SC1566

Very Low Dropout

3.0 Amp Regulator With Enable
POWER MANAGEMENT
Description Features
The SC1566 is a high performance positive voltage u 350mV dropout @ 3A
regulator designed for use in applications requiring very u Adjustable output from 1.2V to 4.8V
low dropout voltage at up to 3 Amps. Since it has u 2.5V and 1.8V options (5 pin parts also adjustable
superior dropout characteristics compared to regular externally using resistors)
LDOs, it can be used to supply 2.5V on motherboards or
u Over current and over temperature protection
2.8V on peripheral cards from the 3.3V supply thus
u Enable pin
allowing heat sink size reduction or elimination.
Additionally, the five pin versions of SC1566 have an u 10µA quiescent current in shutdown
enable pin, to further reduce power dissipation while shut u Low reverse leakage (output to input)
down. The SC1566 provides excellent regulation over u Full industrial temperature range
variations in line, load and temperature. u TO-220 and TO-263 packages

The SC1566 is available as three terminal fixed output Applications

voltage and five terminal fixed or adjustable output u Battery powered systems
voltage devices with enable. Two package options are u Motherboards and notebook computers
available: TO-263 and TO-220.
u Peripheral cards
u Network cards
u Set top boxes
Typical Application Circuits(1)(2) u Medical equipment
U1
SC1566I5T-2.5
VIN 1 5
VIN VO VO = See equation below

2 4
ENABLE EN GND ADJ R1

3 1.200 (R1+ R2)

VO = Volts
C1 C2 R2

R2

U1
SC1566I5T-2.5
1 5
VIN VIN VO VO = 2.5V

2 4
ENABLE EN GND ADJ

C1 C2
3

U1
SC1566IT-1.8
1 3
VIN VIN VO VO = 1.8V

GND Notes:
C1
2
C2
(1) Maximum VO setpoint for 1.8V parts = 5.4V
(2) This device is designed to operate with
ceramic input and output capacitors

Revision 1, January 2001 1 www.semtech.com

 SC1566

POWER MANAGEMENT
Absolute Maximum Ratings
Parameter Sy mbol Max U nits

Input Voltage VIN 5.5 V

Power D i ssi pati on PD Internally Li mi ted W

Thermal Resi stance Juncti on to Ambi ent

SC 1566IM (TO-263) q JA 60 °C /W
SC 1566IT (TO-220) 50

Thermal Resi stance Juncti on to C ase

SC 1566IM (TO-263) q JC 3 °C /W
SC 1566IT (TO-220) 3

Operati ng Ambi ent Temperature Range TA -40 to +85 °C

Operati ng Juncti on Temperature Range TJ -40 to +150 °C

Storage Temperature Range TSTG -65 to +150 °C

Lead Temperature (Solderi ng) 10 Sec. TLEAD 300 °C

ESD Rati ng (Human Body Model) V ESD 2 kV

Electrical Characteristics
Unless specified: VEN = VIN. Adjustable Option (VADJ > VTH(ADJ)): VIN = 2.2V to 5.5V and IO = 10µA to 3A.
Fixed Options (VADJ = GND): VIN = (VO + 0.7V) to 5.5V and IO = 0A to 3A. Values in bold apply over the full operating temperature range.

Parameter Sy mbol Test C onditions Min Ty p Max U nits

VIN

Supply Voltage Range VIN 2.2 5.5 V

Qui escent C urrent IQ VIN = 3.3V 0.75 1.75 mA

VIN = 5.5V, VEN = 0V 10 35 µA

VO

Output Voltage(1) VO VIN = VO + 0.7V, IO = 10mA -1% VO +1% V

(Internal Fi xed Voltage) -2% +2%

Li ne Regulati on(1) REG(LINE) VIN = (VO + 0.25V) to 5.5V, IOUT = 10mA 0.035 0.3 %

Load Regulati on(1) REG(LOAD) VIN = VO + 0.7V 0.2 0.4 %

D ropout Voltage(1)(2) VD IO = 10mA 1 5 mV

10

IO = 500mA 75 100 mV

150

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 SC1566

POWER MANAGEMENT
Electrical Characteristics (Cont.)
Unless specified: VEN = VIN. Adjustable Option (VADJ > VTH(ADJ)): VIN = 2.2V to 5.5V and IO = 10µA to 3A.
Fixed Options (VADJ = GND): VIN = (VO + 0.7V) to 5.5V and IO = 0A to 3A. Values in bold apply over the full operating temperature range.

Parameter Sy mbol Test C onditions Min Ty p Max U nits

VO (C ont.)

D ropout Voltage(1)(2) IO = 1.5A 200 300 mV

400

IO = 3A 350 450 mV

600

Mi ni mum Load C urrent(3) IO VIN = VO + 0.7V 1 10 µA

C urrent Li mi t ICL 3.0 4.5 6.5 A

AD J

Reference Voltage(1) VREF VIN = 2.2V, VADJ = VOUT, IO = 10mA 1.188 1.200 1.212 V

1.176 1.224

Adjust Pi n C urrent(4) IADJ VADJ = VREF 10 50 nA

Adjust Pi n Threshold(5) VTH(ADJ) 0.10 0.20 0.40 V

EN

Enable Pi n C urrent IEN VEN = 0V, VIN = 3.3V 1.5 10 µA

Enable Pi n Threshold VIH VIN = 3.3V 1.8 V

VIL VIN = 3.3V 0.4

Ov er Temperature Protection

Hi gh Tri p level THI 175 °C

Hysteresi s THYST 10 °C

Notes:
(1) Low duty cycle pulse testing with Kelvin connections required.
(2) Defined as the input to output differential at which the output voltage drops to 1% below the value
measured at a differential of 0.7V.
(3) Required to maintain regulation. Voltage set resistors R1 and R2 are usually utilized to meet this
requirement. Adjustable versions only.
(4) Guaranteed by design.
(5) When VADJ exceeds this threshold, the “Sense Select” switch disconnects the internal feedback chain from
the error amplifier and connects VADJ instead.

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 SC1566

POWER MANAGEMENT
Pin Configurations Ordering Information
D ev ice(1) P ackag e
SC 1566 5-PIN
Versions SC 1566IM-X.X.TR TO-263-3(3)

Pin Function SC 1566I5M-X.X.TR(2) TO-263-5(3)

1 VIN SC 1566IT-X.X TO-220-3(4)

2 EN SC 1566I5T-X.X(2) TO-220-5(4)

TO-263-5 3 GND Notes:

(1) Where -X.X denotes voltage options. Available
4 AD J
voltages are: 2.5V and 1.8V.
5 VO (2) Output voltage can be adjusted using external
resistors, see Pin Descriptions below.
TAB IS GND (3) Only available in tape and reel packaging. A reel
TO-220-5 contains 800 devices.
(6) Only available in tube packaging. A tube contains 50
devices.
SC 1566 3-PIN
Versions
Block Diagram
Pin Function

1 VIN

2 GND

TO-263-3 3 VO

TAB IS GND

Note:
(1) 3-pin versions are fixed output
voltage only.
TO-220-3
* 5 lead versions only

Pin Descriptions
Pin N ame Pin D esciption

AD J Thi s pi n, when grounded, sets the output voltage to that set by the i nternal feedback resi stors. If external
feedback resi stors are used, the output voltage wi ll be (See Appli cati on C i rcui ts on page 1):
1.200 (R1 + R2)
VO = Volts
R2

EN Enable Input. Pulli ng thi s pi n below 0.4V turns the regulator off, reduci ng the qui escent current to a fracti on of
i ts operati ng value. The devi ce wi ll be enabled i f thi s pi n i s left open. C onnect to VIN i f not bei ng used.

GND Reference ground. Use the tab (electri cally connected to GND ) for heatsi nki ng.

VIN Input voltage. For regulati on at full load, the i nput to thi s pi n must be between (VO + 0.7V) and 5.5V. Mi ni mum
VIN = 2.2V.

VO Thi s pi n i s the power output of the devi ce.

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 SC1566

POWER MANAGEMENT
Typical Characteristics
Dropout Voltage vs. Output Current Dropout Voltage vs. Junction
vs. Junction Temperature Temperature vs. Output Current
500 500
150°C
450 450
IO = 3A
400 400
25°C
350 350
0°C
300 -40°C 300 IO = 1.5A
VD (mV)

VD (mV)
250 250
200 200
150 150
IO = 0.5A
100 100
50 50
0 0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 -50 -25 0 25 50 75 100 125 150
IO (A) TJ (°C)

Output Voltage (2.5V) vs. Junction Output Voltage (2.5V) vs. Junction
Temperature vs. Output Current Temperature vs. Output Current
2.550 2.550
VIN = 3.2V VIN = 5.5V
2.540 2.540
2.530 2.530

2.520 2.520
2.510 2.510
IO = 10mA IO = 10mA
VO (V)

VO (V)

2.500 2.500
2.490 2.490
IO = 3A IO = 3A
2.480 2.480
2.470 2.470
2.460 2.460
2.450 2.450
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
TJ (°C) TJ (°C)

Reference Voltage vs. Junction Reference Voltage vs. Junction

Temperature vs. Output Current Temperature vs. Output Current
1.225 1.225
VIN = 2.2V VIN = 5.5V
1.220 1.220
1.215 1.215
1.210 1.210
1.205 1.205
VREF (V)

VREF (V)

IO = 10mA IO = 3A
1.200 1.200
1.195 1.195
IO = 3A IO = 10mA
1.190 1.190
1.185 1.185
1.180 1.180
1.175 1.175
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
TJ (°C) TJ (°C)

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 SC1566

POWER MANAGEMENT
Typical Characteristics (Cont.)
Quiescent Current vs. Off-State Quiescent Current vs.
Junction Temperature Junction Temperature
700 12
VIN = 3.3V VIN = 5.5V
690
10
680
670
8

IQ(OFF) (µA)
660
IQ (µA)

650 6
640
4
630
620
2
610
600 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
TJ (°C) TJ (°C)

Applications Information
Introduction External voltage selection resistors (5-pin parts): the
use of 1% resistors, and designing for a current flow
The SC1566 is intended for applications such as ³ 10µA is recommended to ensure a well regulated
graphics cards where high current capability and very low output (thus R2 £ 120kW).
dropout voltage are required. It provides a very simple,
low cost solution that uses very little pcb real estate and Thermal Considerations
typically does not require a heatsink. Additional features
include an enable pin to allow for a very low power The power dissipation in the SC1566 is approximately
consumption standby mode, and a fully adjustable equal to the product of the output current and the input
output (5-pin versions). to output voltage differential:

Component Selection PD ≈ (VIN − VOUT ) • I O

Input capacitor: a 4.7µF or 10µF ceramic capacitor is The absolute worst-case dissipation is given by:
recommended. This allows for the device being some
distance from any bulk capacitance on the rail. PD ( MAX ) = (VIN ( MAX ) − VOUT ( MIN ) )• I O ( MAX ) + VIN ( MAX ) • I Q ( MAX )
Additionally, input droop due to load transients is reduced,
improving load transient response. Additional capacitance For a typical scenario, VIN = 3.3V ± 5%, VOUT = 2.8V and
may be added if required by the application. IO = 2.5A, therefore:
Output capacitor: a minimum bulk capacitance of 22µF, VIN(MAX) = 3.465V, VOUT(MIN) = 2.744V and IQ(MAX) = 1.75mA,
along with a 0.1µF ceramic decoupling capacitor is
recommended. Increasing the bulk capacitance will Thus PD(MAX) = 1.81W.
improve the overall transient response. The use of
multiple lower value ceramic capacitors in parallel to Using this figure, and assuming TA(MAX) = 85°C, we can
achieve the desired bulk capacitance will not cause calculate the maximum thermal impedance allowable to
stability issues. Although designed for use with ceramic maintain TJ £ 150°C (see page 7):
output capacitors, the SC1566 is extremely tolerant of
output capacitor ESR values and thus will also work
comfortably with tantalum output capacitors.

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 SC1566

POWER MANAGEMENT
Applications Information (Cont.)
This should be achievable for the TO-263 package using
R TH ( J − A )( MAX ) =
(T
J( MAX ) − TA (MAX ) )
=
(150 − 85 ) = 36 °C / W pcb copper area to aid in conducting the heat away from
PD (MAX ) 1 .81
the device, such as a large (~2 squ. inch) pad connected
R TH ( J − C )( MAX ) = 3 °C / W and R TH ( C − S ) = 0 °C / W , to the tab of the device. Internal ground/power planes
therefore R TH ( S − A )( MAX ) = 33 °C / W and air flow will also assist in removing heat. For higher
power dissipations it may be necessary to use a small
heatsink and the TO-220 package.

Outline Drawing - T0-263-3

Minimum Land Pattern - TO-263-3

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 SC1566

POWER MANAGEMENT
Outline Drawing - TO-263-5

Minimum Land Pattern - TO-263-5

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 SC1566

POWER MANAGEMENT
Outline Drawing - TO-220-3

Outline Drawing - TO-220-5

Contact Information

Semtech Corporation
Power Management Products Division
652 Mitchell Rd., Newbury Park, CA 91320
Phone: (805)498-2111 FAX (805)498-3804

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