Product Summary General Description: 30V N-Channel MOSFET
Product Summary General Description: 30V N-Channel MOSFET
Product Summary General Description: 30V N-Channel MOSFET
SOIC-8
G G
S
S S
S
Thermal Characteristics
Parameter Symbol Typ Max Units
Maximum Junction-to-Ambient A t ≤ 10s 31 40 °C/W
AD RθJA
Maximum Junction-to-Ambient Steady-State 59 75 °C/W
Maximum Junction-to-Lead C Steady-State RθJL 16 24 °C/W
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Ratings are based on low frequency and duty cycles to keep initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g.
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
70 30
VDS= 5V
7V
60 25
10V
50 4.5V
20
40
ID (A)
ID(A)
15
30 4V 125°C
10
20 25°C
VGS= 3V
10 5
2.5V
0 0
0 1 2 3 4 5 0 1 2 3 4 5
VDS (Volts) VGS(Volts)
Figure 1: On-Region Characteristics(Note E) Figure 2: Transfer Characteristics(Note E)
40 2.0
35 1.8
Normalized On-Resistance
30 1.6
VGS=4.5V
RDS(ON) (mΩ )
VGS=4.5V
25 1.4 ID=8A
20 1.2 VGS=10V
ID=9A
15 1.0
VGS=10V
10 0.8
5 0.6
0 5 10 15 20 25 0 25 50 75 100 125 150 175
ID (A) Temperature (°C)
Figure 3: On-Resistance vs. Drain Current and Figure 4: On-Resistance vs. Junction
Gate Voltage(Note E) Temperature(Note E)
70 1E+01
ID=9A
60 1E+00
50 1E-01
RDS(ON) (mΩ )
125°C
IS (A)
40 1E-02
25°C
125°C
30 1E-03
25°C
20
1E-04
10
1E-05
2 3 4 5 6 7 8 9 10
VGS (Volts) 0.0 0.2 0.4 0.6 0.8 1.0
Figure 5: On-Resistance vs. Gate-Source VSD (Volts)
Voltage(Note E) Figure 6: Body-Diode Characteristics(Note E)
10 800
8 VDS=15V
ID=9A 600
Capacitance (pF)
Ciss
VGS (Volts)
6
400
4
200 Coss
2
Crss
0 0
0 2 4 6 8 10 0 5 10 15 20 25 30
Qg (nC) VDS (Volts)
Figure 7: Gate-Charge Characteristics Figure 8: Capacitance Characteristics
70 1000
RDS(ON) limited
ID(A), Peak Avalanche Current
60 TA=25°C
100
10µs
TA=25°C
50
ID (Amps)
10 100µs
40
TA=150°C TA=100°C 1ms
TA=150°C 1 10ms
30
100ms
20 TA=125°C TJ(Max)=150°C
0.1 10s
TA=25°C
10 DC
0.01
0 0.1 1 10 100
0.000001 0.00001 0.0001 0.001 VDS (Volts)
Time in avalanche, tA (s)
Figure 10: Maximum Forward Biased
Figure 9: Single Pulse Avalanche capability Safe Operating Area (Note F)
(Note C)
1000
TJ(Max)=150°C
TA=25°C
100
Power (W)
10
1
0.00001 0.001 0.1 10 1000
Pulse Width (s)
Figure 11: Single Pulse Power Rating Junction-to-Ambient (Note F)
10
D=Ton/T In descending order
TJ,PK=TA+PDM.ZθJA.RθJA D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
RθJA=75°C/W
Zθ JA Normalized Transient
1
Thermal Resistance
0.1
PD
0.01
Ton
Single Pulse T
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 12: Normalized Maximum Transient Thermal Impedance (Note F)
DUT -
Vgs
Ig
Charge
Resistive Switching Test Circuit & Waveforms
RL
Vds
Vds
90%
DUT
+ Vdd
Vgs VDC
Rg - 10%
t on t off
Id Vds
Vgs + Vdd I AR
Vgs VDC
Rg - Id
DUT
Vgs Vgs
Vds + Q rr = - Idt
DUT
Vgs
t rr
Vds - L Isd IF
Isd dI/dt
+ Vdd I RM
Vgs VDC
Vdd
Ig
- Vds