IPC-JPCA-4104(L)

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ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
IPC/JPCA-4104
Specification for High

Density Interconnect (HDI)
and Microvia Materials
IPC/JPCA-4104
May 1999 A standard developed by IPC and JPCA
2215 Sanders Road, Northbrook, IL 60062-6135

Tel. 847.509.9700 Fax 847.509.9798
www.ipc.org
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IPC/JPCA-4104
ELECTRONICS INDUSTRIES ®
Specification for High

Density Interconnect (HDI)
and Microvia Materials
Developed by the Microvia/High Density Interconnect Materials

Subcommittee (D-42) of the High Density Interconnect (HDI)
Committee (D-40) of IPC and the Build-Up PWB Committee
of JPCA
May 19, 1999
Users of this standard are encouraged to participate in the

development of future revisions.
Contact:
IPC JPCA
3000 Lakeside Drive, Suite 309S 2F, Kairo Kaikan
Bannockburn, Illinois 12-2, Nishiogikita 3-chome
60015-1219 Suginami-Ku, Tokyo 167-0042
Tel 847 615.7100 Japan
Fax 847 615.7105 Tel 011 81/3-5310-2020
Fax 011 81/3-5310-2021
Foreword
IPC-4104 was developed with consideration to High Density Interconnect (HDI) layers that use modified ‘‘conventional’’
plated-through hole (PTH) processes and chemistries. The industry does not yet have enough experience to develop speci-
fication standards for materials used to make HDI layers. The added layers are formed by novel processes that are drasti-
cally different from ‘‘conventional’’ PTH constructions (i.e., non-plated copper processes). As experiences are gathered,
additional specifications may be added. In the meantime, the customer and manufacturer should work together to set the cri-
teria for acceptance of product using the new technologies.
May 1999 IPC/JPCA-4104
Acknowledgment
Any Standard involving a complex technology draws material from a vast number of sources. While the principal members
of the Microvia/High Density Interconnect Materials Subcommittee (D-42) of the High Density Interconnect (HDI) Com-
mittee (D-40) and the Build-Up PWB Committee of JPCA are shown below, it is not possible to include all of those who
assisted in the evolution of this Standard. To each of them, the members of the IPC extend their gratitude.
IPC High Density IPC Microvia/High Density TechnicaL Liaison of the

Interconnect (HDI) Interconnect Materials IPC Board of Directors
Committee Subcommittee
Chairman Chairman
Bob Neves Cef Gonzalez Stan Plzak Peter Murphy
Microtek Laboratories E. I. du Pont de Nemours and Co. Pensar Corp. Parlex Corp.
JPCA Build-Up JPCA Build-Up

PWB Committee PWB Committee
Chairman Secretary
Kanji Ohtsuka, Meisei Univ. Setsuo Noguchi, NEC Toyama, Ltd.
Microvia/High Density Interconnect Materials Subcommittee
Kevin Arledge, Motorola, Inc. Theodore Edwards, Honeywell Inc. John Holley, Motorola, Inc.
Richard A. Barnett, Compaq Air Transport Sys Mason Hu, Hadco Santa Clara, Inc.
Computer Corp. Werner Engelmaier, Engelmaier Daniel W. Hudson, E. I. du Pont de
Dick Barry, AT&S Austria Associates, L.C. Nemours and Co.
Technologie Stephen J. Feltham, Automata, Inc. Stephen N. Keller, Trace Laboratories
Harvey Beaman, Arlon, Inc. Joe Fjelstad, Tessera, Inc. - East
Erik J. Bergum, Polyclad Laminates, Dennis Fritz, MacDermid, Inc. Clarence W. Knapp, Litton Guidance
Inc. Mahendra S. Gandhi, Raytheon & Control Systems
Mark Bosnjak, Tulon, Inc. Systems Co. Philip D. Knudsen, Shipley Co.
Jack R. Bramel, Jack Bramel & Thomas F. Gardeski, E. I. du Pont de L.L.C.
Associates Nemours and Co. Fujio Kuwako, Mitsui Mining &
Thomas N. Bresnan, Hadco Corp. Stanley Glukh, BFGoodrich Specialty Smelting Co. Ltd
James Briguglio, Multek, Inc. Chemicals Joel Larvor, Matra Nortel
Otto K. Goins, Jr., Albemarle Corp. Communication
Donald A. Burns, Nelco Products,
Inc. Patricia J. Goldman, PPG Industries, Kuan-Shaur Lei, Compaq Computer
Inc. Corp.
Jeff Burress, Automata, Inc.
Ceferino G. Gonzalez, E. I. du Pont Dale J. Lubitz, Johnson Matthey
Mike Busby, Dynamic Details, Inc.
de Nemours and Co. Advanced Circuits, Inc
Matthew Byrne, Hadco Corp.
Marshall I. Gurian, Coates/ASI Curtis A. Lustig, Morton
Alan Cable, Electro Scientific International
Industries Don Gustafson, Olec Corp.
Rene R. Martinez, TRW
Thomas J. Carabine, Courtaulds Masaru Hanamori, Yamanashi
Avionics Company Ltd. Dr. Goran Matijasevic, Ormet Corp.
Performance Films
Carol A. Handwerker, Sc.D., U.S. Brian McDermott, MicroVia, Inc.
Ken H. Carlson, Harris Corp.
Department of Commerce John A. McGowen, Motorola, Inc.
Steven A. Castaldi, MacDermid, Inc.
Phillip E. Hinton, Hinton ’PWB’ Irving Memis, IBM Corp.
Marcelo Chan, Harris Corp.
Engineering John D. Meyers, Electrochemicals,
Jay B. Conrod, Enthone-OMI, Inc.
Kazuo Hirasaka, Eastern Company Inc.
Nitin B. Desai, Motorola, Inc. Ltd. Tom Miller, IBM Corp.
Joseph A. DiPalermo, Parlex Corp. John T. Hoback, Amoco Chemical Monty J. Montiel, Xerox Corp.
Co.
iii
IPC/JPCA-4104 May 1999
Dr. Cameron T Murray, 3M Co. Kovil Ramachandran, Filtran Grant W. Smedley, III, Raytheon
Kathleen A. Nargi-Toth, Microcircuits Systems Co.
Enthone-OMI, Inc. Jad Rasul, Motorola, Inc. Douglas J. Sober, isolaUSA
Richard Nasielski, NVF Co. Srirama T. Reddy, Lucent Frank St. John, Methode Electronics,
Bob Neves, Microtek Laboratories Technologies Inc/Bell Labs Inc.
Steven M. Nolan, Silicon Graphics George Riccitelli, Celestica, Inc. Dr. John G. Stephanie, IBM Corp.
Computer System Dr. Courtland N. Robinson, Sheldahl, Thomas C. Sutter, Shipley Co. L.L.C.
Thomas J. Nowak, Nowak & Inc. Avtar S. Takhar, Xerox Corp.
Associates Marianne Romansky, Ph.D, Celestica, David A. Vaughan, Vaughan
Janet R. Pierson, General Dynamics Inc. Consulting
Information Sys. Inc. David J. Russell, IBM Corp. Richard Wessel, E. I. du Pont de
Douglas O. Powell, IBM Corp. Joseph C. Salvini, Underwriters Labs, Nemours and Co.
David J. Powell, E. I. du Pont de Inc. Art Wolfrum
Nemours and Co. Rolland D. Savage, Gould Fonda B. Wu, Raytheon Systems Co.
John M. Radman, Trace Laboratories Electronics, Inc.
Wally Younger, Nelco Arizona
- East
JPCA Build-Up PWB Committee
Kouji Ikawa, CMK Circuit Toyotaro Shinko, Hitachi Chemical Toshio Nakamura, Airex Inc.
Technology Center Corp. Co., Ltd. Yasuharu Nojima, Ciba Specialty
Satoshi Itaya, Oki Electric Industry Tadashi Takai, Motorola Japan Ltd. Chemicals K. K.
Co., Ltd. Yoshinori Takazaki, Ibiden Co., Ltd. Yoshitaka Fukuoka, Toshiba Corp.
Kazuaki Shiraishi, Matsushita Eiji Takehara, Taiyo Ink Mfg. Co., Yoshizumi Satoh, Toshiba Corp.
Electronic Components Co., Ltd. Ltd. Shogo Mizumoto, IBM Japan, Ltd.
iv
Table of Contents
1 SCOPE ......................................................................... 1 3.9.3 Mechanical Requirements of Dielectrics
1.1 General ................................................................. 1 with Conductive Materials ............................... 15
1.2 Designation System ............................................. 1 3.10 Chemical Requirements..................................... 15
1.2.1 Dielectric Insulator Designations ........................ 3 3.10.1 Chemical Requirements of Dielectric
Materials............................................................. 15
1.2.2 Conductor Designations....................................... 4
3.10.2 Chemical Requirements of Conductive
1.2.3 Dielectric with Conductor Designations ............. 5 Materials............................................................. 15
1.3 Application Levels............................................... 6 3.10.3 Chemical Requirements of Dielectrics with
Conductive Materials......................................... 16
2 APPLICABLE DOCUMENTS ...................................... 6
3.10.4 Chemical Resistance of Dielectrics and
2.1 IPC........................................................................ 6
Conductors ......................................................... 16
2.2 American Society for Testing and Materials
3.11 Electrical Requirements..................................... 16
(ASTM) ................................................................ 7
2.3 Underwriters Laboratories (UL).......................... 7 3.11.1 Electrical Requirements of Dielectric
Materials............................................................. 16
2.4 American National Standards Institute
(ANSI).................................................................. 7 3.11.2 Electrical Requirements of Conductive
Materials............................................................. 16
3 REQUIREMENTS ........................................................ 7 3.11.3 Electrical Requirements of Dielectric with
3.1 Terms and Definitions.......................................... 7 Conductive Materials......................................... 16
3.1.1 Microvia (Build-Up Via) ..................................... 7 3.12 Environmental Requirements ............................ 17
3.1.2 High Density Interconnection (HDI) 3.12.1 Environmental Requirements of Dielectric
(Build-Up PCB) ................................................... 7 Materials ........................................................... 17
3.2 Specification Sheets ............................................. 7 3.12.2 Environmental Requirements of Conductive
3.3 Manufacturer’s Quality Profile............................ 7 Materials............................................................. 17
3.4 Qualification (Characterization) Testing ............. 7 3.12.3 Environmental Requirements of Dielectrics
with Conductive Materials ................................ 17
3.4.1 Material Qualification .......................................... 7
3.13 Non-Nutrient ...................................................... 17
3.4.2 Qualification Testing Dielectric Materials .......... 9
3.14 Workmanship ..................................................... 17
3.4.3 Qualification Testing of Conductive
Materials............................................................... 9 3.15 Material Safety Data Sheets (MSDS) ............... 17
3.5 Verification of Material Supplier’s Quality 3.16 Shelf Life ........................................................... 17
System .................................................................. 9 3.17 Marking .............................................................. 18
3.6 Conflict................................................................. 9
4 QUALITY ASSURANCE PROVISIONS .................... 18
3.7 Materials............................................................... 9
4.1 Quality System................................................... 18
3.7.1 Dielectric Materials............................................ 10
4.2 Responsibility for Inspection............................. 18
3.7.2 Materials for Conductive Paths (In-Plane or
Inter-Plane)......................................................... 10 4.2.1 Test Equipment and Inspection Facilities ......... 18
3.7.3 Materials with Dielectric and Conductive 4.2.2 Standard Laboratory Conditions........................ 18
Functionality ...................................................... 10 4.3 Qualification (Characterization) Testing .......... 18
3.8 General Acceptability ........................................ 10 4.3.1 Samples .............................................................. 18
3.8.1 Dielectric and Conductive Materials ............... 10 4.3.2 Structurally Similar Construction...................... 18
3.8.2 Inspection Lot .................................................... 11
4.3.3 Tolerances........................................................... 18
3.8.3 Visual Properties ............................................... 11
4.4 Quality Conformance Inspection....................... 18
3.8.4 Dimensional Requirements................................ 13
4.4.1 Frequency........................................................... 18
3.9 Mechanical Requirements.................................. 14
4.4.2 Inspection of Product for Delivery ................... 18
3.9.1 Mechanical Requirements of Dielectric
Materials............................................................. 14 4.4.3 Acceptance Criteria............................................ 18
3.9.2 Mechanical Requirements of Conductive 4.4.4 Rejected Lots ..................................................... 18
Materials............................................................. 15 4.5 Statistical Process Control (SPC)...................... 19
v
5 PREPARATION FOR DELIVERY.............................. 19 Figure 3-4 Mechanical Requirements ............................... 14

5.1 Packaging ........................................................... 19 Figure 3-5 Chemical Requirements .................................. 15
Figure 3-6 Electrical Requirements................................... 16
6 NOTES ....................................................................... 19
Figure 3-7 Environmental Requirements .......................... 17
6.1 Ordering Data .................................................... 19
6.2 References .......................................................... 19
APPENDIX A ............................................................... 20
Tables
Figures Table 1-1 Sample Dielectric Insulator Designation .............. 3
Figure 1-1 Cross-Section of a General HDI with Table 1-2 Sample Conductor Designation ........................... 4
Microvias............................................................ 2 Table 1-3 Sample Dielectric with Conductor Designations .. 5
Figure 1-2 Cross-Sectional Views of Methods to Make Table 3-1 Reference Information and Test Frequency
HDI with Microvias............................................. 2 of Materials........................................................... 8
Figure 1-3 IC Chip Carrier on HDI/Microvia Substrate Table 3-2 Visual Inspection Criteria of Dielectrics
(Application I)..................................................... 6 (Maximum Allowable Points) .............................. 11
Figure 1-4 BGA Package (on MCM-L Substrate Using Table 3-3 Sample Point Counts
HDI-PCB Technology) (Application I) ................ 6 for Voids and Inclusions ..................................... 12
Figure 1-5 PCB-HDI/Microvia Substrate Table 3-4 Visual Inspection of Solid Conductor
Application H) .................................................... 6 Material (Maximum Allowable Points) ................ 12
Figure 3-1 Layout of Materials Section ............................... 9 Table 3-5 Point Counts for Scratches
Figure 3-2 Visual Properties .............................................. 11 for Solid Conductor Material .............................. 12
Figure 3-3 Dimensional Requirements.............................. 13 Table 3-6 Point Count for Pin Holes & Porosity................. 13
vi
Specification for High Density

Interconnection (HDI) and Microvia Materials
1 SCOPE The materials contained in this standard represent general

This document describes various materials that can be used material categories. As new materials become available,
for the fabrication of high density interconnection (HDI) they will be added to future revisions. Users and material
and microvias. It provides information on general classifi- developers are encouraged to supply information on new
cations and associated characteristics of HDI materials. materials for review by the IPC Microvia/High Density
The document shall be used as a qualification and con- Interconnect Materials Subcommittee (D-42). Users who
formance standard for designers and users when designing wish to invoke this specification for materials not listed
or constructing HDI and microvias. shall list a zero for the specification sheet number (IPC-
This document contains material designation, conformance 4104/0).
(requirements), qualification (characterization), and quality
The committee may approve new or revised specification
assurance requirements. IPC-4104 should be used in con-
sheets independent from revision of the document text.
junction with IPC-2315 and IPC-6016.
When this occurs, the new or revised specification sheet
1.1 General This document covers the requirements for shall be printed and made available through IPC-4104. The
dielectric and conductive materials that are used with con- effective date of the new or revised specification sheet
ventional core materials for the manufacture of HDI. The shall be clearly indicated on the individual sheet. Specifi-
added HDI layer(s) is ≤0.15 mm in thickness. cation sheets shall be transferred from IPC-4104 to the
appropriate parent document whenever that document is
A microvia substrate contains reduced geometries. The revised.
microvia is used to reduce size and weight and enhance
electrical performance. Its nature also allows innovation in The designation system recognizes three general material
three-dimensional packaging. A microvia substrate repre- types used in manufacturing HDI:
sents the combination of multichip modules (MCM) and
• Dielectric insulators only
conventional PCB manufacturing technologies (see Figure
1-1). • Conductors only
• Combinations of conductors and insulators
Microvias are the PCB technology solution in the form of
blind and buried vias ≤0.15 mm in diameter and pad diam- The first level of the designations system is the material
eters ≤0.35 mm. These vias are the central characteristic of type.
HDI, as shown in Figure 1-2.
Level 1 Material Type
1.2 Designation System The system in 1.2.1 through IN = Dielectric Insulator
1.2.3 identifies materials used for HDI structures. This is a CD = Conductor
general identification system and does not in any way CI = Conductor and Insulator
imply that all the permutations of properties and forms
exist. See the series of specification sheets at the end of this The other levels used to designate a particular material
document for the specific materials available. Each specifi- depend upon Level 1. Table 1-1, Table 1-2, and Table 1-3
cation sheet outlines engineering and performance data for illustrate the designation system for each of the material
materials that can be used to manufacture HDI. These types. The designation listed in the specification sheets can
materials include dielectric insulators, conductors, and be used to determine the exact material construction by
dielectric/conductor combinations. The specification sheets first looking at the Level 1 designation (IN, CD, or CI) and
are provided with letters and numbers for identification and then looking in the correct section (1.2.1, 1.2.2. or 1.2.3)
ordering purposes. For example, a user wishing to order for that material type. These sections contain the descrip-
from specification sheet 1 would substitute the number ‘‘1’’ tion of the remaining designation levels with an example
for the ‘‘S’’ in the designation examples (i.e., IPC-4104/1) table to aid in deciphering the designation.
shown in 1.2.1 through 1.2.3. To start the ordering process,
one can use the specification sheets in this document in The default designations are non-photoimageable and unre-
combination with relevant IPC documents for each material inforced. They will not be used as descriptors for simplic-
sets (i.e., IPC-CF-148, IPC-MF-150, or IPC-4101). ity (see Table 1-1, Table 1-2, and Table 1-3).
1
Plated-Through
Capture Pad Target Pad
Hole (PTH)
Microvia (Via Top (Via Bottom
(Build-up Via) Buried Via Land) Land)
IPC-4104-1-1
Figure 1-1 Cross-Section of a General HDI with Microvias
1 2 3 4 5
6 7 8 9 10
Mechanically Drilled - 1 Wet Etched - 2, 3, 6 Insulation Displacement - 8

Mechanically Punched - 1 Dry Etched (Plasma) - 2 Conductive Paste Via - 9
Laser Drilled - 1, 4, 5, (6) Abrasive Blast - 3 Conductive Bonding Sheets - 10
Photo Formed - 5, 6, 7 Post Pierced - 8
IPC-4104-1-2
Figure 1-2 Cross-Sectional Views of Methods to Make HDI with Microvias
2
1.2.1 Dielectric Insulator Designations
Example The sample from Table 1-1 will be written as IN F 1 N 1.
Note The letter ‘‘X’’ shall be entered into the designation where an item is not specified and does not matter.
Table 1-1 Sample Dielectric Insulator Designation
IPC-4104 Level 1 Level 2 Level 3 Level 4 Level 5
4104 / S IN F 1 N 1
Where S is Material Type Form of Dielectric Photosensitivity Reinforcement Chemistry
specification (slash)
sheet number
Level 1 IN = Material Type Level 5 Chemistry

1 = Epoxy
Level 2 Form of Dielectric
2 = Epoxy blends
L = Liquid
3 = Polyimide
P = Paste
4 = Polyester
F = Film
5 = Acrylics
R = Reinforced (prepreg)
6 = BT resins
C = Adhesive Coated Film
7 = Cyanate ester
Level 3 Photosensitivity 8 = BCB (benzocyclobutene)
1 = Non-photoimageable 9 = PEEK (polyetheretherketone)
2 = Photoimageable 10 = FEP (fluorinated ethylene propylene)
11 = LCP (liquid crystal polymer)
Level 4 Reinforcement
12 = PPE (polyphenylene ether)
G = Woven Glass
13 = PNB (polynorborene)
M = Nonwoven Matte Glass
O = Other
A = Nonwoven Aramid
E = E-PTFE (expanded PTFE)
N = None
O = Other
3
1.2.2 Conductor Designations
Table 1-2 Sample Conductor Designation
IPC-4104 Level 1 Level 2 Level 3
4104 / S CD P 3
Where S is specification Material Type Form of Conductor Type of Form
(slash) sheet number
Level 1 CD = Material Type Printable Paste (P):

1 = Silver particle loaded
Level 2 Form of Conductor
2 = Other conductive particle loaded
F = Metal Foil
3 = Transient liquid phase sintering
S = Solution Plate
4 = Organometallic
P = Printable/Paste
5 = Conductive polymers
V = Vacuum Deposit
O = Other Vacuum deposited (V):
1 = Evaporative
Level 3 Type of Form
2 = Sputtering
1 = Copper
3 = Other
2 = Nickel
3 = Other
Solution Plate (S):
1 = Electrolytic Copper
2 = Electroless Copper
3 = Direct plate initiation
4 = Other metal plate
4
1.2.3 Dielectric with Conductor Designations
Table 1-3 Sample Dielectric with Conductor Designations
IPC-4104 Level 1 Level 2 Level 3 Level 4 Level 5 Level 6 Level 7
4104 / S CI F 1 N 1 CF 1
Where S is Material Type Form of Photo- Reinforce- Chemistry Type of Type of
specification Dielectric sensitivity ment metal/ conduction
(slash) sheet conductor
number
Level 1 CI = Material Type Level 6 Type of metal/conductor

CF = Copper foil
Level 2 Form of Dielectric
CP = Copper particle/post
L = Liquid
SP = Silver particle/post
P = Paste
NP = Nickel particle/post
F = Film
AP = Alloy particle/post
R = Reinforced
OP = Other particle/post
C = Adhesive Coated Film
Level 7 Type of conduction
Level 3 Photosensitivity
1 (e.g., copper foil) = In plane (x-y)
1 = Non-photoimageable
2 (anisotropic conductive adhesive)
2 = Photoimageable
= Through plane (z-axis)
Level 4 Reinforcement 3 (e.g., post) = Both
G = Woven Glass
M = Nonwoven Matte Glass
A = Nonwoven Aramid
E = E-PTFE (expanded PTFE)
N = None
O = Other
Level 5 Chemistry
1 = Epoxy
2 = Epoxy blends
3 = Polyimide
4 = Polyester
5 = Acrylics
6 = BT resins
7 = Cyanate ester
8 = BCB
9 = PEEK
10 = FEP
11 = LCP
12 = PPE
13 = PNB
O = Other
5
1.3 Application Levels All applications for microvias

require high reliability. This includes equipment where 1 Level Microvia
2 Level Microvia
continued performance is critical, equipment downtime
cannot be tolerated, or the equipment is a life support item.
The application levels used in IPC-4104 slash sheets are:
H – Printed Circuit Board/ High Density Interconnect
Applications (see Figure 1-3)
I – Integrated Circuit Packaging Applications (see Fig- PC Board Drilled Through Via
ure 1-4 and Figure 1-5) IPC-4104-1-5
U – User Defined Applications
Figure 1-5 PCB-HDI/Microvia Substrate (Application H)
Application level H (see Figure 1-3) does not require mois-
2 APPLICABLE DOCUMENTS
ture resistance of PCB materials testing (see IPC-TM-650,
Method 2.6.16.1). Application level I (see Figure 1-4 and The following documents of the issue in effect at the time
Figure 1-5) does not require Relative Thermal Index test- of order form a part of this specification to the extent speci-
ing (see UL 796). User defined applications are just like fied herein. If a conflict exists between IPC-4104 and the
application levels H or I, except the exact values and slash listed applicable documents, IPC-4104 shall take prece-
sheets are not defined. The values for application level U dence.
will be agreed upon between user and supplier.
2.1 IPC1
The intended application level is listed on each slash sheet.
Certain materials may have more than one application IPC-T-50 Terms and Definitions for Interconnecting and
level. Packaging Electronic Circuits
IPC-PC-90 General Requirements for Implementation of

Statistical Process Control
IPC-MF-150 Metal Foil for Printed Wiring Applications
IPC-TM-650 Test Methods Manual

2.1.2 Pinholes Evaluation, Dye Penetration Method
2.2.21 Planarity of Dielectrics for High Density Inter-
connection (HDI)/Microvia Technology
IPC-4104-1-3
2.3.2 Chemical Resistance of Flexible Printed Wiring
Figure 1-3 IC Chip Carrier on HDI/Microvia Substrate Materials
(Application I)
2.4.18.3 Tensile Strength, Elongation, and Modulus
2.4.24.4 Glass Transition and Modulus of Materials Used
in High Density Interconnection (HDI) and
Microvias - DMA Method
2.4.24.5 Glass Transition Temperature and Thermal
Expansion of Materials Used in High Density
Interconnection (HDI) and Microvias - TMA
Method
2.4.25 Glass Transition Temperature and Cure Factor
IPC-4104-1-4 by DSC
Figure 1-4 BGA Package (on MCM-L Substrate Using 2.5.5.9 Permittivity and Loss Tangent, Parallel Plate,
HDI-PCB Technology) (Application I) 1 MHz to 1.5 GHz
2.5.6.1 Dielectric Strength, Polymer Solder Mask,
and/or Conformal Coatings
2.5.17.1 Volume and Surface Resistivity of Dielectric
Materials
1. IPC, 2215 Sanders Rd., Northbrook, IL 60062-6135, 847-509-9700, www.ipc.org
6
2.5.17.2 Volume Resistivity of Conductive Materials ventional printed circuit board (PCB) manufacturing tech-
Used in High Density Interconnection (HDI) and nologies.
Microvias, Two-Wire Method
2.6.1 Fungus Resistance Printed Wiring Materials 3.2 Specification Sheets The individual item require-
ments shall be as specified herein and in accordance with
2.6.2.1 Water Absorption, Metal Clad Plastic Laminates
the applicable specification sheets. Where there is no speci-
2.6.16.1 Moisture Resistance of High Density Intercon- fication sheet available, the individual requirements shall
nection (HDI) Materials Under High Tempera- be as specified in complementary documents such as mas-
ture and Pressure (Pressure Vessel) ter drawings or ordering data sheets (see 6.1). In the event
of any conflict between requirements of this specification
IPC-2315 Design Guide for High Density Interconnects
and the specification sheet or complementary documents,
(HDIs) and Microvias
the latter shall govern.
IPC-4101 Specification for Base Materials for Rigid and
3.3 Manufacturer’s Quality Profile Suppliers of dielec-
Multilayer Printed Boards
tric and conductive materials shall assess their manufactur-
IPC-6016 Qualification and Performance Specification for ing capability and make such data available either elec-
High Density Interconnection (HDI) Layers or Boards tronically or in hard copy.
2.2 American Society for Testing and Materials (ASTM)2 3.4 Qualification (Characterization) Testing Dielectric
and conductive materials furnished under this specification
ASTM-D-374 Test Methods for Thickness of Solid Electri- shall be qualified as in Table 3-1. The supplier shall retain
cal Insulation on file data that support that the material meets the require-
ments of this specification using the test methods described
2.3 Underwriters Laboratories (UL)3 herein. Qualification testing shall be performed to demon-
strate the supplier’s ability to meet all of the requirements
UL 94 Standard Tests for Flammability of Plastic Materi- of each applicable specification sheet for each dielectric
als for Parts in Devices and Appliances and conductive material.
UL 796 Printed Wiring Boards Qualification is synonymous with characterization testing
of materials and is done one time to verify material prop-
2.4 American National Standards Institute (ANSI)4 erties (conformance is synonymous with requirement).
ANSI/NCSL Z540-1-1994
3.4.1 Material Qualification Material qualification shall
ISO 10012-1 Quality Assurance Requirements for Measur-
be performed on test specimens that are produced with
ing Equipment equipment and procedures normally used in production or
in accordance with the test method procedure indicated.
3 REQUIREMENTS Material characterization provides the material supplier
with a method to specify the characteristics of their prod-
3.1 Terms and Definitions Terms and definitions shall ucts, which may be useful for the PCB fabricator, designer
be in accordance with IPC-T-50 and as stated in 3.1.1 and or end user to know. This group of tests is typically per-
3.1.2. formed by the material supplier a single time and reported
on the specification sheets. The PCB fabricator and/or end
3.1.1 Microvia (Build-Up Via) Blind and buried vias that
user may also utilize this group of tests, if desired.
are ≤0.15 mm in diameter and have pad diameters that are
3.4.1.1 Samples When required under the provisions of
≤0.35 mm.
Table 3-1, samples shall be selected from normal produc-
3.1.2 High Density Interconnection (HDI) (Build-Up
tion for each material for which qualification is sought. The
PCB) A HDI substrate contains reduced geometries. The
number of samples required for the individual test methods
HDI is used to reduce size and weight and to enhance elec- shall be as specified in the test method or as outlined in 3.8
trical performance. Its nature also allows innovation in through 3.12.3.
three-dimensional packaging. A HDI substrate represents
the combination of multi-chip modules (MCM) and con-
2. ASTM, 100 Barr Harbor Dr., West Conshohocken, PA 19428-2959

3. UL, 333 Pfingsten Rd., Northbrook, IL 60062-2002
4. ANSI, 655 15th St., N.W., Ste. 300, Washington, D.C. 20005-5794
7
Table 3-1 Reference Information and Test Frequency of Materials

Test Method
(IPC-TM-650 Qualification Conformance Samples per
Properties Section or as noted) Testing Testing Frequency unit/measure
Visual 3.8.3
Inclusions 3.8.3.1.1 U A 3
3.8.3.2.2
Holes and Tears 3.8.3.2.3 U
Voids (Surface) 3.8.3.1.2 U A 3
Wrinkles, Creases & Indentations 3.8.3.1.3 U A 3
Scratches 3.8.3.2.1
Tears and Delaminations 3.8.3.1.4 U A 3
3.8.3.2.3
Dimensional 3.8.4 U A 3
Thickness 3.8.4.1.1 U A 3
Length and Width 3.8.4.1.2 U A 3
Weight 3.8.4.2.1 U A 3
Mechanical Requirements 3.9
Tensile Strength 3.9.1.1, 2.4.18.3 U C per TM
3.9.2.1
Elongation 3.9.1.2 2.4.18.3 U C per TM
3.9.2.2
Young’s Modulus 3.9.1.3 2.4.18.3 or U C per TM
3.9.2.3 2.4.24.4
Planarity 3.9.1.4 2.2.21 U C per TM
Glass Transition Temperature (Tg) 3.9.1.5 2.4.24.4, U C per TM
3.9.2.4 2.4.24.5, or
2.4.25
CTE Above and Below Tg 3.9.1.6 2.4.24.5 U C per TM
3.9.2.5
Chemical Requirements 3.10
Flammability 3.10.1.1 UL 94 U C per TM
5
Relative Thermal Index (RTI) 3.10.1.2 UL 796 U C per TM
Electrical Requirements 3.11
Dielectric Constant (Relative 3.11.1.1 2.5.5.9 U B per TM
Permittivity and Range)
Loss Tangent and Range 3.11.1.2 2.5.5.9 U B per TM
Dielectric Strength 3.11.1.3 2.5.6.1 U B per TM
Bulk or Volume Resistivity 3.11.2.1 2.5.17.2 U B per TM
Environmental Requirements 3.12
Surface Resistivity 3.12.1.1 2.5.17.1 U B per TM
Volume Resistivity 3.12.1.2 2.5.17.1 U B per TM
Moisture Resistance by Pressure 3.12.1.3 2.6.16.1 U B per TM
Vessel Test 3.12.2.1
Moisture and Water Absorption 3.12.1.4 2.6.2.1 U C per TM
3.12.2.2
A = Lot basis
B = Every 12 months
C = One time for material qualification
For an explanation of frequency indicators, see 4.4.
5. RTI requirements can be exempt for applications intended for use in low voltage limited energy (LVLE) circuitry (see UL 796).
8
3.4.1.2 Frequency Each material (as outlined in the will allow selection of suitable materials for specific prod-
specification sheets) shall undergo qualification once. The ucts. This section defines the characterization testing that is
material supplier upon demand shall provide certified data included in the specification sheet information but is not a
that the supplied material is qualified to this standard. requirement for routine conformance testing.
Qualification retesting is not required unless agreed upon
For solid metal conductive material, characterization test-
between end user and material supplier or as specified in
ing such as 3.9.2.4 and 3.12.2.1 are not applicable. For
Table 3-1.
applied conductive materials, (i.e., plated, vacuum depos-
ited, conductive paste), material characterization in 3.9.2.1,
3.4.1.3 Production Board Qualification Assessment of 3.9.2.2, 3.9.2.3, 3.9.2.4, and 3.10.1.2 may not be appli-
Materials Production board system qualification is the cable, depending on the specific material.
responsibility of the PCB fabricator and/or end user to con-
firm that the materials, production board system, and pro- 3.5 Verification of Material Supplier’s Quality System
duction process chosen is qualified for the appropriate The verification of the material supplier’s quality system
application level. This qualification can use test vehicles may be conducted to reduce risk to the PCB fabricator. The
from IPC-6016 or a substitute pattern agreed upon by the verification can be accomplished via several means, includ-
printed board fabricator and user, which are evaluated ing internal assessment, individual customer audit, and/or
according to tests listed in Table 3-1. end user assessment.
3.6 Conflict In the event of conflict, the following order

3.4.2 Qualification Testing Dielectric Materials The
of precedence shall apply:
specification sheets referenced herein are designed to pro-
vide the designer and end user with information that will 1. Purchase order as agreed upon between PCB fabricator
allow selection of suitable materials for specific products. and material supplier
Definitions of characterization testing included in the speci- 2. Master drawing (see 6.1)
fication sheet information but are not a requirement for 3. This specification (specification sheet takes precedence
routine conformance testing are explained in 3.8 through over the body of the text)
3.12.
4. Applicable documents (see Section 2)
3.4.3 Qualification Testing of Conductive Materials 3.7 Materials The type of materials shall be specified as
The specification sheets referenced herein are designed to stated in 3.7.1 through 3.7.3.3. See Figure 3-1 for a layout
provide the designer and end user with information that of 3.7.
4104-3-1
Figure 3-1 Layout of Materials Section
9
3.7.1 Dielectric Materials be used to fill the core board through hole to achieve con-
duction and planarity. They differ by the material that is
3.7.1.1 Non-Photoimageable Dielectric Materials Non- responsible for electrical conduction. They include silver
photoimageable materials are typically supplied as a liquid, particle loaded, other metal or metal-coated particles, tran-
paste, or dry film non-reinforced dielectric, which is sient liquid phase sintering compositions, organometallics,
applied to the sub-composite to form an insulating layer in and conductive polymers.
a build-up circuit at the PCB manufacturing location.
These dielectrics are suitable for via formation by LASER 3.7.3 Materials with Dielectric and Conductive Func-
or mechanical methods. Some of these materials are used tionality
to fill the core board through hole to achieve planarization.
3.7.3.1 Copper Clad Copper clad materials have copper
Material chemistries for this application include epoxies,
foil laminated on one or both sides of cured (c-stage)
epoxy blends, polyester, polynorborenes, polyimides, etc.
dielectric. The typical application uses single-side clad
material where the copper clad is used as the outer layer
3.7.1.2 Photoimageable Dielectric Materials Photoim-
and the c-stage is bonded to the sub-composite. Vias are
ageable materials are typically supplied as a liquid, paste,
formed utilizing methods such as plasma, LASER, or
or dry film non-reinforced dielectric, which is applied to
mechanical drilling. Materials available differ by reinforce-
the sub-composite to form an insulating layer in a build-up
ment (woven glass, nonwoven glass, aramid, film, and
circuit at the PCB manufacturing location. These dielec-
expanded PTFE) and chemistries involved (epoxies, poly-
trics have the capability of forming vias by photographi-
imides, cyanate esters, acrylics, liquid crystal polymers,
cally defined processes. Some of these materials may also
etc.).
be used to fill the core board through hole to achieve pla-
narization. Material chemistries for this application include
3.7.3.2 Coated Copper Coated copper materials are
epoxies, epoxy blends, polynorborenes, polyimides, etc.
comprised of copper foil coated with a dielectric material
3.7.1.3 Adhesive Coated Dielectric Materials with Rein- that can be directly bonded to the sub-composite. They dif-
forcements These materials act as an insulator and pro-
fer by whether they are wet processable or not. In wet pro-
vide the bond-ply required to adhere copper foil to the sur- cessable coated copper, the vias are formed by acidic or
face of a sub-composite. Vias are formed utilizing methods alkaline etching, or the dielectric may be made etchable by
such as plasma, LASER, or mechanical drilling. Materials photographic definition. In non-wet processable-coated
available differ by reinforcement (i.e., woven glass, non- copper materials, vias are formed utilizing methods such as
woven glass, aramid, film, expanded PTFE, etc.) and plasma, LASER, or mechanical drilling. The materials
chemistries involved (i.e., epoxies, polyimides, cyanate coated are typically epoxy, polyimide, or acrylic.
esters, acrylics, etc.).
3.7.3.3 Anisotropically Conductive Film These materi-
3.7.2 Materials for Conductive Paths (In-Plane or Inter- als are conductive in the z-axis and are applied as bond-
Plane) plies in between circuit layers to form the vertical electri-
cal connection. They differ by the material (silver, nickel,
3.7.2.1 Conductive Foil Conductive foils are comprised alloy, or other metals or metal-coated particles) that is
of foil that is either laminated with dielectric, coated with responsible for electrical conduction.
dielectric, or used as stand alone and then laminated into
the structure. Foil materials are mostly copper, although 3.8 General Acceptability Materials in paste, sheet, roll,
other metals are possible. For more information, see IPC- or liquid shall be considered acceptable if they meet the
MF-150. requirements of 3.8.1 through 3.8.4.2.1 or are as agreed
upon between user and supplier.
3.7.2.2 Plated Vias, Holes, Posts, and Bumps These
materials include various applied conductive materials that 3.8.1 Dielectric and Conductive Materials
are plated (electroless and electrolytic) in vias or as bumps
or posts on top of other circuitry to make the electrical 3.8.1.1 General Acceptability of Dielectric Materials
connection between layers. Plated materials are mostly Dielectric material property qualification and conformance
copper, although other plating is possible. are required to be performed by the material supplier but
may, by appropriate agreement, also be used as an incom-
3.7.2.3 Conductive Paste Conductive pastes are pastes ing material inspection procedure by the PCB user. The
applied into vias that are photoimaged, LASER ablated, tests the supplier shall perform to determine the properties
plasma formed, or formed by other means in any of the of each material are outlined in 3.8.3.1, 3.8.4.1, 3.9.1,
dielectric materials in 3.7.1. Some of these materials may 3.10.1, 3.11.1, and 3.12.1. A summary of the results is
10
indicated on the specific specification sheet for each mate- Table 3-2 Visual Inspection Criteria of Dielectrics
(Maximum Allowable Points)
rial that has been qualified to this specification.
Application Level
For application level H, all tests except 3.12.1.3 are
Inspection H I U
required.
Inclusions 8 3 AABUS
3.8.1.2 General Acceptability of Conductive Materials Voids 8 3 AABUS

Conductive material qualification and conformance are Wrinkles, 0 0 AABUS
Creases, and
required to be performed by the material supplier but may, Indentations
by appropriate agreement, also be used as an incoming
Tears and 0 0 AABUS
material inspection procedure by the PCB user. The tests Delaminations
the supplier shall perform to determine the properties of AABUS = As Agreed Upon Between User and Supplier
each material are outlined in 3.8.3.2 through 3.8.3.3,
3.8.3.1 Visual Properties of Dielectric Materials Dielec-
3.8.4.2, and 3.9.2. The result is indicated on the specific
specification sheet for each material that has been qualified tric material shall meet the visual requirements specified in
to this specification. 3.8.3.1.1 through 3.8.3.1.4 using the test methods described
therein and in the applicable specification sheets. Any
Conductive material will be prepared on the process dielec- defect within 6.35 mm of the outside edges of the sheet or
tric being used to manufacture the HDI structures. Thick- roll shall be disregarded. In the inspection of the dielectric
ness is determined by the performance requirement. film as received or after coating, any defects as defined in
Table 3-2 and explained in 3.8.3.1.1 through 3.8.3.1.4 shall
3.8.1.3 General Acceptability of Dielectrics with Con- be located visually using 30X magnification, with referee
ductive Materials For dielectric and conductor combined inspections at 100X. A measurement of the longest dimen-
materials, refer to 3.8.1.1 for the dielectric portion of the sion shall be made.
material and refer to 3.8.1.2 for the conductor portion of
the material. The point value system in Table 3-3 shall be used to deter-
mine point count for the prerequisite sampling. Three
3.8.2 Inspection Lot Inspection lot shall be as defined in 50 mm x 50 mm duplicate samples from a 0.1 sq. m mate-
IPC-T-50 or as agreed upon between user and supplier. rial sample should be inspected to determine point value.
3.8.3 Visual Properties See Figure 3-2 for a layout of

the visual properties of IPC-4104.
4104-3-2
Figure 3-2 Visual Properties
11
Table 3-3 Sample Point Counts Table 3-4 Visual Inspection of Solid Conductor
for Voids and Inclusions Material (Maximum Allowable Points)
Longest Dimension (mm) Point Value Application Level
0.013 - 0.025 1 Inspection H I U
0.026 - 0.05 2 Scratches 8 5 AABUS
0.051 - 0.08 5 Inclusions 8 3 AABUS
>0.08 10 Holes & 0 0 AABUS
Tears
The application level shall be determined by a point count Pin Holes & 5 2 AABUS
when examined in accordance with point value versus Porosity
longest dimension chart shown in Table 3-3 and the provi- AABUS - As Agreed Upon Between User and Supplier
sion in Table 3-2. Applied conductive materials (i.e., plated, vacuum depos-
ited, or conductive paste) will be excluded from the
3.8.3.1.1 Inclusions When tested in accordance with
requirements of 3.8.3.2.1 through 3.8.3.2.4. The visual
3.8.3.1, inclusions in dielectric materials shall not reduce requirements for these materials are dependent on the
the dielectric thickness by more than 20%, be non- application of the conductive material, which will occur in
conductive, and meet the requirements outlined in Table the fabricator’s facility. The supplier has the responsibility
3-2, unless otherwise agreed upon between user and sup- to demonstrate the material capabilities with regard to for-
plier. mation of a uniform and usable material in the coating
method outlined in the supplier’s operating information.
3.8.3.1.2 Voids (Surface) When tested in accordance
with 3.8.3.1, voids in dielectric materials shall not reduce 3.8.3.2.1 Scratches For solid conductive materials,
the dielectric thickness by more than 20% and meet the scratches are not permitted where the depth is greater than
requirements outlined in Table 3-2, unless otherwise agreed or equal 20% of the nominal conductor thickness (i.e., 3.5
upon between user and supplier. µm for 17 µm copper). No more than three scratches per
300 mm x 300 mm are allowed. Any scratch with a depth
3.8.3.1.3 Wrinkles, Creases, and Indentations When
less than 5% of the nominal thickness shall not be counted.
tested in accordance with 3.8.3.1, dielectric materials shall
See Table 3-5 for point counts for scratches in conductor
be free of wrinkles, creases, and indentations to allow for
materials.
suitable use by the fabricator/user.
Table 3-5 Point Counts for Scratches
for Solid Conductor Material
3.8.3.1.4 Tears and Delaminations When tested in
accordance with 3.8.3.1, dielectric materials shall be free Depth (% of
conductor Amount (per 300
of tears and delaminations, so as to be usable for the thickness) mm x 300 mm) Point Value
intended applications. 0 to 4.9 No limit 0
5 to 9.9 one 1
3.8.3.2 Visual Properties of Conductive Materials
10 to 19.9 two 2
Solid conductive materials (i.e., form of conductor is metal
foil, F, - Table 1-2) shall meet the visual inspection 20 three 10
requirements stated in 3.8.3.2.1 through 3.8.3.2.4 (see
3.8.3.2.2 Inclusions When tested in accordance with
Table 3-4). As applicable, any defect within 6.35 mm of the
3.8.3.2, inclusions in solid conductive materials shall be no
outside edges of the sheet or roll shall be disregarded.
greater than 0.028 mm in any direction (see Table 3-3).
12
3.8.3.2.3 Holes and Tears Solid conductive materials 3.8.4.1 Dimensional Requirements of Dielectric Materi-
shall be free of holes and tears. als
3.8.3.2.4 Pinholes and Porosity For 17 µm copper, there 3.8.4.1.1 Thickness When tested in accordance with
shall be a maximum of five spots of dye penetration per ASTM-D-374, method A or C, the thickness of purchased
300 mm x 300 mm. For 35 µm copper, there shall be a dry or solid dielectric materials shall be ± 10% of the
maximum of three spots of dye penetration per 300 mm x nominal values indicated for dielectric materials. The con-
300 mm, as determined by IPC-TM-650, Method 2.1.2. trol of dielectric thickness for liquid materials to meet the
Table 3-6 gives the point counts for pinholes and porosity. end use application level shall be as agreed upon by the
user and the supplier.
Table 3-6 Point Count for Pin Holes & Porosity
Number of Spots Number of Spots 3.8.4.1.2 Length and Width The length and width of
for ≤17µm Copper for >17µm Copper Point Value
dielectric materials, when applicable, shall be as specified
1 1 1 in the procurement document (see 6.1).
2 - 1
3 2 2 3.8.4.2 Dimensional Requirements of Conductive Mate-
4 - 4 rials
5 3 10
3.8.4.2.1 Weight For conductive metal foil, designators
3.8.3.3 Visual Properties of Dielectrics with Conductive shall be per IPC-MF-150.
Materials For dielectric and conductor combined materi-
als, refer to 3.8.3.1 for the dielectric portion of the material 3.8.4.3 Dimensional Requirements of Dielectrics with
and 3.8.3.2 for the conductor portion. Conductive Materials Dimensional requirements for
dielectric materials shall be as in 3.8.4.1. Dimensional
3.8.4 Dimensional Requirements Length, width, thick- requirements for conductive materials shall be as in
ness, and other dimensional characteristics shall be mea- 3.8.4.2.
sured with equipment capable of accuracy to verify the
requirements of this specification. See Figure 3-3 for the
layout of the dimensional requirements of IPC-4104.
4104-3-3
Figure 3-3 Dimensional Requirements
13
3.9 Mechanical Requirements See Figure 3-4 for a lay- 3.9.1.5 Glass Transition Temperature (T g) The pre-
out of the mechanical requirements of IPC-4104. ferred method for determining Tg is TMA extension (see
IPC-TM-650, Method 2.4.24.5, method A or B). If neither
3.9.1 Mechanical Requirements of Dielectric Materials method A or B can be used because of specimen prepara-
tion difficulties or lack of sensitivity of the technique, IPC-
3.9.1.1 Tensile Strength When specimens are tested in TM-650, Method 2.4.25 shall be substituted. When speci-
accordance with IPC-TM-650, Method 2.4.18.3, the tensile mens are tested in accordance with IPC-TM-650, Method
strength shall be as indicated in the applicable specification 2.4.24.5, the Tg shall be as indicated in the applicable
sheet. specification sheet.
3.9.1.2 Elongation When tested in accordance with IPC- 3.9.1.6 CTE Above and Below Tg The preferred method
TM-650, Method 2.4.18.3, the elongation shall be as indi- for determining CTE is IPC-TM-650, Method 2.4.24.5,
cated in the applicable specification sheet. method A or B.
3.9.1.3 Young’s Modulus For low strains and low fre- IPC-TM-650, Method 2.4.24.5, method A, provides a volu-
quency testing, storage modulus is equivalent to Young’s metric CTE for isotropic (unreinforced) materials, or z-axis
modulus. Storage modulus is correlated to hardness (see CTE for reinforced materials. IPC-TM-650, Method
6.2). When tested in accordance with IPC-TM-650, 2.24.4.5, method B, provides an in plane (x-y) CTE. Either
Method 2.4.18.3 or 2.4.24.4, the modulus shall be as indi- method A or B is adequate for unreinforced dielectrics.
cated in the applicable specification sheet. Perform both method A and B for reinforced dielectrics to
adequately describe the behavior of their materials.
3.9.1.4 Planarity When tested in accordance with IPC- When specimens are tested in accordance with IPC-TM-
TM-650, Method 2.2.21, the planarity shall be as indicated 650, Method 2.4.24.5, the CTE above and below the Tg
in the applicable specification sheet. shall be as indicated in the applicable specification sheet.
4104-3-4
Figure 3-4 Mechanical Requirements
14
3.9.2 Mechanical Requirements of Conductive Materi- method B, provides for an in-plane (x-y) CTE. When
als specimens are tested in accordance with IPC-TM-650,
Method 2.4.24.5, the CTE above and below the Tg shall be
3.9.2.1 Tensile Strength When specimens are tested in as indicated in the applicable specification sheet.
accordance with IPC-TM-650, Method 2.4.18.3, the tensile
strength shall be as indicated in the applicable specification 3.9.3 Mechanical Requirements of Dielectrics with Con-
sheet. ductive Materials Mechanical requirements for dielectric
materials shall be as in 3.9.1. Mechanical requirements for
3.9.2.2 Elongation When tested in accordance with IPC- conductive materials shall be as in 3.9.2.
TM-650, Method 2.4.18.3, the elongation shall be as indi-
cated in the applicable specification sheet. 3.10 Chemical Requirements See Figure 3-5 for a lay-
out of the chemical requirements of IPC-4104.
3.9.2.3 Young’s Modulus For low strains and low fre-
quency testing, storage modulus is equivalent to Young’s 3.10.1 Chemical Requirements of Dielectric Materials
modulus. Storage modulus is correlated to hardness (see
6.2). When tested in accordance with IPC-TM-650, 3.10.1.1 Flammability When specimens are tested in
Method 2.4.18.3, the modulus shall be as indicated in the accordance with UL 94, the flammability classification
applicable specification sheet. shall be as indicated on the applicable specification sheet.
The dielectric thickness and flame retardant core material
3.9.2.4 Glass Transition Temperature (T g) The pre- thickness may affect the flammability rating. The flame
ferred method for determining is TMA extension using retardant core material type may also affect this rating.
IPC-TM-650, Method 2.4.24.5, method A or B. If neither
method can be used because of specimen preparation diffi- 3.10.1.2 Relative Thermal Index (RTI) When specimens
culties or lack of sensitivity of the technique, a DSC are tested in accordance with the requirements in UL 796,
method shall be substituted (see IPC-TM-650, Method the RTI for electrical properties shall be as indicated in the
2.4.25). When specimens are tested in accordance with applicable specification sheet. RTI requirements can be
IPC-TM-650, Method 2.4.24.5, the Tg shall be as indicated exempt for applications intended for use in low voltage
in the applicable specification sheet. limited energy (LVLE) circuitry (see UL 796). The dielec-
tric thickness and the flame retardant core material thick-
3.9.2.5 CTE Above and Below Tg The preferred method ness may affect RTI value. The flame retardant core mate-
for determining CTE is TMA extension using IPC-TM- rial type may also affect RTI.
650, Method 2.4.24.5, method A or B.
3.10.2 Chemical Requirements of Conductive Materi-
IPC-TM-650, Method 2.4.24.5, method A, provides a volu- als There are no chemical requirements for conductive
metric CTE for isotropic materials, or z-axis CTE for materials.
anisotropic materials. IPC-TM-650, Method 2.4.24.5,
4104-3-5
Figure 3-5 Chemical Requirements
15
3.10.3 Chemical Requirements of Dielectrics with Con- 3.11.1.2 Loss Tangent and Range When specimens are
ductive Materials Chemical requirements for dielectric tested in accordance with IPC-TM-650, Method 2.5.5.9, at
materials shall be as in 3.10.1. Chemical requirements for 1 MHz, 100 MHz, and 1 GHz, the loss tangent range shall
conductive materials shall be as in 3.10.2. be as indicated in the applicable specification sheet.
3.10.4 Chemical Resistance of Dielectrics and Conduc- 3.11.1.3 Dielectric Strength When specimens are tested
tors It is not possible to establish a complete set of in accordance with IPC-TM-650, Method 2.5.6.1, the mini-
requirements for chemical resistance, since no material can mum dielectric strength shall be as indicated in the appli-
be expected to be resistant to all of the chemicals used in cable specification sheet.
the industry. Therefore, consultation should be made with
the supplier when chemicals and processes to be used are 3.11.2 Electrical Requirements of Conductive Materials
other than those specified in this standard and its associated
test method (see IPC-TM-650, Method 2.3.2). 3.11.2.1 Bulk or Volume Resistivity Conductive mate-
rial bulk resistance shall be determined by IPC-TM-650,
3.11 Electrical Requirements See Figure 3-6 for a lay- Method 2.5.17.2.
out of the electrical requirements of IPC-4104.
3.11.3 Electrical Requirements of Dielectric with Con-
3.11.1 Electrical Requirements of Dielectric Materials ductive Materials Electrical requirements for dielectric
materials shall be as in 3.11.1. Electrical requirements for
3.11.1.1 Dielectric Constant (Relative Permittivity) and conductive materials shall be as in 3.11.2.
Range When specimens are tested in accordance with
IPC-TM-650, Method 2.5.5.9, at 1 MHz, 100 MHz, and 1
GHz, the dielectric constant range shall be as indicated in
the applicable specification sheet.
4104-3-6
Figure 3-6 Electrical Requirements
16
3.12 Environmental Requirements See Figure 3-7 for a 650, Method 2.6.16.1, the material condition after test shall
layout of the environmental requirements of IPC-4104. be as indicated in the applicable specification sheet.
3.12.1 Environmental Requirements of Dielectric Mate- 3.12.2.2 Moisture and Water Absorption When the
rials specimens are tested in accordance with IPC-TM-650,
Method 2.6.2.1, the moisture absorption shall be as indi-
3.12.1.1 Surface Resistivity When specimens are tested cated in the applicable specification sheet.
in accordance with IPC-TM-650, Method 2.5.17.1, the
minimum moisture and insulation resistance shall be as 3.12.3 Environmental Requirements of Dielectrics with
indicated in the applicable specification sheet. Conductive Materials Environmental requirements for
dielectric materials shall be as in 3.12.1. Environmental
3.12.1.2 Volume Resistivity When specimens are tested requirements for conductive materials shall be as in 3.12.2.
in accordance with IPC-TM-650, Method 2.5.17.1, the
minimum insulation resistance shall be as indicated in the 3.13 Non-Nutrient All material shall not contribute to,
applicable specification sheet. support, or be degraded by biological growth when tested
as specified in IPC-TM-650, Method 2.6.1
3.12.1.3 Moisture Resistance by Pressure Vessel Test
When specimens are tested in accordance with IPC-TM- 3.14 Workmanship All material shall be supplied in
650, Method 2.6.16.1, the material condition after test shall such a manner as to be uniform in quality and free of
be as indicated in the applicable specification sheet. defects that will affect life, serviceability, processability, or
appearance as specified in 3.8 through 3.12.3.
3.12.1.4 Moisture and Water Absorption When speci-
mens are tested in accordance with IPC-TM-650, Method 3.15 Material Safety Data Sheets (MSDS) All materials
2.6.2.1, the moisture absorption shall be as indicated in the suppliers shall have available a material safety data sheet
applicable specification sheet. (MSDS) and other additional safety information as appro-
priate.
3.12.2 Environmental Requirements of Conductive
Materials 3.16 Shelf Life Shelf life and storage requirements shall
be specified by the supplier.
3.12.2.1 Moisture Resistance by Pressure Vessel Test
When specimens are tested in accordance with IPC-TM-
4104-3-7
Figure 3-7 Environmental Requirements
17
3.17 Marking All material shall have a unique lot num- whose thickness details will not affect test results will be
ber traceable to all raw materials and processing param- considered structurally similar.
eters. Each package shall contain evidence of compliance.
4.3.3 Tolerances Unless otherwise specified, all labora-
4 QUALITY ASSURANCE PROVISIONS tory equipment shall have tolerances of ± 5%.
4.1 Quality System A quality system shall be docu- 4.4 Quality Conformance Inspection Quality conform-
mented to support the conformance testing frequency ance inspection shall be as documented in the material
selected by the supplier. supplier’s manufacturing quality system. If a documented
quality system does not exist, conformance testing shall be
4.2 Responsibility for Inspection Unless otherwise conducted in accordance with Table 3-1. Additional testing
specified in the purchase order, the material supplier is required by the user may be included in the purchase order.
responsible for the performance of all the inspection Quality conformance inspection shall consist of group A,
requirements as specified herein. Except as otherwise B, C, and X inspection as follows:
specified in the purchase order, the material supplier may
Group A On a lot basis
use his own or any other facility suitable for the perfor-
Group B Every 12 months
mance of the inspection requirements herein, unless disap-
Group C One time for material qualification
proved by the procuring authority. The procuring authority
Group X Not required
reserves the right to perform any of the inspections set
forth in the specification where such inspections are Group C testing is required for qualification only. Group C
deemed necessary to assure supplies and service meet the properties are those properties that would be useful for
prescribed requirements. design and/or are characteristics of the material.
4.2.1 Test Equipment and Inspection Facilities Test 4.4.1 Frequency The frequency of conformance testing
and measuring equipment and inspection facilities of suffi- shall be as specified in the material supplier’s quality sys-
cient accuracy, quality, and quantity to permit performance tem, Table 3-1, or purchase order. Where lot is indicated in
of the required inspection shall be established and main- Table 3-1, only a random sample is selected for testing
tained by the material supplier. The establishment and (e.g., one sheet of laminate in the case of a copper clad
maintenance of a calibration system to control the accuracy material). Additional samples may be taken to satisfy the
of the measuring and test equipment shall utilize method- terms of the purchase order.
ology acceptable to all concerned parties. A calibration sys-
tem that controls the accuracy of measuring and test equip- 4.4.2 Inspection of Product for Delivery Inspection of
ment shall be in accordance with ANSI/NCSL Z540-1- product for delivery consists of testing material as defined
1994 or ISO 10012-1. by the method of examination in sufficient quantity to
achieve statistical confidence or by process control docu-
4.2.2 Standard Laboratory Conditions All inspection/ mentation of key process parameters correlated to product
testing shall be performed in accordance with the condi- performance testing and testing frequency requirements
tions specified in the applicable test method(s) or specifica- shall be required. The sample specimens shall be subjected
tion(s). Where inspection/test conditions are not specified, to the inspections specified in Table 3-1. Inspection of
a standard laboratory condition of 15°C to 35°C at ambient product for delivery shall consist of group A and B inspec-
air pressure and RH shall apply. tion. Products that have passed Group A inspection may be
shipped prior to obtaining the results of Group B inspec-
4.3 Qualification (Characterization) Testing tion.
4.3.1 Samples When required under the provisions of 4.4.3 Acceptance Criteria All sampled units shall meet
Table 3-1, samples shall be selected from normal produc- the requirements defined in 3.8.3 through 3.14, as required
tion for each material supplier’s brand type for which when tested in accordance with Table 3-1.
qualification is sought. The number of specimens required
for the individual test methods shall be as specified in the 4.4.4 Rejected Lots If an inspection lot is rejected, the
test method. Unless otherwise specified herein, samples material supplier may rework it to correct the defects or
shall be prepared in accordance with standard in-house screen out the defective units and resubmit for reinspec-
procedures. If a referee method is required, it shall be as tion. Resubmitted lots shall be separate from new lots and
agreed upon between PCB fabricator and material supplier. clearly identified as reinspected lots while the material is
within the material supplier’s facility. If the defect cannot
4.3.2 Structurally Similar Construction When testing be screened out, the material supplier shall sample addi-
products at the primary stage of manufacture, materials tional lots and make processing corrections as necessary. If
18
the additional lots inspected show the same defect, it shall 5 PREPARATION FOR DELIVERY
be the material supplier’s responsibility to contact the user
regarding the problem. 5.1 Packaging Materials shall be packed in a manner
that will afford adequate protection against corrosion, dete-
4.5 Statistical Process Control (SPC) SPC utilizes sys- rioration, and physical damage during shipment and stor-
tematic statistical techniques to analyze a process or its age. Containers shall conform to the requirements of the
outputs. The purpose of these analyses is to take appropri- consolidated freight classification rules in effect at the time
ate action to achieve and improve process capability. The of shipment, except the fiber board, when used, shall be
primary goal of SPC is to continually reduce variation in able to withstand storage, re-handling, and re-shipment
processes, products, or services in order to provide product without the necessity of re-packaging.
meeting or exceeding real or important customer require-
ments. Implementation of SPC shall be in accordance with 6 NOTES
IPC-PC-90. Depending on the progress made in imple-
menting SPC on a particular product, an individual supplier 6.1 Ordering Data Purchase orders should specify the
may demonstrate compliance to specification with any of following:
the following: A. Title, number, and revision letter of the specification
• Quality conformance evaluations B. Specification sheet number and revision level
• End-product control C. Specific exemptions to the specifications, if any
• In-process product control D. Title, number, and date of any applicable drawing
• Process parameter control E. Information for preparation of delivery, if applicable
(see section 5)
An individual supplier may choose to use a combination of
the four assurance techniques listed above to prove compli- F. Part identification and matching instructions
ance. G. Production inspection, if applicable (see 4.4)
H. Application level
Example
l. Thickness, width, and length of material (see paragraph
A product with 15 characteristics may meet specifications 3.8.4)
by quality conformance evaluations on two characteristics,
J. Other exceptions as agreed upon between user and sup-
in-process product evaluations on five characteristics, and
plier
process parameter control on five characteristics. The
remaining three characteristics meet specification by a
6.2 References Van Krevelen, D.W., ‘‘Properties of
combination of in-process control and quality conformance
Polymers, Their Estimation and Correlation with Chemical
evaluations. Evidence of compliance to the specification at
Structure,’’ Elsevier Science Publishing Company, Inc.,
the level of SPC implementation claimed is auditable by
1987, Chap. 25.
the customer or appointed third party.
Requirements are dynamic in nature and are based on what
is acceptable in the worldwide market. Requirements may
be stated as a reduction of variation around a target value,
as opposed to just meeting the specification, drawing, etc.
19
APPENDIX A
Specification Sheets for HDI and Microvia Materials
Following this appendix are the specification (slash) sheets Established requirements, where they exist, are listed in the
for HDI Materials, as outlined in 1.2. Each specification Requirements column. The Typical Values column is
sheet outlines engineering and performance data for the intended to reflect a range of values for each class of mate-
class of material that it represents. The specification sheets rial. It is based on information provided by the material
identify the type of material by following the format of 1.2. suppliers of the various classes of materials.
They also indicate the appropriate application level (H, I,
As more products become available within an individual
U), as outlined in 1.3. Certain materials may have more
class, the specification sheets will be added by the
than one application level.
Microvia/High Density Interconnect Subcommittee (D-42),
The specification sheets are based on information on mate- independent from revision of the document text.
rials available at the time this document was created. As
new materials become available, they will be added to
future revisions.
20
Specification Sheets for HDI and Microvia Materials
Specification Specification
Sheet # Description Sheet # Description
1 IN F 2 N 1 12 CI C 1 N 1 CF 1
Epoxy Photoimageable Dielectric Dry Film Epoxy Coated Foil
H, U
13 CI C 1 N 12 CF 1
2 IN L 2 N 1 Polyphenylene Ether Coated Foil
Epoxy Photoimageable Dielectric Liquid H
H, U
14 CD P 4
3 CD P 3 Conductive Printable Organometallic
Conductive Printable Transient Liquid Paste, Copper
Sintering Paste TBD
H, I
15 CD P 4
4 CD P 1 Conductive Printable Organometallic
Conductive Printable Silver Paste Paste, Silver
TBD TBD
5 CI R 1 A 1 CF 1 (Copper Clad) 16 IN F 2 N 1
or IN R 1 A 1 (Prepreg) Epoxy Photoimageable Dielectric Dry Film
Reinforced Nonwoven Aramid with H, I
Epoxy Resin
17 IN L 1 N 13
H, I
Polynorborene Dielectric Liquid
6 IN F 1 N 2 H, I
Epoxy Blend Dielectric Dry Film
18 IN L 1 N 1
H, I
Epoxy Blend Dielectric Liquid
7 IN L 2 N 1 H, I
Epoxy Photoimageable Dielectric Liquid
19 CI C 1 N 12 CF 1
H, I
Polyphenylene Ether Coated Foil
8 IN F 2 N 1 H
Epoxy Photoimageable Dielectric Dry Film
20 CI C 1 N 2 CF 1
H, I
Epoxy Blend Coated Foil
9 IN L 2 N 2 H, I
Epoxy Blend Photoimageable Dielectric
21 CI C 1 N 2 CF 1
Liquid
Epoxy Blend Coated Foil
H, I
H, I
10 IN L 2 N 2
22 CI L 1 N 1 CF 1
Epoxy Blend Photoimageable Dielectric
Epoxy Liquid/Epoxy Coated Foil
Liquid
H
H
23 CI R 1 A 3 CF 1 (Copper Clad)
11 IN L1 N 2
or IN R 1 A 3 (Prepreg)
Epoxy Blend Dielectric Liquid
Reinforced Nonwoven Aramid with
H
Polyimide Resin
H, I
21
Effective date: October 15, 1998
Specification Sheet
Specification Sheet # : IPC-4104/1
Designation : IN F 2 N 1 Epoxy Photoimageable Dielectric Dry Film
Application Level (H, I, U) : H, U
Test Method
Reference (IPC-TM-650
End Use Property Paragraph or Other) Requirement Typical Values
CONFORMANCE OF MATERIALS
1. Dielectric Constants (and one sigma) 3.11.1.1 2.5.5.9
A. at 1 MHz A. 3.9
B. at 100 MHZ B. TBD
C. at 1 GHz C. 3.15
2. Loss Tangent (and one sigma) 3.11.1.2 2.5.5.9
A. at 1 MHz A. 0.025
B. at 100 MHz B. TBD
C. at 1 GHz C. 0.020
3. Dielectric Strength* V/µm 3.11.1.3 2.5.6.1 >20 84
4. Surface Resistivity of Dielectric Materials, Ω 3.12.1.1 2.5.17.1 A. >3.5 E + 13
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 (21°C, 90%RH)
B. At elevated temperature (at RTI value) B. ≥1.0E + 9 B. TBD
5. Volume Resistivity of Dielectric Materials,* Ω-cm 3.12.1.2 2.5.17.1 A. >1.0 E + 14
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 (21°C, 46% RH)
6. Moisture Resistance by Pressure Vessel 3.12.1.3 2.6.16.1 Required TBD
3.12.2.1 only for IC
packaging
7. Volume Resistivity for Conductors, Ω-cm 3.11.2.1 2.5.17.2 NA
QUALIFICATION OF MATERIALS
8. Tg (Cure dependent), °C 3.9.1.5 2.4.24.4 130 (TMA, cured at 150°C)
3.9.2.4 2.4.24.5 150 (TMA, cured at 170°C)
2.4.25
9. CTE xy or CTE in-plane (T < Tg), ppm/°C 3.9.1.6 2.4.24.5 50
3.9.2.5
10. CTE xy or CTE in-plane (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 TBD
3.9.2.5
11. CTE z or Volume CTE (T < Tg), ppm/°C 3.9.1.6 2.4.24.5 50
3.9.2.5
12. CTE z or Volume CTE (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 TBD
3.9.2.5
13. Tensile Strength, MPa 3.9.1.1 2.4.18.3 44
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 2.5
3.9.2.2
15. Young’s Modulus (Hardness), GPa 3.9.1.3 2.4.18.3 33
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21
A. 0.1 mm trace width A. 95.8 (b = 18.29, c = 50)
B. 0.8 mm trace width B. 70 (b = 25.4, c = 50)
b = metal thickness (µm)
c = dielectric thickness (µm)
17. Moisture and Water Absorption, % 3.12.1.4 2.6.2.1 <0.5
3.12.2.2
18. Flammability* 3.10.1.1 UL 94 94 V-0
t = core thickness (mm) (t = 0.51, u = 25 to 64)
u = dielectric thickness per side (µm)
19. RTI*, °C 3.10.1.2 UL 796 Required for TBD
t = core thickness (mm) PCB only
c = dielectric thickness per side (µm)
*Property may be affected by dielectric and conductor thickness. May have to report low and high values.
22
Specification Sheet
Designation : IN L 2 1 Epoxy Photoimageable Dielectric Liquid
Application Level (H, I, U) : H, U
Test Method
A. at 1 MHz A. 3.9
C. at 1 GHz C. 3.15
A. at 1 MHz A. 0.025
C. at 1 GHz C. 0.020
4. Surface Resistivity of Dielectric Materials, Ω 3.12.1.1 2.5.17.1 A. >3.5 E + 13
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 (21°C, 90% RH)
5. Volume Resistivity of Dielectric Materials,* Ω-cm 3.12.1.2 2.5.17.1 A. >1.0 E + 14
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 (21°C, 46% RH)
packaging
8. Tg (Cure dependent), °C 3.9.1.5 2.4.24.4 130 (TMA, cured at 150°C)
3.9.2.4 2.4.24.5 150 (TMA, cured at 170°C)
2.4.25
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 2.5
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21
A. 0.1 mm trace width A. 89 (b = 29.7, c = 52)
B. 0.8 mm trace width B. 57 (b = 32, c = 52.8)
3.12.2.2
23
Effective date: December 17, 1998
Specification Sheet
Designation : CD P 3 Conductive Printable Transient Liquid Sintering Paste
Application Level (H, I, U) : H, I
Test Method
1. Dielectric Constants (and one sigma) 3.11.1.1 2.5.5.9 NA
A. at 1 MHz
B. at 100 MHZ
C. at 1 GHz
2. Loss Tangent (and one sigma) 3.11.1.2 2.5.5.9 NA
A. at 1 MHz
B. at 100 MHz
C. at 1 GHz
3. Dielectric Strength* V/µm 3.11.1.3 2.5.6.1 >20 NA
4. Surface Resistivity of Dielectric Materials, Ω 3.12.1.1 2.5.17.1 NA
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10
B. At elevated temperature (at RTI value) B. ≥1.0E + 9
5. Volume Resistivity of Dielectric Materials,* Ω-cm 3.12.1.2 2.5.17.1 NA
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12
6. Moisture Resistance by Pressure Vessel 3.12.1.3 2.6.16.1 Required NA
packaging
7. Volume Resistivity for Conductors, Ω-cm 3.11.2.1 2.5.17.2 3.5 x 10-5
8. Tg (Cure dependent), °C 3.9.1.5 2.4.24.4 NA
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
10. CTE xy or CTE in-plane (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 NA
3.9.2.5
3.9.2.5
12. CTE z or Volume CTE (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 NA
3.9.2.5
13. Tensile Strength, MPa 3.9.1.1 2.4.18.3 NA
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 NA
3.9.2.2
15. Young’s Modulus (Hardness), GPa 3.9.1.3 2.4.18.3 NA
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 NA
A. 0.1 mm trace width
B. 0.8 mm trace width
17. Moisture and Water Absorption, % 3.12.1.4 2.6.2.1 0.05
3.12.2.2
18. Flammability* 3.10.1.1 UL 94 NA
t = core thickness (mm)
19. RTI*, °C 3.10.1.2 UL 796 Required for NA
24
Effective date: November 20, 1998
Specification Sheet
Designation : CD P 1 Conductive Printable Silver Paste
Application Level (H, I, U) : TBD
Test Method
A. at 1 MHz
B. at 100 MHZ
C. at 1 GHz
A. at 1 MHz
B. at 100 MHz
C. at 1 GHz
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12
packaging
7. Volume Resistivity for Conductors, Ω-cm 3.11.2.1 2.5.17.2 0.00016
8. Tg (Cure dependent), °C 3.9.1.5 2.4.24.4 115
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
10. CTE xy or CTE in-plane (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 35
3.9.2.5
3.9.2.5
12. CTE z or Volume CTE (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 35
3.9.2.5
13. Tensile Strength, MPa 3.9.1.1 2.4.18.3 NA
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 NA
3.9.2.2
15. Young’s Modulus (Hardness), GPa 3.9.1.3 2.4.18.3 NA
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 NA
3.12.2.2
25
Specification Sheet
Designation : CI R 1 A 1 CF 1 (Copper Clad) or IN R 1 A 1 (Prepreg) Reinforced Nonwoven Aramid with Epoxy Resin
Test Method
A. at 1 MHz A. 3.9
B. at 100 MHZ B. 3.7
C. at 1 GHz C. 3.6
A. at 1 MHz A. 0.015
B. at 100 MHz B. 0.018
C. at 1 GHz C. 0.019
4. Surface Resistivity of Dielectric Materials, Ω 3.12.1.1 2.5.17.1
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 A. 1.0 E + 12
B. At elevated temperature (at RTI value) B. ≥1.0E + 9 B. 1.0 E + 11
5. Volume Resistivity of Dielectric Materials,* Ω-cm 3.12.1.2 2.5.17.1
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 A. 1.0 E + 13
packaging
7. Volume Resistivity for Conductors, Ω-cm 3.11.2.1 2.5.17.2 TBD
8. Tg (Cure dependent), °C 3.9.1.5 2.4.24.4 165 - 185
3.9.2.4 2.4.24.5
2.4.25
9. CTE xy or CTE in-plane (T < Tg), ppm/°C 3.9.1.6 2.4.24.5 8 to 12(1)
3.9.2.5
10. CTE xy or CTE in-plane (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 NA(2)
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 TBD
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 N/A
3.12.2.2
t = core thickness (mm) (t = 0.05, u = 50)
19. RTI*, °C 3.10.1.2 UL 796 Required for 105
t = core thickness (mm) PCB only (t = 0.05, c = 50)
1) In-plane CTE values based on 48% to 53% epoxy resin content by weight.
2) CTE becomes negative above Tg due to negative axial CTE of para-aramid fibers (-4.5 ppm/°C).
26
Effective date: January 27, 1998
Specification Sheet
Designation : IN F 1 N 2 Epoxy Blend Dielectric Dry Film
Test Method
A. at 1 MHz A. 3.43
B. at 100 MHZ B. 3.16
C. at 1 GHz C. 3.70
A. at 1 MHz A. 0.015
B. at 100 MHz B. 0.019
C. at 1 GHz C. 0.031
3. Dielectric Strength* V/µm 3.11.1.3 2.5.6.1 >20 145.8
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 A. 1.98 E + 14
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 A. 1.08 E + 16
6. Moisture Resistance by Pressure Vessel 3.12.1.3 2.6.16.1 Required PASS
packaging
8. Tg (Cure dependent), °C 3.9.1.5 2.4.24.4 180 (DSC)
3.9.2.4 2.4.24.5
2.4.25
9. CTE xy or CTE in-plane (T < Tg), ppm/°C 3.9.1.6 2.4.24.5 TBD
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 7.2
3.9.2.2
15. Young’s Modulus (Hardness), GPa 3.9.1.3 2.4.18.3 3.539
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 A. 100 (b = 35, c = 55)
A. 0.1 mm trace width B. 50 (b = 35, c = 55)
3.12.2.2
27
Effective date: August 12, 1998
Specification Sheet
Designation : IN L 2 N 1 Epoxy Photoimageable Dielectric Liquid
Test Method
A. at 1 MHz A. 3.0 (0.15)
B. at 100 MHZ B. 2.9 (0.14)
C. at 1 GHz C. 2.8 (0.14)
A. at 1 MHz A. 0.012
B. at 100 MHz B. 0.015
C. at 1 GHz C. 0.020
3. Dielectric Strength* V/µm 3.11.1.3 2.5.6.1 >20 >98
4. Surface Resistivity of Dielectric Materials, Ω 3.12.1.1 2.5.17.1 TBD
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10
5. Volume Resistivity of Dielectric Materials,* Ω-cm 3.12.1.2 2.5.17.1 TBD
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12
packaging
8. Tg (Cure dependent), °C 3.9.1.5 2.4.24.4 >150
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
10. CTE xy or CTE in-plane (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 >180
3.9.2.5
3.9.2.5
12. CTE z or Volume CTE (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 >180
3.9.2.5
13. Tensile Strength, MPa 3.9.1.1 2.4.18.3 68.9
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 4
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 A. 91.4 (b = 32, c = 46)
3.12.2.2
28
Effective date: January 27, 1998
Specification Sheet
Test Method
A. at 1 MHz A. 3.72
B. at 100 MHZ B. 3.32
C. at 1 GHz C. 3.19
A. at 1 MHz A. 0.026
B. at 100 MHz B. 0.026
C. at 1 GHz C. 0.026
3. Dielectric Strength* V/µm 3.11.1.3 2.5.6.1 >20 98.4
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 A. 5.4 E + 11
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 A. 1.5 E + 13
packaging
7. Volume Resistivity for Conductors, Ω-cm 3.11.2.1 2.5.17.2
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 9
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21
A. 0.1 mm trace width A. ± 13
B. 0.8 mm trace width B. TBD
3.12.2.2
t = core thickness (mm) (t = 0.3, u = 63.5)
t = core thickness (mm) PCB only (t = 0.3, c = 63.5)
29
Effective date: December 21, 1998
Specification Sheet
Designation : IN L 2 N 2 Epoxy Blend Photoimageable Dielectric Liquid
Test Method
A. at 1 MHz A. 3.88
B. at 100 MHZ B. 3.54
C. at 1 GHz C. 2.71
A. at 1 MHz A. 0.0288
B. at 100 MHz B. 0.0265
C. at 1 GHz C. 0.0198
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 A. 8.6E + 11
B. At elevated temperature (at RTI value) B. ≥1.0E + 9 B. 5.3E + 12
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 A. 1.2E + 14
packaging
8. Tg (Cure dependent), °C 3.9.1.5 2.4.24.4 160 to 165
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
3.9.2.5
11. CTE z or Volume CTE (T < Tg), ppm/°C 3.9.1.6 2.4.24.5 TBD
3.9.2.5
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 3.7
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 TBD
3.12.2.2
18. Flammability* 3.10.1.1 UL 94 TBD
30
Effective date: June 1, 1998
Specification Sheet
Designation : IN L 2 N 2 Epoxy Blend Photoimageable Dielectric Liquid
Application Level (H, I, U) : H
Test Method
A. at 1 MHz A. 3.27
B. at 100 MHZ B. 2.92
C. at 1 GHz C. 2.81
A. at 1 MHz A. 0.043
B. at 100 MHz B. 0.028
C. at 1 GHz C. 0.021
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 A. 4.40 x 1012
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 A. 3.0 x 1014
packaging
3.9.2.4 2.4.24.5
2.4.25
9. CTE xy or CTE in-plane (T < Tg), ppm/°C 3.9.1.6 2.4.24.5 66.4
3.9.2.5
10. CTE xy or CTE in-plane (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 271.3
3.9.2.5
11. CTE z or Volume CTE (T < Tg), ppm/°C 3.9.1.6 2.4.24.5 66.4
3.9.2.5
12. CTE z or Volume CTE (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 271.3
3.9.2.5
13. Tensile Strength, MPa 3.9.1.1 2.4.18.3 TBD
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 4.20
3.9.2.2
15. Young’s Modulus (Hardness), GPa 3.9.1.3 2.4.18.3 TBD
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21
A. 0.1 mm trace width A. >93 (b = 35, c = 50)
B. 0.8 mm trace width B. >90 (b = 35, c = 50)
3.12.2.2
31
Effective date: June 1, 1998
Specification Sheet
Designation : IN L1 N 2 Epoxy Blend Dielectric Liquid
Test Method
A. at 1 MHz A. 3.27
B. at 100 MHZ B. 2.97
C. at 1 GHz C. 2.85
A. at 1 MHz A. 0.026
B. at 100 MHz B. 0.031
C. at 1 GHz C. 0.030
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 A. 5.50 x 1012
B. At elevated temperature (at RTI value) B. ≥1.0E + 9 B. 6.20 x 1011
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 A. 7.50 x 1015
B. At elevated temperature (at RTI value) B. ≥1.0E + 9 B. 6.2 x E + 12
packaging
3.9.2.4 2.4.24.5
2.4.25
9. CTE xy or CTE in-plane (T < Tg), ppm/°C 3.9.1.6 2.4.24.5 50.2
3.9.2.5
10. CTE xy or CTE in-plane (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 348.0
3.9.2.5
11. CTE z or Volume CTE (T < Tg), ppm/°C 3.9.1.6 2.4.24.5 50.2
3.9.2.5
12. CTE z or Volume CTE (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 348.0
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 2.20
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21
A. 0.1 mm trace width A. >93
B. 0.8 mm trace width (b = 0.035, c = 0.05)
b = metal thickness (µm) B. >90
c = dielectric thickness (µm) (b = 0.35, c = 0.05)
17. Moisture and Water Absorption, % 3.12.1.4 2.6.2.1 0.30 to 0.90
3.12.2.2
32
Specification Sheet
Designation : CI C 1 N 1 CF 1 Epoxy Coated Foil
Test Method
A. at 1 MHz A. 3.5
B. at 100 MHZ B. 3.4
C. at 1 GHz C. 3.4
A. at 1 MHz A. 0.02
B. at 100 MHz B. 0.02
C. at 1 GHz C. TBD
3. Dielectric Strength* V/µm 3.11.1.3 2.5.6.1 >20 >39.4
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12
packaging
8. Tg (Cure dependent), °C 3.9.1.5 2.4.24.4 >140
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 TBD
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 TBD
17. Moisture and Water Absorption, % 3.12.1.4 2.6.2.1 TBD
3.12.2.2
t = core thickness (mm) PCB only (t = TBD, c = TBD)
33
Specification Sheet
Designation : CI C 1 N 12 CF 1 Polyphenylene Ether Coated Foil
Test Method
A. at 1 MHz A. 2.8
C. at 1 GHz C. TBD
A. at 1 MHz A. 0.0003
C. at 1 GHz C. TBD
3. Dielectric Strength* V/µm 3.11.1.3 2.5.6.1 >20 >39.4
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12
packaging
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 TBD
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 TBD
3.12.2.2
t = core thickness (mm) (t = TBD, u = TBD)
34
Specification Sheet
Designation : CD P 4 Conductive Printable Organometallic Paste, Copper
Test Method
A. at 1 MHz
B. at 100 MHZ
C. at 1 GHz
A. at 1 MHz
B. at 100 MHz
C. at 1 GHz
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12
packaging
3.9.2.4 2.4.24.5
2.4.25
9. CTE xy or CTE in-plane (T < Tg), ppm/°C 3.9.1.6 2.4.24.5 17**
3.9.2.5
10. CTE xy or CTE in-plane (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 17**
3.9.2.5
11. CTE z or Volume CTE (T < Tg), ppm/°C 3.9.1.6 2.4.24.5 50**
3.9.2.5
12. CTE z or Volume CTE (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 50**
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 TBD
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 NA
3.12.2.2
**Properties are the same as bulk copper.
35
Specification Sheet
Designation : CD P 4 Conductive Printable Organometallic Paste, Silver
Test Method
A. at 1 MHz
B. at 100 MHZ
C. at 1 GHz
A. at 1 MHz
B. at 100 MHz
C. at 1 GHz
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12
packaging
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
10. CTE xy or CTE in-plane (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 19**
3.9.2.5
3.9.2.5
12. CTE z or Volume CTE (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 57**
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 TBD
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 NA
3.12.2.2
**Properties are the same as bulk silver.
36
Specification Sheet
Test Method
A. at 1 MHz A. 3.0
B. at 100 MHZ B. 2.8
C. at 1 GHz C. 2.7
A. at 1 MHz A. 0.038
B. at 100 MHz B. 0.015
C. at 1 GHz C. 0.014
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 A. 2.3 E 11
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 A. 1.73 E 13
packaging
8. Tg (Cure dependent), °C 3.9.1.5 2.4.24.4 <170
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
10. CTE xy or CTE in-plane (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 >180
3.9.2.5
3.9.2.5
12. CTE z or Volume CTE (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 >180
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 4
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 A. 90 (b = 18.2, c = 50)
3.12.2.2
37
Effective date: August 19, 1998
Specification Sheet
Designation : IN L 1 N 13 Polynorborene Dielectric Liquid
Test Method
A. at 1 MHz A. 2.56 (± 0.006)
B. at 100 MHZ B. 2.54 (± 0.026)
C. at 1 GHz C. 2.54 (± 0.026)
A. at 1 MHz A. 0.002
B. at 100 MHz B. 0.002
C. at 1 GHz C. 0.002
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 A. >1.0 E + 15
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 A. >1.0 E + 16
packaging
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
10. CTE xy or CTE in-plane (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 NA
3.9.2.5
3.9.2.5
12. CTE z or Volume CTE (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 NA
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 20
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 A. 70 (b = 3.5, c = 6)
3.12.2.2
**CTE by wafer bending measurement method (MCM Handbook).
38
Effective date: September 1998
Specification Sheet
Designation : IN L 1 N 1 Epoxy Blend Dielectric Liquid
Test Method
A. at 1 MHz A. 2.83
B. at 100 MHZ B. 2.63
C. at 1 GHz C. 2.28
A. at 1 MHz A. 0.0254
B. at 100 MHz B. 0.0214
C. at 1 GHz C. 0.0142
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 A. 1.6E + 10
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 A. 2.0E + 13
packaging
8. Tg (Cure dependent), °C 3.9.1.5 2.4.24.4 150 to 155
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 33.50
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 A. 0.14
A. 0.1 mm trace width (b = TBD, c = TBD)
B. 0.8 mm trace width B. TBD
3.12.2.2
t = core thickness (mm) (t = 0.2, u = TBD)
39
Specification Sheet
Designation : CI C 1 N 12 CF 1 Polyphenylene Ether Coated Foil
Test Method
A. at 1 MHz A. 2.8
C. at 1 GHz C. TBD
A. at 1 MHz A. 0.0002
C. at 1 GHz C. TBD
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12
packaging
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 TBD
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 TBD
3.12.2.2
t = core thickness (mm) (t = TBD, u = TBD)
40
Specification Sheet
Designation : CI C 1 N 2 CF 1 Epoxy Blend Coated Foil
Test Method
A. at 1 MHz A. 4.0
B. at 100 MHZ B. 3.6
C. at 1 GHz C. 3.4
A. at 1 MHz A. 0.028
B. at 100 MHz B. 0.026
C. at 1 GHz C. 0.025
3. Dielectric Strength* V/µm 3.11.1.3 2.5.6.1 >20 TBD
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 A. 1.0E + 14
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 A. 1.0E + 15
packaging
8. Tg (Cure dependent), °C 3.9.1.5 2.4.24.4 180 (DMA)
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 4.6
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 TBD
3.12.2.2
41
Specification Sheet
Designation : CI C 1 N 2 CF 1 Epoxy Blend Coated Foil
Test Method
A. at 1 MHz A. 4.0
B. at 100 MHZ B. 3.6
C. at 1 GHz C. 3.4
A. at 1 MHz A. 0.028
B. at 100 MHz B. 0.026
C. at 1 GHz C. 0.025
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 A. 1.0E + 14
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 A. 1.0E + 15
packaging
8. Tg (Cure dependent), °C 3.9.1.5 2.4.24.4 150 (DMA)
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 TBD
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 TBD
3.12.2.2
42
Effective date: February 13, 1999
Specification Sheet
Designation : CI L 1 N 1 CF 1 Epoxy Liquid/Epoxy Coated Foil
Test Method
1. Dielectric Constants (and one sigma) 3.11.1.1 2.5.5.9 4.2
A. at 1 MHz 4.0
B. at 100 MHZ 3.9
C. at 1 GHz
2. Loss Tangent (and one sigma) 3.11.1.2 2.5.5.9 0.025
A. at 1 MHz 0.023
B. at 100 MHz 0.022
C. at 1 GHz
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 A. 4.0 x 108
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 A. 2.5 x 1010
packaging
7. Volume Resistivity for Conductors, Ω-cm 3.11.2.1 2.5.17.2 N/A
3.9.2.4 2.4.24.5
2.4.25
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 4.8
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 TBD
3.12.2.2
t = core thickness (mm) (e = 0.1, u = 40)
43
Specification Sheet
Designation : CI R 1 A 3 CF 1 (Copper Clad) or IN R 1 A 1 (Prepreg) Reinforced Nonwoven Aramid with Epoxy Resin
Test Method
A. at 1 MHz A. 3.9
B. at 100 MHZ B. 3.7
C. at 1 GHz C. 3.6
A. at 1 MHz A. 0.015
B. at 100 MHz B. 0.018
C. at 1 GHz C. 0.019
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 10 A. 1.0 E + 12
A. 96 hours / 35°C / 90% RH A. ≥1.0E + 12 A. 1.0 E + 13
packaging
3.9.2.4 2.4.24.5
2.4.25
9. CTE xy or CTE in-plane (T < Tg), ppm/°C 3.9.1.6 2.4.24.5 8 to 12(1)
3.9.2.5
10. CTE xy or CTE in-plane (T > Tg), ppm/°C 3.9.1.6 2.4.24.5 NA(2)
3.9.2.5
3.9.2.5
3.9.2.5
3.9.2.1
14. Elongation, % 3.9.1.2 2.4.18.3 TBD
3.9.2.2
3.9.2.3 2.4.24.4
16. Planarity*, % 3.9.1.4 2.2.21 N/A
3.12.2.2
1) In-plane CTE values based on 48% to 53% epoxy resin content by weight.
2) CTE becomes negative above Tg due to negative axial CTE of para-aramid fibers (-4.5 ppm/°C).
44
ANSI/IPC-T-50 Terms and Definitions for

Interconnecting and Packaging Electronic Circuits
Definition Submission/Approval Sheet
The purpose of this form is to keep SUBMITTOR INFORMATION:
current with terms routinely used in Name:
the industry and their definitions.
Individuals or companies are Company:
invited to comment. Please
City:
complete this form and return to:
IPC State/Zip:
2215 Sanders Road Telephone:
Northbrook, IL 60062-6135
Fax: 847 509.9798 Date:
❑ This is a NEW term and definition being submitted.

❑ This is an ADDITION to an existing term and definition(s).
❑ This is a CHANGE to an existing definition.
Term Definition
If space not adequate, use reverse side or attach additional sheet(s).
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❑ Included: Electronic File Name:
Document(s) to which this term applies:
Committees affected by this term:
Office Use
IPC Office Committee 2-30
Date Received: Date of Initial Review:
Comments Collated: Comment Resolution:
Returned for Action: Committee Action: ❑ Accepted ❑ Rejected
Revision Inclusion: ❑ Accept Modify
IEC Classification
Classification Code • Serial Number
Terms and Definition Committee Final Approval Authorization:
Committee 2-30 has approved the above term for release in the next revision.
Name: Committee: IPC 2-30 Date:
IPC World Wide Web Page www.ipc.org

Our home page provides access to information about upcoming events, publications and videos, membership,
and industry activities and services. Visit soon and often.
Education and Training

IPC conducts local educational workshops and national conferences to help you better understand emerging
technologies. National conferences have covered Ball Grid Array and Flip Chip/Chip Scale Packaging. Some
workshop topics include:
Printed Wiring Board Fundamentals High Speed Design
Troubleshooting the PWB Manufacturing Process Design for Manufacturability
Choosing the Right Base Material Laminate Design for Assembly
Acceptability of Printed Boards Designers Certification Preparation
New Design Standards
IPC video tapes and CD-ROMs can increase your industry know-how and on the job effectiveness.
For more information on programs, contact John Riley
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For more information on IPC Video/CD Training, contact Mark Pritchard
tel 505/758-7937 ext. 202 fax 505/758-7938
e-mail: markp@ipcvideo.org www.ipc.org
Training and Certification

IPC-A-610 Training and Certification Program
“The Acceptability of Electronic Assemblies” (ANSI/IPC-A-610) is the most widely used specification for the
PWB assembly industry. An industry consensus Training and Certification program based on the IPC-A-610 is
available to your company.
For more information, contact John Riley
tel 847/790-5308 fax 847/509-9798
e-mail: rilejo@ipc.org www.ipc.org/html/610.htm
IPC Printed Circuits Expo

IPC Printed Circuits Expo is the largest trade exhibition in North America devoted to the PWB industry. Over 90
technical presentations make up this superior technical conference.
March 16-18, 1999 April 4-6, 2000

Long Beach, California San Diego, California
For exhibitor information, For registration information:

Contact: Ken Romeo tel 847/790-5361 fax 847/509-9798
tel 630-434-7779 e-mail: registration@ipc.org www.ipc.org
How to Get Involved

The first step is to join IPC. An application for membership can be found on page 74. Once you become a
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our industry’s best while you help develop the standards for our industry. Participate in market research
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For information on how to get involved, contact:
Jeanette Ferdman, Membership Manager
tel 847/790-5309 fax 847/509-9798
e-mail: JeanetteFerdman@ipc.org www.ipc.org
Application for Site

ELECTRONICS INDUSTRIES Membership
Thank you for your decision to join IPC. IPC Membership is site specific, which
means that IPC member benefits are available to all individuals employed at the
PLEASE CHECK site designated on the other side of this application.
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To help IPC serve your member site in the most efficient manner possible, please
tell us what your facility does by choosing the most appropriate member category.
CATEGORY
■ Our facility manufactures and sells to other companies, printed wiring boards or other electronic
INDEPENDENT interconnection products on the merchant market.
PRINTED
BOARD WHAT PRODUCTS DO YOU
MANUFACTURERS MAKE FOR SALE?
■ One-sided and two-sided rigid ■ Flexible printed boards ■ Discrete wiring devices
printed boards ■ Flat cable ■ Other interconnections
■ Multilayer printed boards ■ Hybrid circuits
Name of Chief Executive

Officer/President___________________________________________________________________
Our facility assembles printed wiring boards on a contract basis and/or offers other electronic
■ interconnection products for sale.
INDEPENDENT
PRINTED BOARD ■ Turnkey ■ Through-hole ■ Consignment
ASSEMBLERS ■ SMT ■ Mixed Technology ■ BGA
EMSI ■ Chip Scale Technology
COMPANIES
Name of Chief Executive

Officer/President___________________________________________________________________
■ Our facility purchases, uses and/or manufactures printed wiring boards or other electronic interconnection
OEM – products for our own use in a final product. Also known as original equipment manufacturers (OEM).
MANUFACTURERS
OF ANY END IS YOUR INTEREST IN:
PRODUCT USING ■ purchasing/manufacture of printed circuit boards

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OR CAPTIVE
MANUFACTURERS What is your company’s main product line?
OF PCBS/PCAS
_________________________________________________________________________________
■ Our facility supplies raw materials, machinery, equipment or services used in the manufacture or
INDUSTRY assembly of electronic interconnection products.
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Specification for High

2215 Sanders Road, Northbrook, IL 60062-6135

Thank you for your continued support.

Specification for High

Developed by the Microvia/High Density Interconnect Materials

May 19, 1999

Users of this standard are encouraged to participate in the

May 1999 IPC/JPCA-4104

IPC High Density IPC Microvia/High Density TechnicaL Liaison of the

JPCA Build-Up JPCA Build-Up

Microvia/High Density Interconnect Materials Subcommittee

IPC/JPCA-4104 May 1999

JPCA Build-Up PWB Committee

May 1999 IPC/JPCA-4104

IPC/JPCA-4104 May 1999

5 PREPARATION FOR DELIVERY.............................. 19 Figure 3-4 Mechanical Requirements ............................... 14

May 1999 IPC/JPCA-4104

Specification for High Density

1 SCOPE The materials contained in this standard represent general

IPC/JPCA-4104 May 1999

Figure 1-1 Cross-Section of a General HDI with Microvias

Mechanically Drilled - 1 Wet Etched - 2, 3, 6 Insulation Displacement - 8

Figure 1-2 Cross-Sectional Views of Methods to Make HDI with Microvias

May 1999 IPC/JPCA-4104

1.2.1 Dielectric Insulator Designations

Example The sample from Table 1-1 will be written as IN F 1 N 1.

Level 1 IN = Material Type Level 5 Chemistry

IPC/JPCA-4104 May 1999

1.2.2 Conductor Designations

Level 1 CD = Material Type Printable Paste (P):

May 1999 IPC/JPCA-4104

1.2.3 Dielectric with Conductor Designations

Level 1 CI = Material Type Level 6 Type of metal/conductor

IPC/JPCA-4104 May 1999

1.3 Application Levels All applications for microvias

IPC-PC-90 General Requirements for Implementation of

IPC-MF-150 Metal Foil for Printed Wiring Applications

IPC-TM-650 Test Methods Manual

1. IPC, 2215 Sanders Rd., Northbrook, IL 60062-6135, 847-509-9700, www.ipc.org

May 1999 IPC/JPCA-4104

2. ASTM, 100 Barr Harbor Dr., West Conshohocken, PA 19428-2959

IPC/JPCA-4104 May 1999

Table 3-1 Reference Information and Test Frequency of Materials

May 1999 IPC/JPCA-4104

3.6 Conflict In the event of conflict, the following order

Figure 3-1 Layout of Materials Section

IPC/JPCA-4104 May 1999

May 1999 IPC/JPCA-4104

3.8.1.2 General Acceptability of Conductive Materials Voids 8 3 AABUS

3.8.3 Visual Properties See Figure 3-2 for a layout of

Figure 3-2 Visual Properties

IPC/JPCA-4104 May 1999

May 1999 IPC/JPCA-4104

Figure 3-3 Dimensional Requirements

IPC/JPCA-4104 May 1999

Figure 3-4 Mechanical Requirements

May 1999 IPC/JPCA-4104

Figure 3-5 Chemical Requirements

IPC/JPCA-4104 May 1999