AO4441 P-Channel Enhancement Mode Field Effect Transistor: Features General Description
AO4441 P-Channel Enhancement Mode Field Effect Transistor: Features General Description
AO4441 P-Channel Enhancement Mode Field Effect Transistor: Features General Description
D
SOIC-8
Top View
S D
S D
S D G
G D S
Thermal Characteristics
Parameter Symbol Typ Max Units
Maximum Junction-to-Ambient A t ≤ 10s 24 40 °C/W
RθJA
Maximum Junction-to-Ambient A Steady-State 54 75 °C/W
Maximum Junction-to-Lead C Steady-State RθJL 21 30 °C/W
2
A: The value of R θJA is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any ien
given
application
application
depends
dependson on
thethe
user's
user's
specific
specific
board
board
design.
design.
TheThe
current
current
rating
rating
is based
is based
on on
thethe
t ≤ 10s
t ≤ 10s
thermal
thermal
resistance
resistance
rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The
SOA curve provides a single pulse rating.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE Rev 1: Sept 2005
20 10
6
-ID (A)
-ID(A)
10
-3.5V
4
125°C
5
VGS=-3.0V 2
25°C
0
0
0 1 2 3 4 5
1 1.5 2 2.5 3 3.5 4
-VDS (Volts)
-VGS(Volts)
Fig 1: On-Region Characteristics
Figure 2: Transfer Characteristics
110 2
VGS=-4.5V
Normalized On-Resistance
1.8 VGS=-10V
100 ID=-4A
1.6
RDS(ON) (mΩ)
1.4 VGS=-4.5V
90
ID=-3A
ID=-3A
1.2
80 VGS=-10V
1
0.8
70 0 25 50 75 100 125 150 175
0 2 4 6 8 10
Temperature (°C)
-ID (A) Figure 4: On-Resistance vs. Junction
Figure 3: On-Resistance vs. Drain Current and Temperature
Gate Voltage
200 1.0E+01
ID=-4A
180 1.0E+00
140 1.0E-02
-IS (A)
120
1.0E-03
100
1.0E-04
25°C
80 25°C
1.0E-05
60
2 4 6 8 10 1.0E-06
0.0 0.2 0.4 0.6 0.8 1.0
-VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage -VSD (Volts)
Figure 6: Body-Diode Characteristics
10 1500
VDS=-30V
ID=-4A
8
Ciss
Capacitance (pF)
1000
-VGS (Volts)
4
500
2 Coss Crss
0
0
0 10 20
0 10 20 30 40 50 60
-Qg (nC)
-VDS (Volts)
Figure 7: Gate-Charge Characteristics
Figure 8: Capacitance Characteristics
100.0
40
TJ(Max)=150°C, TA=25°C TJ(Max)=150°C
TA=25°C
RDS(ON) 30
10.0 limited 100µs 10µs
-ID (Amps)
Power (W)
1ms
20
10ms
1.0 0.1s
1s 10
10s DC
0.1 0
0.001 0.01 0.1 1 10 100 1000
0.1 1 10 100
-VDS (Volts) Pulse Width (s)
Figure 9: Maximum Forward Biased Safe Figure 10: Single Pulse Power Rating Junction-to-
Operating Area (Note E) Ambient (Note E)
10
D=Ton/T In descending order
TJ,PK=TA+PDM.ZθJA.RθJA D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
ZθJA Normalized Transient
RθJA=40°C/W
Thermal Resistance
PD
0.1
Ton
T
Single Pulse
0.01
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance