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In presence of aortic stenosis, a jet is produced downstream of the aortic valve annulus during systole. The vena contracta corresponds to the location where the cross-sectional area of the flow jet is minimal. The maximal transvalvular... more
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Abstract—The current proliferation of mobile devices has resulted in a large diversity of hardware specifications, each designed for different services and applications (e.g. cell phones, smart phones, PDAs). At the same time, e-mail... more
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A semi-empirical model has been elaborated for analyzing and predicting the flow characteristics of small electro-pneumatic (EP) valves within a wide range of pressure ratio. As a basis for characterization of flow coefficient, an... more
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This paper presents a design optimization problem reformulation method based on Singular Value Decomposition (SVD), dimensionality reduction, and unsupervised clustering. The method calculates linear approximations of the associative... more
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Needles with asymmetric bevel tips naturally bend when they are inserted into soft tissue. In this study, we present an analytical model for the loads developed at the bevel tip during needle-tissue interaction. The model calculates the... more
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We discuss some theoretical models for vital signs monitoring by using a UWB radar. Focusing attention on the respiration and heartbeat signals, we show the impact of relevant parameters, like the sampling time interval, on the ability to... more
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The results are presented for an experiment that compares the difference between a one- and two-step reaction setup using 1 GeV protons. The rates of production from an on-line isotope separator target containing UCx are measured for... more
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The corrosion of metallic reinforcement is a major threat to aging infrastructure. Prestressed structures such as the bridges built in the early 1950's and 1960's are showing signs of deterioration. The current corrosion... more
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One key failure root cause during wafer production is the electrical test by probing all interconnects of each die of the wafer. The probing process can result in excessive damage of the back end of line (BEOL) wafer layers underneath the... more
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