research-article

Statistical Peak Temperature Prediction and Thermal Yield Improvement for 3D Chip Multiprocessors

Authors:

Siddharth Garg,

Diana MarculescuAuthors Info & Claims

ACM Transactions on Design Automation of Electronic Systems (TODAES), Volume 19, Issue 4

Article No.: 39, Pages 1 - 23

https://doi.org/10.1145/2633606

Published: 29 August 2014 Publication History

Abstract

Thermal issues have become critical roadblocks for achieving highly reliable three-dimensional (3D) integrated circuits (ICs). The presence of process variations further exacerbates these problems. In this article, we propose techniques for the efficient evaluation and mitigation of the impact of leakage power variations on the temperature profile of 3D Chip Multiprocessors (CMPs). Experimental results demonstrate that, due to the impact of process variations, a 4-tier 3D implementation can be more than 40ˆC hotter and 23% leakier than its 2D counterpart. To determine the maximum temperature of each fabricated 3D IC, we propose an accurate learning-based model for peak temperature prediction. Based on the learning model, we then propose two post-fabrication techniques to increase the thermal yield of 3D CMPs: (1) tier restacking and (2) thermally-aware die matching. Experimental results show that: (1) the proposed prediction model achieves more than 98% accuracy, and (2) the proposed thermally-aware, post-fabrication optimization techniques significantly improve the thermal yield from only 51% to 99% for 3D CMPs.

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Cited By

Niknam SShen YPathania APimentel A(2023)3D-TTP: Efficient Transient Temperature-Aware Power Budgeting for 3D-Stacked Processor-Memory Systems2023 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)10.1109/ISVLSI59464.2023.10238664(1-6)Online publication date: 20-Jun-2023
https://doi.org/10.1109/ISVLSI59464.2023.10238664
Siavashi AMomtazpour M(2022)Yield-aware joint die packing, die matching and static thread mapping for hard real-time 3D embedded CMPsMicroprocessors & Microsystems10.1016/j.micpro.2022.10454392:COnline publication date: 1-Jul-2022
https://dl.acm.org/doi/10.1016/j.micpro.2022.104543
Siddhu LKedia RPanda P(2020)Leakage-Aware Dynamic Thermal Management of 3D MemoriesACM Transactions on Design Automation of Electronic Systems10.1145/341946826:2(1-31)Online publication date: 23-Oct-2020
https://dl.acm.org/doi/10.1145/3419468
Show More Cited By

Index Terms

Statistical Peak Temperature Prediction and Thermal Yield Improvement for 3D Chip Multiprocessors
1. Hardware
  1. Robustness

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Published In

cover image ACM Transactions on Design Automation of Electronic Systems

ACM Transactions on Design Automation of Electronic Systems Volume 19, Issue 4

August 2014

246 pages

ISSN:1084-4309

EISSN:1557-7309

DOI:10.1145/2663459

Editor:
Naehyuck Chang
Korea Advanced Institute of Science and Technology, Korea

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Copyright © 2014 ACM.

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ACM Journals for the Design of Smart and Connected Systems

Publication History

Published: 29 August 2014

Accepted: 01 April 2014

Revised: 01 April 2014

Received: 01 December 2012

Published in TODAES Volume 19, Issue 4

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Cited By

Niknam SShen YPathania APimentel A(2023)3D-TTP: Efficient Transient Temperature-Aware Power Budgeting for 3D-Stacked Processor-Memory Systems2023 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)10.1109/ISVLSI59464.2023.10238664(1-6)Online publication date: 20-Jun-2023
https://doi.org/10.1109/ISVLSI59464.2023.10238664
Siavashi AMomtazpour M(2022)Yield-aware joint die packing, die matching and static thread mapping for hard real-time 3D embedded CMPsMicroprocessors & Microsystems10.1016/j.micpro.2022.10454392:COnline publication date: 1-Jul-2022
https://dl.acm.org/doi/10.1016/j.micpro.2022.104543
Siddhu LKedia RPanda P(2020)Leakage-Aware Dynamic Thermal Management of 3D MemoriesACM Transactions on Design Automation of Electronic Systems10.1145/341946826:2(1-31)Online publication date: 23-Oct-2020
https://dl.acm.org/doi/10.1145/3419468
Cui YCao KLi LZhou JWei THu S(2020)Augmented Cross-Entropy-Based Joint Temperature Optimization of Real-Time 3-D MPSoC SystemsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2019.293932839:10(1987-1999)Online publication date: Oct-2020
https://doi.org/10.1109/TCAD.2019.2939328
Siddhu LPanda P(2019)PredictNcoolACM Transactions on Embedded Computing Systems10.1145/335820818:5s(1-22)Online publication date: 8-Oct-2019
https://dl.acm.org/doi/10.1145/3358208
Sultan HChauhan ASarangi S(2019)A Survey of Chip-level Thermal SimulatorsACM Computing Surveys10.1145/330954452:2(1-35)Online publication date: 30-Apr-2019
https://dl.acm.org/doi/10.1145/3309544
Ababei CMoghaddam M(2019)A Survey of Prediction and Classification Techniques in Multicore Processor SystemsIEEE Transactions on Parallel and Distributed Systems10.1109/TPDS.2018.287869930:5(1184-1200)Online publication date: 1-May-2019
https://doi.org/10.1109/TPDS.2018.2878699
Lee DDas SPande P(2019)Analyzing power-thermal-performance trade-offs in a high-performance 3D NoC architectureIntegration, the VLSI Journal10.1016/j.vlsi.2017.12.00265:C(282-292)Online publication date: 1-Mar-2019
https://dl.acm.org/doi/10.1016/j.vlsi.2017.12.002
Lee DDas SDoppa JPande PChakrabarty K(2018)Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-ChipACM Transactions on Design Automation of Electronic Systems10.1145/322304623:5(1-25)Online publication date: 22-Aug-2018
https://dl.acm.org/doi/10.1145/3223046
Dongjin Lee Das SPande P(2017)Performance-thermal trade-offs for a VFI-enabled 3D NoC architecture2017 18th International Symposium on Quality Electronic Design (ISQED)10.1109/ISQED.2017.7918327(271-276)Online publication date: Mar-2017
https://doi.org/10.1109/ISQED.2017.7918327
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