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A Gate Defined Quantum Dot On The Two-Dimensional Transition Metal Dichalcogenide Semiconductor Wse

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A gate defined quantum dot on the two-dimensional transition

metal dichalcogenide semiconductor WSe2

Xiang-Xiang Song,1,2 Di Liu,1,2 Vahid Mosallanejad,1,2 Jie You,1,2 Tian-Yi Han,1,2


Dian-Teng Chen,1 Hai-Ou Li,1,2 Gang Cao, 1,2 Ming Xiao,1,2 Guang-Can Guo,1,2
and Guo-Ping Guo1,2

1
Key Laboratory of Quantum Information, CAS, University of Science and Technology of China,
Hefei, Anhui 230026, China
2
Synergetic Innovation Center of Quantum Information & Quantum Physics, University of
Science and Technology of China, Hefei, Anhui 230026, China

ABSTRACT
Two-dimensional layered materials, such as transition metal dichalcogenides
(TMDCs), are promising materials for future electronics owing to their unique
electronic properties. With the presence of a band gap, atomically thin gate defined
quantum dots (QDs) can be achieved on TMDCs. Here, standard semiconductor
fabrication techniques are used to demonstrate quantum confined structures on WSe2
with tunnel barriers defined by electric fields, thereby eliminating the edge states
induced by etching steps, which commonly appear in gapless graphene QDs. Over 40
consecutive Coulomb diamonds with a charging energy of approximately 2 meV were
observed, showing the formation of a QD, which is consistent with the simulations.
The size of the QD could be tuned over a factor of 2 by changing the voltages applied
to the top gates. These results shed light on obtaining smaller quantum dots on
TMDCs with the same top gate geometry, compared to traditional GaAs/AlGaAs
heterostructure, for further researches.

*Correspondence and requests for materials should be addressed to G.P.G.


(gpguo@ustc.edu.cn)
I. INTRODUCTION
Two-dimensional layered materials, such as graphene or transition metal
dichalcogenides (TMDCs), are considered as promising materials for future
electronics owing to their unique electronic properties1-3. Compared with traditional
semiconducting materials, two-dimensional layered materials have the advantages of
their inherent flexibility, atomically thin geometry and dangling-bond-free interfaces,
making them easy to integrate with various substrates. Graphene has been studied in
high-speed electronic applications because of its ultrahigh mobility4. A variety of
electronic applications have been demonstrated using graphene5-7.
However, the absence of a band gap limits the performance of graphene-based
devices, typically insufficient current on-off ratios8. Consequently, significant effort
has been devoted to identifying alternative two-dimensional semiconductors. TMDCs
are one of the most promising materials among those studied as they have band gaps
ranging from 1 to 2 eV9, 10. A variety of devices made out of TMDCs have been
demonstrated, including field-effect transistors (FETs)11-17, heterostructure junctions18,
19
and photodetectors20, 21.
Meanwhile, from the quantum device aspect, especially for quantum dots (QDs),
monolayer graphene cannot be electrically confined to form QDs because of the lack
of a band gap. Plasma etching is widely used to shape graphene flakes to obtain QDs,
both single dots22, 23 and double dots24-26. However, the edge states and charge
inhomogeneities induced by etching change the properties of the graphene flakes,
limiting the performance of the nano-devices27, 28, especially the coherency of the
graphene QDs. With a band gap, TMDCs overcome the disadvantages associated with
forming graphene QDs. Similar to traditional semiconductor heterostructures, QDs
can be formed on atomically thin two-dimensional layered TMDC materials by
applying a gate voltage to tune the local band structure. Recently, due to strong
spin-orbital coupling, theoretical predictions using TMDC QDs as qubits have been
proposed29.
Semiconducting TMDCs consist of hexagonal layers of metal atoms (M)
sandwiched between two layers of chalcogen atoms (X), which can be written as MX2,
where M = Mo or W and X = S, Se or Te30, 31. As one of the TMDCs, WSe2 has a
direct band gap of 1.7 eV for a monolayer and an indirect band gap of 1.2 eV for a
bulk crystal9. Several studies have been performed, showing that the typical carrier
mobility of WSe2 is the range ~140–500 cm2/(V·s)11, 14, 32.
Here, we used standard semiconductor fabrication techniques to demonstrate a
quantum confined structure made of WSe2, one of the TMDCs, with tunnel barriers
defined by electric fields. Different from the common graphene etched QDs and
graphene-like etched MoS2 nanoribbons33, the WSe2 QDs were formed by applying a
voltage to the top gates to decrease the influence of the edge states. Over 40
consecutive Coulomb diamonds were observed, demonstrating the formation of QDs
that was predicted in our simulations. Furthermore, it is demonstrated that the size of
the QDs could be tuned over a factor of 2 by changing the voltage applied to the top
gates. Compared to traditional GaAs/AlGaAs heterostructure, for the same top gate
geometry and voltages, the smaller quantum dot can be formed in layered material
structure. These gate defined QDs in two-dimensional TMDCs open an avenue to
explore the electronic properties of TMDCs. Also, tunable TMDC QDs that are
isolated from the edge states could be used as spin or valley qubits in electron
manipulations in further research studies.

II. DEVICE FABRICATION


Similar to the graphene devices, the WSe2 flakes were produced by mechanically
cleaving a bulk WSe2 crystal and depositing it onto a highly doped silicon substrate
covered by 100 nm of SiO2. The silicon substrate was used as the back gate.
Few-layer flakes were selected using an optical microscope.
After depositing the WSe2 flake on the substrate, we located where the WSe2
flake precisely was and fabricated metal marks for further steps. The standard electron
beam lithography (EBL) process was used to form the pattern of source-drain
electrodes. We used E-beam evaporation of 10 nm Pd and 90 nm Au to fabricate the
source-drain contacts. Then, an atomic layer deposition (ALD) technique was used to
make a 40 nm thick insulating Al2O3 layer. Another EBL step followed by E-beam
evaporation was used to fabricate four split top gates. 5 nm Ti and 45 nm Au was
deposited to form the top gates. After the Al2O3 layer covering the source-drain
contacts was etched, the device was bonded to the chip carrier for the measurements.
Figure 1(a) shows a scanning electron microscope (SEM) image of the WSe2
device used in our experiments. The WSe2 flake had an area of approximately 2 μm×3
μm. The thickness of the flake was measured using an atomic force microscope
(AFM). Figure 1(b) shows that the thickness of the WSe2 flake was 4.5 nm,
corresponding to 7 layers34. Figure 1(c) shows a schematic cross-section of the device.
The heavily doped silicon substrate operated as the back gate, which was isolated
from the WSe2 by a 100 nm thick layer of SiO2. Depositing metal contacts on TMDCs
are a critical issue for the electronic applications of TMDCs. Several studies have
focused on reducing the Schottky barrier to form Ohmic contacts between the metal
contacts and TMDCs32, 35-37. Here, Pd was used as the interlayer between Au and
WSe2 to obtain Ohmic contacts, these are labeled as “source” and “drain” in Figure
1(c). On the Al2O3 insulating layer, four top gates were fabricated to form the QD,
these are labeled MG, LB, PG and RB. To obtain a better understanding of the
geometric design, we used a commercial finite element analysis simulation tool
(COMSOL) to calculate the potential profile in the WSe2 layer in the top gate
geometry. The potential profile of the structure used in the experiments (see Figure
1(a) and (c)) was modelled by solving the Poisson equation. As shown in Figure 1(d),
the voltage applied to the top gates changed the local potential and confined the
electrons. The closed contours indicate where the QD could exist. The experiments
were performed in a He3 refrigerator at a base temperature of 240 mK. The standard
Lock-in method was used to probe the electronic signals.

III. RESULTS AND DISCUSSION


First, a DC voltage was applied to the back gate to tune the Fermi energy of the
WSe2 device. As the back gate voltage (VBG) was swept the source-drain current was
measured. Figure 2(a) shows that a non-zero current appeared at a back gate voltage
of 36 V and increased when the back gate voltage was tuned to be more positive,
showing the characteristic behavior of an n-doped semiconductor. Because an
impurity potential could exist, which may modulate the local conduction band gap,
affecting the QDs, the applied back gate voltage was tuned to more positive to make
the device operate at a higher Fermi level in order to decrease the influence of the
disorder potential33. We measured the current as a function of the DC bias voltage at
different back gate voltages. As shown in Figure 2(b), changing the back gate voltage
from 41.5 V to 45.5 V, over 40 consecutive Coulomb diamonds were observed,
showing a QD formation. Here, all of the top gates had an applied DC voltage of −2 V
to tune the local Fermi level underneath the electrodes.
By zooming in the region highlighted with red dotted lines in Figure 2(b), the EC
of the WSe2 QDs could be measured. The charging energy EC remained almost
constant from VBG=43.1 V to VBG=44.1 V, as shown in Figure 2(c). The EC was
estimated to be approximately 2 meV. The lever arm of the back gate (αBG) was 0.020
eV/V. Figure 2(d) shows the current as a function of back gate voltage, obtained along
the red dashed line in Figure 2(c), known as Coulomb peaks.
Next, to investigate whether the QD was formed by the electric field applied to
the top gates, the voltage applied to the top gates was changed to tune the size of the
WSe2 QD. For simplicity, the same voltage was applied to all of the top gates. We
measured the Coulomb diamonds as a function of the back gate voltage, as described
above, at different top gate voltages. The EC for over 20 Coulomb diamonds was
measured from VBG=42 to 45 V for each top gate voltage. Statistic distributions of the
EC are shown in Figure 3(a)–(f). Here, the top gate voltage was tuned from −4 V to 1
V. We found that when the top gate voltage (VTG) became more negative, larger EC
appeared, indicating that the QDs had become smaller. When the VTG was changed
more negative to −2 V, larger EC (above 2.5 meV) was observed, suggesting the size
of the QD decreased. The number of Coulomb diamonds, which had an EC larger than
2.5 meV, increased if we continued to tune VTG to more negative. The average EC was
measured as a function of VTG, shown as the black squares in Figure 3(g). EC
increased when VTG was changed from 1 V to −4 V. Using EC=e2/(8ε0εrr) 38, where εr
is the relative permittivity of WSe2 and r is the radius of the QD, it was estimated that
the QD radius changed from 275 nm to 150 nm, as shown with the blue circles in
Figure 3(g). The area of each QD (~r2) decreased by over a factor of 2 when VTG
became more negative, suggesting that the top gates tuned the confinement potential
that formed the QD. Note that, because the estimated dot size is comparable to the
thickness of the insulating SiO2 layer, the isolated disk approximation should change
to a parallel plate approximation. Thus, the result of the estimated QD size should be
considered as an upper limit, which is comparable to our geometric design.
We also investigated the change in the dot size qualitatively, using COMSOL
simulations. Figure 3(h)–(j) show the potential profiles of the areas where closed the
contours existed in Figure 1(d). By changing the voltages applied to the top gates
from 0 V to −4 V, we plotted the potential profiles at different VTG in the same range.
The confinement potential became lower and the dot size decreased when VTG was
tuned to be more negative, which is consistent with the experimental results. In
addition, there were some variations in the size of Coulomb diamonds, as shown in
Figure 3(a)–(f). As the VBG was tuned monotonically, which can be understood as
changing the Fermi level, the EC should also change monotonically if the energy band
varies smoothly. The variations in the EC suggest that fluctuations may exist in the
energy band which may be caused by local impurities. Such local impurities modified
the band structure of the flake, resulting in variations in EC. Similar results were
observed in Ref. [33]. The influence of the local impurity potential had not been
excluded, although the devices worked at a relatively high VBG.
Furthermore, to demonstrate the direct influence of the top gate, the plunger gate
was tuned to obtain Coulomb diamonds. It is shown in Figure 4 that when the plunger
gate voltage was changed from −1.7 V to −2.2 V, Coulomb diamonds were observed.
Note that the plunger gate still had an influence on the confinement potential, as EC
became larger when the voltage of the plunger gate was tuned to be more negative.
This result is consistent with the result shown in Figure 3(g). We estimated the lever
arm of the plunger gate (αPG) to be about 0.048 eV/V here. The difference between
αPG 𝜀 d
αBG and αPG can be calculated using: = 𝜀PG × dBG , where εBG(PG) is the relative
αBG BG PG

dielectric constant of the back gate (plunger gate) and dBG(PG) is the distance between
the dot and the back gate (plunger gate). Using the αBG value obtained above, the
calculated αPG should be 0.094 eV/V, which is about 2 times larger than the αPG
measured here. This can be understood because the relative dielectric constant of
Al2O3 may be smaller, caused by the quality of the growth.
Here, we found some evidence of overlapped Coulomb diamonds which suggests
double dots may be formed, shown by the black arrows in Figure 4. Since the edge
states were absent in our devices, we believed that there are two possibilities that may
cause the formation of the double dots. One is the aggressive gate voltage applied to
the top gates, which changed the electron distribution. The other is disorders in the
crystals, which trap impurities, affecting the confinement potential. These disorders
may also contribute to another conductance channel, which results in the non-zero
Coulomb blockade current observed in Figure 2(d). However, different from the edge
states, this impurity problem could be solved in principle, when the crystal-growth
technique improves.
Next, the source and drain contacts in the devices will be discussed. Figure 5(a)
shows a schematic of two Coulomb diamonds. Using the constant interaction model,
the slope of the two sides can be calculated as |e|Cg/CS and −|e|Cg/(C−CS)
respectively39, as shown in Figure 5(a). Here, CS(D) is the capacitance between the
source (drain) and the dot, Cg is the capacitance between the gate and the dot, and C is
the total capacitance: C=CS+Cg+CD. In our experiments, the Coulomb diamonds were
always asymmetric. Moreover, when the top gates voltages were tuned to a different
region, the Coulomb diamonds exhibited different configurations, as shown in Figure
5(b) and (c). In Figure 5(b), the Coulomb diamonds have one side almost parallel to
the y-axis, indicating that CS was almost zero. However, in Figure 5(c), the side of the
Coulomb diamonds which parallels to the y-axis changed to the other side, suggesting
CS became larger as the domination of the total capacitance C in this configuration
(C=CS). The change in CS suggests that the location of the WSe2 dot varied under the
gate potential. However, due to the limitation of the accuracy of estimation from
diagram, it is hard to get quantitative estimation such as the exact location of the dot.
Note that CS is much larger than Cg in the situation in Figure 5(c), as C=CS. We can
estimate the source and drain contacts of our device were not purely Ohmic. Although
Schottky barriers existed on the device, the quantum confinement is still valid. In
order to achieve further manipulation of the electrons in the QDs on TMDCs, more
studies are needed to improve the contact between the TMDCs and metal electrodes.
Finally, we want to discuss the difference between our layered material gate
defined quantum dot and traditional GaAs/AlGaAs heterostructure quantum dot.
Because of the existence of a layer of donors, the back gate voltage VBG is no longer
needed here to accumulate carriers. Using COMSOL, we can simulate the potential
profile at the interface of AlGaAs and GaAs, where 2DEG (2 dimensional electron
gas) is formed. As shown in Figure 6, the potential profile for GaAs/AlGaAs
heterostructure with the same top gate geometry and VTG is calculated. Compared
Figure 6 to Figure 1(d), the closed contours disappear, which indicates the quantum
dot is no longer formed in this case. Moreover, the potential in the area between
barriers (LB, RB) and plunger gate (PG) is in the same range as in the area
surrounded by the top gates. This result is different from Figure 1(d), where the
potential is pulled up in the area between barriers (LB, RB) and plunger gate (PG),
indicating that the electrons are depleted underneath the gates (LB, RB, PG). While in
the case for Figure 6, electrons still can tunnel through the channel between the gates
(LB, RB, PG). This means the distance between the top gates needs to be decreased in
order to confine a quantum dot when applying the same VTG for the GaAs/AlGaAs
heterostructure, which increases the difficulty in fabrication steps. Alternatively, for
the same top gate geometry and VTG, the smaller quantum dot with lager energy of
excited states could be formed in layered material structure, which is essential for
further studies. Moreover, changing the Al2O3 with another layered material h-BN, we
can decrease the thickness of insulator layer further to even one layer of atoms,
allowing a more aggressive influence of top gates. While for GaAs/AlGaAs
heterostructure, obtaining 2DEG forbids decreasing the vertical distance between the
top gates and electrons. This difference allows fabricating atomic-scale and even
flexible quantum dots to have a better control of electrons inside.

IV. CONCLUSIONS
In summary, standard semiconductor fabrication techniques were used to obtain a
gate defined WSe2 QD with tunnel barriers defined by electric fields. Over 40
consecutive Coulomb diamonds with an EC of approximately 2 meV were observed,
showing the confinement potential that was predicted by our simulations. By tuning
the gate voltage applied to both of the top gates and the back gate, we observed the
statistic distribution of the EC varied, indicating that the size of the dots changed by
over a factor of 2. For the same top gate geometry and VTG, the smaller quantum dot
can be formed in layered material structure, compared to traditional GaAs/AlGaAs
heterostructure, where quantum dots may even vanish for our top gates design. These
gate defined QDs in two-dimensional TMDCs open an avenue to explore the
electronic properties of TMDCs. Also, tunable TMDC QDs, which are isolated from
the edge states, shed light on quantum nano-devices in TMDCs for further research
studies.

ACKNOWLEDGEMENTS
This work was supported by the National Fundamental Research Program (Grant
No. 2011CBA00200), the National Natural Science Foundation (Grand Nos.
11222438, 11174267, 61306150, 11304301 and 91121014) and the Chinese Academy
of Sciences.

REFERENCES
1. A. K. Geim and K. S. Novoselov, Nature Materials, 2007, 6, 183-191.
2. G. Fiori, F. Bonaccorso, G. Iannaccone, T. Palacios, D. Neumaier, A.
Seabaugh, S. K. Banerjee and L. Colombo, Nature Nanotechnology, 2014, 9,
768-779.
3. A. C. Ferrari, F. Bonaccorso, V. Fal'ko, K. S. Novoselov, S. Roche, P. Boggild,
S. Borini, F. H. L. Koppens, V. Palermo, N. Pugno, J. A. Garrido, R. Sordan, A.
Bianco, L. Ballerini, M. Prato, E. Lidorikis, J. Kivioja, C. Marinelli, T.
Ryhanen, A. Morpurgo, J. N. Coleman, V. Nicolosi, L. Colombo, A. Fert, M.
Garcia-Hernandez, A. Bachtold, G. F. Schneider, F. Guinea, C. Dekker, M.
Barbone, Z. Sun, C. Galiotis, A. N. Grigorenko, G. Konstantatos, A. Kis, M.
Katsnelson, L. Vandersypen, A. Loiseau, V. Morandi, D. Neumaier, E. Treossi,
V. Pellegrini, M. Polini, A. Tredicucci, G. M. Williams, B. Hee Hong, J.-H.
Ahn, J. Min Kim, H. Zirath, B. J. van Wees, H. van der Zant, L. Occhipinti, A.
Di Matteo, I. A. Kinloch, T. Seyller, E. Quesnel, X. Feng, K. Teo, N.
Rupesinghe, P. Hakonen, S. R. T. Neil, Q. Tannock, T. Lofwander and J.
Kinaret, Nanoscale, 2015, 7, 4598-4810.
4. K. I. Bolotin, K. J. Sikes, Z. Jiang, M. Klima, G. Fudenberg, J. Hone, P. Kim
and H. L. Stormer, Solid State Communications, 2008, 146, 351-355.
5. F. Schwierz, Nature Nanotechnology, 2010, 5, 487-496.
6. Z. Guo, R. Dong, P. S. Chakraborty, N. Lourenco, J. Palmer, Y. Hu, M. Ruan, J.
Hankinson, J. Kunc, J. D. Cressler, C. Berger and W. A. de Heer, Nano Letters,
2013, 13, 942-947.
7. L. A. Ponomarenko, F. Schedin, M. I. Katsnelson, R. Yang, E. W. Hill, K. S.
Novoselov and A. K. Geim, Science, 2008, 320, 356-358.
8. M. C. Lemme, T. J. Echtermeyer, M. Baus and H. Kurz, Ieee Electron Device
Letters, 2007, 28, 282-284.
9. Q. H. Wang, K. Kalantar-Zadeh, A. Kis, J. N. Coleman and M. S. Strano,
Nature Nanotechnology, 2012, 7, 699-712.
10. M. Xu, T. Liang, M. Shi and H. Chen, Chemical Reviews, 2013, 113,
3766-3798.
11. V. Podzorov, M. E. Gershenson, C. Kloc, R. Zeis and E. Bucher, Applied
Physics Letters, 2004, 84, 3301-3303.
12. B. Radisavljevic, A. Radenovic, J. Brivio, V. Giacometti and A. Kis, Nature
Nanotechnology, 2011, 6, 147-150.
13. S. Kim, A. Konar, W.-S. Hwang, J. H. Lee, J. Lee, J. Yang, C. Jung, H. Kim,
J.-B. Yoo, J.-Y. Choi, Y. W. Jin, S. Y. Lee, D. Jena, W. Choi and K. Kim,
Nature Communications, 2012, 3.
14. H. Fang, S. Chuang, T. C. Chang, K. Takei, T. Takahashi and A. Javey, Nano
Letters, 2012, 12, 3788-3792.
15. M. M. Perera, M.-W. Lin, H.-J. Chuang, B. P. Chamlagain, C. Wang, X. Tan,
M. M.-C. Cheng, D. Tomanek and Z. Zhou, ACS Nano, 2013, 7, 4449-4458.
16. W. Bao, X. Cai, D. Kim, K. Sridhara and M. S. Fuhrer, Applied Physics
Letters, 2013, 102.
17. R. Cheng, S. Jiang, Y. Chen, Y. Liu, N. Weiss, H.-C. Cheng, H. Wu, Y. Huang
and X. Duan, Nature Communications, 2014, 5.
18. T. Georgiou, R. Jalil, B. D. Belle, L. Britnell, R. V. Gorbachev, S. V. Morozov,
Y.-J. Kim, A. Gholinia, S. J. Haigh, O. Makarovsky, L. Eaves, L. A.
Ponomarenko, A. K. Geim, K. S. Novoselov and A. Mishchenko, Nature
Nanotechnology, 2013, 8, 100-103.
19. M. S. Choi, G.-H. Lee, Y.-J. Yu, D.-Y. Lee, S. H. Lee, P. Kim, J. Hone and W.
J. Yoo, Nature Communications, 2013, 4.
20. W. Choi, M. Y. Cho, A. Konar, J. H. Lee, G.-B. Cha, S. C. Hong, S. Kim, J.
Kim, D. Jena, J. Joo and S. Kim, Advanced Materials, 2012, 24, 5832-5836.
21. O. Lopez-Sanchez, D. Lembke, M. Kayci, A. Radenovic and A. Kis, Nature
Nanotechnology, 2013, 8, 497-501.
22. C. Stampfer, E. Schurtenberger, F. Molitor, J. Guettinger, T. Ihn and K. Ensslin,
Nano Letters, 2008, 8, 2378-2383.
23. L.-J. Wang, G. Cao, T. Tu, H.-O. Li, C. Zhou, X.-J. Hao, Z. Su, G.-C. Guo,
H.-W. Jiang and G.-P. Guo, Applied Physics Letters, 2010, 97.
24. X. L. Liu, D. Hug and L. M. K. Vandersypen, Nano Letters, 2010, 10,
1623-1627.
25. S. Moriyama, D. Tsuya, E. Watanabe, S. Uji, M. Shimizu, T. Mori, T.
Yamaguchi and K. Ishibashi, Nano Letters, 2009, 9, 2891-2896.
26. L.-J. Wang, H.-O. Li, T. Tu, G. Cao, C. Zhou, X.-J. Hao, Z. Su, M. Xiao, G.-C.
Guo, A. M. Chang and G.-P. Guo, Applied Physics Letters, 2012, 100.
27. X.-X. Song, H.-O. Li, J. You, T.-Y. Han, G. Cao, T. Tu, M. Xiao, G.-C. Guo,
H.-W. Jiang and G.-P. Guo, Scientific Reports, 2015, 5.
28. K. Todd, H.-T. Chou, S. Amasha and D. Goldhaber-Gordon, Nano Letters,
2009, 9, 416-421.
29. A. Kormanyos, V. Zolyomi, N. D. Drummond and G. Burkard, Physical
Review X, 2014, 4.
30. J. A. Wilson and A. D. Yoffe, Advances in Physics, 1969, 18, 193-&.
31. Mattheis.Lf, Physical Review B, 1973, 8, 3719-3740.
32. W. Liu, J. Kang, D. Sarkar, Y. Khatami, D. Jena and K. Banerjee, Nano Letters,
2013, 13, 1983-1990.
33. Y. Li and N. Mason, Preprint at http://arxiv.org/abs/1312.3939(2013).
34. R. Ganatra and Q. Zhang, ACS Nano, 2014, 8, 4074-4099.
35. S. Das, H.-Y. Chen, A. V. Penumatcha and J. Appenzeller, Nano Letters, 2013,
13, 100-105.
36. H. Liu, M. Si, Y. Deng, A. T. Neal, Y. Du, S. Najmaei, P. M. Ajayan, J. Lou
and P. D. Ye, ACS Nano, 2014, 8, 1031-1038.
37. J. Kang, W. Liu, D. Sarkar, D. Jena and K. Banerjee, Physical Review X, 2014,
4.
38. L. P. Kouwenhoven, P. L. Mceuen, S. Tarucha, R. M. Westervelt, and N. S.
Wingreen, Kluwer Series, E345, Proceedings of the NATO Advanced Study
Institute on Mesoscopic Electron Transport, 1997, 105-214.
39. R. Hanson, L. P. Kouwenhoven, J. R. Petta, S. Tarucha and L. M. K.
Vandersypen, Reviews of Modern Physics, 2007, 79, 1217-1265.
Figures:

FIG. 1. (a) SEM image of the WSe2 QD studied in this work. The WSe2 flake is
highlighted by the white dotted line. The four top gates are labeled as MG, LB, PG
and RB. The white bar has a length of 5 μm. (b) Thickness profile of the WSe2 flake
(4.5-nm thick) measured with an AFM. (c) Schematic cross-section of the device. The
few-layer WSe2 was deposited on a heavily doped silicon substrate covered with
100-nm-thick SiO2. The WSe2 flake was separated from the four top gates (Ti/Au) by
40 nm of ALD-grown Al2O3. Two metal gates (Pd/Au) were connected to the flake
used as the source-drain contacts. (d) COMSOL simulations on the potential profile in
the WSe2 layer for the gate pattern of the device shown in (a). Here VMG=VLB=VPG
=VRB=−2 V and VBG=43 V. The closed contours indicate where the QD could exist.
FIG. 2. (a) Source-drain current flow through the WSe2 device as a function of back
gate voltage (VBG), showing the characteristic behavior of an n-doped semiconductor.
(b) Over 40 consecutive Coulomb diamonds were measured from VBG=41.5 V to 45.5
V. All of the top gates had an applied DC voltage of −2 V. (c) Zoom in of the region
highlighted by the red dotted lines in (b), showing that the EC was approximately 2
meV. (d) A series of Coulomb peaks measured along the red dashed line in (c).
FIG. 3. (a)–(f) Statistic distributions of the EC, measured from over 20 Coulomb
diamonds in the range from VBG=42 V to 45 V at different top gate voltages (VTGs). (g)
Average EC (black squares) and calculated quantum radii (blue circles) as a function
of VTG. (h)–(j) Potential profile of the area where the closed contours were in Figure
1(d) at different VTG values, showing the change in the dot size. Here VBG=43 V.
FIG. 4. Coulomb diamonds measured as a function of the gate voltage applied to the
plunger gate, from VPG=−2.2 V to −1.7 V. The EC changed with VPG. Here
VMG=VLB=VRB=−2 V and VBG=44.5 V. The black arrows indicate evidence that
double dots may have formed.
FIG. 5. (a) Schematic of two consecutive Coulomb diamonds. The slopes of the two
sides are |e|Cg/CS and −|e|Cg/(C−CS). (b) Coulomb diamonds obtained from
VPG=−1.75 V to −1.5 V. Here, VRB=−2 V, VMG=VLB=−1.5 V and VBG=42.5 V. (c)
Different configurations of the Coulomb diamonds obtained from VPG=−2.5 V to
−2.35 V. Here VRB=−2.15 V, VMG=VLB=−2.25 V and VBG=43 V.
FIG. 6. COMSOL simulations on the potential profile for GaAs/AlGaAs
heterostructure, with the same VTG and top gate geometry of the device shown in
Figure 1(d), is calculated. Here VMG=VLB=VPG =VRB=−2 V. The closed contours
shown in Figure 1(d) disappear, indicating the QD no longer exists in this case. In the
simulation, the distance between the top gates and 2DEG is about 95 nm, including a
10 nm of GaAs cap and an 85 nm of AlGaAs.

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