultra-low-power low-cost devices for sensing and measurement applications. MSP430FR235x
MCUs integrate four configurable signal-chain modules called smart analog combos, each of which can be
used as a 12-bit DAC or a configurable programmable-gain Op-Amp to meet the specific needs of a
system while reducing the BOM and PCB size. The device also includes a 12-bit SAR ADC and two
comparators. The MSP430FR215x and MSP430FR235x MCUs all support an extended temperature
range from –40° up to 105°C, so higher temperature industrial applications can benefit from the devices'
FRAM data-logging capabilities. The extended temperature range allows developers to meet requirements
of applications such as smoke detectors, sensor transmitters, and circuit breakers.
The MSP430FR215x and MSP430FR235x MCUs feature a powerful 16-bit RISC CPU, 16-bit registers,
and a constant generator that contribute to maximum code efficiency. The digitally controlled oscillator
(DCO) allows the device to wake up from low-power modes to active mode typically in less than 10 µs.
The MSP430 ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM
and a holistic ultra-low-power system architecture, allowing system designers to increase performance
while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and
endurance of RAM with the nonvolatile behavior of flash.
MSP430FR215x and MSP430FR235x MCUs are supported by an extensive hardware and software
ecosystem with reference designs and code examples to get your design started quickly. Development
kits include the MSP-EXP430FR2355 LaunchPad™ development kit and the MSP-TS430PT48 48-pin
target development board. TI also provides free MSP430Ware™ software, which is available as a
component of Code Composer Studio™ IDE desktop and cloud versions within TI Resource Explorer. The
MSP430 MCUs are also supported by extensive online collateral, training, and online support through the
E2E™ support forums.
For complete module descriptions, see the MSP430FR4xx and MSP430FR2xx Family User's Guide.
2 Device Overview Copyright © 2018–2019, Texas Instruments Incorporated

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Product Folder Links: MSP430FR2355 MSP430FR2353 MSP430FR2155 MSP430FR2153
www.ti.com SLASEC4D – MAY 2018 – REVISED DECEMBER 2019
Device Information (1)

OPERATING
PART NUMBER PACKAGE BODY SIZE (2)
TEMPERATURE
MSP430FR2355TPT
MSP430FR2353TPT
–40°C to 105°C LQFP (48) 7 mm × 7 mm
MSP430FR2155TPT
MSP430FR2153TPT
MSP430FR2355TRHA
MSP430FR2353TRHA
–40°C to 105°C VQFN (40) 6 mm × 6 mm
MSP430FR2155TRHA
MSP430FR2153TRHA
MSP430FR2355TDBT
MSP430FR2353TDBT
–40°C to 105°C TSSOP (38) 9.7 mm × 4.4 mm
MSP430FR2155TDBT
MSP430FR2153TDBT
MSP430FR2355TRSM
MSP430FR2353TRSM
–40°C to 105°C VQFN (32) 4 mm × 4 mm
MSP430FR2155TRSM
MSP430FR2153TRSM
(1) For the most current part, package, and ordering information, see the Package Option Addendum in
Section 9, or see the TI web site at www.ti.com.
(2) The sizes shown here are approximations. For the package dimensions with tolerances, see the
Mechanical Data in Section 9.
CAUTION
System-level ESD protection must be applied in compliance with the device-
level ESD specification to prevent electrical overstress or disturbing of data or
code memory. See MSP430™ System-Level ESD Considerations for more
information.
Copyright © 2018–2019, Texas Instruments Incorporated Device Overview 3

1.4 Functional Block Diagrams

Figure 1-1 shows the MSP430FR235x functional block diagram.
XIN XOUT P1.x, P2.x P3.x, P4.x P5.x, P6.x
HF, LF XT1
ADC SAC0, SAC1, eCOMP0 I/O Ports I/O Ports
I/O Ports
SAC2, SAC3 eCOMP1 P1, P2 P3, P4
DVCC FRAM RAM P5, P6
ROM Up to 12-ch 2×8 IOs 2×8 IOs
1×5 IOs
Power 24-MHz Single-end Configurable Enhanced Interrupt Interrupt
32KB + 512B 4KB 1×7 IOs
DVSS Management Clock 20KB 12 bit OA, PGA, Comparator and Wakeup and Wakeup
16KB + 512B 2KB PC
Module System 200 ksps 12-bit DAC with 6-bit PA PB
1×12 IOs
Combo DAC 1×16 IOs 1×16 IOs
RST/NMI
MAB
24-MHz CPU
including
16 registers MDB
EEM
RTC BAKMEM
SYS TB0
CRC16 MPY32 ICC Counter
TCK Infrared TB1 TB3 eUSCI_A0
eUSCI_B0 32 Bytes
MFM TB2 Timer_B eUSCI_A1
TMS 16-bit eUSCI_B1 16-bit Backup
JTAG Timer_B
TDI/TCLK Cyclic 32-bit Interrupt Real-Time Memory
7 CC (UART, 2
TDO Redundancy Hardware Compare (SPI, I C) Clock
3 CC Registers IrDA, SPI)
Check Multiplier Controller
SBWTCK Registers
SBW Watchdog LPM3.5 Domain
SBWTDIO
Figure 1-1. MSP430FR235x Functional Block Diagram
Figure 1-2 shows the MSP430FR215x functional block diagram.

XIN XOUT P1.x, P2.x P3.x, P4.x P5.x, P6.x
HF, LF XT1
ADC eCOMP0 I/O Ports I/O Ports
I/O Ports
eCOMP1 P1, P2 P3, P4
DVCC FRAM RAM P5, P6
ROM Up to 12-ch 2×8 IOs 2×8 IOs
1×5 IOs
Power 24-MHz Single-end Enhanced Interrupt Interrupt
32KB + 512B 4KB 1×7 IOs
DVSS Management Clock 20KB 12 bit Comparator and Wakeup and Wakeup
16KB + 512B 2KB PC
Module System 200 ksps with 6-bit PA PB
1×12 IOs
DAC 1×16 IOs 1×16 IOs
RST/NMI
MAB
24-MHz CPU
including
16 registers MDB
EEM
RTC BAKMEM
SYS TB0
CRC16 MPY32 ICC Counter
TCK Infrared TB1 TB3 eUSCI_A0
eUSCI_B0 32 Bytes
MFM TB2 Timer_B eUSCI_A1
TMS 16-bit eUSCI_B1 16-bit Backup
JTAG Timer_B
TDI/TCLK Cyclic 32-bit Interrupt Real-Time Memory
7 CC (UART, 2
TDO Redundancy Hardware Compare (SPI, I C) Clock
3 CC Registers IrDA, SPI)
Check Multiplier Controller
SBWTCK Registers
SBW Watchdog LPM3.5 Domain
SBWTDIO
Figure 1-2. MSP430FR215x Functional Block Diagram

• The MCU has one main power pair of DVCC and DVSS pins that supplies digital and analog modules.
Recommended bypass and decoupling capacitors are 4.7 µF to 10 µF and 0.1 µF, respectively, with
±5% accuracy.
• P1, P2, P3, and P4 feature the pin-interrupt function and can wake the MCU from all LPMs, including
LPM4, LPM3.5, and LPM4.5.
• Each Timer_B3 has three capture/compare registers. Only CCR1 and CCR2 are externally connected.
Timer_B7 has seven capture/compare registers. Only CCR1 to CCR6 are externally connected. CCR0
registers can be used only for internal period timing and interrupt generation.
• In LPM3.5, the RTC counter and backup memory can be functional while the rest of peripherals are off.
4 Device Overview Copyright © 2018–2019, Texas Instruments Incorporated
Table of Contents
1 Device Overview ......................................... 1 6 Detailed Description ................................... 61
1.1 Features .............................................. 1 6.1 CPU ................................................. 61
1.2 Applications ........................................... 2 6.2 Operating Modes .................................... 61
1.3 Description ............................................ 2 6.3 Interrupt Vector Addresses.......................... 63
1.4 Functional Block Diagrams ........................... 4 6.4 Memory Organization ............................... 65
2 Revision History ......................................... 6 6.5 Bootloader (BSL) .................................... 65
3 Device Comparison ..................................... 8 6.6 JTAG Standard Interface............................ 66
3.1 Related Products ..................................... 9 6.7 Spy-Bi-Wire Interface (SBW)........................ 66
4 Terminal Configuration and Functions ............ 10 6.8 FRAM................................................ 66
4.1 Pin Diagrams ........................................ 10 6.9 Memory Protection .................................. 67
4.2 Pin Attributes ........................................ 18 6.10 Peripherals .......................................... 67
4.3 Signal Descriptions .................................. 22 6.11 Input/Output Diagrams .............................. 95
4.4 Pin Multiplexing ..................................... 26 6.12 Device Descriptors (TLV) .......................... 107
4.5 Buffer Type .......................................... 26 6.13 Identification........................................ 109
4.6 Connection of Unused Pins ......................... 26 7 Applications, Implementation, and Layout ...... 110
5 Specifications ........................................... 27 7.1 Device Connection and Layout Fundamentals .... 110
5.1 Absolute Maximum Ratings ........................ 27 7.2 Peripheral- and Interface-Specific Design
5.2 ESD Ratings ........................................ 27 Information ......................................... 113
5.3 Recommended Operating Conditions ............... 27 7.3 ROM Libraries ..................................... 114
5.4 Active Mode Supply Current Into VCC Excluding 7.4 Typical Applications ................................ 114
External Current ..................................... 28 8 Device and Documentation Support .............. 115
5.5 Active Mode Supply Current Per MHz .............. 28 8.1 Getting Started ..................................... 115
5.6 Low-Power Mode LPM0 Supply Currents Into VCC 8.2 Device Nomenclature .............................. 115
Excluding External Current.......................... 28 8.3 Tools and Software ................................ 116
5.7 Low-Power Mode LPM3 and LPM4 Supply Currents
8.4 Documentation Support ............................ 118
(Into VCC) Excluding External Current .............. 29
8.5 Related Links ...................................... 119
5.8 Low-Power Mode LPMx.5 Supply Currents (Into
VCC) Excluding External Current .................... 30 8.6 Trademarks ........................................ 120
5.9 Production Distribution of LPM Supply Currents .... 31 8.7 Electrostatic Discharge Caution ................... 120
5.10 Typical Characteristics - Current Consumption Per 8.8 Glossary............................................ 120
Module .............................................. 32 9 Mechanical, Packaging, and Orderable
5.11 Thermal Resistance Characteristics ................ 32 Information ............................................. 121
5.12 Timing and Switching Characteristics ............... 33
Copyright © 2018–2019, Texas Instruments Incorporated Table of Contents 5

2 Revision History
Changes from revision C to revision D
Changes from March 6, 2019 to December 10, 2019 Page
• Corrected the ROM size in Figure 1-1 MSP430FR235x Functional Block Diagram and Figure 1-2
MSP430FR215x Functional Block Diagram ....................................................................................... 4
• Added a note on all VQFN pinouts to indicate that the thermal pad should be connected to VSS ...................... 11
• Corrected Figure 4-4, 32-Pin RSM (VQFN) (Top View) – MSP430FR235x ................................................. 13
• Changed the note that begins "Supply voltage changes faster than 0.2 V/µs can trigger a BOR reset..." in
Section 5.3, Recommended Operating Conditions ............................................................................. 27
• Added the note that begins "TI recommends that power to the DVCC pin must not exceed the limits..." in
Section 5.3, Recommended Operating Conditions ............................................................................. 27
• Changed the note that begins "A capacitor tolerance of ±20% or better is required..." in Section 5.3,
Recommended Operating Conditions ............................................................................................ 27
• Combined former sections 5.8 and 5.10 into Section 5.9, Production Distribution of LPM Supply Currents ........... 31
• Corrected the "SVS disabled" condition for Figure 5-1 ........................................................................ 31
• Added the note "See MSP430 32-kHz Crystal Oscillators for details on crystal section, layout, and testing" to
Table 5-3, XT1 Crystal Oscillator (Low Frequency) ............................................................................ 35
• Changed the note that begins "Requires external capacitors at both terminals..." in Table 5-3, XT1 Crystal
Oscillator (Low Frequency) ........................................................................................................ 35
• Added the tTB,cap parameter in Table 5-13, Timer_B ............................................................................ 45
• Corrected the test conditions for the RI parameter in Table 5-20, ADC, Power Supply and Input Range Conditions . 51
• Removed ADCDIV from the equation for the ADC conversion time because ADCCLK is after division in Table 5-
21, ADC, Timing Parameters ...................................................................................................... 51
• Added the note that begins "tSample = ln(2n+1) × τ ..." in Table 5-21, ADC, Timing Parameters ........................... 51
• Changed the unit from "nV" to "µV" for the "Input noise voltage" in the Table 5-25, SAC, OA .......................... 55
• Changed the unit from "nv/Hz" to "nV/√Hz" for the "Input noise voltage density" in the Table 5-25, SAC, OA ........ 55
• Removed the Iref trim parameter from Table 5-27, FRAM ..................................................................... 57
• Changed the bitfield name from RTCCLK to RTCCKSEL in the table note on Table 6-9, Clock Distribution ......... 68
• Added Section 6.10.17, Cross-Chip Interconnection (SACx are MSP430FR235x Devices Only) ....................... 83
• Added P1SELC information in Table 6-41, Port P1, P2 Registers (Base Address: 0200h) .............................. 86
• Changed CRC covered end address to 0x1AF7 in table note (1) in Table 6-70, Device Descriptors ................. 107
Changes from revision B to revision C
Changes from July 3, 2018 to March 5, 2019 Page
• Added 32-pin VQFN (RSM) package information in Section 1.1, Features ................................................... 2
• Added 32-pin VQFN (RSM) package information to the Device Information table in Section 1.3, Description .......... 3
• Added 32-pin VQFN (RSM) package information in Table 3-1, Device Comparison ....................................... 8
• Added Figure 4-4, 32-Pin RSM (VQFN) (Top View) – MSP430FR235x ..................................................... 13
• Added Figure 4-8, 32-Pin RSM (VQFN) (Top View) – MSP430FR215x ..................................................... 17
• Added 32-pin VQFN (RSM) package information in Section 4.2, Pin Attributes ............................................ 18
• Added 32-pin VQFN (RSM) package information in Section 4.3, Signal Descriptions ..................................... 22
• Added 32-pin VQFN (RSM) package information in Section 5.11, Thermal Resistance Characteristics ............... 32
6 Revision History Copyright © 2018–2019, Texas Instruments Incorporated

Changes from revision A to revision B
Changes from June 20, 2018 to July 2, 2018 Page

• Updated Section 8.3, Tools and Software ..................................................................................... 116
• Added errata in Section 8.4, Documentation Support ........................................................................ 118
Changes from initial release to revision A
Changes from May 11, 2018 to June 19, 2018 Page
• Changed the document status to PRODUCTION DATA ........................................................................ 1

• Added missing UCB0SCL signal to P1.3/UCB0SOMI/UCB0SCL/OA0+/A3 in pinout figures ............................. 11
• Added row for "Driver library and FFT library" in Table 6-4, Memory Organization ....................................... 65
• Added Section 7.3, ROM Libraries ............................................................................................. 114
• Corrected the title and link to reference design in Table 7-1, Tools and Reference Designs ........................... 114
Copyright © 2018–2019, Texas Instruments Incorporated Revision History 7

3 Device Comparison
Table 3-1 summarizes the features of the available family members.
Table 3-1. Device Comparison (1) (2)
12-BIT ADC
DEVICE PROGRAM FRAM SRAM (bytes) TB0, TB1, TB2 TB3 eUSCI_A eUSCI_B SAC eCOMP I/Os PACKAGE
CHANNELS
(3) (3)
MSP430FR2355PT 32KB + 512B 4096 3 × CCR 7 × CCR 2 2 12 4 2 44 48 PT (LQFP)
MSP430FR2353PT 16KB + 512B 2048 3 × CCR (3) 7 × CCR (3) 2 2 12 4 2 44 48 PT (LQFP)
MSP430FR2355RHA 32KB + 512B 4096 3 × CCR (3) 7 × CCR (3) 2 2 10 4 2 36 40 RHA (VQFN)
MSP430FR2353RHA 16KB + 512B 2048 3 × CCR (3) 7 × CCR (3) 2 2 10 4 2 36 40 RHA (VQFN)
(3)
MSP430FR2355DBT 32KB + 512B 4096 3 × CCR 7 × CCR (3) 2 2 10 4 2 34 38 DBT (TSSOP)
MSP430FR2353DBT 16KB + 512B 2048 3 × CCR (3) 7 × CCR (3) 2 2 10 4 2 34 38 DBT (TSSOP)
(3)
MSP430FR2355RSM 32KB + 512B 4096 3 × CCR 7 × CCR (3) 2 2 (4) 8 4 2 28 32 RSM (VQFN)
MSP430FR2353RSM 16KB + 512B 2048 3 × CCR (3) 7 × CCR (3) 2 2 (4) 8 4 2 28 32 RSM (VQFN)
MSP430FR2155PT 32KB + 512B 4096 3 × CCR (3) 7 × CCR (3) 2 2 12 – 2 44 48 PT (LQFP)
MSP430FR2153PT 16KB + 512B 2048 3 × CCR (3) 7 × CCR (3) 2 2 12 – 2 44 48 PT (LQFP)
MSP430FR2155RHA 32KB + 512B 4096 3 × CCR (3) 7 × CCR (3) 2 2 10 – 2 36 40 RHA (VQFN)
MSP430FR2153RHA 16KB + 512B 2048 3 × CCR (3) 7 × CCR (3) 2 2 10 – 2 36 40 RHA (VQFN)
MSP430FR2155DBT 32KB + 512B 4096 3 × CCR (3) 7 × CCR (3) 2 2 10 – 2 34 38 DBT (TSSOP)
MSP430FR2153DBT 16KB + 512B 2048 3 × CCR (3) 7 × CCR (3) 2 2 10 – 2 34 38 DBT (TSSOP)
(3)
MSP430FR2155RSM 32KB + 512B 4096 3 × CCR 7 × CCR (3) 2 2 (4) 8 – 2 28 32 RSM (VQFN)
MSP430FR2153RSM 16KB + 512B 2048 3 × CCR (3) 7 × CCR (3) 2 2 (4) 8 – 2 28 32 RSM (VQFN)
(1) For the most current device, package, and ordering information, see the Package Option Addendum in Section 9, or see the TI web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/packaging.
(3) A CCR register is a configurable register that provides internal and external capture or compare inputs, or internal and external PWM outputs. Not all CCR channels are package specific.
See the definition in Section 4.3.
(4) eUSCI_B1 supports only I2C function.
8 Device Comparison Copyright © 2018–2019, Texas Instruments Incorporated

3.1 Related Products

For information about other devices in this family of products or related products, see the following links.
TI 16-bit and 32-bit microcontrollers
High-performance, low-power solutions to enable the autonomous future
Products for MSP430 ultra-low-power sensing & measurement microcontrollers
One platform. One ecosystem. Endless possibilities.
Companion products for MSP430FR2355
Review products that are frequently purchased or used with this product.
Reference designs for MSP430FR2355
Find reference designs leveraging the best in TI technology to solve your system-level challenges.
Copyright © 2018–2019, Texas Instruments Incorporated Device Comparison 9

4 Terminal Configuration and Functions

4.1 Pin Diagrams
Figure 4-1 shows the pinout of the 48-pin PT package for the MSP430FR235x MCUs.
P1.3/UCB0SOMI/UCB0SCL/OA0+/A3
P5.0/TB2.1/MFM.RX/A8
P5.1/TB2.2/MFM.TX/A9
P5.3/TB2TRG/A11
P5.2/TB2CLK/A10
P3.4/SMCLK
P3.0/MCLK
P3.1/OA2O
P3.5/OA3O
P3.3/OA2+
P3.2/OA2-
P5.4
48
47
46
45
44
43
42
41
40
39
38
37
P1.2/UCB0SIMO/UCB0SDA/TB0TRG/OA0-/A2/Veref- 1 36 P3.6/OA3-
P1.1/UCB0CLK/ACLK/OA0O/COMP0.1/A1 2 35 P3.7/OA3+
P1.0/UCB0STE/SMCLK/COMP0.0/A0/Veref+ 3 34 P1.4/UCA0STE/TCK/A4
TEST/SBWTCK 4 33 P1.5/UCA0CLK/TMS/OA1O/A5
RST/NMI/SBWTDIO 5 32 P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/OA1-/A6
DVCC 6 MSP430FR2355TPT 31 P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/OA1+/A7/VREF+
DVSS 7 MSP430FR2353TPT 30 P2.0/TB1.1/COMP0.O
P2.7/TB0CLK/XIN 8 29 P2.1/TB1.2/COMP1.O
P2.6/MCLK/XOUT 9 28 P2.2/TB1CLK
P2.5/COMP1.0 10 27 P2.3/TB1TRG
P2.4/COMP1.1 11 26 P4.0/UCA1STE/ISOTXD/ISORXD
P4.7/UCB1SOMI/UCB1SCL 12 25 P4.1/UCA1CLK
13
14
15
16
17
18
21
22
20
24
19
23
P6.0/TB3.1
P6.1/TB3.2
P4.3/UCA1TXD/UCA1SIMO/UCA1TXD
P4.2/UCA1RXD/UCA1SOMI/UCA1RXD
P6.3/TB3.4
P6.2/TB3.3
P4.6/UCB1SIMO/UCB1SDA
P4.5/UCB1CLK
P4.4/UCB1STE
P6.6/TB3CLK
P6.5/TB3.6
P6.4/TB3.5
Figure 4-1. 48-Pin PT (LQFP) (Top View) – MSP430FR235x
10 Terminal Configuration and Functions Copyright © 2018–2019, Texas Instruments Incorporated

Figure 4-2 shows the pinout of the 40-pin RHA package for the MSP430FR235x MCUs.
P1.2/UCB0SIMO/UCB0SDA/TB0TRG/OA0-/A2/Veref-
P3.4/SMCLK
P3.5/OA3O
P3.0/MCLK
P3.1/OA2O
P3.3/OA2+
P3.2/OA2-
40
39
38
37
36
35
34
33
32
31
P1.1/UCB0CLK/ACLK/OA0O/COMP0.1/A1 1 30 P3.6/OA3-
P1.0/UCB0STE/SMCLK/COMP0.0/A0/Veref+ 2 29 P3.7/OA3+
TEST/SBWTCK 3 28 P1.4/UCA0STE/TCK/A4
RST/NMI/SBWTDIO 4 27 P1.5/UCA0CLK/TMS/OA1O/A5
DVCC 5 MSP430FR2355TRHA 26 P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/OA1-/A6
DVSS 6 MSP430FR2353TRHA 25 P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/OA1+/A7/VREF+
P2.6/MCLK/XOUT 8 23 P2.1/TB1.2/COMP1.O
P2.5/COMP1.0 9 22 P2.2/TB1CLK
P2.4/COMP1.1 10 21 P2.3/TB1TRG
12
13
14
15
16
17
18
19
20
11
P4.7/UCB1SOMI/UCB1SCL
P4.4/UCB1STE
P6.0/TB3.1
P4.1/UCA1CLK
P4.5/UCB1CLK
P6.1/TB3.2
P4.0/UCA1STE/ISOTXD/ISORXD
NOTE: Connect the exposed thermal pad to VSS.
Figure 4-2. 40-Pin RHA (VQFN) (Top View) – MSP430FR235x
Copyright © 2018–2019, Texas Instruments Incorporated Terminal Configuration and Functions 11

Figure 4-3 shows the pinout of the 38-pin DBT package for the MSP430FR235x MCUs.
P3.2/OA2- 1 38 P3.3/OA2+
P3.1/OA2O 2 37 P5.0/TB2.1/MFM.RX/A8
P3.0/MCLK 3 36 P5.1/TB2.2/MFM.TX/A9
P1.3/UCB0SOMI/UCB0SCL/OA0+/A3 4 35 P3.4/SMCLK
P1.2/UCB0SIMO/UCB0SDA/TB0TRG/OA0-/A2/Veref- 5 34 P3.5/OA3O
RST/NMI/SBWTDIO 9 30 P1.5/UCA0CLK/TMS/OA1O/A5
MSP430FR2355TDBT
DVCC 10 29 P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/OA1-/A6
MSP430FR2353TDBT
DVSS 11 28 P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/OA1+/A7/VREF+
P2.5/COMP1.0 14 25 P2.2/TB1CLK
P2.4/COMP1.1 15 24 P2.3/TB1TRG
P4.7/UCB1SOMI/UCB1SCL 16 23 P4.0/UCA1STE/ISOTXD/ISORXD
P4.6/UCB1SIMO/UCB1SDA 17 22 P4.1/UCA1CLK
P4.5/UCB1CLK 18 21 P4.2/UCA1RXD/UCA1SOMI/UCA1RXD
P4.4/UCB1STE 19 20 P4.3/UCA1TXD/UCA1SIMO/UCA1TXD
Figure 4-3. 38-Pin DBT (TSSOP) (Top View) – MSP430FR235x

Figure 4-4 shows the pinout of the 32-pin RSM package for the MSP430FR235x MCUs.
P1.2/UCB0SIMO/UCB0SDA/TB0TRG/OA0-/A2/Veref-
P3.4/SMCLK
P3.0/MCLK
P3.1/OA2O
P3.5/OA3O
P3.3/OA2+
P3.2/OA2-
32
31
30
29
28
27
26
25
RST/NMI/SBWTDIO 4 MSP430FR2355TRSM 21 P1.5/UCA0CLK/TMS/OA1O/A5
MSP430FR2353TRSM
DVCC 5 20 P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/OA1-/A6
DVSS 6 19 P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/OA1+/A7/VREF+
10
11
12
13
14
15
16
9 P2.5/COMP1.0
P2.4/COMP1.1
P4.7/UCB1SCL
P4.6/UCB1SDA
P4.1/UCA1CLK
Figure 4-4. 32-Pin RSM (VQFN) (Top View) – MSP430FR235x

Figure 4-5 shows the pinout of the 48-pin PT package for the MSP430FR215x MCUs.
P1.3/UCB0SOMI/UCB0SCL/A3
P5.3/TB2TRG/A11
P5.2/TB2CLK/A10
P3.4/SMCLK
P3.0/MCLK
P3.2
P3.3
P3.1
P5.4
P3.5
48
47
46
45
44
43
42
41
40
39
38
37
P1.2/UCB0SIMO/UCB0SDA/TB0TRG/A2/Veref- 1 36 P3.6
P1.1/UCB0CLK/ACLK/COMP0.1/A1 2 35 P3.7
P1.0/UCB0STE/SMCLK/COMP0.0/A0/Veref+ 3 34 P1.4/UCA0STE/TCK/A4
TEST/SBWTCK 4 33 P1.5/UCA0CLK/TMS/A5
RST/NMI/SBWTDIO 5 32 P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/A6
DVCC 6 MSP430FR2155TPT 31 P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/A7/VREF+
DVSS 7 MSP430FR2153TPT 30 P2.0/TB1.1/COMP0.O
P2.6/MCLK/XOUT 9 28 P2.2/TB1CLK
P2.5/COMP1.0 10 27 P2.3/TB1TRG
P2.4/COMP1.1 11 26 P4.0/UCA1STE/ISOTXD/ISORXD
P4.7/UCB1SOMI/UCB1SCL 12 25 P4.1/UCA1CLK
21
13
14
15
16
17
18
22
20
24
19
23
P6.0/TB3.1
P6.1/TB3.2
P6.3/TB3.4
P6.2/TB3.3
P4.5/UCB1CLK
P4.4/UCB1STE
P6.6/TB3CLK
P6.5/TB3.6
P6.4/TB3.5
Figure 4-5. 48-Pin PT (LQFP) (Top View) – MSP430FR215x

Figure 4-6 shows the pinout of the 40-pin RHA package for the MSP430FR215x MCUs.
P1.2/UCB0SIMO/UCB0SDA/TB0TRG/A2/Veref-
P3.4/SMCLK
P3.0/MCLK
P3.5
P3.1
P3.2
P3.3
40
39
38
37
36
35
34
33
32
31
P1.0/UCB0STE/SMCLK/COMP0.0/A0/Veref+ 2 29 P3.7
RST/NMI/SBWTDIO 4 27 P1.5/UCA0CLK/TMS/A5
DVCC 5 MSP430FR2155TRHA 26 P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/A6
DVSS 6 MSP430FR2153TRHA 25 P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/A7/VREF+
P2.5/COMP1.0 9 22 P2.2/TB1CLK
P2.4/COMP1.1 10 21 P2.3/TB1TRG
12
13
14
15
16
17
18
19
20
11
P4.4/UCB1STE
P6.0/TB3.1
P4.1/UCA1CLK
P4.5/UCB1CLK
P6.1/TB3.2
Figure 4-6. 40-Pin RHA (VQFN) (Top View) – MSP430FR215x

Figure 4-7 shows the pinout of the 38-pin DBT package for the MSP430FR215x MCUs.
P3.2 1 38 P3.3
P3.1 2 37 P5.0/TB2.1/MFM.RX/A8
P3.0/MCLK 3 36 P5.1/TB2.2/MFM.TX/A9
P1.3/UCB0SOMI/UCB0SCL/A3 4 35 P3.4/SMCLK
P1.2/UCB0SIMO/UCB0SDA/TB0TRG/A2/Veref- 5 34 P3.5
RST/NMI/SBWTDIO 9 30 P1.5/UCA0CLK/TMS/A5
MSP430FR2155TDBT
DVCC 10 MSP430FR2153TDBT 29 P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/A6
DVSS 11 28 P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/A7/VREF+
P2.5/COMP1.0 14 25 P2.2/TB1CLK
P2.4/COMP1.1 15 24 P2.3/TB1TRG
P4.7/UCB1SOMI/UCB1SCL 16 23 P4.0/UCA1STE/ISOTXD/ISORXD
P4.6/UCB1SIMO/UCB1SDA 17 22 P4.1/UCA1CLK
P4.5/UCB1CLK 18 21 P4.2/UCA1RXD/UCA1SOMI/UCA1RXD
P4.4/UCB1STE 19 20 P4.3/UCA1TXD/UCA1SIMO/UCA1TXD
Figure 4-7. 38-Pin DBT (TSSOP) (Top View) – MSP430FR215x

Figure 4-8 shows the pinout of the 32-pin RSM package for the MSP430FR215x MCUs.
P1.2/UCB0SIMO/UCB0SDA/TB0TRG/A2/Veref-
P3.4/SMCLK
P3.0/MCLK
P3.1
P3.2
P3.3
P3.5
32
31
30
29
28
27
26
25
RST/NMI/SBWTDIO 4 MSP430FR2155TRSM 21 P1.5/UCA0CLK/TMS/A5
MSP430FR2153TRSM
DVCC 5 20 P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/A6
DVSS 6 19 P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/A7/VREF+
10
11
12
13
14
15
16
9 P2.5/COMP1.0
P2.4/COMP1.1
P4.7/UCB1SCL
P4.6/UCB1SDA
P4.1/UCA1CLK
Figure 4-8. 32-Pin RSM (VQFN) (Top View) – MSP430FR215x

4.2 Pin Attributes

Table 4-1 lists the attributes of all pins.
Table 4-1. Pin Attributes

PIN NUMBER SIGNAL POWER RESET STATE
SIGNAL NAME (1) (2)
BUFFER TYPE (4)
PT RHA DBT RSM TYPE (3) SOURCE AFTER BOR (5)
P1.2 (RD) I/O LVCMOS DVCC OFF
UCB0SIMO I/O LVCMOS DVCC –
UCB0SDA I/O LVCMOS DVCC –
1 40 5 32 TB0TRG I LVCMOS DVCC –
(6)
OA0- I Analog DVCC –
A2 I Analog DVCC –
Veref- I Analog DVCC –
UCB0CLK I/O LVCMOS DVCC –
ACLK O LVCMOS DVCC –
2 1 6 1
OA0O (6) O Analog DVCC –
COMP0_1 I Analog DVCC –
UCB0STE I/O LVCMOS DVCC –
SMCLK O LVCMOS DVCC –
3 2 7 2
COMP0_0 I Analog DVCC –
Veref+ I Analog DVCC –
TEST (RD) I LVCMOS DVCC OFF
4 3 8 3
SBWTCK I LVCMOS DVCC –
RST (RD) I/O LVCMOS DVCC OFF
5 4 9 4 NMI I LVCMOS DVCC –
SBWTDIO I/O LVCMOS DVCC –
6 5 10 5 DVCC P Power DVCC N/A
7 6 11 6 DVSS P Power DVCC N/A
8 7 12 7 TB0CLK I LVCMOS DVCC –
XIN I LVCMOS DVCC –
9 8 13 8 MCLK O LVCMOS DVCC –
XOUT O LVCMOS DVCC –
10 9 14 9
COMP1.0 I Analog DVCC –
11 10 15 10
COMP1.1 I Analog DVCC –
(1) Signals names with (RD) denote the reset default pin name.
(2) To determine the pin mux encodings for each pin, see Section 6.11.
(3) Signal types: I = input, O = output, I/O = input or output
(4) Buffer types: LVCMOS, analog, or power
(5) Reset states:
OFF = High-impedance input with pullup or pulldown disabled (if available)
N/A = Not applicable
(6) MSP430FR235x devices only
Table 4-1. Pin Attributes (continued)

SIGNAL NAME (1) (2)
BUFFER TYPE (4)
12 11 16 11 UCB1SOMI (7) I/O LVCMOS DVCC –
UCB1SCL I/O LVCMOS DVCC –
13 12 17 12 UCB1SIMO (7) I/O LVCMOS DVCC –
UCB1SDA I/O LVCMOS DVCC –
14 13 18 –
UCB1CLK I/O LVCMOS DVCC –
15 14 19 –
UCB1STE I/O LVCMOS DVCC –
16 – – –
TB3CLK I LVCMOS DVCC –
17 – – –
TB3.6 I/O LVCMOS DVCC –
18 – – –
19 – – –
20 – – –
21 15 – –
22 16 – –
UCA1TXD O LVCMOS DVCC –
23 17 20 13
UCA1SIMO I/O LVCMOS DVCC –
UCA1RXD I LVCMOS DVCC –
24 18 21 14
UCA1SOMI I/O LVCMOS DVCC –
25 19 22 15
UCA1CLK I/O LVCMOS DVCC –
UCA1STE I/O LVCMOS DVCC –
26 20 23 16
ISOTXD O LVCMOS DVCC –
ISORXD I LVCMOS DVCC –
27 21 24 –
TB1TRG I LVCMOS DVCC –
28 22 25 –
TB1CLK I LVCMOS DVCC –
P2.1(RD) I/O LVCMOS DVCC OFF
29 23 26 17 TB1.2 I/O LVCMOS DVCC –
COMP1.O O LVCMOS DVCC –
(7) Not applicable in RSM package.


SIGNAL NAME (1) (2)
BUFFER TYPE (4)
30 24 27 18 TB1.1 I/O LVCMOS DVCC –
COMP0.O O LVCMOS DVCC –
UCA0SIMO I/O LVCMOS DVCC –
31 25 28 19
TDO O LVCMOS DVCC –
OA1+ (6) I Analog DVCC –
VREF+ O Analog DVCC –
UCA0SOMI I/O LVCMOS DVCC –
32 26 29 20
TDI I LVCMOS DVCC –
TCLK I LVCMOS DVCC –
OA1- (6) I Analog DVCC –
UCA0CLK I/O LVCMOS DVCC –
33 27 30 21 TMS I LVCMOS DVCC –
OA1O (6) O Analog DVCC -
UCA0STE I/O LVCMOS DVCC –
34 28 31 22
TCK I LVCMOS DVCC –
35 29 32 23
36 30 33 24
37 31 34 25
38 32 35 26
SMCLK O LVCMOS DVCC –
39 – – – P5.4 (RD) I/O LVCMOS DVCC OFF
40 – – – TB2TRG I LVCMOS DVCC –
41 – – – TB2CLK I LVCMOS DVCC –


SIGNAL NAME (1) (2)
BUFFER TYPE (4)
42 33 36 –
MFM.TX O LVCMOS DVCC –
43 34 37 –
MFM.RX I LVCMOS DVCC –
44 35 38 27
45 36 1 28
46 37 2 29
47 38 3 30
MCLK O LVCMOS DVCC –
UCB0SOMI I/O LVCMOS DVCC –
48 39 4 31 UCB0SCL I/O LVCMOS DVCC –

4.3 Signal Descriptions

Table 4-2 describes the signals for all device variants and package options.
Table 4-2. Signal Descriptions

PIN NUMBER (1) PIN
FUNCTION SIGNAL NAME DESCRIPTION
PT RHA DBT RSM TYPE (2)
A0 3 2 7 2 I Analog input A0
ADC
A8 43 34 37 – I Analog input A8
A9 42 33 36 – I Analog input A9
A10 41 – – – I Analog input A10
A11 40 – – – I Analog input A11
Veref+ 3 2 7 2 I ADC positive reference
Veref- 1 40 5 32 I ADC negative reference
C0 3 2 7 2 I Comparator input channel C0
eCOMP0 C1 2 1 6 1 I Comparator input channel C1
COUT 30 24 27 18 O Comparator output channel COUT
C0 10 9 14 9 I Comparator input channel C0
eCOMP1 C1 11 10 15 10 I Comparator input channel C1
COUT 29 23 26 17 O Comparator output channel COUT
OA0+ 48 39 4 31 I SAC0, OA positive input
(3)
SAC0 OA0- 1 40 5 32 I SAC0, OA negative input
OA0O 2 1 6 1 O SAC0, OA output
(3)
SAC1 OA1- 32 26 29 20 I SAC1, OA negative input
SAC2 (3) OA2- 45 36 1 28 I SAC2, OA negative input
SAC3 (3) OA3- 36 30 33 24 I SAC3, OA negative input
OAO 37 31 34 25 O SAC3, OA output
ACLK 2 1 6 1 O ACLK output
9 8 13 8 O
MCLK MCLK output
47 38 3 30 O
Clock 3 2 7 2 O
SMCLK SMCLK output
38 32 35 26 O
XIN 8 7 12 7 I Input terminal for crystal oscillator
XOUT 9 8 13 8 O Output terminal for crystal oscillator
(1) Any pin that is not bonded out in a smaller package must be initialized by software after reset to achieve the lowest leakage current.
(2) I = input, O = output, I/O = input/output, P = power
Table 4-2. Signal Descriptions (continued)

PIN NUMBER (1) PIN
SBWTCK 4 3 8 3 I Spy-Bi-Wire input clock
SBWTDIO 5 4 9 4 I/O Spy-Bi-Wire data input/output
TCK 34 28 31 22 I Test clock
TCLK 32 26 29 20 I Test clock input
Debug
TDI 32 26 29 20 I Test data input
TDO 31 25 28 19 O Test data output
TMS 33 27 30 21 I Test mode select
TEST 4 3 8 3 I Test mode pin – selected digital I/O on JTAG pins
NMI 5 4 9 4 I Nonmaskable interrupt input
System
RST 5 4 9 4 I/O Reset input, active-low
DVCC 6 5 10 5 P Power supply
DVSS 7 6 11 6 P Power ground
Power
Output of positive reference voltage with ground as
VREF+ 31 25 28 19 P
reference
P1.0 3 2 7 2 I/O General-purpose I/O
GPIO, Port 1 (4)
(4)
(4)
P1.7 31 25 28 19 I/O General-purpose I/O (4)
P2.2 28 22 25 – I/O General-purpose I/O
GPIO, Port 2
GPIO, Port 3
(4) Because this pin is multiplexed with the JTAG function, TI recommends disabling the pin interrupt function while in JTAG debug to
prevent collisions.
Functions shared with these four pins cannot be debugged if 4-wire JTAG is used for debug.

PIN NUMBER (1) PIN
GPIO, Port 4
GPIO, Port 5 P5.2 41 – – – I/O General-purpose I/O
P5.3 40 – – – I/O General-purpose I/O
P6.0 22 16 – – I/O General-purpose I/O
P6.1 21 15 – – I/O General-purpose I/O
GPIO, Port 6 P6.3 19 – – – I/O General-purpose I/O
UCA0TXD 31 25 28 19 O eUSCI_A0 UART transmit data
UCA0RXD 32 26 29 20 I eUSCI_A0 UART receive data
UART
UCA1TXD 23 17 20 13 O eUSCI_A1 UART transmit data
UCA1RXD 24 18 21 14 I eUSCI_A1 UART receive data
ISO transmit data (the logical AND product of
ISOTXD 26 20 23 16 O
ISO UCA1TXD and TB3.2B)
ISORXD 26 20 23 16 I ISO receive data (to UCA1RXD and TB3.CCI2B)
UCA0STE 34 28 31 22 I/O eUSCI_A0 SPI slave transmit enable
UCA0CLK 33 27 30 21 I/O eUSCI_A0 SPI clock input/output
UCA0SOMI 32 26 29 20 I/O eUSCI_A0 SPI slave out/master in
UCA0SIMO 31 25 28 19 I/O eUSCI_A0 SPI slave in/master out
UCA1STE 26 20 23 16 I/O eUSCI_A1 SPI slave transmit enable
UCA1CLK 25 19 22 15 I/O eUSCI_A1 SPI clock input/output
UCA1SOMI 24 18 21 14 I/O eUSCI_A1 SPI slave out/master in
UCA1SIMO 23 17 20 13 I/O eUSCI_A1 SPI slave in/master out
SPI
UCB0STE 3 2 7 2 I/O eUSCI_B0 slave transmit enable
UCB0CLK 2 1 6 1 I/O eUSCI_B0 clock input/output
UCB0SIMO 1 40 5 32 I/O eUSCI_B0 SPI slave in/master out
UCB0SOMI 48 39 4 31 I/O eUSCI_B0 SPI slave out/master in
UCB1STE 15 14 19 – I/O eUSCI_B1 slave transmit enable
UCB1CLK 14 13 18 – I/O eUSCI_B1 clock input/output
UCB1SIMO 13 12 17 – I/O eUSCI_B1 SPI slave in/master out
UCB1SOMI 12 11 16 – I/O eUSCI_B1 SPI slave out/master in
UCB0SCL 48 39 4 31 I/O eUSCI_B0 I2C clock
UCB0SDA 1 40 5 32 I/O eUSCI_B0 I2C data
I2C
UCB1SCL 12 11 16 11 I/O eUSCI_B1 I2C clock
UCB1SDA 13 12 17 12 I/O eUSCI_B1 I2C data


PIN NUMBER (1) PIN
Timer TB0 CCR1
TB0.1 32 26 29 20 I/O
capture: CCI1A input, compare: Out1 output
Timer TB0 CCR2
TB0.2 31 25 28 19 I/O capture: CCI2A input
compare: Out2 output
TB0TRG 1 40 5 32 I TB0 external trigger input for TB0OUTH
TB0CLK 8 7 12 7 I Timer clock input TBCLK for TB0
Timer TB1 CCR1
Timer TB1 CCR2
TB1CLK 28 22 25 – I Timer clock input TBCLK for TB1
TB1TRG 27 21 24 – I TB1 external trigger input for TB1OUTH
Timer TB2 CCR1
TB2.1 43 34 37 – I/O capture: CCI1A input
Timer TB2 CCR2
TB2.2 42 33 36 – I/O capture: CCI2A input
Timer_B
TB2CLK 41 – – – I Timer clock input TBCLK for TB2
TB2TRG 40 – – – I TB2 external trigger input for TB2OUTH
Timer TB3 CCR1
TB3.1 22 16 – – I/O capture: CCI1A input
Timer TB3 CCR2
TB3.2 21 15 – – I/O capture: CCI2A input
Timer TB3 CCR3
TB3.3 20 – – – I/O capture: CCI3A input
Timer TB3 CCR4
Timer TB3 CCR5
compare: Out5 outputs
Timer TB3 CCR6
TB3CLK 16 – – – I Timer clock input TBCLK for TB3
TX 42 33 36 – O Manchester function module transmit
MFM
RX 43 34 37 – I Manchester function module receive
VQFN
– Pad – Pad – Connect the exposed thermal pad to VSS.
thermal pad

4.4 Pin Multiplexing

Pin multiplexing for these devices is controlled by both register settings and operating modes (for
example, if the device is in test mode). For details of the settings for each pin and diagrams of the
multiplexed ports, see Section 6.11.
4.5 Buffer Type

Table 4-3 defines the pin buffer types that are listed in Table 4-1.
Table 4-3. Buffer Type

NOMINAL
OUTPUT DRIVE
BUFFER TYPE NOMINAL PU OR PD OTHER
HYSTERESIS PU OR PD STRENGTH
(STANDARD) VOLTAGE STRENGTH CHARACTERISTICS
(mA)
(µA)
See See
LVCMOS 3.0 V Y (1) Programmable
Section 5.12.5 Section 5.12.5
See the analog modules in
Analog 3.0 V N N/A N/A N/A
Section 5 for details
SVS enables hysteresis on
Power (DVCC) 3.0 V N N/A N/A N/A
DVCC
Power (AVCC) 3.0 V N N/A N/A N/A
(1) Only for input pins
4.6 Connection of Unused Pins

Table 4-4 lists the correct termination of unused pins.
Table 4-4. Connection of Unused Pins (1)

PIN POTENTIAL COMMENT
Px.0 to Px.7 Open Set to port function, output direction (PxDIR.n = 1)
RST/NMI DVCC 47-kΩ pullup or internal pullup selected with 10-nF (or 1.1-nF) pulldown (2)
TEST Open This pin always has an internal pulldown enabled.
(1) Any unused pin with a secondary function that is shared with general-purpose I/O should follow the Px.0 to Px.7 unused pin connection
guidelines.
(2) The pulldown capacitor should not exceed 1.1 nF when using devices with Spy-Bi-Wire interface in Spy-Bi-Wire mode with TI tools like
FET interfaces or GANG programmers.

5 Specifications
5.1 Absolute Maximum Ratings (1)

over operating free-air temperature range (unless otherwise noted)
DEVICE
MIN MAX UNIT
GRADE
Voltage applied at DVCC pin to VSS T –0.3 4.1 V
(2) VCC + 0.3
Voltage applied to any pin T –0.3 V
4.1 V Max
Current across the whole chip including IO currents T +50 mA
Diode current at any device pin T ±2 mA
Maximum junction temperature, TJ T 115 °C
(3)
Storage temperature, Tstg T –40 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.
(2) All voltages referenced to VSS.
(3) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
5.2 ESD Ratings

DEVICE
VALUE UNIT
GRADE
Electrostatic Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) T ±1000
V(ESD) V
discharge Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
T ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±1000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±250 V may actually have higher performance.
5.3 Recommended Operating Conditions

DEVICE
MIN NOM MAX UNIT
GRADE
(1) (2) (3) (4)
VCC Supply voltage applied at DVCC pin T 1.8 3.6 V
VSS Supply voltage applied at DVSS pin T 0 V
TA Operating free-air temperature T –40 105 °C
TJ Operating junction temperature T –40 115 °C
CDVCC Recommended capacitor at DVCC (5) T 4.7 10 µF
No FRAM wait states
T 0 8
(NWAITSx = 0)
With FRAM wait states
fSYSTEM Processor frequency (maximum MCLK frequency) (4) (6) T 0 16 MHz
(NWAITSx = 1) (7)
With FRAM wait states
T 0 24 (8)
(NWAITSx = 2) (7)
(1) Supply voltage changes faster than 0.2 V/µs can trigger a BOR reset even within the recommended supply voltage range. Following the
data sheet recommendation for capacitor CDVCC limits the slopes accordingly.
(2) Modules can have a different supply voltage range specification. See the specification of the respective module in this data sheet.
(3) TI recommends that power to the DVCC pin must not exceed the limits specified in Recommended Operating Conditions. Exceeding the
specified limits can cause malfunction of the device including erroneous writes to RAM and FRAM.
(4) The minimum supply voltage is defined by the SVS levels. See the SVS threshold parameters in Table 5-1.
(5) A capacitor tolerance of ±20% or better is required. A low-ESR ceramic capacitor of 100 nF (minimum) should be placed as close as
possible (within a few millimeters) to the respective pin pair.
(6) Modules can have a different maximum input clock specification. See the specification of the respective module in this data sheet.
(7) Wait states only occur on actual FRAM accesses (that is, on FRAM cache misses). RAM and peripheral accesses are always executed
without wait states.
(8) If clock sources such as HF crystals or the DCO with frequencies >24 MHz are used, the clock must be divided in the clock system to
comply with this operating condition.
Copyright © 2018–2019, Texas Instruments Incorporated Specifications 27
Recommended Operating Conditions (continued)

DEVICE
MIN NOM MAX UNIT
GRADE
fACLK Maximum ACLK frequency T 40 kHz
fSMCLK Maximum SMCLK frequency T 24 (8) MHz
5.4 Active Mode Supply Current Into VCC Excluding External Current
over operating free-air temperature range (unless otherwise noted) (1)
Frequency (fMCLK = fSMCLK)
1 MHz 8 MHz 16 MHz 24 MHz
0 WAIT 0 WAIT 1 WAIT 2 WAIT
EXECUTION TEST DEVICE
PARAMETER STATES STATES STATE STATES UNIT
MEMORY CONDITIONS GRADE
(NWAITSx (NWAITSx (NWAITSx (NWAITSx
= 0) = 0) = 1) = 2)
TYP MAX TYP MAX TYP MAX TYP MAX
3.0 V, 25°C T 555 3084 3411 3692
FRAM
IAM, FRAM(0%) 3.0 V, 85°C T 575 3207 3519 3807 µA
0% cache hit ratio
3.0 V, 105°C T 583 3233 3545 3833
3.0 V, 25°C T 261 724 1245 1772
FRAM
IAM, FRAM(100%) 3.0 V, 85°C T 272 742 1267 1800 µA
100% cache hit ratio
3.0 V, 105°C T 283 753 1281 1817
(2)
IAM, RAM RAM 3.0 V, 25°C T 285 917 1627 2355 µA
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current. Characterized with program executing typical data
processing.
fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO at specified frequency
Program and data entirely reside in FRAM. All execution is from FRAM.
(2) Program and data reside entirely in RAM. All execution is from RAM. No access to FRAM.
5.5 Active Mode Supply Current Per MHz

VCC = 3.0 V, TA = 25°C (unless otherwise noted)
DEVICE
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
GRADE
Active mode current consumption (IAM, 75% cache hit rate at 8 MHz –
dIAM,FRAM/df per MHz, execution from FRAM, no wait IAM, 75% cache hit rate at 1 MHz) T 142 µA/MHz
states (1) / 7 MHz
(1) All peripherals are turned on in default settings.
5.6 Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
VCC = 3.0 V, TA = 25°C (unless otherwise noted) (1) (2)
FREQUENCY (fSMCLK)
DEVICE
PARAMETER VCC 1 MHz 8 MHz 16 MHz 24 MHz UNIT
GRADE
TYP MAX TYP MAX TYP MAX TYP MAX
2.0 V T 199 312 437 637
ILPM0 Low-power mode 0 supply current µA
3.0 V T 211 324 449 649
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
(2) Current for watchdog timer clocked by SMCLK included.
fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK at specified frequency.
28 Specifications Copyright © 2018–2019, Texas Instruments Incorporated

5.7 Low-Power Mode LPM3 and LPM4 Supply Currents (Into VCC) Excluding External Current
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
DEVICE –40°C 25°C 85°C 105°C
PARAMETER VCC UNIT
GRADE TYP MAX TYP MAX TYP MAX TYP MAX
Low-power mode 3,
ILPM3,XT1 T 3.0 V 1.21 1.49 6.35 21.85 13.29 47.87 µA
includes SVS (2) (3) (4)
Low-power mode 3,
ILPM3,XT1 T 2.0 V 1.18 1.45 6.28 13.17 µA
includes SVS (2) (3) (4)
Low-power mode 3, VLO,
ILPM3,VLO T 3.0 V 1.01 1.29 6.15 21.65 13.1 47.67 µA
excludes SVS (5)
Low-power mode 3, VLO,
ILPM3,VLO T 2.0 V 0.99 1.26 6.09 12.98 µA
excludes SVS (5)
Low-power mode 3, RTC,
ILPM3, T 3.0 V 1.15 1.43 6.29 13.24 µA
RTC excludes SVS (6)
Low-power mode 3, RTC,
ILPM3, T 2.0 V 1.13 1.41 6.23 13.13 µA
RTC excludes SVS (6)
Low-power mode 4,
ILPM4, SVS T 3.0 V 0.74 1.00 5.83 12.73 µA
includes SVS
Low-power mode 4,
ILPM4, SVS T 2.0 V 0.72 0.98 5.77 12.62 µA
includes SVS
Low-power mode 4,
ILPM4, T 3.0 V 0.56 0.82 5.64 12.54 µA
excludes SVS
Low-power mode 4,
ILPM4, T 2.0 V 0.55 0.81 5.59 12.45 µA
excludes SVS
Low-power mode 4, RTC
ILPM4, RTC, VLO is sourced from VLO, T 3.0 V 0.66 0.93 5.76 12.67 µA
excludes SVS (7)
ILPM4, RTC, VLO is sourced from VLO, T 2.0 V 0.66 0.92 5.71 12.58 µA
excludes SVS (7)
ILPM4, RTC, XT1 is sourced from XT1, T 3.0 V 1.06 1.34 6.21 13.15 µA
excludes SVS (8)
ILPM4, RTC, XT1 is sourced from XT1, T 2.0 V 1.05 1.33 6.16 13.05 µA
excludes SVS (8)
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current
(2) Not applicable for devices with HF crystal oscillator only.
(3) Characterized with a Seiko Crystal SC-32S crystal with a load capacitance chosen to closely match the required load.
(4) Low-power mode 3, includes SVS test conditions:
Current for watchdog timer clocked by ACLK and RTC clocked by XT1 included. Current for brownout and SVS included (SVSHE = 1).
CPUOFF = 1, SCG0 = 1 SCG1 = 1, OSCOFF = 0 (LPM3),
fXT1 = 32768 Hz, fACLK = fXT1, fMCLK = fSMCLK = 0 MHz
(5) Low-power mode 3, VLO, excludes SVS test conditions:
Current for watchdog timer clocked by VLO included. RTC disabled. Current for brownout included. SVS disabled (SVSHE = 0).
fXT1 = 32768 Hz, fACLK = fMCLK = fSMCLK = 0 MHz
(6) RTC wakes every second with external 32768-Hz clock as source.
(7) Low-power mode 4, VLO, excludes SVS test conditions:
Current for RTC clocked by VLO included. RTC disabled. Current for brownout included. SVS disabled (SVSHE = 0).
(8) Low-power mode 4, XT1, excludes SVS test conditions:
Current for RTC clocked by XT1 included. RTC disabled. Current for brownout included. SVS disabled (SVSHE = 0).

5.8 Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
DEVICE –40°C 25°C 85°C 105°C
PARAMETER VCC UNIT
GRADE TYP MAX TYP MAX TYP MAX TYP MAX
Low-power mode 3.5,
ILPM3.5, XT1 includes SVS (1) (2) (3) T 3.0 V 0.57 0.62 0.89 2.06 1.27 3.21 µA
(also see Figure 5-3)
Low-power mode 3.5,
ILPM3.5, XT1 includes SVS (1) (2) (3) T 2.0 V 0.55 0.59 0.84 1.19 µA
(also see Figure 5-3)
Low-power mode 4.5,
ILPM4.5, T 3.0 V 0.27 0.29 0.41 0.63 0.61 1.13 µA
SVS includes SVS (4)
Low-power mode 4.5,
ILPM4.5, T 2.0 V 0.25 0.27 0.37 0.55 µA
SVS includes SVS (4)
Low-power mode 4.5,
ILPM4.5 T 3.0 V 0.031 0.042 0.153 0.343 0.337 0.832 µA
excludes SVS (5)
Low-power mode 4.5,
ILPM4.5 T 2.0 V 0.025 0.036 0.128 0.289 µA
excludes SVS (5)
(1) Not applicable for devices with HF crystal oscillator only
(2) Characterized with a Seiko Crystal SC-32S crystal with a load capacitance chosen to closely match the required load.
(3) Low-power mode 3.5, includes SVS test conditions:
Current for RTC clocked by XT1 included. Current for brownout and SVS included (SVSHE = 1). Core regulator disabled.
PMMREGOFF = 1, CPUOFF = 1, SCG0 = 1 SCG1 = 1, OSCOFF = 1 (LPMx.5),
fXT1 = 32768 Hz, fACLK = fXT1, fMCLK = fSMCLK = 0 MHz
(4) Low-power mode 4.5, includes SVS test conditions:
Current for brownout and SVS included (SVSHE = 1). Core regulator disabled.
(5) Low-power mode 4.5, excludes SVS test conditions:
Current for brownout included. SVS disabled (SVSHE = 0). Core regulator disabled.

5.9 Production Distribution of LPM Supply Currents

VCC = 3 V
16 16
LPM3 Supply Current (µA)
14 14
LPM4 Supply Current (µA)

12 12
10 10
8 8
6 6
4 4
2 2
0 0
-40 -30 -20 -10 0 10 25 30 40 50 60 70 85 95 105 -40 -30 -20 -10 0 10 25 30 40 50 60 70 85 95 105
Temperature (°C) Temperature (°C)

RTC enabled 12.5-pF crystal SVS disabled RTC enabled 12.5-pF crystal SVS disabled
Figure 5-1. Population vs Low-Power Mode 3 Supply Current Figure 5-2. Population vs Low-Power Mode 4 Supply Current
4 0.4
LPM4.5 Supply Current (µA)
LPM3.5 Supply Current (µA)
3.5 0.35
3 0.3
2.5 0.25
2 0.2
1.5 0.15
1 0.1
0.5 0.05
0 0
-40 -30 -20 -10 0 10 25 30 40 50 60 70 85 95 105 -40 -30 -20 -10 0 10 25 30 40 50 60 70 85 95 105
Temperature (°C) Temperature (°C)
RTC enabled 12.5-pF crystal SVS enabled RTC disabled SVS disabled
Figure 5-3. LPM3.5 Supply Current vs Temperature Figure 5-4. LPM4.5 Supply Current vs Temperature

5.10 Typical Characteristics - Current Consumption Per Module

DEVICE
MODULE TEST CONDITIONS REFERENCE CLOCK TYP UNIT
GRADE
Timer_B Module input clock T 5 µA/MHz
eUSCI_A UART mode Module input clock T 7 µA/MHz
eUSCI_A SPI mode Module input clock T 5 µA/MHz
eUSCI_B SPI mode Module input clock T 5 µA/MHz
eUSCI_B I2C mode, 100 kbaud Module input clock T 5 µA/MHz
RTC 32 kHz T 85 nA
CRC From start to end of operation MCLK T 8.5 µA/MHz
5.11 Thermal Resistance Characteristics

THERMAL METRIC (1) VALUE (2) UNIT
QFP 48 pin (PT) 67.6
QFN 40 pin (RHA) 31.6
RθJA Junction-to-ambient thermal resistance, still air ºC/W
TSSOP 38 pin (DBT) 67.0
QFN 32 pin (RSM) 32.3
RθJC Junction-to-case (top) thermal resistance ºC/W
RθJB Junction-to-board thermal resistance ºC/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC (RθJC) value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment and application. For more information, see these EIA/JEDEC
standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

5.12 Timing and Switching Characteristics
5.12.1 Power Supply Sequencing

Figure 5-5 shows the power cycle and reset conditions.
Power Cycle Reset SVS Reset BOR Reset
VSVS+
VSVS–
V BOR
t BOR
t
Figure 5-5. Power Cycle, SVS, and BOR Reset Conditions
Table 5-1 lists the characteristics of the SVS and BOR.
Table 5-1. PMM, SVS and BOR

TEST DEVICE
PARAMETER MIN TYP MAX UNIT
CONDITIONS GRADE
(1)
VBOR, safe Safe BOR power-down level T 0.1 V
tBOR, safe Safe BOR reset delay (2) T 10 ms
ISVSH,AM SVSH current consumption, active mode VCC = 3.6 V T 1.5 µA
ISVSH,LPM SVSH current consumption, low-power modes VCC = 3.6 V T 240 nA
VSVSH- SVSH power-down level (3) T 1.71 1.80 1.87 V
(3)
VSVSH+ SVSH power-up level T 1.76 1.88 1.99 V
VSVSH_hys SVSH hysteresis T 100 mV
tPD,SVSH, AM SVSH propagation delay, active mode T 10 µs
tPD,SVSH, LPM SVSH propagation delay, low-power modes T 100 µs
(1) A safe BOR can only be correctly generated only if DVCC must drop below this voltage before it rises.
(2) When an BOR occurs, a safe BOR can only be correctly generated only if DVCC is kept low longer than this period before it reaches
VSVSH+.
(3) For additional information, see the Dynamic Voltage Scaling Power Solution for MSP430 Devices With Single-Channel LDO Reference
Design.

5.12.2 Reset Timing

Table 5-2 lists the device wake-up times.
Table 5-2. Wake-up Times From Low-Power Modes and Reset

TEST DEVICE
PARAMETER VCC MIN TYP MAX UNIT
CONDITIONS GRADE
(Additional) wake-up time to activate
the FRAM in AM if previously
disabled through the FRAM
tWAKE-UP FRAM T 3V 10 µs
controller or from a LPM if
immediate activation is selected for
wake-up (1)
Wake-up time from LPM0 to active 200 ns +
tWAKE-UP LPM0 T 3V
mode (1) 2.5 / fDCO
Wake-up time from LPM3 to active
tWAKE-UP LPM3 T 3V 10 µs
mode (1)
Wake-up time from LPM4 to active
tWAKE-UP LPM4 T 3V 10 µs
mode (2)
Wake-up time from LPM3.5 to
tWAKE-UP LPM3.5 T 3V 350 µs
active mode (2)
Wake-up time from LPM4.5 to SVSHE = 1 T 3V 350 µs
tWAKE-UP LPM4.5
active mode (2) SVSHE = 0 T 3V 1 ms
Wake-up time from RST or BOR
tWAKE-UP-RESET T 3V 1 ms
event to active mode (2)
Pulse duration required at RST/NMI
tRESET T 2 µs
pin to accept a reset
(1) The wake-up time is measured from the edge of an external wake-up signal (for example, port interrupt or wake-up event) to the first
externally observable MCLK clock edge.
(2) The wake-up time is measured from the edge of an external wake-up signal (for example, port interrupt or wake-up event) until the first
instruction of the user program is executed.

5.12.3 Clock Specifications

Table 5-3 lists the characteristics of XT1 in low-frequency mode.
Table 5-3. XT1 Crystal Oscillator (Low Frequency)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) (2)
DEVICE
GRADE
fXT1, LF XT1 oscillator crystal, low frequency LFXTBYPASS = 0 T 32768 Hz
Measured at MCLK,
DCXT1, LF XT1 oscillator LF duty cycle T 30% 70%
fLFXT = 32768 Hz
XT1 oscillator logic-level square-wave
fXT1,SW LFXTBYPASS = 1 (3) (4) T 32768 Hz
input frequency
LFXT oscillator logic-level square-wave
DCXT1,SW LFXTBYPASS = 1 T 40% 60%
input duty cycle
LFXTBYPASS = 0,
LFXTDRIVE = {3},
OALFXT Oscillation allowance for LF crystals (5) T 200 kΩ
fLFXT = 32768 Hz,
CL,eff = 12.5 pF
CL,eff Integrated effective load capacitance (6) (7)
T 1 pF
fOSC = 32768 Hz,
LFXTBYPASS = 0,
tSTART,LFXT Start-up time (8) T 1000 ms
LFXTDRIVE = {3},
TA = 25°C, CL,eff = 12.5 pF
fFault,LFXT Oscillator fault frequency (9) XTS = 0 (10) T 0 3500 Hz
(1) To improve EMI on the LFXT oscillator, observe the following guidelines.
• Keep the trace between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
• Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
• Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.
• If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
(2) See MSP430 32-kHz Crystal Oscillators for details on crystal section, layout, and testing.
(3) When LFXTBYPASS is set, LFXT circuits are automatically powered down. Input signal is a digital square wave with parametrics
defined in the Schmitt-trigger inputs section of this data sheet. Duty cycle requirements are defined by DCLFXT,SW.
(4) Maximum frequency of operation of the entire device cannot be exceeded.
(5) Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
LFXTDRIVE settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but should be evaluated based on the actual crystal selected for the application:
• For LFXTDRIVE = {0}, CL,eff = 3.7 pF
• For LFXTDRIVE = {1}, 6 pF ≤ CL,eff ≤ 9 pF
(6) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
(7) Requires external capacitors at both terminals to meet the effective load capacitance specified by crystal manufacturers. Recommended
effective load capacitance values supported are 3.7 pF, 6 pF, 9 pF, and 12.5 pF. Maximum shunt capacitance of 1.6 pF. The PCB adds
additional capacitance, so it must also be considered in the overall capacitance. Verify that the recommended effective load capacitance
of the selected crystal is met.
(8) Includes startup counter of 1024 clock cycles.
(9) Frequencies above the MAX specification do not set the fault flag. Frequencies between the MIN and MAX specifications might set the
flag. A static condition or stuck at fault condition sets the flag.
(10) Measured with logic-level input frequency but also applies to operation with crystals.

Table 5-4 lists the characteristics of XT1 in high-frequency mode.
Table 5-4. XT1 Crystal Oscillator (High Frequency)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
DEVICE
GRADE
XT1BYPASS = 0, XTS = 1,
T 1 4
XT1HFFREQ = 00
T 4.01 6
HFXT oscillator crystal XT1HFFREQ = 01
fHFXT MHz
frequency, crystal mode XT1BYPASS = 0, XTS = 1,
T 6.01 16
XT1HFFREQ = 10
T 16.01 24
XT1HFFREQ = 11
HFXT oscillator logic-
(2) (3)
fHFXT,SW level square-wave input XT1BYPASS = 1, XTS = 1 T 1 24 MHz
frequency, bypass mode
HFXT oscillator duty Measured at ACLK,
DCHFXT T 40% 60%
cycle. fHFXT,HF = 4 MHz (4)
HFXT oscillator logic-
DCHFXT,SW level square-wave input XT1BYPASS = 1 T 40% 60%
duty cycle
Oscillation allowance for XT1BYPASS = 0, XT1HFSEL = 1
OAHFXT T 3.1 Ω
HFXT crystals (5) fHFXT,HF = 24 MHz, CL,eff = 18 pF
fOSC = 4 MHz, XTS = 1 (4)
XT1BYPASS = 0,
XT1HFFREQ = 00, T 1.6
XT1DRIVE = 3, TA = 25°C,
CL,eff = 18 pF
tSTART,HFXT Start-up time (6) ms
fOSC = 24 MHz, XTS = 1 (4)
XT1BYPASS = 0,
XT1HFFREQ = 00, T 1.1
XT1DRIVE = 3, TA = 25°C,
CL,eff = 18 pF
Integrated effective load
CL,eff T 1 pF
capacitance (7) (8)
Oscillator fault
fFault,HFXT T 0 800 kHz
frequency (9) (10)
(1) To improve EMI on the HFXT oscillator, observe the following guidelines.
• Keep the trace between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
• Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
• Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.
• If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
(2) When XT1BYPASS is set, HFXT circuits are automatically powered down. Input signal is a digital square wave with parametrics defined
in the Schmitt-trigger Inputs section of this datasheet. Duty cycle requirements are defined by DCHFXT,SW.
(3) Maximum frequency of operation of the entire device cannot be exceeded.
(4) The 4-MHz crystal used for lab characterization is the Abracon HC49/U AB-4.000MHZ-B2. The 16-MHz crystal used for lab
characterization is the Abracon HC49/U AB-16.000MHZ-B2.
(5) Oscillation allowance is based on a safety factor of 5 for recommended crystals.
(6) Includes startup counter of 4096 clock cycles.
(7) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the oscillator frequency through
MCLK or SMCLK. For a correct setup, the effective load capacitance should always match the specification of the used crystal.
(8) Requires external capacitors at both terminals. Values are specified by crystal manufacturers. Recommended values supported are
14 pF, 16 pF, and 18 pF. The maximum shunt capacitance is 7 pF.
(9) Frequencies above the MAX specification do not set the fault flag. Frequencies between the MIN and MAX specifications might set the
flag. A static condition or stuck at fault condition sets the flag.
(10) Measured with logic-level input frequency but also applies to operation with crystals.

Table 5-5 lists the frequency characteristics of the DCO FLL.
Table 5-5. DCO FLL, Frequency

Over recommended operating free-air temperature (unless otherwise noted)
DEVICE
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
GRADE
Measured at MCLK, internal
fDCO, FLL FLL lock frequency, 24 MHz, 25°C T 3.0 V –1.0% 1.0%
trimmed REFO as reference
Measured at MCLK, internal
fDCO, FLL FLL lock frequency, 24 MHz T 3.0 V –2.0% 2.0%
trimmed REFO as reference
Measured at MCLK, XT1
fDCO, FLL FLL lock frequency, 24 MHz T 3.0 V –0.5% 0.5%
crystal as reference
fDUTY Duty cycle T 3.0 V 40% 50% 60%
Jittercc Cycle-to-cycle jitter, 24 MHz T 3.0 V 0.50%
Jitterlong Long-term Jitter, 24 MHz T 3.0 V 0.022%
tFLL, lock FLL lock time T 3.0 V 200 ms
Table 5-6 lists the frequency characteristics of the DCO.
Table 5-6. DCO Frequency

DEVICE
GRADE
DCORSEL = 111b, DISMOD = 1b,
T 3.0 V 12.6
DCOFTRIM = 000b, DCO = 0
T 3.0 V 20.5
fDCO, 24MHz DCO frequency 24 MHz MHz
T 3.0 V 29.9
T 3.0 V 48.2
T 3.0 V 10.5
T 3.0 V 17.2
T 3.0 V 25.1
T 3.0 V 40.4
T 3.0 V 8.3
T 3.0 V 13.6
T 3.0 V 19.9
T 3.0 V 32.2

Table 5-6. DCO Frequency (continued)

DEVICE
GRADE
T 3.0 V 6.2
T 3.0 V 10.2
T 3.0 V 15
T 3.0 V 24.3
T 3.0 V 4.2
T 3.0 V 6.9
T 3.0 V 10
T 3.0 V 16.4
DCORSEL = 010b,, DISMOD = 1b,
T 3.0 V 2
T 3.0 V 3.4
T 3.0 V 5
T 3.0 V 8.2
T 3.0 V 1
T 3.0 V 1.7
T 3.0 V 2.5
T 3.0 V 4.2
T 3.0 V 0.5
T 3.0 V 0.85
T 3.0 V 1.2
T 3.0 V 2.1

50
DCOFTRIM = 7
40 DCOFTRIM = 7
DCOFTRIM = 7
30
Frequency (MHz)
DCOFTRIM = 7
20
DCOFTRIM = 7
DCOFTRIM = 0
10
DCOFTRIM = 7 DCOFTRIM = 0
DCOFTRIM = 0
DCOFTRIM = 7
DCOFTRIM = 0
DCOFTRIM = 7 DCOFTRIM = 0
DCOFTRIM = 0
0 DCOFTRIM = 0 DCOFTRIM = 0
DCO 0 511 0 511 0 511 0 511 0 511 0 511 0 511 0 511

0 1 2 3 4 5 6 7
DCORSEL (1MHz) (2MHz) (4MHz) (8MHz) (12MHz) (16MHz) (20MHz) (24MHz)
Figure 5-6. Typical DCO Frequency

Table 5-7 lists the characteristics of the REFO.
Table 5-7. REFO

over recommended operating free-air temperature (unless otherwise noted)
DEVICE
GRADE
REFO oscillator current
TA = 25°C, HP mode (REFLP = 0) T 3.0 V 15
consumption
IREFO µA
REFO oscillator current
TA = 25°C, LP mode (REFLP = 1) T 3.0 V 1
consumption
REFO calibrated
Measured at MCLK T 3.0 V 32768 Hz
frequency
fREFO
REFO absolute 1.8 V to
–40°C to 105°C T –3.5% +3.5%
calibrated tolerance 3.6 V
REFO frequency
dfREFO/dT Measured at MCLK (1) T 3.0 V 0.01 %/°C
temperature drift
REFO frequency supply 1.8 V to
dfREFO/dVCC Measured at MCLK at 25°C (2) T 1 %/V
voltage drift 3.6 V
1.8 V to
fDC REFO duty cycle Measured at MCLK T 40% 50% 60%
3.6 V
40% to 60% duty cycle, HP mode
T 3.0 V 72
(REFLP = 0)
tSTART REFO start-up time µs
40% to 60% duty cycle, LP mode
T 3.0 V 75
(REFLP = 1)
(1) Calculated using the box method: (MAX(–40°C to 105°C) – MIN(–40°C to 105°C)) / MIN(–40°C to 105°C) / (105°C – (–40°C))
(2) Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
Table 5-8 lists the characteristics of the VLO.
Table 5-8. Internal Very-Low-Power Low-Frequency Oscillator (VLO)

DEVICE
GRADE
fVLO VLO frequency Measured at MCLK T 3.0 V 10 kHz
dfVLO/dT VLO frequency temperature drift Measured at MCLK (1) T 3.0 V 0.5 %/°C
1.8 V to
dfVLO/dVCC VLO frequency supply voltage drift Measured at MCLK (2) T 4 %/V
3.6 V
fVLO,DC Duty cycle Measured at MCLK T 3.0 V 50%
(2) Calculated using the box method: (MAX(1.8 V to 3.6 V) – MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V – 1.8 V)
NOTE
The VLO clock frequency is reduced by 15% (typical) when the device switches from active
mode to LPM3 or LPM4, because the reference changes. This lower frequency is not a
violation of the VLO specifications (see Table 5-8).

Table 5-9 lists the characteristics of the MODOSC.
Table 5-9. Module Oscillator (MODOSC)

DEVICE
GRADE
fMODOSC MODOSC frequency T 3.0 V 3.0 3.8 4.6 MHz
fMODOSC/dT MODOSC frequency temperature drift (1) T 3.0 V 0.102 %/℃
1.8 V to
fMODOSC/dVCC MODOSC frequency supply voltage drift T 1.17 %/V
3.6 V
fMODOSC,DC Duty cycle T 3.0 V 40% 50% 60%
5.12.4 Internal Shared Reference

Table 5-10 lists the characteristics of the internal shared reference.
Table 5-10. Internal Shared Reference

DEVICE
GRADE
Temperature sensor 2.0 V,
VSENSOR TJ = 30℃ T 788 mV
voltage 3.0 V
Temperature sensor
TCSENSOR TJ = 30℃ T 2.32 mV/°C
coefficient
Low-power threshold 2.0 V,
VeCOMP, LP TJ = 30℃ T 1.20 V
for eCOMP 3.0 V
Positive output 2.0 V,
VREF+, Output TJ = 30℃ T 1.20 V
reference at VREF+ pin 3.0 V
The following parameters are for the 1.5-V, 2.0-V, and 2.5-V internal reference only and cannot be output to the VREF+ pin.
REFVSEL = {2} for 2.5 V,
T 3.0 V 2.5 ±1.5%
INTREFEN = 1
Positive built-in
VREF+, built-in reference voltage as T 2.5 V 2.0 ±1.5% V
INTREFEN = 1
internal reference
T 1.8 V 1.5 ±1.8%
INTREFEN = 1
(1) From 0.1 Hz to 10 Hz,
Noise RMS noise at VREF T 30 130 µV
REFVSEL = {0}
TA = 25 °C , ADC ON,
VREF ADC BUF_INT
VOS_BUF_INT REFVSEL = {0}, INTREFEN = 1, T –16 +16 mV
buffer offset (2)
EXTREFEN=0
TA = 25 °C, REFVSEL = {0} ,
VREF ADC BUF_EXT
VOS_BUF_EXT EXTREFEN = 1, T –16 +16 mV
buffer offset (3)
INTREFEN = 1 or ADC ON
REFVSEL = {0} for 1.5 V T 1.8
DVCC minimum
DVCC(min) voltage, Positive built-in REFVSEL = {1} for 2.0 V T 2.2 V
reference active
REFVSEL = {2} for 2.5 V T 2.7
Operating supply
IREF+ current into DVCC INTREFEN = 1 T 3V 19 26 µA
terminal (4)
Operating supply
ADC ON, EXTREFEN = 0,
IREF+_ADC_BUF current into DVCC T 3V 247 400 µA
REFVSEL = {0, 1, 2}
terminal (4)
(1) Internal reference noise affects ADC performance when ADC uses internal reference.
(2) Buffer offset affects ADC gain error and thus total unadjusted error.
(3) Buffer offset affects ADC gain error and thus total unadjusted error.
(4) The internal reference current is supplied through the DVCC terminal.
Table 5-10. Internal Shared Reference (continued)

DEVICE
GRADE
REFVSEL = {0, 1, 2},
VREF maximum load
DVCC = DVCC(min) for each
IO(VREF+) current, VREF+ T 3V –1000 +10 µA
reference level,
terminal
INTREFEN = EXTREFEN = 1
REFVSEL = {0, 1, 2},
I = +10 µA or –1000 µA,
ΔVout/ Load-current regulation, O(VREF+)
DVCC = DVCC(min) for each T 3V 1500 µV/mA
ΔIo(VREF+) VREF+ terminal
reference level,
Capacitance at VREF+
CVREF+/- INTREFEN = EXTREFEN = 1 T 3V 0 100 pF
and VREF- terminals
REFVSEL = {0, 1, 2},
Temperature coefficient
TCREF+ INTREFEN = EXTREFEN = 1, T 3V 24 50 ppm/K
of built-in reference
TA = –40°C to 105°C (5)
DVCC = DVCC (min) to DVCC(max),
Power supply rejection
PSRR_DC TA = 25°C, REFVSEL = {0, 1, 2}, T 3V 100 400 µV/V
ratio (DC)
Power supply rejection
PSRR_AC dDVCC= 0.1 V at 1 kHz T 3V 3.0 mV/V
ratio (ac)
DVCC = DVCC(min) to DVCC(max),
Settling time of
tSETTLE REFVSEL = {0, 1, 2}, T 3V 75 100 µs
reference voltage (6)
INTREFEN = 0 → 1
(6) The condition is that the error in a conversion started after tREFON is less than ±0.5 LSB.

5.12.5 General-Purpose I/Os

Table 5-11 lists the characteristics of the digital inputs.
Table 5-11. Digital Inputs

DEVICE
GRADE
T 2.0 V 0.90 1.50
VIT+ Positive-going input threshold voltage V
T 3.0 V 1.35 2.25
T 2.0 V 0.50 1.10
VIT– Negative-going input threshold voltage V
T 3.0 V 0.75 1.65
T 2.0 V 0.3 0.8
Vhys Input voltage hysteresis (VIT+ – VIT–) V
T 3.0 V 0.4 1.2
For pullup: VIN = VSS,
RPull Pullup or pulldown resistor T 20 35 50 kΩ
For pulldown: VIN = VCC
CI,dig Input capacitance, digital only port pins VIN = VSS or VCC T 3 pF
Input capacitance, port pins with shared
CI,ana VIN = VSS or VCC T 5 pF
analog functions
2.0 V,
Ilkg(Px.y) High-impedance leakage current (1) (2) T –30 +30 nA
3.0 V
Ports with interrupt
External interrupt timing (external trigger capability (see block 2.0 V,
t(int) T 50 ns
pulse duration to set interrupt flag) (3) diagram and terminal 3.0 V
function descriptions)
(1) The leakage current is measured with VSS or VCC applied to the corresponding pins, unless otherwise noted.
(2) The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup or pulldown resistor is
disabled.
(3) An external signal sets the interrupt flag every time the minimum interrupt pulse duration t(int) is met. It can be set by trigger signals
shorter than t(int).
Table 5-12 lists the characteristics of the digital outputs.
Table 5-12. Digital Outputs

DEVICE
GRADE
I(OHmax) = –3 mA (1) T 2.0 V 1.4 2.0
VOH High-level output voltage (1)
V
I(OHmax) = –5 mA T 3.0 V 2.4 3.0
I(OLmax) = 3 mA (1) T 2.0 V 0.0 0.60
VOL Low-level output voltage V
I(OLmax) = 5 mA (1) T 3.0 V 0.0 0.60
Applicable to all IO ports, CL = 20 T 2.0 V 16
pF (2) T 3.0 V 16
fPort_CLK Clock output frequency MHz
IOs multiplexed with MCLK and T 2.0 V 24
SMCLK, CL = 10 pF (2) T 3.0 V 24
Port output rise time, digital T 2.0 V 10
trise,dig CL = 20 pF ns
only port pins T 3.0 V 7
Port output fall time, digital T 2.0 V 10
tfall,dig CL = 20 pF ns
only port pins T 3.0 V 5
(1) The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop
specified.
(2) The port can output frequencies at least up to the specified limit and might support higher frequencies.

5.12.6 Digital I/O Typical Characteristics
25 10
20
7.5
Low-Level Output Current (mA)

Low-Level Output Current (mA)
15
5
10
TA = -40°C TA = -40°C
TA = 25°C 2.5 TA = 25°C

5
TA = 85°C TA = 85°C
TA = 105°C TA = 105°C
0 0
0 0.5 1 1.5 2 2.5 3 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2
Low-Level Output Voltage (V) Low-Level Output Voltage (V)
DVCC = 3 V DVCC = 2 V
Figure 5-7. Typical Low-Level Output Current Figure 5-8. Typical Low-Level Output Current
vs vs
Low-Level Output Voltage Low-Level Output Voltage
0 0
TA = -40°C TA = -40°C
-5 TA = 25°C TA = 25°C
High-Level Output Current (mA)
High-Level Output Current (mA)
TA = 85°C -2.5 TA = 85°C
-10 TA = 105°C TA = 105°C
-
-15 -5
-20
-7.5
-25
-30 -10
0 0.5 1 1.5 2 2.5 3 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2
High-Level Output Voltage (V) High-Level Output Voltage (V)
DVCC = 3 V DVCC = 2 V
Figure 5-9. Typical High-Level Output Current Figure 5-10. Typical High-Level Output Current
vs vs
High-Level Output Voltage High-Level Output Voltage

5.12.7 Timer_B
Table 5-13 lists the frequency characteristics of Timer_B.
Table 5-13. Timer_B

DEVICE
GRADE
Internal: SMCLK or ACLK,
2.0 V,
fTB Timer_B input clock frequency External: TBCLK, T 24 MHz
3.0 V
Duty cycle = 50% ±10%
All capture inputs, minimum pulse 2.0 V,
tTB,cap Timer_B capture timing T 20 ns
duration required for capture 3.0 V
5.12.8 eUSCI
Table 5-14 lists the supported frequencies of the eUSCI in UART mode.
Table 5-14. eUSCI (UART Mode) Clock Frequencies

DEVICE
GRADE
Internal: SMCLK or MODCLK,
2.0 V,
feUSCI eUSCI input clock frequency External: UCLK, T 24 MHz
3.0 V
BITCLK clock frequency 2.0 V,
fBITCLK T 5 MHz
(equals baud rate in Mbaud) 3.0 V
Table 5-15 lists the switching characteristics of the eUSCI in UART mode.
Table 5-15. eUSCI (UART Mode) Switching Characteristics

DEVICE
GRADE
UCGLITx = 0 12
(1)
UCGLITx = 1 2.0 V, 40
tt UART receive deglitch time T ns
UCGLITx = 2 3.0 V 68
UCGLITx = 3 110
(1) Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To make sure that pulses are
correctly recognized their width should exceed the maximum specification of the deglitch time.

Table 5-16 lists the supported frequencies of the eUSCI in SPI master mode.
Table 5-16. eUSCI (SPI Master Mode) Clock Frequency

DEVICE
GRADE
Internal: SMCLK,
feUSCI eUSCI input clock frequency T 8 MHz
Table 5-17 lists the switching characteristics of the eUSCI in SPI master mode.
Table 5-17. eUSCI (SPI Master Mode) Switching Characteristics

DEVICE
GRADE
UCSTEM = 1, UCxCLK
tSTE,LEAD STE lead time, STE active to clock T 1
UCMODEx = 01 or 10 cycles
STE lag time, Last clock to STE UCSTEM = 1, UCxCLK
tSTE,LAG T 1
inactive UCMODEx = 01 or 10 cycles
2.0 V 60
tSU,MI SOMI input data setup time T ns
3.0 V 42
2.0 V 0
tHD,MI SOMI input data hold time T ns
3.0 V 0
UCLK edge to SIMO 2.0 V 20
tVALID,MO SIMO output data valid time (2) valid, T ns
CL = 20 pF 3.0 V 20
2.0 V –9.0
tHD,MO SIMO output data hold time (3) CL = 20 pF T ns
3.0 V –6.0
(1) fUCxCLK = 1/2tLO/HI with tLO/HI = max(tVALID,MO(eUSCI) + tSU,SI(Slave), tSU,MI(eUSCI) + tVALID,SO(Slave))
For the slave parameters tSU,SI(Slave) and tVALID,SO(Slave), see the SPI parameters of the attached slave.
(2) Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams
in Figure 5-11 and Figure 5-12.
(3) Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data
on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in Figure 5-
11 and Figure 5-12.

1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLOW/HIGH tLOW/HIGH
tSU,MI
tHD,MI
SOMI
tVALID,MO
SIMO
Figure 5-11. SPI Master Mode, CKPH = 0
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLOW/HIGH tLOW/HIGH
tHD,MI
tSU,MI
SOMI
tVALID,MO
SIMO
Figure 5-12. SPI Master Mode, CKPH = 1

Table 5-18 lists the switching characteristics of the eUSCI in SPI slave mode.
Table 5-18. eUSCI (SPI Slave Mode) Switching Characteristics

DEVICE
GRADE
2.0 V 55
tSTE,LEAD STE lead time, STE active to clock T ns
3.0 V 45
STE lag time, last clock to STE 2.0 V 20
tSTE,LAG T ns
inactive 3.0 V 20
STE access time, STE active to SOMI 2.0 V 65
tSTE,ACC T ns
data out 3.0 V 40
STE disable time, STE inactive to 2.0 V 40
tSTE,DIS T ns
SOMI high impedance 3.0 V 35
2.0 V 10
tSU,SI SIMO input data setup time T ns
3.0 V 6
2.0 V 12
tHD,SI SIMO input data hold time T ns
3.0 V 12
UCLK edge to SOMI valid, 2.0 V 69
tVALID,SO SOMI output data valid time (2) T ns
CL = 20 pF 3.0 V 42
(3)
2.0 V 5
tHD,SO SOMI output data hold time CL = 20 pF T ns
3.0 V 5
(1) fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(Master) + tSU,SI(eUSCI), tSU,MI(Master) + tVALID,SO(eUSCI))
For the master parameters tSU,MI(Master) and tVALID,MO(Master), see the SPI parameters of the attached master.
(2) Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams
in Figure 5-13 and Figure 5-14.
(3) Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure 5-13
and Figure 5-14.

tSTE,LEAD tSTE,LAG
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLOW/HIGH tLOW/HIGH tSU,SIMO
tHD,SIMO
SIMO
tACC tVALID,SOMI tDIS
SOMI
Figure 5-13. SPI Slave Mode, CKPH = 0
tSTE,LEAD tSTE,LAG
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLOW/HIGH tLOW/HIGH
tHD,SI
tSU,SI
SIMO
tACC tVALID,SO tDIS
SOMI
Figure 5-14. SPI Slave Mode, CKPH = 1

Table 5-19 lists the switching characteristics of the eUSCI in I2C mode.
Table 5-19. eUSCI (I2C Mode) Switching Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5-15)
DEVICE
GRADE
Internal: SMCLK or MODCLK,
2.0 V,
feUSCI eUSCI input clock frequency External: UCLK T 24 MHz
3.0 V
2.0 V,
fSCL SCL clock frequency T 0 400 kHz
3.0 V
fSCL = 100 kHz 2.0 V, 4.0
tHD,STA Hold time (repeated) START T µs
fSCL > 100 kHz 3.0 V 0.6
Setup time for a repeated fSCL = 100 kHz 2.0 V, 4.7
tSU,STA T µs
START fSCL > 100 kHz 3.0 V 0.6
2.0 V,
tHD,DAT Data hold time T 0 ns
3.0 V
2.0 V,
tSU,DAT Data setup time T 250 ns
3.0 V
fSCL = 100 kHz 2.0 V, 4.0
tSU,STO Setup time for STOP T µs
fSCL > 100 kHz 3.0 V 0.6
UCGLITx = 0 50 600
Pulse duration of spikes UCGLITx = 1 2.0 V, 25 300
tSP T ns
suppressed by input filter UCGLITx = 2 3.0 V 12.5 150
UCGLITx = 3 6.3 75
UCCLTOx = 1 36
2.0 V,
tTIMEOUT Clock low time-out UCCLTOx = 2 T 40 ms
3.0 V
UCCLTOx = 3 44
tHD,STA tSU,STA tHD,STA tBUF
SDA
tLOW tHIGH tSP

SCL
tSU,DAT tSU,STO
tHD,DAT
Figure 5-15. I2C Mode Timing

5.12.9 ADC
Table 5-20 lists the input characteristics of the ADC.
Table 5-20. ADC, Power Supply and Input Range Conditions

DEVICE
GRADE
DVCC ADC supply voltage (1) T 2.0 3.6 V
V(Ax) Analog input voltage range All ADC pins T 0 DVCC V
Operating supply current into fADCCLK = 5 MHz, ADCON = 1, 2.0 V 185
DVCC terminal, reference REFON = 0, SHT0 = 0,
IADC T µA
current not included, repeat- SHT1 = 0, ADCDIV = 0, 3.0 V 280
single-channel mode ADCCONSEQx = 10b
Only one terminal Ax can be
selected at one time from the
CI Input capacitance T 2.2 V 4.5 5.5 pF
pad to the ADC capacitor
array, including wiring and pad
RI Input MUX ON resistance DVCC = 2 V, 0 V ≤ VAx ≤ DVCC T 2 kΩ
(1) This specifies the ADC functional range with 8-bit resolution at 8-bit ENOB. Table 5-22 specifies 10- and 12-bit linearity parameters for
better ENOB requirements.
Table 5-21 lists the timing parameters of the ADC.
Table 5-21. ADC, Timing Parameters

DEVICE
GRADE
ADC clock ADC clock, 10-bit mode 2.4 V to 6.0
fADCCLK frequency T MHz
ADC clock, 12-bit mode 3.6 V 4.4
The error in a conversion started after
Turn-on settling
tSettling tADCON is less than ±0.5 LSB, T 100 ns
time of the ADC
Reference and input signal already settled
RS = 1000 Ω, RI = 4000 Ω,
CI = 5.5 pF, Cexternal = 8.0 pF,
2.4 V to
Approximately 7.62 Tau (t) are required for T 0.52
3.6 V
an error of less than ±0.5 LSB, 10-bit
mode (2)
tSample Sampling time (1) µs
RS = 1000 Ω, RI = 4000 Ω,
CI = 5.5 pF, Cexternal = 8.0 pF,
2.4 V to
Approximately 9.01 Tau (t) are required for T 0.61
3.6 V
an error of less than ±0.5 LSB, 12-bit
mode (2)
(1) This excludes the ADC conversion time. The ADC conversion time is specified as (N + 2) × 1/fADCCLK.
(2) tSample = ln(2n+1) × τ, where n = ADC resolution, τ = (RI + RS) × CI

Table 5-22 lists the linearity parameters of the ADC.
Table 5-22. ADC, Linearity Parameters

DEVICE
GRADE
Integral linearity error(12-bit mode) Veref+ reference 2.4 V to –2.5 2.5
EI T LSB
Integral linearity error (10-bit mode) Veref+ reference 3.6 V –2 2
Differential linearity error(12-bit mode) Veref+ reference 2.4 V to –1 1
ED T LSB
Differential linearity error (10-bit mode) Veref+ reference 3.6 V –1 1
Offset error(12-bit mode) Veref+ reference 2.4 V to –1.5 1.5
EO T mV
Offset error (10-bit mode) Veref+ reference 3.6 V –6.0 6.0
Gain error (12-bit mode) Veref+ as reference 2.4 V to –3.0 3.0
EG T LSB
Gain error (10-bit mode) Veref+ as reference 3.6 V –1.5 1.5
Total unadjusted error (12-bit mode) Veref+ as reference 2.4 V to –4.0 4.0
ET T LSB
Total unadjusted error (10-bit mode) Veref+ as reference 3.6 V –2.0 2.0

5.12.10 Enhanced Comparator (eCOMP)

Table 5-23 lists the characteristics of eCOMP0.
Table 5-23. eCOMP0

DEVICE
GRADE
VCC Supply voltage T 2.0 3.6 V
VIC Common mode input range T 0 VCC V
CPEN = 1, CPHSEL= 00 0
VHYS DC input hysteresis T mV
CPEN = 1, CPMSEL = 0 –30 +30
VOFFSET Input offset voltage T mV
CPEN = 1, CPMSEL = 1 –40 +40
Quiescent current draw from VIC = VCC/2, CPEN = 1, CPMSEL = 0 24 35
ICOMP T µA
VCC, only Comparator VIC = VCC/2, CPEN = 1, CPMSEL = 1 1.6 5
CIN Input channel capacitance (1) T 1 pF
Input channel series On (switch closed) 10 20 kΩ
RIN T
resistance Off (switch open) 50 MΩ
CPMSEL = 0, CPFLT = 0,
1
Propagation delay, response Overdrive = 20 mV
tPD T µs
time CPMSEL = 1, CPFLT = 0,
3.2
Overdrive = 20 mV
CPEN = 0→1, CPMSEL = 0,
8.5
V+ and V- from pads, Overdrive = 20 mV
tEN_CP Comparator enable time T µs
1.4
CPEN = 0→1, CPDACEN = 0→1,
CPMSEL = 0, CPDACREFS = 1, 8.5
CPDACBUF1 = 0F, Overdrive = 20 mV
Comparator with reference
tEN_CP_DAC CPEN = 0→1, CPDACEN = 0→1, T µs
DAC enable time
CPMSEL = 1,
101
CPDACREFS = 1, CPDACBUF1 = 0F,
Overdrive = 20 mV
CPMSEL = 0, CPFLTDY = 00,
0.7
Overdrive = 20 mV, CPFLT = 1
1.1
Propagation delay with Overdrive = 20 mV, CPFLT = 1
tFDLY T µs
analog filter active CPMSEL = 0, CPFLTDY = 10,
1.9
3.4
INL Integral nonlinearity T –0.5 0.5 LSB
DNL Differential nonlinearity T –0.5 0.5 LSB
(1) For details on the eCOMP CIN, model , see Figure 5-16.

Table 5-24 lists the characteristics of eCOMP1.
Table 5-24. eCOMP1

DEVICE
GRADE
VIC Common mode input range T 0 VCC V
VHYS DC input hysteresis T mV
CPEN = 1, CPMSEL = 0 –30 +30
VOFFSET Input offset voltage T mV
CPEN = 1, CPMSEL = 1 –40 +40
Quiescent current draw from VIC = VCC/2, CPEN = 1, CPMSEL = 0 162 209
ICOMP T µA
VCC, only Comparator VIC = VCC/2, CPEN = 1, CPMSEL = 1 20 30
CIN Input channel capacitance (1) T 1 pF
On (switch closed) 1 5 kΩ
RIN Input channel series resistance T
Off (switch open) 50 MΩ
CPMSEL = 0, CPFLT = 0,
0.1
Propagation delay, response Overdrive = 20 mV, DVCC = 3.0 V
tPD T µs
time CPMSEL = 1, CPFLT = 0,
0.32
Overdrive = 20 mV
8.5
tEN_CP Comparator enable time T µs
4.8
CPEN = 0→1, CPDACEN = 0→1,
CPMSEL = 0, CPDACREFS = 1, 8.5
Comparator with reference DAC CPDACBUF1 = 0F, Overdrive = 20 mV
tEN_CP_DAC T µs
enable time CPEN = 0→1, CPDACEN = 0→1,
CPMSEL = 1, CPDACREFS = 1, 101
CPDACBUF1 = 0F, Overdrive = 20 mV
150
350
Propagation delay with analog Overdrive = 20 mV, CPFLT = 1
tFDLY T ns
filter active CPMSEL = 0, CPFLTDY = 10,
1000
1900
INL Integral nonlinearity T –0.5 0.5 LSB
DNL Differential nonlinearity T –0.5 0.5 LSB
(1) For details on the eCOMP CIN, model, see Figure 5-16.
MSP430
VI = External source voltage
RS = External source resistance
RS RI RI = Internal MUX-on input resistance
VI VC CIN = Input capacitance
CPAD = PAD capacitance
CPext = Parasitic capacitance, external
VC = Capacitance-charging voltage
Cpext CPAD CIN
Figure 5-16. eCOMP Input Circuit

5.12.11 Smart Analog Combo (SAC) (MSP430FR235x Devices Only)

Table 5-25 lists the characteristics of the SAC OA.
Table 5-25. SAC, OA

DEVICE
GRADE
VOS Input offset voltage T –5 5 mV
OAPM = 0 (1) 3
dVOS/dT Offset drift (1)
T µV/℃
OAPM = 1 5
IB Input bias current T 50 pA
VCC +
VCM Input voltage range T –0.1 V
0.1
OAPM = 0 350
IIDD Quiescent current T µA
OAPM = 1 120
f = 0.1 Hz to 10 Hz,
Input noise voltage 40 µV
Vin = VCC/2, OAPM = 0
ENI T
f = 1 kHz, Vin = VCC/2, OAPM = 0 64
Input noise voltage density nV/√Hz
f = 10 kHz, Vin = VCC/2, OAPM = 0 28
OAPM = 0 70
CMRR Common-mode rejection ratio T dB
OAPM = 1 80
OAPM = 0 70
PSRR Power supply rejection ratio T dB
OAPM = 1 80
OAPM = 0 2.8
GBW Gain-bandwidth T MHz
OAPM = 1 1.0
OAPM = 0 100
AOL Open-loop voltage gain T dB
OAPM = 1 100
φM Phase margin CL = 50 pF , RL = 2 kΩ T 65 deg
CL = 50 pF, OAPM = 0, step = 1 3
Positive slew rate T V/µs
CL = 50 pF, OAPM = 1, step = 1 1
Cin Input capacitance Common mode T 3 pF
Voltage output swing from
VO RL = 10 kΩ T 40 100 mV
supply rails
To 0.1% final value, G = +1, 1-V setup
1
CL = 50 pF, OAPM = 0
tST OA settling time T µs
To 0.1% final value, G = +1, 1-V setup
4.5
CL = 50 pF, OAPM = 1
THD Total harmonic distortion All gains T –60 dB
Table 5-25. SAC, OA (continued)

DEVICE
GRADE
Gain = 1, inverting mode, follower mode T 0.99 1 1.01
Gain = 2, noninverting mode T 1.98 2 2.02
Gain = 2, inverting mode T 1.98 2 2.02
Gclose loop PGA closed-loop gain
Table 5-26 lists the characteristics of the SAC DAC.
Table 5-26. SAC, DAC

DEVICE
GRADE
Quiescent current of resistor
IIDDR T 5 µA
ladder into VREF_INT
Low-power mode 0.2
IIOAD OA + DAC output load current T mA
High-power mode 1
OA + DAC settling time, full DACDAT = OAPM = 1 477
tST(FS) T µs
scale 0x80h→0xF7Fh→0x80h OAPM = 0 160
DACDAT = OAPM = 1 2 10
0x3F8h→408h→0x3F8h
OA + DAC settling time, code
tST(C-C) or T µs
to code OAPM = 0 2 5
DACDAT =
0xBF8h→C08h→0xBF8h
INL OA + DAC integral nonlinearity DACSREF = DVCC, DVCC = 3.0 V T –4 4 LSB
OA + DAC differential
DNL DACSREF = DVCC, DVCC = 3.0 V T –1 1 LSB
nonlinearity
No load, DACSREF = DVCC, DACDAT = 0 0 0.005
RLOAD = 3 kΩ , DACSREF = DVCC,
0 0.1
VOUT Output voltage range DACDAT = 0 T V
RLOAD = 3 kΩ , DACSREF = DVCC, DVCC –
DVCC
DACDAT = 0FFFh 0.1

5.12.12 FRAM
Table 5-27 lists the characteristics of the FRAM.
Table 5-27. FRAM

DEVICE
GRADE
Read and write endurance T 1015 cycles
TJ = 25°C T 100
tRetention Data retention duration TJ = 70°C T 40 years
TJ = 115°C T 10
(1) (1)
IWRITE Current to write into FRAM T IREAD IREAD IREAD (1) nA
(2) (2)
IERASE Erase current T N/A N/A N/A (2) nA
(3) (3) (3)
tWRITE Write time T tREAD tREAD tREAD ns
NWAITSx = 0 T 1/fSYSTEM (4) 1/fSYSTEM (4) 1/fSYSTEM (4)
TREAD Read time NWAITSx = 1 T 2/fSYSTEM (4) 2/fSYSTEM (4) 2/fSYSTEM (4) ns
NWAITSx = 2 T 3/fSYSTEM (4) 3/fSYSTEM (4) 3/fSYSTEM (4)
(1) Writing to FRAM does not require a setup sequence or additional power when compared to reading from FRAM. The FRAM read
current IREAD is included in the active mode current consumption IAM, FRAM parameters.
(2) FRAM does not require a special erase sequence.
(3) Writing into FRAM is as fast as reading.
(4) The maximum read (and write) speed is specified by fSYSTEM using the appropriate wait state settings (NWAITSx).

5.12.13 Emulation and Debug

Table 5-28 lists the characteristics of the SBW interface.
Table 5-28. JTAG, Spy-Bi-Wire Interface

DEVICE
GRADE
2.0 V,
fSBW Spy-Bi-Wire input frequency T 0 8 MHz
3.0 V
2.0 V,
tSBW,Low Spy-Bi-Wire low clock pulse duration T 0.028 15 µs
3.0 V
SBWTDIO setup time (before falling edge of SBWTCK in 2.0 V,
tSU,SBWTDIO T 4 ns
TMS and TDI slot Spy-Bi-Wire) 3.0 V
SBWTDIO hold time (after rising edge of SBWTCK in TMS 2.0 V,
tHD,SBWTDIO T 19 ns
and TDI slot Spy-Bi-Wire) 3.0 V
SBWTDIO data valid time (after falling edge of SBWTCK in 2.0 V,
tValid,SBWTDIO T 31 ns
TDO slot Spy-Bi-Wire) 3.0 V
Spy-Bi-Wire enable time (TEST high to acceptance of first 2.0 V,
tSBW, En T 110 µs
clock edge) (1) 3.0 V
2.0 V,
tSBW,Ret Spy-Bi-Wire return to normal operation time (2) T 15 100 µs
3.0 V
2.0 V,
Rinternal Internal pulldown resistance on TEST T 20 35 50 kΩ
3.0 V
(1) Tools that access the Spy-Bi-Wire interface must wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying the
first SBWTCK clock edge.
(2) Maximum tSBW,Rst time after pulling or releasing the TEST/SBWTCK pin low, the Spy-Bi-Wire pins revert from their Spy-Bi-Wire function
to their application function. This time applies only if the Spy-Bi-Wire mode was selected.
tSBW,EN 1/fSBW
tSBW,Low
tSBW,High tSBW,Ret
TEST/SBWTCK
tEN,SBWTDIO tValid,SBWTDIO
RST/NMI/SBWTDIO
tSU,SBWTDIO tHD,SBWTDIO
Figure 5-17. JTAG Spy-Bi-Wire Timing

Table 5-29 lists the characteristics of the 4-wire JTAG interface.
Table 5-29. JTAG, 4-Wire Interface

DEVICE
GRADE
(1) 2.0 V,
fTCK TCK input frequency I, T 0 10 MHz
3.0 V
2.0 V,
tTCK,Low Spy-Bi-Wire low clock pulse duration I, T 15 ns
3.0 V
2.0 V,
tTCK,high Spy-Bi-Wire high clock pulse duration I, T 15 ns
3.0 V
2.0 V,
tSU,TMS TMS setup time (before rising edge of TCK) I, T 11 ns
3.0 V
2.0 V,
tHD,TMS TMS hold time (after rising edge of TCK) I, T 3 ns
3.0 V
2.0 V,
tSU,TDI TDI setup time (before rising edge of TCK) I, T 13 ns
3.0 V
2.0 V,
tHD,TDI TDI hold time (after rising edge of TCK) I, T 5 ns
3.0 V
TDO high impedance to valid output time (after falling edge of 2.0 V,
tz-Valid,TDO I, T 26 ns
TCK) 3.0 V
2.0 V,
tValid,TDO TDO to new valid output time (after falling edge of TCK) I, T 26 ns
3.0 V
TDO valid to high impedance output time (after falling edge of 2.0 V,
tValid-Z,TDO I, T 26 ns
TCK) 3.0 V
2.0 V,
tJTAG,Ret Spy-Bi-Wire return to normal operation time I, T 15 100 µs
3.0 V
2.0 V,
Rinternal Internal pulldown resistance on TEST I, T 20 35 50 kΩ
3.0 V
(1) Tools that access the Spy-Bi-Wire interface must wait for the tSBW,En time after pulling the TEST/SBWTCK pin high before applying the
first SBWTCK clock edge.

1/fTCK
tTCK,Low tTCK,High
TCK
TMS
tSU,TMS
tHD,TMS
TDI
(or TDO as TDI)
tSU,TDI
tHD,TDI
TDO
tZ-Valid,TDO tValid,TDO tValid-Z,TDO

tJTAG,Ret
TEST
Figure 5-18. JTAG 4-Wire Timing

6 Detailed Description
6.1 CPU
The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All
operations, other than program-flow instructions, are performed as register operations in conjunction with
seven addressing modes for source operand and four addressing modes for destination operand.
The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-to-
register operation execution time is one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as program counter (PC), stack pointer (SP), status register
(SR), and constant generator (CG), respectively. The remaining registers are general-purpose registers.
Peripherals are connected to the CPU using data, address, and control buses, and can be handled with all
instructions.
6.2 Operating Modes

The MCUs have one active mode and several software-selectable low-power modes of operation. An
interrupt event can wake the device from a low-power mode (LPM0, LPM3, or LPM4), service the request,
and return to the low-power mode on return from the interrupt program. Low-power modes LPM3.5 and
LPM4.5 disable the core supply to minimize power consumption.
Table 6-1. Operating Modes

AM LPM0 LPM3 LPM4 LPM3.5 LPM4.5
MODE ACTIVE ONLY RTC
CPU OFF STANDBY OFF SHUTDOWN
MODE COUNTER
Maximum system clock 24 MHz 24 MHz 40 kHz 0 40 kHz 0
1.43 µA with 620 nA with
0.82 µA 42 nA
Power consumption at 25°C, 3 V 142 µA/MHz 40 µA/MHz RTC counter RTC counter
without SVS without SVS
only in LFXT only in LFXT
Wake-up time N/A Instant 10 µs 10 µs 350 µs 350 µs
RTC counter,
Wake-up events N/A All All I/O I/O
I/O
Full Full Partial power Partial power Partial power
Regulator Power down
regulation regulation down down down
Power
SVS On On Optional Optional Optional Optional
Brownout On On On On On On
MCLK Active Off Off Off Off Off
SMCLK Optional Active Off Off Off Off
FLL Optional Optional Off Off Off Off
DCO Optional Optional Off Off Off Off
MODCLK Optional Optional Off Off Off Off
Clock (1)
REFO Optional Optional Optional Off Off Off
ACLK Optional Optional Active Off Off Off
(2)
XT1HFCLK Optional Optional Off Off Off Off
XT1LFCLK Optional Optional Optional Off Optional Off
VLOCLK Optional Optional Optional Off Optional Off
(1) The status shown for LPM4 applies to internal clocks only.
(2) HFXT must be disabled before entering into LPM3, LPM4, or LPMx.5 mode.
Copyright © 2018–2019, Texas Instruments Incorporated Detailed Description 61
Table 6-1. Operating Modes (continued)

AM LPM0 LPM3 LPM4 LPM3.5 LPM4.5
MODE ACTIVE ONLY RTC
CPU OFF STANDBY OFF SHUTDOWN
MODE COUNTER
CPU On Off Off Off Off Off
FRAM On On Off Off Off Off
Core
RAM On On On On Off Off
Backup Memory (3) On On On On On Off
Timer0_B3 Optional Optional Optional Off Off Off
WDT Optional Optional Optional Off Off Off
eUSCI_A0 Optional Optional Optional Off Off Off
eUSCI_A1 Optional Optional Optional Off Off Off
eUSCI_B0 Optional Optional Optional Off Off Off
eUSCI_B1 Optional Optional Optional Off Off Off
CRC Optional Optional Off Off Off Off
Peripherals
ICC Optional Optional Off Off Off Off
MPY32 Optional Optional Off Off Off Off
ADC Optional Optional Optional Off Off Off
eCOMP0 Optional Optional Optional Optional Off Off
eCOMP1 Optional Optional Optional Optional Off Off
(4)
SAC0 Optional Optional Optional Optional Off Off
SAC1 (4) Optional Optional Optional Optional Off Off
SAC2 (4) Optional Optional Optional Optional Off Off
(4)
SAC3 Optional Optional Optional Optional Off Off
RTC Counter Optional Optional Optional Optional Optional Off
I/O General digital input/output On Optional State held State held State held State held
(3) Backup memory contains one 32-byte register in the peripheral memory space. See Table 6-33 and Table 6-54 for its memory
allocation.
NOTE
XT1CLK and VLOCLK can be active during LPM4 if requested by low-frequency peripherals.
62 Detailed Description Copyright © 2018–2019, Texas Instruments Incorporated

6.3 Interrupt Vector Addresses

The interrupt vectors and the power-up start address are in the address range 0FFFFh to 0FF80h (see
Table 6-2). The vector contains the 16-bit address of the appropriate interrupt-handler instruction
sequence.
Table 6-2. Interrupt Sources, Flags, and Vectors

SYSTEM WORD
INTERRUPT SOURCE INTERRUPT FLAG PRIORITY
INTERRUPT ADDRESS
System Reset
SVSHIFG
Power up, brownout, supply supervisor
PMMRSTIFG
External reset RST
WDTIFG
Watchdog time-out, key violation Reset FFFEh 63, Highest
PMMPORIFG, PMMBORIFG
FRAM uncorrectable bit error detection
SYSRSTIV
Software POR, BOR
FLLULPUC
FLL unlock error
System NMI
Vacant memory access
VMAIFG
JTAG mailbox Non-Maskable FFFCh 62
JMBINIFG, JMBOUTIFG
FRAM access time error
CBDIFG, UBDIFG
FRAM bit-error detection
User NMI
External NMI NMIIFG Non-Maskable FFFAh 61
Oscillator fault OFIFG
Timer0_B3 TB0CCR0 CCIFG0 Maskable FFF8h 60
TB0CCR1 CCIFG1, TB0CCR2
Timer0_B3 Maskable FFF6h 59
CCIFG2, TB0IFG (TB0IV)
Timer1_B3 Maskable FFF2h 57
Timer2_B3 Maskable FFEEh 55
Timer3_B7 TB3CCR0 CCIFG0 Maskable FFECh 54
CCIFG2, TB3CCR3 CCIFG3,
Timer3_B7 TB3CCR4 CCIFG4, TB3CCR5 Maskable FFEAh 53
CCIFG5, TB3CCR6 CCIFG6, TB3IFG
(TB3IV)
RTC counter RTCIFG Maskable FFE8h 52
Watchdog timer interval mode WDTIFG Maskable FFE6h 51
UCTXCPTIFG, UCSTTIFG, UCRXIFG,
UCTXIFG (UART mode)
eUSCI_A0 receive or transmit Maskable FFE4h 50
UCRXIFG, UCTXIFG (SPI mode)
(UCA0IV))
UCTXIFG (UART mode)
eUSCI_A1 receive or transmit Maskable FFE2h 49
(UCA0IV))
UCB0RXIFG, UCB0TXIFG (SPI mode)
UCALIFG, UCNACKIFG, UCSTTIFG,
UCSTPIFG, UCRXIFG0, UCTXIFG0,
UCRXIFG1, UCTXIFG1, UCRXIFG2,
eUSCI_B0 receive or transmit Maskable FFE0h 48
UCTXIFG2, UCRXIFG3, UCTXIFG3,
UCCNTIFG,
UCBIT9IFG,UCCLTOIFG(I2C mode)
(UCB0IV)

Table 6-2. Interrupt Sources, Flags, and Vectors (continued)

SYSTEM WORD
INTERRUPT SOURCE INTERRUPT FLAG PRIORITY
INTERRUPT ADDRESS
eUSCI_B1 receive or transmit Maskable FFDEh 47
UCCNTIFG,
(UCB0IV)
ADCIFG0, ADCINIFG, ADCLOIFG,
ADC ADCHIIFG, ADCTOVIFG, ADCOVIFG Maskable FFDCh 46
(ADCIV)
eCOMP0_eCOMP1 CPIIFG, CPIFG (CP1IV, CP0IV) Maskable FFDAh 45
(1) SAC2DACSTS DACIFG (SAC2IV)
SAC0_SAC2 Maskable FFD8h 44
SAC0DACSTS DACIFG, SAC0IV)
SAC3DACSTS DACIFG (SAC3IV)
SAC1_SAC3 (1) Maskable FFD6h 43
SAC1DACSTS DACIFG, SAC1IV)
P1 P1IFG.0 to P1IFG.7 (P1IV) Maskable FFD4h 42
P4 P4IFG.0 to P4IFG.7 (P4IV) Maskable FFCEh 39
Reserved Reserved Maskable FFCCh to FF88h
Table 6-3 lists the BSL signature settings. The BSL setting on MSP430FR2355 can be customized by
using BSL configuration and I2C address. See the MSP430 FRAM Device Bootloader (BSL) User's Guide
for more details.
Table 6-3. BSL Signatures

SIGNATURE WORD ADDRESS
(1)
BSL I2C Address FFA0h
BSL Config 0FF8Ah
BSL Config Signature 0FF88h
BSL Signature2 0FF86h
BSL Signature1 0FF84h
JTAG Signature2 0FF82h
JTAG Signature1 0FF80h
2
(1) 7-bit address BSL I C interface

6.4 Memory Organization

Table 6-4 summarizes the memory map of the devices.
Table 6-4. Memory Organization

ACCESS MSP430FR2355 MSP430FR2353
Memory (FRAM) 32KB 16KB
Read/Write
Main: interrupt vectors and signatures FFFFh to FF80h FFFFh to FF80h
(Optional Write Protect) (1)
Main: code memory FFFFh to 8000h FFFFh to C000h
4KB 2KB
RAM Read/Write
2FFFh to 2000h 27FFh to 2000h
512 bytes 512 bytes
Information memory (FRAM) Read/Write (2)
19FFh to 1800h 19FFh to 1800h
20KB 20KB
Driver library and FFT library (ROM) Read only
FAC00h to FFBFFh FAC00h to FFBFFh
4KB 4KB
Peripherals Read/Write
0FFFh to 0020h 0FFFh to 0020h
26 bytes 26 bytes
Tiny RAM Read/Write
001Fh to 0006h 001Fh to 0006h
6 bytes 6 bytes
Reserved (3) Read
0005h to 0000h 0005h to 0000h
(1) The program FRAM can be write protected by setting PFWP bit in SYSCFG0 register. See the SYS chapter in MSP430FR4xx and
MSP430FR2xx Family User's Guide for more details.
(2) The information FRAM can be write protected by setting DFWP bit in SYSCFG0 register. See the SYS chapter in MSP430FR4xx and
MSP430FR2xx Family User's Guide for more details.
(3) Reads as D032h at 00h (opcode: BIS.W LPM4, SR), reads as 00F0h at 02h (opcode: BIS.W LPM4, SR), and reads as 3FFFh at 04h
(opcode: JMP$)
6.5 Bootloader (BSL)

The BSL enables users to program the FRAM memory or RAM using a UART or I2C serial interface.
Access to the device memory through the BSL is protected by an user-defined password. Use of the BSL
requires four pins (see Table 6-5 and Table 6-6). BSL entry requires a specific entry sequence on the
RST/NMI/SBWTDIO and TEST/SBWTCK pins. For complete description of the features of the BSL and its
implementation, see MSP430 FRAM Devices Bootloader (BSL) User's Guide.
Table 6-5. UART BSL Pin Requirements and Functions

DEVICE SIGNAL BSL FUNCTION
RST/NMI/SBWTDIO Entry sequence signal
TEST/SBWTCK Entry sequence signal
P1.7 Data transmit
P1.6 Data receive
DVCC Power supply
DVSS Ground supply
Table 6-6. I2C BSL Pin Requirements and Functions

DEVICE SIGNAL BSL FUNCTION
RST/NMI/SBWTDIO Entry sequence signal
TEST/SBWTCK Entry sequence signal
P1.2 Data receive and transmit
P1.3 Clock
DVCC Power supply
DVSS Ground supply

6.6 JTAG Standard Interface

The MSP430 family supports the standard JTAG interface which requires four signals for sending and
receiving data. The JTAG signals are shared with general-purpose I/O. The TEST/SBWTCK pin is used to
enable the JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface with
MSP430 development tools and device programmers. Table 6-7 lists the JTAG pin requirements. For
further details on interfacing to development tools and device programmers, see the MSP430 Hardware
Tools User's Guide.
Table 6-7. JTAG Pin Requirements and Function

DEVICE SIGNAL DIRECTION JTAG FUNCTION
P1.4/UCA0STE/TCK/A4 IN JTAG clock input
P1.5/UCA0CLK/TMS/OA1O/A5 IN JTAG state control
P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/OA1-/A6 IN JTAG data input, TCLK input
P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/OA1+/A7/VREF+ OUT JTAG data output
TEST/SBWTCK IN Enable JTAG pins
RST/NMI/SBWTDIO IN External reset
DVCC – Power supply
DVSS – Ground supply
6.7 Spy-Bi-Wire Interface (SBW)

The MSP430 family supports the two wire Spy-Bi-Wire interface. Spy-Bi-Wire can be used to interface
with MSP430 development tools and device programmers. Table 6-8 shows the Spy-Bi-Wire interface pin
requirements. For further details on interfacing to development tools and device programmers, see the
MSP430 Hardware Tools User's Guide.
Table 6-8. Spy-Bi-Wire Pin Requirements and Functions

DEVICE SIGNAL DIRECTION SBW FUNCTION
TEST/SBWTCK IN Spy-Bi-Wire clock input
RST/NMI/SBWTDIO IN, OUT Spy-Bi-Wire data input and output
DVCC – Power supply
DVSS – Ground supply
6.8 FRAM
The FRAM can be programmed using the JTAG port, Spy-Bi-Wire (SBW), the BSL, or in-system by the
CPU. Features of the FRAM include:
• Byte and word access capability
• Programmable wait state generation
• Error correction coding (ECC)

6.9 Memory Protection

The device features memory protection of user access authority and write protection include:
• Securing the whole memory map to prevent unauthorized access from JTAG port or BSL, by writing
JTAG and BSL signatures using the JTAG port, SBW, the BSL, or in-system by the CPU.
• Write protection enabled to prevent unwanted write operation to FRAM contents by setting the control
bits with accordingly password in System Configuration register 0. For more detailed information, see
the SYS chapter in the MSP430FR4xx and MSP430FR2xx Family User's Guide.
6.10 Peripherals
Peripherals are connected to the CPU through data, address, and control buses. All peripherals can be
handled by using all instructions in the memory map. For complete module description, see the
MSP430FR4xx and MSP430FR2xx Family User's Guide.
6.10.1 Power Management Module (PMM) and On-Chip Reference Voltages

The PMM includes an integrated voltage regulator that supplies the core voltage to the device. The PMM
also includes supply voltage supervisor (SVS) and brownout protection. The brownout reset circuit (BOR)
is implemented to provide the proper internal reset signal to the device during power-on and power-off.
The SVS circuitry detects if the supply voltage drops below a user-selectable safe level. SVS circuitry is
available on the primary supply.
The device contains three on-chip references:
• Internal shared reference (1.5 V, 2.0 V, or 2.5 V)
• 1.2 V for external reference (VREF pin)
• 1.2 V low-power reference for eCOMP
The internal shared reference is controlled by PMM settings to select 1.5 V, 2.0 V, or 2.5 V. This reference
is internally connected to ADC channel 13. DVCC is internally connected to ADC channel 15. When
DVCC is set as the reference voltage for ADC conversion, the DVCC can be easily represent as
Equation 1 by using ADC sampling reference without any external components support.
DVCC = (4095 × reference voltage) ÷ ADC result (1)
The internal shared reference (1.5 V, 2.0 V, or 2.5 V ) is also internally connected to the built-in DAC of
the comparator and SAC (MSP430FR235x devices only) built-in 12-bit DAC as the reference voltage. The
source can be selected by setting the specific register configuration of each module For more information,
see the MSP430FR4xx and MSP430FR2xx Family User's Guide.
P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/OA1+/A7/VREF+ can support a buffered external 1.2-V output
when EXTREFEN = 1 in the PMMCTL2 register. ADC channel 7 can also be selected to monitor this
voltage. For more information, see the MSP430FR4xx and MSP430FR2xx Family User's Guide.
An additional low-power 1.2-V reference is internally connected to eCOMP0 and eCOMP1. This reference
is activated by enabling eCOMP with the channel as threshold source. See Section 6.10.13 for more
details.
6.10.2 Clock System (CS) and Clock Distribution

The clock system includes a 32-kHz low-frequency or up to 24-MHz high-frequency crystal oscillator
(XT1), an internal very low-power low-frequency oscillator (VLO), an integrated 32-kHz RC oscillator
(REFO), an integrated internal digitally controlled oscillator (DCO) that can use frequency-locked loop
(FLL) locking with internal or external 32-kHz reference clock, and on-chip asynchronous high-speed clock
(MODOSC). The clock system is designed to target cost-effective designs with minimal external
components. A fail-safe mechanism is designed for XT1. The clock system module supports the following
clock signals.

• Main Clock (MCLK): the system clock used by the CPU and all relevant peripherals accessed by the
bus. All clock sources except MODOSC can be selected as the source with a predivider of 1, 2, 4, 8,
16, 32, 64, or 128.
• Sub-Main Clock (SMCLK): the subsystem clock used by the peripheral modules. SMCLK derives from
the MCLK with a predivider of 1, 2, 4, or 8. This means SMCLK is always equal to or less than MCLK.
• Auxiliary Clock (ACLK): this clock derived from the external XT1 clock, internal VLO, or internal REFO
clock up to 40 kHz.
All peripherals have one or several clock sources, depending on specific functionality. Table 6-9 lists the
clock distribution used in this device.
Table 6-9. Clock Distribution

CLOCK
EXTERNAL
SOURCE MCLK SMCLK ACLK MODCLK VLOCLK
PIN
SELECT BITS
Frequency
DC to 24 MHz DC to 24 MHz DC to 40 kHz 3.8 MHz ±21% 10 kHz ±50% –
Range
CPU N/A Default – – – – –
FRAM N/A Default – – – – –
RAM N/A Default – – – – –
CRC N/A Default – – – – –
MPY32 N/A Default – – – – –
ICC N/A Default – – – – –
I/O N/A Default – – – – –
00b (TB0CLK
TB0 TBSSEL – 10b 01b – –
pin)
00b (TB1CLK
pin)
00b (TB2CLK
pin)
00b (TB3CLK
pin)
00b (UCA0CLK
eUSCI_A0 UCSSEL – 10b or 11b 01b – –
pin)
00b (UCA1CLK
eUSCI_A1 UCSSEL – 10b or 11b 01b – –
pin)
00b (UCB0CLK
eUSCI_B0 UCSSEL – 10b or 11b 01b – –
pin)
00b (UCB1CLK
eUSCI_B1 UCSSEL – 10b or 11b 01b – –
pin)
MFM N/A – Default – – – –
WDT WDTSSEL – 00b 01b – 10b –
ADC ADCSSEL – 10b or 11b 01b 00b – –
RTC Counter RTCSS – 01b (1) 01b (1) – 11b –
(1) Controlled by the RTCCKSEL bit in the SYSCFG2 register.
Table 6-10. XTCLK Distribution
CLOCK SOURCE XTHFCLK XTLFCLK XTLFCLK (LPMx.5)

OPERATION MODE
SELECT BITS AM to LPM0 AM to LPM3 AM to LPM3.5
MCLK SELMS 10b 10b 10b
SMCLK SELMS 10b 10b 10b
REFO SELREF 0b 0b 0b
ACLK SELA 0b 0b 0b
RTC RTCSS – 10b 10b

6.10.3 General-Purpose Input/Output Port (I/O)

Up to 44 I/O ports are implemented.
• P1, P2, P3, and P4 are full 8-bit ports; P5 and P6 feature up to 5-bit and 7-bit ports, respectively.
• All individual I/O bits are independently programmable.
• Any combination of input, output, is possible for P1, P2, P3, P4, P5, and P6. Interrupt conditions are
possible in P1, P2, P3, and P4.
• Programmable pullup or pulldown on all ports.
• Edge-selectable interrupt and LPM3.5, LPM4 and LPM4.5 wake-up input capability is available in P1,
P2, P3, and P4.
• Read and write access to port-control registers is supported by all instructions.
• Ports can be accessed byte-wise or word-wise in pairs.
NOTE
Configuration of digital I/Os after BOR reset
To prevent cross currents during start-up of the device, all port pins are high-impedance with
Schmitt triggers and module functions disabled. To enable the I/O functions after a BOR
reset, first configure the ports and then clear the LOCKLPM5 bit. For details, see the
Configuration After Reset section in the Digital I/O chapter of the MSP430FR4xx and
MSP430FR2xx Family User's Guide.
6.10.4 Watchdog Timer (WDT)

The primary function of the WDT module is to perform a controlled system restart after a software problem
occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not
needed in an application, the module can be configured as interval timer and can generate interrupts at
selected time intervals.
Table 6-11 lists the clock sources that can be used by the WDT.
Table 6-11. WDT Clocks

NORMAL OPERATION
WDTSSEL (WATCHDOG AND INTERVAL
TIMER MODE)
00 SMCLK
01 ACLK
10 VLOCLK
11 Reserved
6.10.5 System Module (SYS)

The SYS module handles many of the system functions within the device. These include power-on reset
(POR) and power-up clear (PUC) handling, NMI source selection and management, reset interrupt vector
generators (see Table 6-12), bootloader entry mechanisms, and configuration management (device
descriptors). SYS also includes a data exchange mechanism through SBW called a JTAG mailbox that
can be used in the application.

Table 6-12. System Module Interrupt Vector Registers

INTERRUPT VECTOR REGISTER ADDRESS INTERRUPT EVENT VALUE PRIORITY
No interrupt pending 00h
Brownout (BOR) 02h Highest
RSTIFG RST/NMI (BOR) 04h
PMMSWBOR software BOR (BOR) 06h
LPMx.5 wake up (BOR) 08h
Security violation (BOR) 0Ah
Reserved 0Ch
SVSHIFG SVSH event (BOR) 0Eh
Reserved 10h
Reserved 12h
SYSRSTIV, System Reset 015Eh PMMSWPOR software POR (POR) 14h
WDTIFG watchdog time-out (PUC) 16h
WDTPW password violation (PUC) 18h
FRCTLPW password violation (PUC) 1Ah
Uncorrectable FRAM bit error detection 1Ch
Peripheral area fetch (PUC) 1Eh
PMMPW PMM password violation
20h
(PUC)
Reserved 22h
FLL unlock (PUC) 24h
Reserved 26h to 3Eh Lowest
SVS low-power reset entry 02h Highest
Uncorrectable FRAM bit error detection 04h
Reserved 06h
Reserved 08h
Reserved 0Ah
Reserved 0Ch
SYSSNIV, System NMI 015Ch
Reserved 0Eh
Reserved 10h
VMAIFG Vacant memory access 12h
JMBINIFG JTAG mailbox input 14h
JMBOUTIFG JTAG mailbox output 16h
Correctable FRAM bit error detection 18h
Reserved 1Ah to 1Eh Lowest
NMIIFG NMI pin or SVSH event 02h Highest
SYSUNIV, User NMI 015Ah
OFIFG oscillator fault 04h
Reserved 06h to 1Eh Lowest
6.10.6 Cyclic Redundancy Check (CRC)

The 16-bit cyclic redundancy check (CRC) module produces a signature based on a sequence of data
values and can be used for data checking purposes. The CRC generation polynomial is compliant with
CRC-16-CCITT standard of x16 + x12 + x5 + 1.

6.10.7 Interrupt Compare Controller (ICC)

The Interrupt Compare Controller (ICC) allows all maskable interrupt sources to be scheduled in a
preemptive mechanism. Each interrupt source is specified as a source of ICC module. Each source
supports a 4-level software interrupt priority other than the one tired with interrupt vector. When ICC
module is enabled, the ISR in lower software priority can be interrupted by higher priority. It is required to
enable GIE in ISR for proper ICC operation. For details, see the ICC chapter of the MSP430FR4xx and
MSP430FR2xx Family User's Guide. Table 6-13 lists the ICC source configurations.
Table 6-13. ICC Interrupt Source Assignments

INTERRUPT SYSTEM WORD
REGISTER BITS INTERRUPT FLAG PRIORITY
SOURCE INTERRUPT ADDRESS
ILSR0 P4 P4IFG.0 to P4IFG.7 (P4IV) Maskable FFCEh 39
ILSR1 P3 P3IFG.0 to P3IFG.7 (P3IV) Maskable FFD0h 40
SAC3 DAC,
ILSR4 DACIFG, (SAC3IV, SAC1IV) (1) Maskable FFD6h 43
SAC1 DAC (1)
ICCILRS0
SAC2 DAC,
ILSR5 DACIFG (SAC2IV, SAC0IV) (1) Maskable FFD8h 44
SAC0 DAC (1)
eCOMP1,
ILSR6 CPIIFG, CPIFG (CP1IV, CP0IV) Maskable FFDAh 45
eCOMP0
ADCIFG0, ADCINIFG, ADCLOIFG,
ILSR7 ADC ADCHIIFG, ADCTOVIFG, ADCOVIFG Maskable FFDCh 46
(ADCIV)
eUSCI_B1
ILSR8 Receive or Maskable FFDEh 47
Transmit
UCCNTIFG,
(UCB0IV)
eUSCI_B0
ILSR9 Receive or Maskable FFE0h 48
Transmit
UCCNTIFG,
(UCB0IV)
ICCILRS1 eUSCI_A1
UCTXIFG (UART mode)
Transmit
(UCA0IV))
eUSCI_A0
UCTXIFG (UART mode)
Transmit
(UCA0IV))
Watchdog Timer
ILSR12 WDTIFG Maskable FFE6h 51
Interval mode
ILSR13 RTC Counter RTCIFG Maskable FFE8h 52
CCIFG2, TB3CCR3 CCIFG3,
ILSR14 Timer3_B7 TB3CCR4 CCIFG4, TB3CCR5 Maskable FFEAh 53
CCIFG5, TB3CCR6 CCIFG6, TB3IFG
(TB3IV)
ILSR15 Timer3_B7 TB3CCR0 CCIFG0 Maskable FFECh 54

Table 6-13. ICC Interrupt Source Assignments (continued)

INTERRUPT SYSTEM WORD
REGISTER BITS INTERRUPT FLAG PRIORITY
SOURCE INTERRUPT ADDRESS
ILSR16 Timer2_B3 Maskable FFEEh 55
ILSR17 Timer2_B3 TB2CCR0 CCIFG0 Maskable FFF0h 56
ILSR18 Timer1_B3 Maskable FFF2h 57
ICCILRS2 ILSR19 Timer1_B3 TB1CCR0 CCIFG0 Maskable FFF4h 58
ILSR20 Timer0_B3 Maskable FFF6h 59
ILSR21 Timer0_B3 TB0CCR0 CCIFG0 Maskable FFF8h 60
ILSR22 N/A N/A N/A N/A N/A
ICCILRS3
6.10.8 Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_A1,

eUSCI_B0, eUSCI_B1)
The eUSCI modules are used for serial data communications (see Table 6-14). The eUSCI_A module
supports either UART or SPI communications. The eUSCI_B module supports either SPI or I2C
communications. Additionally, eUSCI_A supports automatic baud-rate detection and IrDA..
Table 6-14. eUSCI Pin Configurations

PIN UART SPI
P1.7 TXD SIMO
eUSCI_A0 P1.6 RXD SOMI
P1.5 – SCLK
P1.4 – STE
PIN UART SPI
P4.3 TXD or TXD SIMO
eUSCI_A1 P4.2 RXD or RXD SOMI
P4.1 – SCLK
P4.0 – STE
2
PIN I C SPI
P1.3 SCL SOMI
eUSCI_B0 P1.2 SDA SIMO
P1.1 – SCLK
P1.0 – STE
PIN I2C SPI
P4.7 SCL SOMI
eUSCI_B1 P4.6 SDA SIMO
P4.5 – SCLK
P4.4 – STE

The eUSCI_A1 can work as UART in inverting polarity mode by port settings (see Table 6-15). When
PSEL = 01b, the normal UART or SPI mode is used. When PSEL = 10b, the inverted UART mode is
enabled to transmit and receive data in inverted polarity. In this mode, eUSCI_A1 can also wake up the
device from LPM3 by detecting a rising edge of start bit according the falling edge in normal mode.
Table 6-15. eUSCI_A1 UART Polarity Configurations

eUSCI_A1 PSEL = 01b PSEL = 10b
P4.3 TXD TXD
P4.4 RXD RXD
6.10.9 Timers (Timer0_B3, Timer1_B3, Timer2_B3, Timer3_B7)

The Timer0_B3, Timer1_B3, and Timer2_B3 modules are 16-bit timers and counters with three
capture/compare registers each. Timer3_B7 is a 16-bit timers with seven capture/compare registers each.
Each can support multiple captures or compares, PWM outputs, and interval timing (see Table 6-16,
Table 6-17, Table 6-18, and Table 6-19). Each has extensive interrupt capabilities. Interrupts can be
generated from the counter on overflow conditions and from each of the capture/compare registers. The
CCR0 registers on all timers are not externally connected and can only be used for hardware period timing
and interrupt generation. In Up Mode, they can be used to set the overflow value of the counter.
Table 6-16. Timer0_B3 Signal Connections

DEVICE INPUT MODULE INPUT MODULE OUTPUT DEVICE OUTPUT
PORT PIN MODULE BLOCK
SIGNAL NAME SIGNAL SIGNAL
P2.7 TB0CLK TBCLK
ACLK (internal) ACLK
Timer N/A
SMCLK (internal) SMCLK
N/A INCLK
From RTC (internal) CCI0A Not used
Timer1_B3 CCI0B
ACLK (internal) CCI0B
CCR0 TB0 input
DVSS GND
DVCC VCC
P1.6 TB0.1 CCI1A TB0.1
From eCOMP0.O Timer1_B3 CCI1B
CCI1B
(internal) CCR1 TB1 input
DVSS GND
DVCC VCC
Timer1_B3 INCLK
Timer1_B3 CCI2B
N/A CCI2B
CCR2 TB2 input,
IR carrier input
DVSS GND
DVCC VCC


P2.2 TB1CLK TBCLK
SMCLK (internal) SMCLK Timer N/A
Timer0_B3 CCR2B
INCLK
output (internal)
Timer3_B7 CCR0B
CCI0A Not used
output (internal)
Timer0_B3 CCR0B
CCI0B CCR0 TB0 Not used
output (internal)
DVSS GND
DVCC VCC
Timer0_B3 CCR1B
CCI1B To ADC trigger
output (internal) CCR1 TB1
DVSS GND
DVCC VCC
Timer0_B3 CCR2B
CCI2B IR coding input
output (internal) CCR2 TB2
DVSS GND
DVCC VCC

P2.7 TB2CLK TBCLK
Timer N/A
TB2CLK INCLK
Not used CCI0A CCR0 TB0 Not used
DVSS GND
DVCC VCC
MFM Complete Event CCI0B MFM start trigger
From eCOMP1.O To SAC DAC update
CCI1B
(internal) CCR1 TB1 trigger 10b (1)
DVSS GND
DVCC VCC
To SAC DAC update
Not used CCI2B
CCR2 TB2 trigger 11b (1)
DVSS GND
DVCC VCC


P6.6 TB3CLK TBCLK
Timer N/A
TB3CLK INCLK
Not used CCI0A Not used
Not used CCI0B To Timer1_B3 CCI0A
CCR0 TB0
DVSS GND
DVCC VCC
Not used CCI1B
CCR1 TB1
DVSS GND
DVCC VCC
AND UCA1TXD
P4.0 ISORXD CCI2B
CCR2 TB2 ISOTXD
DVSS GND
DVCC VCC
Not used CCI3B
CCR3 TB3
DVSS GND
DVCC VCC
Not used CCI4B Not used
CCR4 TB4
DVSS GND
DVCC VCC
CCR5 TB5
DVSS GND
DVCC VCC
CCR6 TB6
DVSS GND
DVCC VCC
The interconnection of Timer0_B3 and Timer1_B3 can be used to modulate the eUSCI_A pin of
UCA0TXD/UCA0SIMO in either ASK or FSK mode, with which a user can easily acquire a modulated
infrared command for directly driving an external IR diode. The IR functions are fully controlled by SYS
configuration registers 1 including IREN (enable), IRPSEL (polarity select), IRMSEL (mode select),
IRDSSEL (data select), and IRDATA (data) bits. For more information, see the SYS chapter in the
MSP430FR4xx and MSP430FR2xx Family User's Guide.
The Timer_B module feature the function to put Timer_B all outputs into a high impedance state when the
selected source is triggered. The source can be selected from external pin or internal of the device, it is
controlled by TBxTRG in SYS. For more information, see the SYS chapter in the MSP430FR4xx and
The Timer2_B3 CCR0 is tied with the Manchester function module (MFM).

Table 6-20 lists the Timer_B high-impedance trigger sources.
Table 6-20. TBxOUTH

TBxOUTH TRIGGER SOURCE TIMER_B PAD OUTPUT HIGH
TBxTRGSEL
SELECTION IMPEDANCE
TB0TRGSEL = 0 eCOMP0 output (internal)
P1.6, P1.7
TB0TRGSEL= 1 P1.2
P2.0, P2.1
TB1TRGSEL = 1 P2.3
P5.0, P5.1
TB2TRGSEL = 1 P5.3
P6.0, P6.1, P6.2, P6.3, P6.4, P6.5
TB3TRGSEL = 1 N/A
6.10.10 Backup Memory (BKMEM)

The BKMEM supports data retention functionality during LPM3.5 mode. This device provides up to
32 bytes that are retained during LPM3.5.
6.10.11 Real-Time Clock (RTC) Counter

The RTC counter is a 16-bit modulo counter that is functional in AM, LPM0, LPM3, LPM4, and LPM3.5.
This module can periodically wake up the CPU from LPM0, LPM3, LPM4, and LPM3.5 based on timing
from a low-power clock source such as the XT1, ACLK, and VLO clocks. In AM, RTC can be driven by
SMCLK to generate high-frequency timing events and interrupts. ACLK and SMCLK both can source to
the RTC; however, only one of them can be selected at a time. The RTC overflow events can trigger:
• Timer0_B3 CCI0A
• ADC conversion trigger when ADCSHSx bits are set as 01b

6.10.12 12-Bit Analog-to-Digital Converter (ADC)

The 12-bit ADC module supports fast 12-bit analog-to-digital conversions with single-ended input. The
module implements a 12-bit SAR core, sample select control, reference generator and a conversion result
buffer. A window comparator with a lower and upper limits allows CPU-independent result monitoring with
three window comparator interrupt flags.
The ADC supports 12 external inputs and four internal inputs (see Table 6-21).
Table 6-21. ADC Channel Connections

ADCINCHx ADC CHANNELS EXTERNAL PIN OUTPUT
0 A0/Veref+ P1.0
1 A1/ P1.1
2 A2/Veref- P1.2
3 A3 P1.3
4 A4 P1.4
5 A5 P1.5
6 A6 P1.6
(1)
7 A7 P1.7
8 A8 P5.0
9 A9 P5.1
10 A10 P5.2
11 A11 P5.3
12 On-chip temperature sensor N/A
Internal shared reference voltage
13 N/A
(1.5 V, 2.0 V, or 2.5 V)
14 DVSS N/A
15 DVCC N/A
(1) When A7 is used, the PMM 1.2-V reference voltage can be output to this pin by setting the PMM
control register. The 1.2-V voltage can be measured by channel A7.
The analog-to-digital conversion can be started by software or a hardware trigger. Table 6-22 lists the
trigger sources that are available.
Table 6-22. ADC Trigger Signal Connections

ADCSHSx
TRIGGER SOURCE
BINARY DECIMAL
00 0 ADCSC bit (software trigger)
01 1 RTC event
10 2 TB1.1B
11 3 eCOMP0 COUT

6.10.13 Enhanced Comparator

This device features two enhanced comparators: eCOMP0 and eCOMP1. The enhanced comparator is an
analog voltage comparator with a built-in 6-bit DAC as an internal voltage reference. The integrated 6-bit
DAC can be set to 64 steps for the comparator reference voltage. This module has 4-level programmable
hysteresis and configurable power modes: high-power mode or low-power mode.
The eCOMP0 supports a propagation delay up to 1 µs in high-power mode. In low-power mode, eCOMP0
supports 3.2-µs delay with 1.5-µA leakage at room temperature, which can be an ideal wake-up source in
LPM3 for a voltage monitor.
The eCOMP1 supports a propagation delay up to 100 ns in high-power mode. In low-power mode,
eCOMP1 supports 320-ns delay with 10-µA leakage at room temperature.
Both eCOMP0 and eCOMP1 contains a programmable 6-bit DAC that can use internal shared reference
(1.5, 2.0, or 2.5-V) for high precision comparison threshold. In addition to internal shared reference, a low-
power 1.2-V reference is fixed at channel 2 of both inverting and non-inverting path that allows the DAC
turned off for saving powers.
The eCOMP0 supports external inputs and internal inputs (see Table 6-23) and outputs (see Table 6-25)
Table 6-23. eCOMP0 Input Channel Connections

CPPSEL eCOMP0 CHANNELS CPNSEL eCOMP0 CHANNELS
000 P1.0/COMP0.0/A0 000 P1.0/COMP0.0/A0
001 P1.1/OA0O/COMP0.1/A1 001 P1.1/OA0O/COMP0.1/A1
010 Low-power 1.2-V reference 010 Low-power 1.2-V reference
011 N/A 011 N/A
100 N/A 100 N/A
101 P1.1/OA0O/COMP0.1/A1 101 P3.1/OA2O
110 eCOMP0 6-bit DAC 110 eCOMP0 6-bit DAC
Table 6-24. eCOMP1 Input Channel Connections

CPPSEL eCOMP1 CHANNELS CPNSEL eCOMP1 CHANNELS
000 P2.5/COMP1.0 000 P2.5/COMP1.0
001 P2.4/COMP1.1 001 P2.4/COMP1.1
010 Low-power 1.2-V reference 010 Low-power 1.2-V reference
011 N/A 011 N/A
100 N/A 100 N/A
101 P1.5/OA1O/A5 101 P3.5/OA3O
110 eCOMP1 6-bit DAC 110 eCOMP1 6-bit DAC
Table 6-25. eCOMP0 Output Channel Connections

ECOMP0 OUT EXTERNAL PINOUT, MODULE
1 P2.0
2 TB0.1B, TB0 (TB0OUTH), TB1 (TB1OUTH), ADC trigger
3 Reserved
4 Reserved

Table 6-26. eCOMP1 Output Channel Connections

ECOMP1 OUT EXTERNAL PINOUT, MODULE
1 P2.1
2 TB2.1B, TB2 (TB2OUTH), TB3 (TB3OUTH)
3 Reserved
4 MFM input
6.10.14 Manchester Function Module (MFM)

The MFM is a dedicated module residing between a pair of pins and eUSCI_B1 to encode and decode
Manchester-coded data. For more information, see the MFM chapter in the MSP430FR4xx and
When enabled by setting PSEL, the MFM module receives and transmits data through
P5.0/TB2.1/MFM.RX/A8 and P5.1/TB2.2/MFM.TX/A9, respectively. The MFM always works in SPI master
mode, and the eUSCI_B1 must be configured in 4-wire SPI slave mode.
6.10.15 Smart Analog Combo (SAC) (MSP430FR235x Devices Only)

The MSP430FR235x devices integrate four SAC modules: SAC0, SAC1, SAC2, and SAC3. The SAC
integrates a high-performance low-power operational amplifier. SAC-L3 supports a hybrid configuration of
general-purpose amplifier, 12-bit voltage reference DAC, and a multiplex switch array. For more
information, see the SAC chapter in the MSP430FR4xx and MSP430FR2xx Family User's Guide. Only
MSP430FR235x devices implement the SAC modules. MSP430FR215x devices do not support SAC
modules.
The SAC0 and SAC2 are interconnected and support external inputs and internal inputs (see Table 6-27
and Table 6-28).
Table 6-27. SAC0 Channel Connections

PSEL SAC0 OA NONINVERTING CHANNELS NSEL SAC0 OA INVERTING CHANNELS
00 P1.3/OA0+/A3 00 P1.2/OA0-/A2
01 SAC0 12-bit DAC 01 PGA feedback
10 P3.1/OA2O, SAC2 OA output 10 P3.1/OA2O, SAC2 OA output
11 N/A 11 N/A

00 P3.3/OA2+ 00 P3.2/OA2-
10 P1.1/UCB0CLK/ACLK/OA0O/COMP0.1/A1, SAC0 OA output 10 P1.1/UCB0CLK/ACLK/OA0O/COMP0.1/A1, SAC0 OA output
11 N/A 11 N/A
The SAC1 and SAC3 are interconnected and support external inputs and internal inputs (see Table 6-29
and Table 6-30).

00 P1.7/OA1+/A7 00 P1.6/OA1-/A6
10 P3.5/OA3O, SAC3 OA output 10 P3.5/OA3O, SAC3 OA output
11 N/A 11 N/A


00 P3.7/OA3+ 00 P3.6/OA3-
10 P1.5/OA1O/A5, SAC1 OA output 10 P1.5/OA1O/A5, SAC1 OA output
11 N/A 11 N/A
Each SAC DAC supports two selectable voltage references (see Table 6-31).
Table 6-31. SACx DAC Reference Selection

DACSREF SACx DAC REFERENCE SELECTION
0 DVCC
1 Internal shared reference (1.5, 2.0, or 2.5 V )
DACSREF SAC1 DAC REFERENCE
0 DVCC
0 DVCC
0 DVCC
Each SAC DAC supports one software trigger and two hardware trigger from chip signals.
Table 6-32. SACx DAC Hardware Trigger Selection

DACLSEL SAC0 DAC HARDWARE TRIGGER DACLSEL SAC1 DAC HARDWARE TRIGGER
00 Writing SAC0DACDAT register 00 Writing SAC1DACDAT register
01 N/A 01 N/A
10 TB2.1 10 TB2.1
11 TB2.2 11 TB2.2
DACLSEL SAC2 DAC HARDWARE TRIGGER DACLSEL SAC3 DAC HARDWARE TRIGGER
00 Writing SAC2DACDAT register 00 Writing SAC3DACDAT register
01 N/A 01 N/A
10 TB2.1 10 TB2.1
11 TB2.2 11 TB2.2

6.10.16 eCOMP0, eCOMP1, SAC0, SAC1, SAC2, and SAC3 Interconnection

(MSP430FR235x Devices Only)
The high-performance analog modules of eCOMP0, SAC0, and SAC2 are internally connected (see
Figure 6-1).
P2.0/COMP0.O
P1.0/COMP0.0/A0
P1.1/OA0O/COMP0.1/A1
P1.3/OA0+/A3 00
01
10
SAC0
+
12-bit DAC SAC0
OA
–
P1.2/OA0-/A2 00
01
10
000
001
010
101
SAC0 eCOMP0 110
PGA 6-bit DAC
+
eCOMP0 Polarity To Timer
Selection Capture
P3.1/OA2O –
000
001
Low-power 010
1.2V
101
110
P3.3/OA2+ 00
01
10
SAC2
+
12-bit DAC SAC2
OA
–
P3.2/OA2- 00
01
10
SAC2
PGA
Figure 6-1. eCOMP0, SAC0, SAC2 Interconnection

The high-performance analog modules of eCOMP1, SAC1, and SAC3 are internally connected (see
Figure 6-2):
P2.1/COMP1.O
P2.5/COMP1.0
P2.4/COMP1.1
P1.5/OA1O/A5
P1.7/OA1+/A7 00
01
10
SAC1
12-bit +
DAC SAC1
OA
–
P1.6/OA1-/A6 00
01
10
000
001
010
101
SAC1 eCOMP1
6-bit 110
PGA
DAC +
eCOMP1 Polarity To Timer
Selection Capture
P3.5/OA3O –
000
001
Low-power 010
1.2 V
101
110
P3.7/OA3+ 00
01
10
SAC3
12-bit +
DAC SAC3
OA
–
P3.6/OA3- 00
01
10
SAC3
PGA
Figure 6-2. eCOMP1, SAC1, SAC3 Interconnection

6.10.17 Cross-Chip Interconnection (SACx are MSP430FR235x Devices Only)

This section describes the cross-chip interconnections in a full-featured view.
Timer_B0 Timer_B1
TB0CLK 00
ACLK 01 TB1CLK 00
16-bit Counter
SMCLK 10 ACLK 01
16-bit Counter P1.0/A0
from CapTouch 11 DVSS SMCLK 10
P2.0/COMP0.O 11
P1.1/A1
P1.2/A2
RTC 00
P1.0/COMP0.0/A0 ACLK 01 TB0.0A 00
CCR0 P1.3/A3
DVSS 10 TB0.0B 01 TB1.0A
CCR0
DVCC 11 DVSS 10 TB1.0B
P1.4/A4
DVCC 11
P1.1/OA0O/COMP0.1/A1 RTC P1.5/A5
Counter
P1.6 00 RTC
from COMP Software trigger P1.6/A6
01 TB0.1A P1.6 P2.0 00 Overflow 00
CCR1 from RTC
DVSS 10 TB0.1B 01 TB1.1A P2.0 01 12-bit
CCR1 from TB1.1B P1.7/A7
DVCC 11 DVSS 10 TB1.1B 10 ADC
P1.3/OA0+/A3 00 DVCC 11 from COMP 11

P5.0/A8
DACLSEL 01
HW Trigger
10 Selection
P5.1/A9
from TB2.1B SAC0 P1.7 00
10 +
12-bit DAC
from TB2.2B 11 SAC0 from CapTouch 01 TB0.2A P1.7 P2.1 00
OA CCR2 P5.2/A10
– DVSS 10 TB0.2B 01 TB1.2A P2.1
CCR2
P1.2/OA0-/A2 00 DVCC 11 DVSS 10 TB1.2B
P5.3/A11
01 DVCC 11
TB0OUTH TB1OUTH
10
On-chip Temperature Sensor (A12)
TB0TRG TB1TRG
1.5-V Reference Voltage (A13)
000 1 0
001 C0O 0 C0O 1
DVSS (A14)
010
101
eCOMP0 DVCC (A15)
SAC0 110 TB0TRGSEL TB1TRGSEL
PGA 6-bit DAC
+
Polarity
eCOMP0
Selection
P3.1/OA2O –
000
001
Low-power 010
1.2V
101
110
Coding
P3.3/OA2+ 00
DACLSEL 01 Infrared
Carrier P1.7/UCA0TXD/UCA0SIMO
10 Logic
from TB2.1B SAC2 UCA0TXD/UCA0SIMO

10 +
12-bit DAC eUSCI_A0 Data
from TB2.2B 11 SAC2
OA
–
P3.2/OA2- 00
01
10
UCB1SOMI RX P5.0/MFM.RX
Manchester
eUSCI_B1 UCB1SIMO Function Module
(SPI Slave) UCB1CLK (MFM) TX P5.1/MFM.TX
UCB1STE
Transmit Transmit
Complete Event Start Trigger
SAC2
PGA
Timer_B2 Timer_B3
P2.1/COMP1.O TB2CLK 00 TB3CLK 00

ACLK 01 ACLK 01
16-Bit Counter 16-bit Counter
SMCLK 10 SMCLK 10
11 11
P2.5/COMP1.0
TBD 00 00
P2.4/COMP1.1 MFM Complete Event 01 TB2.0A 01 TB3.0A
CCR0 CCR0
DVSS 10 TB2.0B MFM DVSS 10 TB3.0B
Start
DVCC 11 Trigger DVCC 11
P1.5/OA1O/A5
P5.0 00 P6.0 00
01 TB2.1A P5.0 01 TB3.1A P6.0
CCR1 CCR1
DVSS 10 TB2.1B to SAC DAC Update Trigger 10DVSS 10 TB3.1B
eUSCI_A1 UCA1TXD
DVCC 11 DVCC 11
(UART) UCA1RXD
P1.7/OA1+/A7 00
DACLSEL 01
10
from TB2.1B SAC1 P5.1 00 P6.1 00
10 +
12-bit DAC PDIR4.0 P4.0/UCA1STE/ISOTXD/ISORXD
from TB2.2B 11 SAC1 01 TB2.2A P5.1 01 TB3.2A P6.1
OA CCR2 CCR2
– DVSS 10 TB2.2B to SAC DAC Update Trigger 11DVSS 10 TB3.2B
P1.6/OA1-/A6 00 DVCC 11 DVCC 11
TB2OUTH TB1OUTH
01
10
P6.2 00
000 01 TB3.3A P6.2
CCR3
001 DVSS 10 TB3.3B
010 DVCC 11
101
SAC1 eCOMP1 110 TB2TRG
PGA 6-bit DAC
+ 1
eCOMP1 Polarity 0 P6.3 00
Selection
P3.5/OA3O – 01 TB3.4A P6.3
CCR4
000 DVSS 10 TB3.4B
TB2TRGSEL
001 DVCC 11
Low-power 010
1.2V 1
TB3OUTH
101 0
110
P3.7/OA3+ 00 P6.4 00
TB3TRGSEL
DACLSEL 01 01 TB3.5A P6.4
CCR5
10 DVSS 10 TB3.5B
from TB2.1B SAC3 DVCC 11
10 +
12-bit DAC
from TB2.2B 11 SAC3
OA
–
P3.6/OA3- 00
01 P6.5 00
10 01 TB3.6A P6.5
CCR6
DVSS 10 TB3.6B
DVCC 11
SAC3
PGA
Figure 6-3. Cross-Chip Interconnection

6.10.18 Embedded Emulation Module (EEM)

The EEM supports real-time in-system debugging. The EEM on these devices has the following features:
• Three hardware triggers or breakpoints on memory access
• One hardware trigger or breakpoint on CPU register write access
• Up to four hardware triggers can be combined to form complex triggers or breakpoints
• One cycle counter
• Clock control on module level
6.10.19 Peripheral File Map

Table 6-33 lists the base address and the memory size of each peripheral's registers.
Table 6-33. Peripherals Summary

MODULE NAME BASE ADDRESS SIZE
Special Functions (see Table 6-34) 0100h 0010h
PMM (see Table 6-35) 0120h 0020h
SYS (see Table 6-36) 0140h 0040h
CS (see Table 6-37) 0180h 0020h
FRAM (see Table 6-38) 01A0h 0010h
CRC (see Table 6-39) 01C0h 0008h
WDT (see Table 6-40) 01CCh 0002h
Port P1, P2 (see Table 6-41) 0200h 0020h
RTC (see Table 6-44) 0300h 0010h
Timer0_B3 (see Table 6-45) 0380h 0030h
Timer1_B3 (see Table 6-46) 03C0h 0030h
MPY32 (see Table 6-49) 04C0h 0030h
eUSCI_A0 (see Table 6-50) 0500h 0020h
eUSCI_B0 (see Table 6-51) 0540h 0030h
eUSCI_A1 (see Table 6-52) 0580h 0020h
eUSCI_B1 (see Table 6-53) 05C0h 0030h
Backup Memory (see Table 6-54) 0660h 0020h
ICC (see Table 6-55) 06C0h 0010h
ADC (see Table 6-56) 0700h 0040h
eCOMP0 (see Table 6-57) 08E0h 0020h
eCOMP1 (see Table 6-58) 0900h 0020h
(1)
SAC0 (see Table 6-59) 0C80h 0010h
SAC1 (see Table 6-60) (1) 0C90h 0010h
SAC2 (see Table 6-61) (1) 0CA0h 0010h
(1)
SAC3 (see Table 6-62) 0CB0h 0010h

Table 6-34. Special Function Registers (Base Address: 0100h)

REGISTER DESCRIPTION ACRONYM OFFSET
SFR interrupt enable SFRIE1 00h
SFR interrupt flag SFRIFG1 02h
SFR reset pin control SFRRPCR 04h
Table 6-35. PMM Registers (Base Address: 0120h)

PMM control 0 PMMCTL0 00h
PMM interrupt flags PMMIFG 0Ah
PM5 control 0 PM5CTL0 10h
Table 6-36. SYS Registers (Base Address: 0140h)

System control SYSCTL 00h
Bootloader configuration area SYSBSLC 02h
JTAG mailbox control SYSJMBC 06h
JTAG mailbox input 0 SYSJMBI0 08h
JTAG mailbox input 1 SYSJMBI1 0Ah
JTAG mailbox output 0 SYSJMBO0 0Ch
JTAG mailbox output 1 SYSJMBO1 0Eh
User NMI vector generator SYSUNIV 1Ah
System NMI vector generator SYSSNIV 1Ch
Reset vector generator SYSRSTIV 1Eh
System configuration 0 SYSCFG0 20h
Table 6-37. CS Registers (Base Address: 0180h)

CS control 0 CSCTL0 00h
CS control 5 CSCTL5 0Ah
CS control 6 CSCTL6 0Ch
CS control 7 CSCTL7 0Eh

Table 6-38. FRAM Registers (Base Address: 01A0h)

FRAM control 0 FRCTL0 00h
General control 0 GCCTL0 04h
General control 1 GCCTL1 06h
Table 6-39. CRC Registers (Base Address: 01C0h)

CRC data input CRC16DI 00h
CRC data input reverse byte CRCDIRB 02h
CRC initialization and result CRCINIRES 04h
CRC result reverse byte CRCRESR 06h
Table 6-40. WDT Registers (Base Address: 01CCh)

Watchdog timer control WDTCTL 00h
Table 6-41. Port P1, P2 Registers (Base Address: 0200h)

Port P1 input P1IN 00h
Port P1 output P1OUT 02h
Port P1 direction P1DIR 04h
Port P1 pulling enable P1REN 06h
Port P1 selection 0 P1SEL0 0Ah
Port P1 selection 1 P1SEL1 0Ch
Port P1 interrupt vector word P1IV 0Eh
Port P1 complement selection P1SELC 16h
Port P1 interrupt edge select P1IES 18h
Port P1 interrupt enable P1IE 1Ah
Port P1 interrupt flag P1IFG 1Ch
Port P2 selection 0 P2SEL0 0Bh
Port P2 selection 1 P2SEL1 0Dh
Port P2 interrupt enable P2IE 1Bh
Port P2 interrupt flag P2IFG 1Dh


Port P3 interrupt enable P3IE 1Ah
Port P3 interrupt flag P3IFG 1Ch
Port P4 interrupt enable P4IE 1Bh
Port P4 interrupt flag P4IFG 1Dh

Table 6-44. RTC Registers (Base Address: 0300h)

RTC control RTCCTL 00h
RTC interrupt vector RTCIV 04h
RTC modulo RTCMOD 08h
RTC counter RTCCNT 0Ch

Table 6-45. Timer0_B3 Registers (Base Address: 0380h)

TB0 control TB0CTL 00h
Capture/compare control 0 TB0CCTL0 02h
TB0 counter TB0R 10h
Capture/compare 0 TB0CCR0 12h
TB0 expansion 0 TB0EX0 20h
TB0 interrupt vector TB0IV 2Eh
Table 6-46. Timer1_B3 Registers (Base Address: 03C0h)




Capture/compare control 4 TB3CCTL4 0Ah
Capture/compare control 5 TB3CCTL5 0Ch
Capture/compare control 6 TB3CCTL6 0Eh
Capture/compare 4 TB3CCR4 1Ah
Capture/compare 5 TB3CCR5 1Ch
Capture/compare 6 TB3CCR6 1Eh
Table 6-49. MPY32 Registers (Base Address: 04C0h)

16-bit operand 1 – multiply MPY 00h
16-bit operand 1 – signed multiply MPYS 02h
16-bit operand 1 – multiply accumulate MAC 04h
16-bit operand 1 – signed multiply accumulate MACS 06h
16-bit operand 2 OP2 08h
16 × 16 result low word RESLO 0Ah
16 × 16 result high word RESHI 0Ch
16 × 16 sum extension SUMEXT 0Eh
32-bit operand 1 – multiply low word MPY32L 10h
32-bit operand 1 – multiply high word MPY32H 12h
32-bit operand 1 – signed multiply low word MPYS32L 14h
32-bit operand 1 – signed multiply high word MPYS32H 16h
32-bit operand 1 – multiply accumulate low word MAC32L 18h
32-bit operand 1 – multiply accumulate high word MAC32H 1Ah
32-bit operand 1 – signed multiply accumulate low word MACS32L 1Ch
32-bit operand 1 – signed multiply accumulate high word MACS32H 1Eh
32-bit operand 2 – low word OP2L 20h
32-bit operand 2 – high word OP2H 22h
32 × 32 result 0 – least significant word RES0 24h
32 × 32 result 1 RES1 26h
32 × 32 result 2 RES2 28h
32 × 32 result 3 – most significant word RES3 2Ah
MPY32 control 0 MPY32CTL0 2Ch

Table 6-50. eUSCI_A0 Registers (Base Address: 0500h)

eUSCI_A control word 0 UCA0CTLW0 00h
eUSCI_A control rate 0 UCA0BR0 06h
eUSCI_A modulation control UCA0MCTLW 08h
eUSCI_A status UCA0STAT 0Ah
eUSCI_A receive buffer UCA0RXBUF 0Ch
eUSCI_A transmit buffer UCA0TXBUF 0Eh
eUSCI_A LIN control UCA0ABCTL 10h
eUSCI_A IrDA transmit control lUCA0IRTCTL 12h
eUSCI_A IrDA receive control IUCA0IRRCTL 13h
eUSCI_A interrupt enable UCA0IE 1Ah
eUSCI_A interrupt flags UCA0IFG 1Ch
eUSCI_A interrupt vector word UCA0IV 1Eh
Table 6-51. eUSCI_B0 Registers (Base Address: 0540h)

eUSCI_B control word 0 UCB0CTLW0 00h
eUSCI_B bit rate 0 UCB0BR0 06h
eUSCI_B status word UCB0STATW 08h
eUSCI_B byte counter threshold UCB0TBCNT 0Ah
eUSCI_B receive buffer UCB0RXBUF 0Ch
eUSCI_B transmit buffer UCB0TXBUF 0Eh
eUSCI_B I2C own address 0 UCB0I2COA0 14h
eUSCI_B I2C own address 3 UCB0I2COA3 1Ah
eUSCI_B receive address UCB0ADDRX 1Ch
eUSCI_B address mask UCB0ADDMASK 1Eh
eUSCI_B I2C slave address UCB0I2CSA 20h
eUSCI_B interrupt enable UCB0IE 2Ah
eUSCI_B interrupt flags UCB0IFG 2Ch
eUSCI_B interrupt vector word UCB0IV 2Eh

Table 6-52. eUSCI_A1 Registers (Base Address: 0580h)

eUSCI_A modulation control UCA1MCTLW 08h
eUSCI_A status UCA1STAT 0Ah
eUSCI_A receive buffer UCA1RXBUF 0Ch
eUSCI_A transmit buffer UCA1TXBUF 0Eh
eUSCI_A LIN control UCA1ABCTL 10h
eUSCI_A IrDA transmit control lUCA1IRTCTL 12h
eUSCI_A IrDA receive control IUCA1IRRCTL 13h
eUSCI_A interrupt enable UCA1IE 1Ah
eUSCI_A interrupt flags UCA1IFG 1Ch
eUSCI_A interrupt vector word UCA1IV 1Eh
Table 6-53. eUSCI_B1 Registers (Base Address: 05C0h)

eUSCI_B status word UCB1STATW 08h
eUSCI_B byte counter threshold UCB1TBCNT 0Ah
eUSCI_B receive buffer UCB1RXBUF 0Ch
eUSCI_B transmit buffer UCB1TXBUF 0Eh
eUSCI_B I2C own address 3 UCB1I2COA3 1Ah
eUSCI_B receive address UCB1ADDRX 1Ch
eUSCI_B address mask UCB1ADDMASK 1Eh
eUSCI_B I2C slave address UCB1I2CSA 20h
eUSCI_B interrupt enable UCB1IE 2Ah
eUSCI_B interrupt flags UCB1IFG 2Ch
eUSCI_B interrupt vector word UCB1IV 2Eh

Table 6-54. Backup Memory Registers (Base Address: 0660h)

Backup memory 0 BAKMEM0 00h
Backup memory 5 BAKMEM5 0Ah
Backup memory 6 BAKMEM6 0Ch
Backup memory 7 BAKMEM7 0Eh
Backup memory 13 BAKMEM13 1Ah
Backup memory 14 BAKMEM14 1Ch
Backup memory 15 BAKMEM15 1Eh
Table 6-55. ICC Registers (Base Address: 06C0h)

ICC status and control ICCSC 00h
ICC mask virtual stack ICCMVS 02h
ICC interrupt level setting 0 ICCILSR0 04h
ICC interrupt level setting 3 ICCILSR3 0Ah
Table 6-56. ADC Registers (Base Address: 0700h)

ADC control 0 ADCCTL0 00h
ADC window comparator low threshold ADCLO 06h
ADC window comparator high threshold ADCHI 08h
ADC memory control 0 ADCMCTL0 0Ah
ADC conversion memory ADCMEM0 12h
ADC interrupt enable ADCIE 1Ah
ADC interrupt flags ADCIFG 1Ch
ADC interrupt vector word ADCIV 1Eh

Table 6-57. eCOMP0 Registers (Base Address: 08E0h)

Comparator control 0 CP0CTL0 00h
Comparator interrupt CP0INT 06h
Comparator interrupt vector CP0IV 08h
Comparator built-in DAC control CP0DACCTL 10h
Comparator built-in DAC data CP0DACDATA 12h
Table 6-58. eCOMP1 Registers (Base Address: 0900h)

Comparator interrupt CP1INT 06h
Comparator interrupt vector CP1IV 08h
Comparator built-in DAC control CP1DACCTL 10h
Comparator built-in DAC data CP1DACDATA 12h
Table 6-59. SAC0 Registers (Base Address: 0C80h, MSP430FR235x Devices Only)
SAC0 OA control SAC0OA 00h
SAC0 PGA control SAC0PGA 02h
SAC0 DAC control SAC0DAC 04h
SAC0 DAC data SAC0DAT 06h
SAC0 DAC status SAC0DATSTS 08h
SAC0 interrupt vector SAC0IV 0Ah
Table 6-60. SAC1 Registers (Base Address: 0C90h, MSP430FR235x Devices Only)
Table 6-61. SAC2 Registers (Base Address: 0CA0h, MSP430FR235x Devices Only)

Table 6-62. SAC3 Registers (Base Address: 0CB0h, MSP430FR235x Devices Only)

6.11 Input/Output Diagrams
6.11.1 Port P1 Input/Output With Schmitt Trigger

Figure 6-4 shows the port diagram. Table 6-63 summarizes the selection of the port function.
A0..A7
OA0+, OA0-, OA0O
OA1+, OA1-, OA1O
COMP0.0, COMP0.1
P1REN.x
P1DIR.x 00
From Module 1 01
From Module 2 10
DVSS 0
DVCC 1
P1OUT.x 00
From Module 1 01
From Module 2 10
P1SEL0
P1SEL1
EN
To module D
P1IN.x
P1IE.x
Bus
P1 Interrupt Keeper
Q D
S P1.0/UCB0STE/SMCLK/COMP0.0/A0/Veref+
P1.1/UCB0CLK/ACLK/OA0O/COMP0.1/A1
P1IFG.x P1.2/UCB0SIMO/UCB0SDA/TB0TRG/OA0-/A2/Veref-
Edge P1.4/UCA0STE/TCK/A4
Select P1.5/UCA0CLK/TMS/A5
P1IES.x
P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/A6
From JTAG P1.7/UCA0TXD/UCA0SIMO/TB0.2/TDO/A7/VREF+
To JTAG
Figure 6-4. Port P1 Input/Output With Schmitt Trigger

Table 6-63. Port P1 Pin Functions

CONTROL BITS AND SIGNALS (1)
PIN NAME (P1.x) x FUNCTION
P1DIR.x P1SELx JTAG
P1.0 (I/O) I: 0; O: 1 00 N/A
UCB0STE X 01 N/A
P1.0/UCB0STE/SMCLK/
0 SMCLK 1
COMP0.0/A0/Veref+ 10 N/A
VSS 0
COMP0.0, A0/Veref+ X 11 N/A
P1.1 (I/O) I: 0; O: 1 0 N/A
UCB0CLK X 01 N/A
P1.1/UCB0CLK/ACLK/
1 ACLK 1
OA0O/COMP0.1/A1 10 N/A
VSS 0
OA0O (2), COMP0.1, A1 X 11 N/A
P1.2 (I/O) I: 0; O: 1 00 N/A
P1.2/UCB0SIMO/ UCB0SIMO/UCB0SDA X 01 N/A
UCB0SDA/TB0TRG/ 2
OA0-/A2/Veref- TB0TRG 0 10 N/A
OA0- (2), A2/Veref- X 11 N/A
P1.3 (I/O) I: 0; O: 1 00 N/A
P1.3/UCB0SOMI/
3 UCB0SOMI/UCB0SCL X 01 N/A
UCB0SCL/OA0+/A3
OA0+ (2), A3 X 11 N/A
P1.4 (I/O) I: 0; O: 1 00 Disabled
UCA0STE X 01 Disabled
P1.4/UCA0STE/TCK/A4 4
A4 X 11 Disabled
JTAG TCK X X TCK
P1.5 (I/O) I: 0; O: 1 00 Disabled
P1.5/UCA0CLK/TMS/ UCA0CLK X 01 Disabled
5
OA1O/A5 OA1O (2), A5 X 11 Disabled
JTAG TMS X X TMS
P1.6 (I/O) I: 0; O: 1 00 Disabled
UCA0RXD/UCA0SOMI X 01 Disabled
P1.6/UCA0RXD/ TB0.CCI1A 0
UCA0SOMI/TB0.1/TDI/ 6 10 Disabled
TCLK/OA1-/A6 TB0.1 1
OA1- (2), A6 X 11 Disabled
JTAG TDI/TCLK X X TDI/TCLK
P1.7 (I/O) I: 0; O: 1 00 Disabled
UCA0TXD/UCA0SIMO X 01 Disabled
P1.7/UCA0TXD/ TB0.CCI2A 0
UCA0SIMO/TB0.2/TDO/ 7 10 Disabled
OA1+/A7/VREF+ TB0.2 1
OA1+ (2), A7, VREF+ X 11 Disabled
JTAG TDO X X TDO
(1) X = don't care


COMP1.0, COMP1.1
P2REN.x
P2DIR.x 00
From Module 1 01
From Module 2 10
DVSS 0
DVCC 1
P2OUT.x 00
From Module 1 01
From Module 2 10
P2SEL0
P2SEL1
EN
To module D
P2IN.x
P2IE.x
Bus
P2 Interrupt Keeper
Q D
S P2.0/TB1.1/COMP0.O
P2.1/TB1.2/COMP1.O
P2IFG.x P2.2/TB1CLK
P2.3/TB1TRG
Edge P2.4/COMP1.1
Select P2.5/COMP1.0
P2IES.x
P2.6/MCLK/XOUT
P2.7/TB0CLK/XIN


P2DIR.x P2SELx
P2.0 (I/O) I: 0; O: 1 00
TB1.CCI1A 0
P2.0/TB1.1/COMP0.O 0 01
TB1.1 1
COMP0.O 1 10
P2.1 (I/O)0 I: 0; O: 1 00
TB1.CCI2A 0
P2.1/TB1.2 1 01
TB1.2 1
COMP1.O 1 10
P2.2 (I/O) I: 0; O: 1 00
P2.2/TB1CLK 2
TB1CLK 0 01
P2.3 (I/O) I: 0; O: 1 00
P2.3/UCB0CLK/TB1TRG 3 TB1TRG 0
01
VSS 1
P2.4 (I/O) I: 0; O: 1 00
P2.4/COMP1.1 4
COMP1.1 X 11
P2.5 (I/O) I: 0; O: 1 00
P2.5/COMP1.0 5
COMP1.0 X 11
P2.6 (I/O) I: 0; O: 1 00
MCLK 1
P2.6/MCLK/XOUT 6 01
VSS 0
XOUT X 10
P2.7 (I/O) I: 0; O: 1 00
TB0CLK 0
P2.7/TB0CLK/XIN 7 01
VSS 1
XIN X 10
(1) X = don't care


OA2O, OA2-, OA2+

OA3O, OA3-, OA3+
P3REN.x
P3DIR.x 00
From Module 1 01
From Module 2 10
DVSS 0
DVCC 1
P3OUT.x 00
From Module 1 01
From Module 2 10
P3SEL0
P3SEL1
EN
To module D
P3IN.x
P3IE.x
Bus
P3 Interrupt Keeper
Q D
S P3.0/MCLK
P3.1/OA2O
P3IFG.x P3.2/OA2-
P3.3/OA2+
Edge P3.4/SMCLK
Select P3.5/OA3O
P3IES.x
P3.6/OA3-
P3.7/OA3+


P3DIR.x P3SELx
P3.0 (I/O) I: 0; O: 1 00
P3.0/MCLK 0 MCLK 1
01
VSS 0
P3.1 (I/O) I: 0; O: 1 00
P3.1/OA2O 1
OA2O (2) X 11
P3.2 (I/O) I: 0; O: 1 00
P3.2/OA2- 2
OA2- (2) X 11
P3.3 (I/O) I: 0; O: 1 00
P3.3/OA2+ 3 (2)
OA2+ X 11
P3.4 (I/O) I: 0; O: 1 00
P3.4/SMCLK 4 SMCLK 1
01
VSS 0
P3.5 (I/O) I: 0; O: 1 00
P3.5/OA3O 5
OA3O (2) X 11
P3.6 (I/O) I: 0; O: 1 00
P3.6/OA3- 6 (2)
OA3- X 11
P3.7 (I/O) I: 0; O: 1 00
P3.7/OA3+ 7
OA3+ (2) X 11
(1) X = don't care


P4REN.x
P4DIR.x 00
From Module 1 01
From Module 2 10
DVSS 0
DVCC 1
P4OUT.x 00
From Module 1 01
From Module 2 10
P4SEL0
P4SEL1
EN
To module D
P4IN.x
P4IE.x
Bus
P4 Interrupt Keeper
Q D
S P4.0/UCA1STE/ISOTXD/ISORXD
P4.1/UCA1CLK
P4IFG.x P4.2/UCA1RXD/UCA1SOMI/UCA1RXD
Edge P4.4/UCB1STE
Select P4.5/UCB1CLK
P4IES.x


P4DIR.x P4SELx
P4.0 (I/O) I: 0; O: 1 00
UCA1STE X 01
P4.0/UCA1STE 0
UCA1RXD, TB3.CCI2B 0
10
UCA1TXD logic-AND TB3.2B 1
P4.1 (I/O) I: 0; O: 1 00
P4.1/UCA1CLK 1
UCA1CLK X 01
P4.2 (I/O) I: 0; O: 1 00
P4.2/UCA1RXD/
2 UCA1RXD/UCA1SOMI X 01
UCA1SOMI/UCA1RXD
UCA1RXD X 10
P4.3 (I/O) I: 0; O: 1 00
P4.3/UCA1TXD/
3 UCA1TXD/UCA1SIMO X 01
UCA1SIMO/UCA1TXD
UCA1TXD X 10
P4.4 (I/O) I: 0; O: 1 00
P4.4/UCB1STE 4
UCB1STE X 01
P4.5 (I/O) I: 0; O: 1 00
P4.5/UCB1CLK 5
UCB1CLK X 01
P4.6 (I/O) I: 0; O: 1 00
P4.6/UCB1SIMO/UCB1SDA 6
UCB1SIMO/UCB1SDA X 01
P4.7 (I/O) I: 0; O: 1 00
P4.7/UCB1SOMI/UCB1SCL 7
UCB1SOMI/UCB1SCL X 01
(1) X = don't care


A8, A9, A10, A11
P5REN.x
P5DIR.x 00
From Module 1 01
From Module 2 10
DVSS 0
DVCC 1
P5OUT.x 00
From Module 1 01
From Module 2 10
P5SEL0
P5SEL1
EN
To module D
P5IN.x
Bus
Keeper
P5.2/TB2CLK/A10
P5.3/TB2TRG/A11
P5.4


P5DIR.x P5SELx
P5.0 (I/O) I: 0; O: 1 00
TB2.CCI1A I
01
P5.0/TB2.1/MFM.RX/A8 0 TB2.1 O
MFM.RX X 10
A8 X 11
P5.1 (I/O) I: 0; O: 1 00
TB2.CCI2A I
01
P5.1/TB2.2/MFM.TX/A9 1 TB2.2 O
MFM.TX X 10
A9 X 11
P5.2 (I/O) I: 0; O: 1 00
TB2CLK I
P5.2/TB2CLK/A10 2 01
VSS O
A10 X 11
P5.3 (I/O) I: 0; O: 1 00
TB2TRG I
P5.3/TB2TRG/A11 3 01
VSS O
A11 X 11
P5.4 4 P5.4 (I/O) I: 0; O: 1 00
(1) X = don't care


P6REN.x
P6DIR.x 00
From Module 1 01
From Module 2 10
DVSS 0
DVCC 1
P6OUT.x 00
From Module 1 01
From Module 2 10
P6SEL0
P6SEL1
EN
To module D
P6IN.x
Bus
Keeper
P6.0/TB3.1
P6.1/TB3.2
P6.2/TB3.3
P6.3/TB3.4
P6.4/TB3.5
P6.5/TB3.6
P6.6/TB3CLK


P6DIR.x P6SELx
P6.0 (I/O) I: 0; O: 1 00
P6.0/TB3.1 0 TB3.CCI1A 0
01
TB3.1 1
P6.1 (I/O) I: 0; O: 1 00
P6.1/TB3.2 1 TB3.CCI2A 0
01
TB3.2 1
P6.2 (I/O) I: 0; O: 1 00
P6.2/TB3.3 2 TB3.CCI3A 0
01
TB3.3 1
P6.3 (I/O) I: 0; O: 1 00
P6.3/TB3.4 3 TB3.CCI4A 0
01
TB3.4 1
P6.4 (I/O) I: 0; O: 1 00
P6.4/TB3.5 4 TB3.CCI5A 0
01
TB3.5 1
P6.5 (I/O) I: 0; O: 1 00
P6.5/TB3.6 5 TB3.CCI6A 0
01
TB3.6 1
P6.6 (I/O) I: 0; O: 1 00
P6.6/TB3CLK 6 TB3CLK 0
01
VSS 1
(1) X = don't care

6.12 Device Descriptors (TLV)

Table 6-69 lists the Device IDs. Table 6-70 lists the contents of the device descriptor tag-length-value
(TLV) structure.
Table 6-69. Device IDs

DEVICE ID
DEVICE
1A04h 1A05h
MSP430FR2355 0C 83
MSP430FR2353 0D 83
MSP430FR2155 1E 83
MSP430FR2153 1D 83
Table 6-70. Device Descriptors

DESCRIPTION ADDRESS VALUE
Info length 1A00h 06h
CRC length 1A01h 06h
1A02h Per unit
CRC value (1)
1A03h Per unit
Information block
1A04h (2)
Device ID See
1A05h
Hardware revision 1A06h Per unit
Firmware revision 1A07h Per unit
Die record tag 1A08h 08h
Die record length 1A09h 0Ah
1A0Ah Per unit
1A0Bh Per unit
Lot wafer ID
1A0Ch Per unit
1A0Dh Per unit
Die record
1A0Eh Per unit
Die X position
1A0Fh Per unit
1A10h Per unit
Die Y position
1A11h Per unit
1A12h Per unit
Test result
1A13h Per unit
(1) CRC value covers the checksum from 0x1A04h to 0x1AF7h by applying CRC-CCITT-16 polynomial of x16 + x12 + x5 + 1
Table 6-70. Device Descriptors (continued)

DESCRIPTION ADDRESS VALUE
ADC calibration tag 1A14h 11h
ADC calibration length 1A15h 10h
1A16h Per unit
ADC gain factor
1A17h Per unit
1A18h Per unit
ADC offset
1A19h Per unit
1A1Ah Per unit
ADC internal shared 1.5-V reference, temperature 30°C
1A1Bh Per unit
1A1Ch Per unit
ADC calibration ADC internal shared 1.5-V reference, high temperature (3)
1A1Dh Per unit
1A1Eh Per unit
1A1Fh Per unit
1A20h Per unit
ADC internal shared 2.0-V reference, high temperature (3)
1A21h Per unit
1A22h Per unit
1A23h Per unit
1A24h Per unit
ADC internal shared 2.5-V reference, high temperature (3)
1A25h Per unit
Calibration tag 1A26h 12h
Calibration length 1A27h 0Ah
1A28h Per unit
Internal shared 1.5-V reference factor
1A29h Per unit
1A2Ah Per unit
Reference and DCO 1A2Bh Per unit
calibration 1A2Ch Per unit
1A2Dh Per unit
1A2Eh Per unit
DCO tap settings for 16 MHz, temperature 30°C
1A2Fh Per unit
(4)
1A30h Per unit
DCO tap settings for 24 MHz, temperature 30°C
1A31h Per unit
(3) The calibration value is device dependent at 105°C.
(4) This value can be directly loaded into the DCO bits in the CSCTL0 register to get an accurate 24-MHz frequency at room temperature,
especially when MCU exits from LPM3 and below. TI also suggests to use a predivider to decrease the frequency if the temperature drift
might result an overshoot faster than 24 MHz.

6.13 Identification
6.13.1 Revision Identification

The device revision information is shown as part of the top-side marking on the device package. The
device-specific errata sheet describes these markings. For links to all of the errata sheets for the devices
in this data sheet, see Section 8.4.
The hardware revision is also stored in the Device Descriptor structure in the Info Block section. For
details on this value, see the "Hardware Revision" entries in Section 6.12.
6.13.2 Device Identification

The device type can be identified from the top-side marking on the device package. The device-specific
errata sheet describes these markings. For links to all of the errata sheets for the devices in this data
sheet, see Section 8.4.
A device identification value is also stored in the Device Descriptor structure in the Info Block section. For
details on this value, see the "Device ID" entries in Section 6.12.
6.13.3 JTAG Identification

Programming through the JTAG interface, including reading and identifying the JTAG ID, is described in
detail in the MSP430 Programming With the JTAG Interface.

7 Applications, Implementation, and Layout
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI's customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their implementation to confirm system functionality.
7.1 Device Connection and Layout Fundamentals

This section discusses the recommended guidelines when designing with the MSP430 MCU. These
guidelines are to make sure that the device has proper connections for powering, programming,
debugging, and optimum analog performance.
7.1.1 Power Supply Decoupling and Bulk Capacitors

It is recommended to connect a combination of a 10-µF plus a 100-nF low-ESR ceramic decoupling
capacitor to the DVCC pin. Higher-value capacitors can be used but can impact supply rail ramp-up time.
Place the decoupling capacitors as close as possible to the pins that they decouple (within a few
millimeters).
DVCC
Digital
+
Power Supply
Decoupling
DVSS
10 µF 100 nF
Figure 7-1. Power Supply Decoupling
7.1.2 External Oscillator

Depending on the device variant (see Section 3), the device can support a low-frequency crystal (32 kHz)
on the LFXT pins, a high-frequency crystal on the HFXT pins, or both. External bypass capacitors for the
crystal oscillator pins are required.
It is also possible to apply digital clock signals to the LFXIN and HFXIN input pins that meet the
specifications of the respective oscillator if the appropriate LFXTBYPASS or HFXTBYPASS mode is
selected. In this case, the associated LFXOUT and HFXOUT pins can be used for other purposes. If they
are left unused, they must be terminated according to Section 4.6.
Figure 7-2 shows a typical connection diagram.
LFXIN LFXOUT
or or
HFXIN HFXOUT
CL1 CL2
Figure 7-2. Typical Crystal Connection

110 Applications, Implementation, and Layout Copyright © 2018–2019, Texas Instruments Incorporated
See MSP430 32-kHz Crystal Oscillators for more information on selecting, testing, and designing a crystal
oscillator with MSP430 MCUs.
7.1.3 JTAG
With the proper connections, the debugger and a hardware JTAG interface (such as the MSP-FET or
MSP-FET430UIF) can be used to program and debug code on the target board. In addition, the
connections also support the MSP-GANG production programmers, thus providing an easy way to
program prototype boards, if desired. Figure 7-3 shows the connections between the 14-pin JTAG
connector and the target device required to support in-system programming and debugging for 4-wire
JTAG communication. Figure 7-4 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire).
The connections for the MSP-FET and MSP-FET430UIF interface modules and the MSP-GANG are
identical. Both can supply VCC to the target board (through pin 2). In addition, the MSP-FET and MSP-
FET430UIF interface modules and MSP-GANG have a VCC sense feature that, if used, requires an
alternate connection (pin 4 instead of pin 2). The VCC-sense feature senses the local VCC present on the
target board (that is, a battery or other local power supply) and adjusts the output signals accordingly.
Figure 7-3 and Figure 7-4 show a jumper block that supports both scenarios of supplying VCC to the target
board. If this flexibility is not required, the desired VCC connections can be hard-wired to eliminate the
jumper block. Pins 2 and 4 must not be connected at the same time.
For additional design information regarding the JTAG interface, see the MSP430 hardware tools user’s
guide.
Important to connect VCC

MSP430FRxxx
J1 (see Note A)
DVCC
J2 (see Note A)
R1
47 kW
JTAG
RST/NMI/SBWTDIO
VCC TOOL TDO/TDI
2 1 TDO/TDI
VCC TARGET TDI
4 3 TDI
TMS
6 5 TMS
TEST TCK
8 7 TCK
GND
10 9
RST
12 11
14 13
TEST/SBWTCK
C1
DVSS
1 nF
(see Note B)
Copyright © 2016, Texas Instruments Incorporated

A. If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,
make connection J2.
B. The upper limit for C1 is 1.1 nF when using current TI tools.
Figure 7-3. Signal Connections for 4-Wire JTAG Communication
Copyright © 2018–2019, Texas Instruments Incorporated Applications, Implementation, and Layout 111
Important to connect VCC

MSP430FRxxx
J1 (see Note A)
DVCC
J2 (see Note A)
R1
47 kΩ
(see Note B)
JTAG
VCC TOOL TDO/TDI

2 1 RST/NMI/SBWTDIO
VCC TARGET
4 3
6 5
TCK
8 7
GND
10 9
12 11
14 13
TEST/SBWTCK
C1
1 nF DVSS
(see Note B)

A. Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from the
debug or programming adapter.
B. The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during
JTAG access, and any capacitance that is attached to this signal can affect the ability to establish a connection with
the device. The upper limit for C1 is 1.1 nF when using current TI tools.
Figure 7-4. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire)
7.1.4 Reset
The reset pin can be configured as a reset function (default) or as an NMI function in the special function
register (SFR), SFRRPCR.
In reset mode, the RST/NMI pin is active low, and a pulse applied to this pin that meets the reset timing
specifications generates a BOR-type device reset.
Setting SYSNMI causes the RST/NMI pin to be configured as an external NMI source. The external NMI is
edge sensitive, and its edge is selectable by SYSNMIIES. Setting the NMIIE enables the interrupt of the
external NMI. When an external NMI event occurs, the NMIIFG is set.
The RST/NMI pin can have either a pullup or pulldown that is enabled or not. SYSRSTUP selects either
pullup or pulldown, and SYSRSTRE causes the pullup (default) or pulldown to be enabled (default) or not.
If the RST/NMI pin is unused, it is required either to select and enable the internal pullup or to connect an
external 47-kΩ pullup resistor to the RST/NMI pin with a 2.2-nF pulldown capacitor. The pulldown
capacitor should not exceed 1.1 nF when using devices with Spy-Bi-Wire interface in Spy-Bi-Wire mode or
in 4-wire JTAG mode with TI tools like FET interfaces or GANG programmers.
See the MSP430FR4xx and MSP430FR2xx Family User's Guide for more information on the referenced
control registers and bits.
7.1.5 Unused Pins

For details on the connection of unused pins, seeSection 4.6.
7.1.6 General Layout Recommendations

• Proper grounding and short traces for external crystal to reduce parasitic capacitance. See MSP430
32-kHz Crystal Oscillators for recommended layout guidelines.
• Proper bypass capacitors on DVCC, AVCC, and reference pins if used.
• Avoid routing any high-frequency signal close to an analog signal line. For example, keep digital
switching signals such as PWM or JTAG signals away from the oscillator circuit and ADC signals.
• Proper ESD level protection should be considered to protect the device from unintended high-voltage
electrostatic discharge. See MSP430 System-Level ESD Considerations for guidelines.
7.1.7 Do's and Don'ts

During power up, power down, and device operation, the voltage difference between AVCC and DVCC
must not exceed the limits specified in the Absolute Maximum Ratings section. Exceeding the specified
limits can cause malfunction of the device including erroneous writes to RAM and FRAM.
7.2 Peripheral- and Interface-Specific Design Information
7.2.1 ADC Peripheral
7.2.1.1 Partial Schematic
DVSS
Using an external VREF+/VEREF+

positive reference
+
10 µF 100 nF
Using an external
negative reference VEREF-
10 µF 100 nF
Figure 7-5. ADC Grounding and Noise Considerations
7.2.1.2 Design Requirements

As with any high-resolution ADC, appropriate printed-circuit-board layout and grounding techniques should
be followed to eliminate ground loops, unwanted parasitic effects, and noise.
Ground loops are formed when return current from the ADC flows through paths that are common with
other analog or digital circuitry. This current can generate small unwanted offset voltages that can add to
or subtract from the reference or input voltages of the ADC. The general guidelines in Section 7.1.1
combined with the connections shown in Figure 7-5 prevent these offset voltages.
In addition to grounding, ripple and noise spikes on the power-supply lines that are caused by digital
switching or switching power supplies can corrupt the conversion result. TI recommends a noise-free
design using separate analog and digital ground planes with a single-point connection to achieve high
accuracy.
Figure 7-5 shows the recommended decoupling circuit when an external voltage reference is used. The
internal reference module has a maximum drive current as described in the sections ADC Pin Enable and
1.2-V Reference Settings of the MSP430FR4xx and MSP430FR2xx Family User's Guide.
Copyright © 2018–2019, Texas Instruments Incorporated Applications, Implementation, and Layout 113
The reference voltage must be a stable voltage for accurate measurements. The capacitor values that are
selected in the general guidelines filter out the high- and low-frequency ripple before the reference voltage
enters the device. In this case, the 10-µF capacitor buffers the reference pin and filters low-frequency
ripple, and the 100-nF bypass capacitor filters high-frequency noise.
7.2.1.3 Layout Guidelines

Components that are shown in the partial schematic (see Figure 7-5) should be placed as close as
possible to the respective device pins to avoid long traces, because they add additional parasitic
capacitance, inductance, and resistance on the signal.
Avoid routing analog input signals close to a high-frequency pin (for example, a high-frequency PWM),
because the high-frequency switching can be coupled into the analog signal.
7.3 ROM Libraries

The MSP430FR235x and MSP430FR215x devices in the MSP430FR4xx family have MSP430 Driver
Library and FFT Library in ROM.
MSP430 software libraries in ROM are tested to work with both Code Composer Studio and IAR
Embedded Workbench toolchains.
• For the ROM image to be compatible between CCS and IAR tool chains, there are certain project
properties restrictions. See the TI.com attribute guide for more details.
• To use DriverLib in ROM, #include "rom_driverlib.h". Header file checks continue to provide helpful
hints at build time until the user application adheres to __cc_rom.
• To use FFTLib in ROM, #include "DSPLib.h". FFTLib is a subset of the MSP software library DSPLib.
• For more information, see the MSP430 Driver Library for MSP430FR2xx_4xx ROM README and
MSP DSP Library ROM README in MSP430Ware. The library ROM image is located above the 64KB
memory address. Application code using ROM must be large code model (20-bit address pointer rather
than 16-bit address pointer).
Benefits of ROM library use include:
• Code execution at clock speeds that exceed 8 MHz is faster from ROM than from FRAM, because the
code avoids FRAM wait states (except FRAM controller cache hits). Without FRAM wait states, code
execution performance is limited by only the processor clock, which is generally faster than other
subsystems. Executing code from RAM gives comparable performance, but the available RAM size is
typically more limited.
• More nonvolatile storage (FRAM) available in the device is left for application code.
7.4 Typical Applications

Table 7-1 lists TI reference designs that use the MSP430FR235x devices in real-world application
scenarios. Consult these designs for additional guidance regarding schematic, layout, and software
implementation. For the most up-to-date list of available TI reference designs, visit the TI reference
designs library.
Table 7-1. Tools and Reference Designs

DESIGN NAME LINK
4- to 20-mA Loop-Powered RTD Temperature Transmitter Reference Design With MSP430 Smart Analog Combo TIDM-01000
MSP430FR2355 LaunchPad development kit MSP-EXP430FR2355
8 Device and Documentation Support

8.1 Getting Started
For more information on the MSP430™ family of devices and the tools and libraries that are available to
help with your development, visit the MSP430 ultra-low-power sensing & measurement MCUs overview.
8.2 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
MSP MCU devices. Each MSP MCU commercial family member has one of two prefixes: MSP or XMS.
These prefixes represent evolutionary stages of product development from engineering prototypes (XMS)
through fully qualified production devices (MSP).
XMS – Experimental device that is not necessarily representative of the final device's electrical
specifications
MSP – Fully qualified production device
XMS devices are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
MSP devices have been characterized fully, and the quality and reliability of the device have been
demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (XMS) have a greater failure rate than the standard production
devices. TI recommends that these devices not be used in any production system because their expected
end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
temperature range, package type, and distribution format. Figure 8-1 provides a legend for reading the
complete device name.
MSP 430 FR 2 355 T PT R

Processor Family Distribution Format
Platform Packaging
Memory Type Temperature Range
Series Feature Set
Processor Family MSP = Mixed-Signal Processor

XMS = Experimental Silicon
Platform 430 = MSP430 16-Bit Low-Power Microcontroller
Memory Type FR = FRAM
Series 2 = FRAM 2 Series, up to 24 MHz without LCD
Feature Set First and Second Digits: Third Digit:
SAC Level / ADC Channels / COMP / 16-bit Timers / I/Os FRAM (KB) / SRAM (KB)
35 = SAC-L3 / Up to 12 / 2 / 4 / Up to 44 5 = 32 / 4
15 = No SAC / Up to 12 / 2 / 4 / Up to 44 3 = 16 / 2
Temperature Range T = –40°C to 105°C
Packaging http://www.ti.com/packaging
Distribution Format T = Small reel
R = Large reel
No marking = Tube or tray
Figure 8-1. Device Nomenclature
Copyright © 2018–2019, Texas Instruments Incorporated Device and Documentation Support 115
8.3 Tools and Software

See the Code Composer Studio™ IDE for MSP430™ MCUs User's Guide for details on the available
features.
Table 8-1 lists the debug features supported by the MSP430FR235x and MSP430FR215x
microcontrollers.
Table 8-1. Hardware Features

BREAK- RANGE LPMx.5
MSP430 4-WIRE 2-WIRE CLOCK STATE TRACE EEM
POINTS BREAK- DEBUGGING
ARCHITECTURE JTAG JTAG CONTROL SEQUENCER BUFFER VERSION
(N) POINTS SUPPORT
MSP430Xv2 Yes Yes 3 Yes Yes No No No S
Design Kits and Evaluation Modules

MSP430FR2355 LaunchPad Development Kit
The MSP-EXP430FR2355 LaunchPad development kit is an easy-to-use evaluation module (EVM) that
contains everything needed to start developing on the ultra-low-power MSP430FR215x and
MSP430FR235x FRAM microcontroller family, including an onboard debug probe for programming,
debugging, and energy measurements.
MSP-TS430PT48 Target Development Board
MSP-TS430PT48 target development board is a 48-pin ZIF socket target board that is used to program
and debug the MSP430 MCU in-system through the JTAG interface or the Spy-Bi-Wire (2-wire JTAG)
protocol.
Software
MSP430Ware™ Software
MSP430Ware software is a collection of code examples, data sheets, and other design resources for all
MSP430 devices delivered in a convenient package. In addition to providing a complete collection of
existing MSP430 design resources, MSP430Ware software also includes a high-level API called MSP
Driver Library. This library makes it easy to program MSP430 hardware. MSP430Ware software is
available as a component of CCS or as a stand-alone package.
MSP430FR235x and MSP430FR215x Code Examples
C code examples are available for every MSP device that configures each of the integrated peripherals for
various application needs.
MSP Driver Library
The abstracted API of MSP Driver Library provides easy-to-use function calls that free you from directly
manipulating the bits and bytes of the MSP430 hardware. Thorough documentation is delivered through a
helpful API Guide, which includes details on each function call and the recognized parameters.
Developers can use Driver Library functions to write complete projects with minimal overhead.
MSP EnergyTrace™ Technology
EnergyTrace technology for MSP430 microcontrollers is an energy-based code analysis tool that
measures and displays the energy profile of the application and helps to optimize it for ultra-low-power
consumption.
ULP (Ultra-Low Power) Advisor
ULP Advisor™ software is a tool for guiding developers to write more efficient code to fully use the unique
ultra-low-power features of MSP430 and MSP432™ microcontrollers. Aimed at both experienced and new
microcontroller developers, ULP Advisor checks your code against a thorough ULP checklist to help
minimize the energy consumption of your application. At build time, ULP Advisor provides notifications and
remarks to highlight areas of your code that can be further optimized for lower power.
116 Device and Documentation Support Copyright © 2018–2019, Texas Instruments Incorporated
FRAM Embedded Software Utilities for MSP Ultra-Low-Power Microcontrollers

The FRAM Utilities is designed to grow as a collection of embedded software utilities that leverage the
ultra-low-power and virtually unlimited write endurance of FRAM. The utilities are available for
MSP430FRxx FRAM microcontrollers and provide example code to help start application development.
Included utilities include Compute Through Power Loss (CTPL). CTPL is utility API set that enables ease
of use with LPMx.5 low-power modes and a powerful shutdown mode that allows an application to save
and restore critical system components when a power loss is detected.
IEC60730 Software Package
The IEC60730 MSP430 software package was developed to help customers comply with IEC 60730-
1:2010 (Automatic Electrical Controls for Household and Similar Use – Part 1: General Requirements) for
up to Class B products, which includes home appliances, arc detectors, power converters, power tools, e-
bikes, and many others. The IEC60730 MSP430 software package can be embedded in customer
applications running on MSP430 MCUs to help simplify the customer's certification efforts of functional
safety-compliant consumer devices to IEC 60730-1:2010 Class B.
Fixed-Point Math library for MSP
The MSP IQmath and Qmath Libraries are a collection of highly optimized and high-precision
mathematical functions for C programmers to seamlessly port a floating-point algorithm into fixed-point
code on MSP430 and MSP432 devices. These routines are typically used in computationally intensive
real-time applications where optimal execution speed, high accuracy, and ultra-low energy are critical. By
using the IQmath and Qmath libraries, it is possible to achieve execution speeds considerably faster and
energy consumption considerably lower than equivalent code written using floating-point math.
Floating-Point Math library for MSP430
Continuing to innovate in the low-power and low-cost microcontroller space, TI provides MSPMATHLIB.
Leveraging the intelligent peripherals of our devices, this floating-point math library of scalar functions that
are up to 26 times faster than the standard MSP430 math functions. Mathlib is easy to integrate into your
designs. This library is free and is integrated in both Code Composer Studio IDE and IAR Embedded
Workbench IDE.
Development Tools
Code Composer Studio™ Integrated Development Environment for MSP Microcontrollers
Code Composer Studio (CCS) integrated development environment (IDE) supports all MSP
microcontroller devices. CCS comprises a suite of embedded software utilities used to develop and debug
embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build
environment, debugger, profiler, and many other features.
IAR Embedded Workbench® IDE
IAR Embedded Workbench IDE for MSP430 MCUs is a complete C/C++ compiler toolchain for building
and debugging embedded applications based on MSP430 microcontrollers. The debugger can be used for
source and disassembly code with support for complex code and data breakpoints. It also provides a
hardware simulator that allows debugging without a physical target connected.
Uniflash Standalone Flash Tool
The Uniflash standalone flash tool is used to program on-chip flash memory on TI MCUs. Uniflash has a
GUI, command line, and scripting interface. Uniflash is a software tool available by TI Cloud Tools or
desktop application download from the TI web page.
MSP MCU Programmer and Debugger
The MSP-FET is a powerful emulation development tool – often called a debug probe – which lets users
quickly begin application development on MSP low-power MCUs. Creating MCU software usually requires
downloading the resulting binary program to the MSP device for validation and debugging.
MSP-GANG Production Programmer

The MSP Gang Programmer is an MSP430 or MSP432 device programmer that can program up to eight
identical MSP430 or MSP432 flash or FRAM devices at the same time. The MSP Gang Programmer
connects to a host PC using a standard RS-232 or USB connection and provides flexible programming
options that let the user fully customize the process.
TIREX Resource Explorer (TIRex)
An online portal to examples, libraries, executables, and documentation for your device and development
board. TIRex can be accessed directly in Code Composer Studio IDE or in TI Cloud Tools.
TI Cloud Tools
Start development immediately on dev.ti.com. Begin by using the Resource Explorer interface to quickly
find all the files you need. Then, edit, build, and debug embedded applications in the cloud, using industry-
leading Code Composer Studio Cloud IDE.
GCC - Compiler for MSP
MSP430 and MSP432 GCC open source packages are complete debugger and open source C/C++
compiler toolchains for building and debugging embedded applications based on MSP430 and MSP432
microcontrollers. These free GCC compilers support all MSP430 and MSP432 devices without code size
limitations. In addition, these compilers can be used stand-alone from the command-line or within Code
Composer Studio v6.0 or later. Get started today whether you are using a Windows®, Linux®, or macOS®
environment.
8.4 Documentation Support

The following documents describe the MSP430FR235x and MSP430FR215x microcontrollers.
Receiving Notification of Document Updates
To receive notification of documentation updates—including silicon errata—go to the product folder for
your device on ti.com (for links to the product folders, see Section 8.5). In the upper right corner, click the
"Alert me" button. This registers you to receive a weekly digest of product information that has changed (if
any). For change details, see the revision history of any revised document.
Errata
MSP430FR2355 Device erratasheet
Describes the known exceptions to the functional specifications for all silicon revisions of this device.
User's Guides
MSP430FR4xx and MSP430FR2xx Family User's Guide
Detailed description of all modules and peripherals available in this device family.
MSP430 FRAM device bootloader (BSL) User's Guide
The bootloader (BSL) on MSP430 MCUs lets users communicate with embedded memory in the MSP430
MCU during the prototyping phase, final production, and in service. Both the programmable memory
(FRAM memory) and the data memory (RAM) can be modified as required.
MSP430 Programming With the JTAG Interface

This document describes the functions that are required to erase, program, and verify the memory module
of the MSP430 flash-based and FRAM-based microcontroller families using the JTAG communication port.
In addition, it describes how to program the JTAG access security fuse that is available on all MSP430
devices. This document describes device access using both the standard 4-wire JTAG interface and the
2-wire JTAG interface, which is also referred to as Spy-Bi-Wire (SBW).
MSP430 Hardware Tools User's Guide
This manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is the
program development tool for the MSP430 ultra-low-power microcontroller. Both available interface types,
the parallel port interface and the USB interface, are described.
Application Reports
MSP430 32-kHz Crystal oscillators
Selection of the right crystal, correct load circuit, and proper board layout are important for a stable crystal
oscillator. This application report summarizes crystal oscillator function and explains the parameters to
select the correct crystal for MSP430 ultra-low-power operation. In addition, hints and examples for correct
board layout are given. The document also contains detailed information on the possible oscillator tests to
ensure stable oscillator operation in mass production.
MSP430 System-Level ESD Considerations
System-level ESD has become increasingly demanding with silicon technology scaling towards lower
voltages and the need for designing cost-effective and ultra-low-power components. This application
report addresses different ESD topics to help board designers and OEMs understand and design robust
system-level designs.
8.5 Related Links

Table 8-2 lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to order now.
Table 8-2. Related Links

TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER ORDER NOW
DOCUMENTS SOFTWARE COMMUNITY
MSP430FR2355 Click here Click here Click here Click here Click here
8.6 Trademarks
LaunchPad, MSP430, MSP430Ware, Code Composer Studio, E2E, EnergyTrace, ULP Advisor, MSP432
are trademarks of Texas Instruments.
macOS is a registered trademark of Apple, Inc.
IAR Embedded Workbench is a registered trademark of IAR Systems.
Linux is a registered trademark of Linus Torvalds.
Windows is a registered trademark of Microsoft Corporation.
8.7 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.8 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, see the left-hand navigation.
Copyright © 2018–2019, Texas Instruments Incorporated Mechanical, Packaging, and Orderable Information 121
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
MSP430FR2153TDBT ACTIVE TSSOP DBT 38 50 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 430FR2153
MSP430FR2153TDBTR ACTIVE TSSOP DBT 38 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 430FR2153
MSP430FR2153TPT ACTIVE LQFP PT 48 250 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 430FR2153
MSP430FR2153TPTR ACTIVE LQFP PT 48 1000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 430FR2153
MSP430FR2153TRHAR ACTIVE VQFN RHA 40 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 FR2153
MSP430FR2153TRHAT ACTIVE VQFN RHA 40 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 FR2153
MSP430FR2153TRSMR ACTIVE VQFN RSM 32 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 FR2153
MSP430FR2153TRSMT ACTIVE VQFN RSM 32 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 FR2153
Addendum-Page 1
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 2
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 22-Feb-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
MSP430FR2153TDBTR TSSOP DBT 38 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1
MSP430FR2153TPTR LQFP PT 48 1000 330.0 16.4 9.6 9.6 1.9 12.0 16.0 Q2
MSP430FR2153TRHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2
MSP430FR2153TRHAT VQFN RHA 40 250 180.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2
MSP430FR2153TRSMR VQFN RSM 32 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
MSP430FR2153TRSMT VQFN RSM 32 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2
Pack Materials-Page 1
Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1

Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MSP430FR2153TDBTR TSSOP DBT 38 2000 350.0 350.0 43.0
MSP430FR2153TPTR LQFP PT 48 1000 350.0 350.0 43.0
MSP430FR2153TRHAR VQFN RHA 40 2500 367.0 367.0 35.0
MSP430FR2153TRHAT VQFN RHA 40 250 210.0 185.0 35.0
MSP430FR2153TRSMR VQFN RSM 32 3000 367.0 367.0 35.0
MSP430FR2153TRSMT VQFN RSM 32 250 210.0 185.0 35.0
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
PACKAGE OUTLINE
DBT0038A SCALE 2.000
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
6.55 TYP SEATING

C PLANE
6.25
A
0.1 C
PIN 1 INDEX AREA
38 X 0.5
38
1
2X
9
9.75
9.65
NOTE 3
19 20
38 X 0.23
0.17
B 4.45 0.1 C A B 1.2 MAX
4.35
NOTE 4
0.25
GAGE PLANE
0.15
0.05
(0.15) TYP
SEE DETAIL A 0.75
0 -8 0.50
DETAIL A
A 20
TYPICAL
4220221/A 05/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
DBT0038A TSSOP - 1.2 mm max height
38 X (1.5)
SYMM
(R0.05) TYP
1
38
38 X (0.3)
38 X (0.5)
SYMM
19 20
(5.8)
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK METAL UNDER SOLDER MASK

METAL
OPENING SOLDER MASK OPENING
EXPOSED METAL EXPOSED METAL
0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND
NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
15.000
4220221/A 05/2020
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBT0038A TSSOP - 1.2 mm max height
38 X (1.5) SYMM
(R0.05) TYP
1
38
38 X (0.3)
38 X (0.5)
SYMM
19 20
(5.8)
SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220221/A 05/2020
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
MECHANICAL DATA
MTQF003A – OCTOBER 1994 – REVISED DECEMBER 1996
PT (S-PQFP-G48) PLASTIC QUAD FLATPACK
0,27
0,50 0,08 M
0,17
36 25
37 24
48 13
0,13 NOM
1 12
5,50 TYP
7,20
SQ
6,80 Gage Plane
9,20
SQ
8,80
0,25
1,45 0,05 MIN 0°– 7°
1,35
0,75
Seating Plane 0,45
1,60 MAX 0,10
4040052 / C 11/96
NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
D. This may also be a thermally enhanced plastic package with leads conected to the die pads.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1

GENERIC PACKAGE VIEW
RSM 32 VQFN - 1 mm max height
4 x 4, 0.4 mm pitch PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224982/A
www.ti.com
PACKAGE OUTLINE
RSM0032B SCALE 3.000
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
4.1 B
A 0.45
3.9
0.25
0.25
0.15
PIN 1 INDEX AREA DETAIL
OPTIONAL TERMINAL
4.1 TYPICAL
3.9
(0.1)
SIDE WALL DETAIL

OPTIONAL METAL THICKNESS
1 MAX C
SEATING PLANE
0.05
0.08 C
0.00 2.8 0.05
2X 2.8
(0.2) TYP
4X (0.45)
9 16
28X 0.4
8 SEE SIDE WALL
17 DETAIL
EXPOSED
THERMAL PAD
2X SYMM
33
2.8
24 0.25
1 32X
SEE TERMINAL 0.15
DETAIL 0.1 C A B
PIN 1 ID 32 25 0.05
SYMM
(OPTIONAL) 0.45
32X
0.25
4219108/B 08/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RSM0032B VQFN - 1 mm max height
( 2.8)
SYMM
32 25
32X (0.55)
1
32X (0.2) 24
( 0.2) TYP (1.15)

VIA
SYMM 33
(3.85)
28X (0.4)
8 17
(R0.05)
TYP
9 16
(1.15)
(3.85)
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:20X
0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND
METAL SOLDER MASK

EXPOSED METAL OPENING
EXPOSED METAL
SOLDER MASK METAL UNDER
OPENING SOLDER MASK
NON SOLDER MASK

DEFINED SOLDER MASK
(PREFERRED) DEFINED
SOLDER MASK DETAILS

4219108/B 08/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RSM0032B VQFN - 1 mm max height
(0.715)
4X ( 1.23)
32 25 (R0.05) TYP
32X (0.55)
1
32X (0.2) 24
(0.715)
SYMM 33
(3.85)
28X (0.4)
8 17
METAL
TYP 9 16
SYMM
(3.85)
SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 33:

77% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4219108/B 08/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party
intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages,
costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either
on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s
applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

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MSP430FR2355, MSP430FR2353, MSP430FR2155, MSP430FR2153

MSP430FR235x, MSP430FR215x Mixed-Signal Microcontrollers

2 Device Overview Copyright © 2018–2019, Texas Instruments Incorporated

Device Information (1)

Copyright © 2018–2019, Texas Instruments Incorporated Device Overview 3

1.4 Functional Block Diagrams

Figure 1-1. MSP430FR235x Functional Block Diagram

Figure 1-2 shows the MSP430FR215x functional block diagram.

Figure 1-2. MSP430FR215x Functional Block Diagram

Copyright © 2018–2019, Texas Instruments Incorporated Table of Contents 5

Changes from March 6, 2019 to December 10, 2019 Page

Changes from revision B to revision C

Changes from July 3, 2018 to March 5, 2019 Page

6 Revision History Copyright © 2018–2019, Texas Instruments Incorporated

Changes from revision A to revision B

Changes from June 20, 2018 to July 2, 2018 Page

• Added the tTB,cap parameter in Table 5-13, Timer_B ............................................................................ 45

Changes from initial release to revision A

Changes from May 11, 2018 to June 19, 2018 Page

• Changed the document status to PRODUCTION DATA ........................................................................ 1

Copyright © 2018–2019, Texas Instruments Incorporated Revision History 7

Table 3-1. Device Comparison (1) (2)

8 Device Comparison Copyright © 2018–2019, Texas Instruments Incorporated

3.1 Related Products

Copyright © 2018–2019, Texas Instruments Incorporated Device Comparison 9

4 Terminal Configuration and Functions

Figure 4-1. 48-Pin PT (LQFP) (Top View) – MSP430FR235x

10 Terminal Configuration and Functions Copyright © 2018–2019, Texas Instruments Incorporated

NOTE: Connect the exposed thermal pad to VSS.

Figure 4-2. 40-Pin RHA (VQFN) (Top View) – MSP430FR235x

Copyright © 2018–2019, Texas Instruments Incorporated Terminal Configuration and Functions 11

Figure 4-3. 38-Pin DBT (TSSOP) (Top View) – MSP430FR235x

12 Terminal Configuration and Functions Copyright © 2018–2019, Texas Instruments Incorporated

NOTE: Connect the exposed thermal pad to VSS.

Figure 4-4. 32-Pin RSM (VQFN) (Top View) – MSP430FR235x

Copyright © 2018–2019, Texas Instruments Incorporated Terminal Configuration and Functions 13

Figure 4-5. 48-Pin PT (LQFP) (Top View) – MSP430FR215x

14 Terminal Configuration and Functions Copyright © 2018–2019, Texas Instruments Incorporated

NOTE: Connect the exposed thermal pad to VSS.

Figure 4-6. 40-Pin RHA (VQFN) (Top View) – MSP430FR215x

Copyright © 2018–2019, Texas Instruments Incorporated Terminal Configuration and Functions 15

Figure 4-7. 38-Pin DBT (TSSOP) (Top View) – MSP430FR215x

16 Terminal Configuration and Functions Copyright © 2018–2019, Texas Instruments Incorporated

NOTE: Connect the exposed thermal pad to VSS.

Figure 4-8. 32-Pin RSM (VQFN) (Top View) – MSP430FR215x

Copyright © 2018–2019, Texas Instruments Incorporated Terminal Configuration and Functions 17

4.2 Pin Attributes

Table 4-1. Pin Attributes

Table 4-1. Pin Attributes (continued)

(7) Not applicable in RSM package.

Table 4-1. Pin Attributes (continued)

20 Terminal Configuration and Functions Copyright © 2018–2019, Texas Instruments Incorporated

Table 4-1. Pin Attributes (continued)

Copyright © 2018–2019, Texas Instruments Incorporated Terminal Configuration and Functions 21

4.3 Signal Descriptions

Table 4-2. Signal Descriptions

Table 4-2. Signal Descriptions (continued)