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RD3G01BAT

Pch -40V -15A Power MOSFET Datasheet

l Outline
VDSS -40V
RDS(on)(Max.) 39mΩ DPAK

ID ±15A TO-252

PD 25W

l Inner circuit
l Features
1) Low on - resistance
2) Fast switching speed
3) Drive circuits can be simple
4) Parallel use is easy
5) Pb-free plating ; RoHS compliant

l Packaging specifications
Packing Embossed
Tape
Reel size (mm) 330
l Application Type Tape width (mm) 16
Switching Quantity (pcs) 2500
Taping code TL1
Marking RD3G01BAT
l Absolute maximum ratings (Ta = 25°C ,unless otherwise specified)
Parameter Symbol Value Unit
Drain - Source voltage VDSS -40 V
Continuous drain current ID*1 ±15 A
Pulsed drain current IDP*2 ±30 A
Gate - Source voltage VGSS ±20 V
Avalanche current, single pulse IAS*3 -15 A
Avalanche energy, single pulse EAS*3 18 mJ
Power dissipation PD*1 25 W
Junction temperature Tj 150 ℃
Operating junction and storage temperature range Tstg -55 to +150 ℃

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© 2020 ROHM Co., Ltd. All rights reserved. 1/11 20201030 - Rev.002
RD3G01BAT Datasheet

l Thermal resistance
Values
Parameter Symbol Unit
Min. Typ. Max.
Thermal resistance, junction - case RthJC*1 - - 4.9 ℃/W

l Electrical characteristics (T a = 25°C)


Values
Parameter Symbol Conditions Unit
Min. Typ. Max.
Drain - Source breakdown V(BR)DSS VGS = 0V, ID = -1mA -40 - - V
voltage

Breakdown voltage ΔV(BR)DSS ID = -1mA


temperature coefficient - -22 - mV/℃
ΔTj referenced to 25℃
Zero gate voltage IDSS VDS = -40V, VGS = 0V
drain current - - -1 μA

Gate - Source leakage current IGSS VGS = ±20V, VDS = 0V - - ±100 nA


Gate threshold voltage VGS(th) VDS = VGS, ID = -1mA -1.0 - -2.5 V
Gate threshold voltage ΔVGS(th) ID = -1mA
temperature coefficient - 3.7 - mV/℃
ΔTj referenced to 25℃
Static drain - source VGS = -10V, ID = -15A - 31 39
RDS(on)*4 mΩ
on - state resistance VGS = -4.5V, ID = -7.5A - 38 49
Gate resistance RG f = 1MHz, open drain - 12 - Ω
Forward Transfer |Yfs| *4 VDS = -5V, ID = -7.5A 7.5 - - S
Admittance

*1 Tc=25℃, Limited only by maximum temperature allowed.


*2 Pw ≤ 10μs, Duty cycle ≤ 1%
*3 L ⋍ 0.1mH, V DD = -20V, RG = 25Ω, Starting Tj = 25℃ Fig.3-1,3-2
*4 Pulsed

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© 2020 ROHM Co., Ltd. All rights reserved. 2/11 20201030 - Rev.002
RD3G01BAT Datasheet

l Electrical characteristics (Ta = 25°C)


Values
Parameter Symbol Conditions Unit
Min. Typ. Max.
Input capacitance Ciss VGS = 0V - 1030 -
Output capacitance Coss VDS = -20V - 105 - pF
Reverse transfer capacitance Crss f = 1MHz - 80 -
Turn - on delay time td(on)*4 VDD ⋍ -20V,VGS = -10V - 9.2 -
Rise time tr*4 ID = -7.5A - 38 -
ns
Turn - off delay time td(off)*4 RL ⋍ 2.6Ω - 67 -
Fall time tf*4 RG = 10Ω - 34 -

l Gate charge characteristics (Ta = 25°C)


Values
Parameter Symbol Conditions Unit
Min. Typ. Max.
V GS = -10V - 19.3 -
Total gate charge Qg*4
VDD ⋍ -20V - 9.5 -
nC
Gate - Source charge Qgs*4 ID = -15A V GS = -4.5V - 3.0 -
Gate - Drain charge Qgd*4 - 3.8 -

l Body diode electrical characteristics (Source-Drain) (Ta = 25°C)


Values
Parameter Symbol Conditions Unit
Min. Typ. Max.
Continuous forward current IS*1 - - -15 A
Ta = 25℃
Pulse forward current ISP*2 - - -30 A
Forward voltage VSD*4 VGS = 0V, IS = -15A - - -1.2 V
Reverse recovery time trr*4 IS = -15A, VGS=0V - 26 - ns
Reverse recovery charge Qrr*4 di/dt = 100A/μs - 24 - nC

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© 2020 ROHM Co., Ltd. All rights reserved. 3/11 20201030 - Rev.002
RD3G01BAT Datasheet

l Electrical characteristic curves

Fig.1 Power Dissipation Derating Curve Fig.2 Maximum Safe Operating Area

Fig.3 Normalized Transient Thermal Fig.4 Single Pulse Maximum Power


Resistance vs. Pulse Width Dissipation

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© 2020 ROHM Co., Ltd. All rights reserved. 4/11 20201030 - Rev.002
RD3G01BAT Datasheet

l Electrical characteristic curves

Fig.5 Typical Output Characteristics(I) Fig.6 Typical Output Characteristics(II)

Fig.7 Breakdown Voltage vs.


Junction Temperature

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© 2020 ROHM Co., Ltd. All rights reserved. 5/11 20201030 - Rev.002
RD3G01BAT Datasheet

l Electrical characteristic curves

Fig.8 Typical Transfer Characteristics Fig.9 Gate Threshold Voltage vs.


Junction Temperature

Fig.10 Forward Transfer Admittance vs.


Drain Current

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© 2020 ROHM Co., Ltd. All rights reserved. 6/11 20201030 - Rev.002
RD3G01BAT Datasheet

l Electrical characteristic curves

Fig.11 Drain Current Derating Curve Fig.12 Static Drain - Source On - State
Resistance vs. Gate Source Voltage

Fig.13 Static Drain - Source On - State


Resistance vs. Junction Temperature

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© 2020 ROHM Co., Ltd. All rights reserved. 7/11 20201030 - Rev.002
RD3G01BAT Datasheet

l Electrical characteristic curves

Fig.14 Static Drain - Source On - State Fig.15 Static Drain - Source On - State
Resistance vs. Drain Current(I) Resistance vs. Drain Current(II)

Fig.16 Static Drain - Source On - State


Resistance vs. Drain Current(III)

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© 2020 ROHM Co., Ltd. All rights reserved. 8/11 20201030 - Rev.002
RD3G01BAT Datasheet

l Electrical characteristic curves

Fig.17 Typical Capacitances vs. Fig.18 Switching Characteristics


Drain - Source Voltage

Fig.19 Typical Gate Charge Fig.20 Source Current vs.


Source Drain Voltage

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© 2020 ROHM Co., Ltd. All rights reserved. 9/11 20201030 - Rev.002
RD3G01BAT Datasheet

l Measurement circuits

Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms

Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform

Fig.3-1 Avalanche Measurement Circuit Fig.3-2 Avalanche Waveform

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© 2020 ROHM Co., Ltd. All rights reserved. 10/11 20201030 - Rev.002
RD3G01BAT Datasheet

l Dimensions

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© 2020 ROHM Co., Ltd. All rights reserved. 11/11 20201030 - Rev.002
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
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(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ

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[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

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H2S, NH3, SO2, and NO2
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[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
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Precaution for Mounting / Circuit board design


1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
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incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic


This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation


1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
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Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Datasheet

General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.

Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.

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