P4NC60
P4NC60
P4NC60
ID 4.2 A 4.2 A
TYPICAL RDS(on) = 1.8 EXTREMELY HIGH dv/dt CAPABILITY 100% AVALANCHE TESTED NEW HIGH VOLTAGE BENCHMARK GATE CHARGE MINIMIZED
1
3 2
1 2
DESCRIPTION The PowerMESH is the evolution of the first generation of MESH OVERLAY. The layout refinements introduced greatly improve the Ron*area figure of merit while keeping the device at the leading edge for what concerns switching speed, gate charge and ruggedness. APPLICATIONS s HIGH CURRENT, HIGH SPEED SWITCHING s SWITH MODE POWER SUPPLIES (SMPS) s DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVER
TO-220
T0-220FP
Value ST P4NC60 STP4NC60F P 600 600 30 4.2 2.6 16.8 100 0.8 3 -65 to 150 150
( 1) ISD 4.2A, di/dt 200 A/s, VDD V(BR)DSS, Tj TJMAX
C C
() Pulse width limited by safe operating area (*) Limited only by maximum temperature allowed
October 1999
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THERMAL DATA
TO-220 R thj -case Thermal Resistance Junction-case Max 1.25 62.5 0.5 300 TO-220FP 3.57
o o o
Rthj-amb Thermal Resistance Junction-ambient Max R thc-sink Thermal Resistance Case-sink Typ Tl Maximum Lead Temperature F or Soldering Purpose
AVALANCHE CHARACTERISTICS
Symbol IAR E AS Parameter Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by Tj max) Single Pulse Avalanche Energy (starting Tj = 25 o C, ID = IAR , V DD = 50 V) Max Value 4.2 160 Unit A mJ
V DS = Max Rating Zero Gate Voltage Drain Current (V GS = 0) V DS = Max Rating Gate-body Leakage Current (VDS = 0) V GS = 30 V
T c = 125 oC
ON ()
Symbol V GS(th) R DS(on) I D(o n) Parameter Gate Threshold Voltage V DS = V GS Static Drain-source On Resistance On State Drain Current V GS = 10V Test Conditions ID = 250 A ID = 2 A 4.2 Min. 2 Typ. 3 1.8 Max. 4 2.2 Unit V A
DYNAMIC
Symbol g f s ( ) C iss C os s C rss Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Test Conditions V DS > ID(o n) x R DS(on )ma x V DS = 25 V f = 1 MHz ID = 2 A V GS = 0 Min. Typ. 3 700 100 9 Max. Unit S pF pF pF
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STP4NC60/FP
ELECTRICAL CHARACTERISTICS (continued) SWITCHING ON
Symbol t d(on) tr Qg Q gs Q gd Parameter Turn-on Time Rise Time Total G ate Charge Gate-Source Charge Gate-Drain Charge Test Conditions V DD = 300 V I D = 2 A R G = 4.7 V GS = 10 V (see test circuit, figure 3) V DD = 480 V I D = 4.2 A VGS = 10 V Min. Typ. 12 10 18 6 8 25 Max. Unit ns ns nC nC nC
SWITCHING OFF
Symbol tr (Voff) tf tc Parameter Off-voltage Rise T ime Fall T ime Cross-over Time Test Conditions V DD = 480 V I D = 4.2 A R G = 4.7 VGS = 10 V (see test circuit, figure 5) Min. Typ. 8 7 15 Max. Unit ns ns ns
() Pulsed: Pulse duration = 300 s, duty cycle 1.5 % () Pulse width limited by safe operating area
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STP4NC60/FP
Thermal Impedance Thermal Impedance for TO-220FP
Output Characteristics
Transfer Characteristics
Transconductance
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Gate Charge vs Gate-source Voltage Capacitance Variations
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Fig. 1: Unclamped Inductive Load Test Circuit Fig. 2: Unclamped Inductive Waveform
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
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STP4NC60/FP
mm TYP. MAX. 4.60 1.32 2.72 1.27 0.70 0.88 1.70 1.70 5.15 2.7 10.40 0.019 0.024 0.044 0.044 0.194 0.094 0.393 MIN. 0.173 0.048 0.094 4.40 1.23 2.40
inch TYP. MAX. 0.181 0.051 0.107 0.050 0.027 0.034 0.067 0.067 0.203 0.106 0.409 0.645 0.551 0.116 0.620 0.260 0.154 0.151
D1
L2 F1
G1
Dia. F2 F
L5 L7 L6
L9
L4
H2
P011C
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L3 L6 L7 F1 F
G1
F2
1 2 3 L2 L4
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Information furnished is believed to be accurate and reliable. However, STMicroelect ronics assumes no responsibil ity for the consequences of use of such information nor for any infringement of patents or other rights of third part ies which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectro nics. Specific ation mentioned in this publication are subjec t to change without notice. This publication supersedes and replaces all informat ion previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems with out express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics 1999 STMicroelectronics Printed in Italy All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japa n - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com .
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