survey

Security of Electrical, Optical, and Wireless On-chip Interconnects: A Survey

Authors:

Hansika Weerasena,

Prabhat MishraAuthors Info & Claims

ACM Transactions on Design Automation of Electronic Systems, Volume 29, Issue 2

Article No.: 40, Pages 1 - 41

https://doi.org/10.1145/3631117

Published: 14 February 2024 Publication History

Abstract

The advancement of manufacturing technologies has enabled the integration of more intellectual property (IP) cores on the same system-on-chip (SoC). Scalable and high throughput on-chip communication architecture has become a vital component in today’s SoCs. Diverse technologies such as electrical, wireless, optical, and hybrid are available for on-chip communication with different architectures supporting them. On-chip communication sub-system is shared across all the IPs and continuously used throughout the lifetime of the SoC. Therefore, the security of the on-chip communication is crucial, because exploiting any vulnerability would be a goldmine for an attacker. In this survey, we provide a comprehensive review of threat models, attacks, and countermeasures over diverse on-chip communication technologies as well as sophisticated architectures.

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Weerasena HMishra P(2024)Breaking On-Chip Communication Anonymity Using Flow Correlation AttacksACM Journal on Emerging Technologies in Computing Systems10.1145/367703420:4(1-27)Online publication date: 10-Jul-2024
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Index Terms

Security of Electrical, Optical, and Wireless On-chip Interconnects: A Survey
1. Networks
  1. Network types
    1. Network on chip
2. Security and privacy
  1. Network security
    1. Security protocols
  2. Security in hardware
    1. Hardware attacks and countermeasures

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cover image ACM Transactions on Design Automation of Electronic Systems

ACM Transactions on Design Automation of Electronic Systems Volume 29, Issue 2

March 2024

438 pages

EISSN:1557-7309

DOI:10.1145/3613564

Editor:
Jiang Hu
Texas A&M University, USA

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Publication History

Published: 14 February 2024

Online AM: 30 October 2023

Accepted: 20 October 2023

Revised: 15 September 2023

Received: 30 March 2023

Published in TODAES Volume 29, Issue 2

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Cited By

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https://dl.acm.org/doi/10.1145/3688001
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