MC 33199
MC 33199
MC 33199
Simplified Application
VCC VS
PIN CONNECTIONS
TXD Driver
Gnd
Current ORDERING INFORMATION
Limit
Operating
Device Temperature Range Package
THERMAL RATINGS
Rating Symbol Value Unit
Storage Temperature Tstg 55 to +150 C
Operating Junction Temperature TJ 40 to +150 C
Thermal Resistance, JunctiontoAmbient RJA 180 C/W
Maximum Power Dissipation (@ TA = 105C) PD 250 mW
ELECTRICAL CHARACTERISTICS ( 40C TA 125C, 4.5 V VCC 5.5 V, 4.5 V VS 20 V, unless otherwise
noted. Typical values reflect approximate mean at 25C, nominal VCC and VS, at time of device characterization.)
Characteristic Symbol Min Typ Max Unit
VCC PIN 1
VCC Supply Voltage Range VCC 4.5 5.5 V
VCC Supply Current (Note 1) ICC 0.5 1.0 1.5 mA
REFINL PIN 2 AND REFINK PIN 3
REFINL and REFINK Input Voltage Range Vinref V
For 0 < VS < VCC 2.0 VCC 2.0 V
For VCC < VS < 40 V 2.0 VS 1.0 V
REFINL and REFINK Inputs Currents IVIN 5.0 5.0 A
LO PIN 4
LO Open Collector Output VOL V
Low Level Voltage @ Iout = 1.0 mA 0.34 0.7
Low Level Voltage @ Iout = 4.0 mA 0.8
RXD PIN 5
PullUp Resistor to VCC RRXD 1.5 2.0 2.5 k
Low Level Voltage @ Iout = 1.0 mA VOL 0.3 0.7 V
NOTES: 1. Measured with TXD = VCC, I1 = VS, DIA and L high, no load. REFINL and REFINK connected to REFOUT.
2. 0 < VCC < 5.5 V, 0 < VS < 40 V, 0 < VDIA < 20 V, TXD high or floating.
3. When an over temperature is detected, the DIA output is forced off.
4. 0 < VCC < 5.5 V, 0 < VS < 40 V, 0 < VL < 20 V.
5. At static High or Low level TXD, the current source I1 delivers a current of 3.0 mA (typ). Only during Low to High transition, does this current
increase to a higher value in order to charge the K Line capacitor (CL < 4.0 nF) in a short time (see Figure 3).
6. Measured with TXD = VCC, I1 = VS, DIA and L high, no load, REFINL and REFINK connected to REFOUT.
ELECTRICAL CHARACTERISTICS (continued) ( 40C TA 125C, 4.5 V VCC 5.5 V, 4.5 V VS 20 V, unless otherwise
noted. Typical values reflect approximate mean at 25C, nominal VCC and VS, at time of device characterization.)
Characteristic Symbol Min Typ Max Unit
TXD PIN 6
High Level Input Voltage VIH 0.7 VCC 2.8 V
Low Level Input Voltage VIL 2.0 0.3 VCC V
Input Current @ 0 < VS < 40 V A
TXD at High Level IH 200 30
TXD at Low Level IL 600 100
Low Level Input Threshold Voltage VIL Vref min Vref Vref max V
(REFINK Connected to REFOUT) 0.2 V 0.125 V 0.05 V
Low Level Input Threshold Voltage VIL Vref min Vref Vref max V
(REFINL Connected to REFOUT) 0.2 V 0.125 V 0.05 V
ELECTRICAL CHARACTERISTICS (continued) ( 40C TA 125C, 4.5 V VCC 5.5 V, 4.5 V VS 20 V, unless otherwise
noted. Typical values reflect approximate mean at 25C, nominal VCC and VS, at time of device characterization.)
Characteristic Symbol Min Typ Max Unit
REFOUT PIN 14
Output Voltage Vref V
3.0 < VS < 5.6 V and IRO = 10 A 2.7 3.3
5.6 < VS < 18 V and IRO = 10 A 0.5 x VS 0.56 x VS
18 < VS < 40 V and IRO = 10 A 8.5 10.8
Maximum Output Current Iout 50 50 A
PullUp Resistor to VCC RPU 3.0 8.0 12 k
NOTES: 1. Measured with TXD = VCC, I1 = VS, DIA and L high, no load. REFINL and REFINK connected to REFOUT.
2. 0 < VCC < 5.5 V, 0 < VS < 40 V, 0 < VDIA < 20 V, TXD high or floating.
3. When an over temperature is detected, the DIA output is forced off.
4. 0 < VCC < 5.5 V, 0 < VS < 40 V, 0 < VL < 20 V.
5. At static High or Low level TXD, the current source I1 delivers a current of 3.0 mA (typ). Only during Low to High transition, does this current
increase to a higher value in order to charge the K Line capacitor (CL < 4.0 nF) in a short time (see Figure 3).
6. Measured with TXD = VCC, I1 = VS, DIA and L high, no load, REFINL and REFINK connected to REFOUT.
DYNAMIC CHARACTERISTICS ( 40C TA 125C, 4.5 V VCC 5.5 V, 4.5 V VS 20 V, unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
Transmission Speed 1/t Bit 0 200 k Baud
High or Low Bit Time t Bit 5.0 s
RXD Output ns
Low to High Transition Delay Time tRDR 450
High to Low Transition Delay Time tRDF 450
LO Output s
Low to High Transition Delay Time tLDR 2.0
High to Low Transition Delay Time tLDF 2.0
DIA Output ns
Low to High Transition Delay Time tDDR 650
High to Low Transition Delay Time tDDF 650
I1 Output (VS I1 > 2.7 V) s
Rise Time tI1R 0.3
Hold Time tI1F 1.5 4.5
+ 5.0 V +12 V 12 V
Test LO RXD to LO
Gnd Output Signal
Points RXD 0.4 V
2 x 30 pF
Figure 3. Current Source I1 AC Characteristics Figure 4. Current Source I1 and DIA Discharge
Current Test Schematic
tBit I1 Pulse
TXD 5.0 V + 5.0 V +12 V Current
Signal
tI1F 0V
tI1H VCC Vbat
120 mA REFOUT
REFINL
Input I1 DIA Discharge
Current Source Signal REFINK Current
Typical I1 I1 Maximum Limit
Waveform TXD DIA
40 mA 33 nF To
LO
Gnd Oscilloscope
4.0 mA RXD
2.0 mA 10
tI1R Current Source
I1 Minimum Limit
Vbat
VCC = 5.0 V VS
REFINL
I1 RPU
REFINK Source
I1 TXD
RXD VCC
K Line
C1 DIA
+ RXD
Thermal
MCU Shutdown
TXD
Driver Gnd
RPU
L Line
Service Tester or
End of Line
K Line
MCU MC33199 Manufacturer
Programmation or
Checking System
ECU #1
ECU #2
Car
Other
ECUs
25C 40C
1.0 1.5
125C
0.8 1.0
0.6 0.5
0.4 0
50 25 0 25 50 75 100 125 5.0 10 15 20
TA, AMBIENT TEMPERATURE (C) VS, SUPPLY VOLTAGE (V)
35
40C
VS , VOLTAGE (V)
20
25C 30
40C
15
25
10
125C
5.0 20
0 15
5.0 10 15 20 25 30 35 40 5.0 1.0 3.0 7.0 11 15
VS, SUPPLY VOLTAGE (V) IS, CURRENT (mA)
8.0 8.0
6.0 6.0
4.0 4.0
VS = 6.0 V
2.0 2.0
0 0
0 5.0 10 15 20 25 30 35 40 50 40 30 20 10 0 10 20 30 40 50
VS, VOLTAGE (V) REFOUT, OUTPUT CURRENT (A)
Figure 13. L and DIA Hysteresis Figure 14. L and DIA Current
versus Ambient Temperature versus L and DIA Voltage
500 12
V Hyst , L AND DIA HYSTERESIS (mV)
460 40C
8.0 25C
440
6.0 125C
420
400 4.0
50 25 0 25 50 75 100 125 0 5.0 10 15 20 25 30 35 40
TA, AMBIENT TEMPERATURE (C) VDIA, VL, DIA AND L VOLTAGE (V)
Figure 15. DIA Saturation Voltage Figure 16. DIA Current Limit
versus Temperature versus Temperature
V DIA(sat) , DIA SATURATION VOLTAGE (mV)
550 70
IDIA = 40 mA
500 I DIA , DIA CURRENT LIMIT (mA) 66
450 62
400 58
350 54
300 50
50 25 0 25 50 75 100 125 50 25 0 25 50 75 100 125
TA, AMBIENT TEMPERATURE (C) TA, AMBIENT TEMPERATURE (C)
Figure 17. RXD PullUp Resistor Figure 18. TXD and LO Saturation Voltage
V TXD(sat) , V LO(sat) , TXD AND V LO SATURATION (mV)
2.4
500
2.3
2.2
400
2.1 LO
2.0 300 RXD
1.9
200
1.8
1.7
100
1.6
1.5 0
50 25 0 25 50 75 100 125 50 25 0 25 50 75 100 125
TA, AMBIENT TEMPERATURE (C) TA, AMBIENT TEMPERATURE (C)
3.25
0.9
0.6 2.25
0.5 2.00
50 25 0 25 50 75 100 125 50 25 0 25 50 75 100 125
TA, AMBIENT TEMPERATURE (C) TA, AMBIENT TEMPERATURE (C)
Figure 21. I1 Output Pulse Current Figure 22. I1 Pulse Current Width
versus VS Supply Voltage versus Temperature
100 4.4
90
I1, OUTPUT CURRENT (mA)
4.2
t I1 , I1 PULSE WIDTH ( s)
125C
80
25C 4.0
70
3.8
60
40C
3.6
50
40 3.4
5.0 7.5 10 12.5 15 17.5 20 50 25 0 25 50 75 100 125
VS, SUPPLY VOLTAGE (V) TA, AMBIENT TEMPERATURE (C)
+12 V
D2
100 nF D1
Schaffner
Vbat Generator
I1
2 x 1.0 nF
L
DIA
2 x 330 pF
Gnd
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC PACKAGE
CASE 751A03
(SO14) NOTES:
ISSUE F 1. DIMENSIONING AND TOLERANCING PER ANSI
A Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
14 8 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
B P 7 PL 5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
1 7
0.25 (0.010) M B M PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS INCHES
G R X 45 _ F DIM MIN MAX MIN MAX
C A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
T F 0.40 1.25 0.016 0.049
K M J G 1.27 BSC 0.050 BSC
SEATING D 14 PL
PLANE J 0.19 0.25 0.008 0.009
0.25 (0.010) M T B S A S K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals
must be validated for each customer application by customers technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
MFAX: RMFAX0@email.sps.mot.com TOUCHTONE 6022446609 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,
INTERNET: http://DesignNET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 85226629298
*MC33199/D*
MC33199/D