lsd815 65 XX PF
lsd815 65 XX PF
lsd815 65 XX PF
8 Inch)
Pb
Lead-Free Parts
LSD815/65-XX-PF
DATA SHEET
QW0905- LSD815/65-XX-PF A
: 02 - Mar. - 2006
Package Dimensions
19.7(0.776")
8.2(0.323")
PIN NO.1
27.5 (1.083")
20.3 (0.8")
LSD815/65-XX-PF LIGITEK
2.2(0.087")
5.0 0.5
Note : 1.All dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
1 14 12 10 4
2 13 6
1 14 12 10 4
2 13 6
Electrical Connection
LSD8155-XX-PF A F
LSD8165-XX-PF A F
9 10 11 12 13 14 15 16
IFP
100
mA
PD Ir Topr Tstg
mW
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260
PART NO
P (nm)
(nm)
Vf(v)
Iv(mcd)
IV-M
LSD8155-XX-PF
660
20
1.5
1.8
2.4
6.1
10.5
2:1
LSD8165-XX-PF
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Peak Wavelength Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio
Symbol Vf Iv
P
Ir IV-M
1000
Forward Current(mA)
100
10 1.0
1.0
10
100
1000
1.2
Ambient Temperature( )
Ambient Temperature( )
Relative Intensity@20mA
1.0
0.5
Wavelength (nm)
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 C 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 C
260
5 /sec max
120
2 /sec max Preheat
60 Seconds Max
25 0 0
50
100
150
Time(sec)
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
The purpose of this test is the resistance of the device under tropical for hours.
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
Solderability Test