Location via proxy:   [ UP ]  
[Report a bug]   [Manage cookies]                
0% found this document useful (0 votes)
99 views9 pages

lsd815 65 XX PF

Download as pdf or txt
Download as pdf or txt
Download as pdf or txt
You are on page 1/ 9

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SINGLE DIGIT LED DISPLAY (0.

8 Inch)

Pb
Lead-Free Parts

LSD815/65-XX-PF

DATA SHEET

DOC. NO REV. DATE :

QW0905- LSD815/65-XX-PF A

: 02 - Mar. - 2006

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only


PART NO. LSD815/65-XX-PF Page 1/8

Package Dimensions

19.7(0.776")

8.2(0.323")

PIN NO.1

27.5 (1.083")

20.3 (0.8")

2.54X7 =17.78 (0.7")

LSD815/65-XX-PF LIGITEK

2.2(0.087")

0.51 TYP 15.24(0.6")

5.0 0.5

Note : 1.All dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only


PART NO. LSD815/65-XX-PF Page 2/8

Internal Circuit Diagram

LSD8155-XX-PF 3,5,11,16 A B C D E F G LDPRDP

1 14 12 10 4

2 13 6

LSD8165-XX-PF 3,5,11,16 A B C D E F G LDPRDP

1 14 12 10 4

2 13 6

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only


PART NO. LSD815/65-XX-PF Page 3/8

Electrical Connection

PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Anode Anode

LSD8155-XX-PF A F

PIN NO. 1 2 3 4 5 6 7 8 Cathode Cathode

LSD8165-XX-PF A F

Common Cathode Anode E

Common Anode Cathode E

Common Cathode Anode No Pin No Pin Anode Anode RDP D LDP

Common Anode Cathode No Pin No Pin Cathode Cathode RDP D LDP

9 10 11 12 13 14 15 16

Common Cathode Anode Anode Anode No Pin Common Cathode C G B

Common Anode Cathode Cathode Cathode No Pin Common Anode C G B

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only


PART NO. LSD815/65-XX-PF Page 4/7

Absolute Maximum Ratings at Ta=25


Ratings Parameter Symbol SR Forward Current Per Chip Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Reverse Current Per Any Chip Operating Temperature Storage Temperature IF 30 mA UNIT

IFP

100

mA

PD Ir Topr Tstg

100 10 -25 ~ +85 -25 ~ +85

mW

Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260

Part Selection And Application Information(Ratings at 25)


Electrical

PART NO

common cathode or anode Material Emitted


CHIP Common Cathode
GaAlAs

P (nm)

(nm)

Vf(v)

Iv(mcd)

IV-M

Min. Typ. Max. Min. Typ.

LSD8155-XX-PF

Red Common Anode

660

20

1.5

1.8

2.4

6.1

10.5

2:1

LSD8165-XX-PF

Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only


PART NO. LSD815/65-XX-PF Page 5/7

Test Condition For Each Parameter

Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Peak Wavelength Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio

Symbol Vf Iv

Unit volt mcd nm nm

Test Condition If=20mA If=10mA If=20mA If=20mA Vr=5V

P
Ir IV-M

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only


PART NO. LSD815/65-XX-PF Page 6/7

Typical Electro-Optical Characteristics Curve


SR CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.0

1000

Forward Current(mA)

100

Relative Intensity Normalize @20mA

2.5 2.0 1.5 1.0 0.5 0.0

10 1.0

0.1 1.0 2.0 3.0 4.0 5.0

1.0

10

100

1000

Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature

Forward Current(mA) Fig.4 Relative Intensity vs. Temperature


3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100

Forward Voltage@20mA Normalize @25

1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100

Relative Intensity@20mA Normalize @25

1.2

Ambient Temperature( )

Ambient Temperature( )

Fig.5 Relative Intensity vs. Wavelength

Relative Intensity@20mA

1.0

0.5

0.0 600 650 700 750

Wavelength (nm)

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only


PART NO. LSD815/65-XX-PF Page 7/8

Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 C 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 C

Temp( C) 260 C3sec Max

260
5 /sec max

120
2 /sec max Preheat
60 Seconds Max

25 0 0

50

100

150
Time(sec)

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only


PART NO. LSD815/65-XX-PF Page 8/8

Reliability Test:

Test Item

Test Condition
1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs)

Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.

Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1

Operating Life Test

High Temperature Storage Test

1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)

The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.

MIL-STD-883:1008 JIS C 7021: B-10

Low Temperature Storage Test

1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)

The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.

JIS C 7021: B-12

High Temperature High Humidity Test

1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs

The purpose of this test is the resistance of the device under tropical for hours.

MIL-STD-202:103B JIS C 7021: B-11

Thermal Shock Test

1.Ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles

The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.

MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011

Solder Resistance Test

1.T.Sol=260 5 2.Dwell time= 10 1sec.

MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1

Solderability Test

1.T.Sol=230 5 2.Dwell time=5 1sec

This test intended to see soldering well performed or not.

MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

You might also like