research-article

TEI-power: Temperature Effect Inversion--Aware Dynamic Thermal Management

Authors:

Shahin Nazarian,

Massoud PedramAuthors Info & Claims

ACM Transactions on Design Automation of Electronic Systems (TODAES), Volume 22, Issue 3

Article No.: 51, Pages 1 - 25

https://doi.org/10.1145/3019941

Published: 21 April 2017 Publication History

Abstract

FinFETs have emerged as a promising replacement for planar CMOS devices in sub-20nm technology nodes. However, based on the temperature effect inversion (TEI) phenomenon observed in FinFET devices, the delay characteristics of FinFET circuits in sub-, near-, and superthreshold voltage regimes may be fundamentally different from those of CMOS circuits with nominal voltage operation. For example, FinFET circuits may run faster in higher temperatures. Therefore, the existing CMOS-based and TEI-unaware dynamic power and thermal management techniques would not be applicable. In this article, we present TEI-power, a dynamic voltage and frequency scaling--based dynamic thermal management technique that considers the TEI phenomenon and also the superlinear dependencies of power consumption components on the temperature and outlines a real-time trade-off between delay and power consumption as a function of the chip temperature to provide significant energy savings, with no performance penalty—namely, up to 42% energy savings for small circuits where the logic cell delay is dominant and up to 36% energy savings for larger circuits where the interconnect delay is considerable.

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Cited By

Chakraborty SSharma YMoulik S(2024)TREAFET: Temperature-Aware Real-Time Task Scheduling for FinFET based MulticoresACM Transactions on Embedded Computing Systems10.1145/3665276Online publication date: 16-May-2024
https://doi.org/10.1145/3665276
Jang HLee SPark HLee W(2024)Development of a Low-Power Touch-Based Lifelogging ProcessorIEEE Transactions on Circuits and Systems II: Express Briefs10.1109/TCSII.2024.336841071:8(3910-3914)Online publication date: Aug-2024
https://doi.org/10.1109/TCSII.2024.3368410
Lee KPark JChoi EJeon MLee W(2022)Developing a TEI-Aware PMIC for Ultra-Low-Power System-on-ChipsEnergies10.3390/en1518678015:18(6780)Online publication date: 16-Sep-2022
https://doi.org/10.3390/en15186780
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Index Terms

TEI-power: Temperature Effect Inversion--Aware Dynamic Thermal Management
1. Computer systems organization
  1. Embedded and cyber-physical systems
    1. Embedded systems
    2. System on a chip
2. Hardware
  1. Power and energy
    1. Power estimation and optimization
      1. Chip-level power issues
    2. Thermal issues
      1. Temperature optimization
  2. Very large scale integration design
    1. Design reuse and communication-based design
      1. System on a chip

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Published In

cover image ACM Transactions on Design Automation of Electronic Systems

ACM Transactions on Design Automation of Electronic Systems Volume 22, Issue 3

July 2017

440 pages

ISSN:1084-4309

EISSN:1557-7309

DOI:10.1145/3062395

Editor:
Naehyuck Chang
Korea Advanced Institute of Science and Technology, Korea

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Copyright © 2017 ACM.

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Association for Computing Machinery

New York, NY, United States

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ACM Journals for the Design of Smart and Connected Systems

Publication History

Published: 21 April 2017

Accepted: 01 November 2016

Revised: 01 November 2016

Received: 01 June 2016

Published in TODAES Volume 22, Issue 3

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Funding Sources

IT R&D Program of MSIP/IITP [16ZS1200:Near-Zero-Voltage Micro-Grain Architecture for Ultra-Low-Energy Processor]
the software-hardware foundations program of the CISE Directorate of the National Science Foundation

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Cited By

Chakraborty SSharma YMoulik S(2024)TREAFET: Temperature-Aware Real-Time Task Scheduling for FinFET based MulticoresACM Transactions on Embedded Computing Systems10.1145/3665276Online publication date: 16-May-2024
https://doi.org/10.1145/3665276
Jang HLee SPark HLee W(2024)Development of a Low-Power Touch-Based Lifelogging ProcessorIEEE Transactions on Circuits and Systems II: Express Briefs10.1109/TCSII.2024.336841071:8(3910-3914)Online publication date: Aug-2024
https://doi.org/10.1109/TCSII.2024.3368410
Lee KPark JChoi EJeon MLee W(2022)Developing a TEI-Aware PMIC for Ultra-Low-Power System-on-ChipsEnergies10.3390/en1518678015:18(6780)Online publication date: 16-Sep-2022
https://doi.org/10.3390/en15186780
Li WShi JLi FLin JWang WGuan LDwyer MDamian DZeller A(2022)μAFLProceedings of the 44th International Conference on Software Engineering10.1145/3510003.3510208(1-12)Online publication date: 21-May-2022
https://dl.acm.org/doi/10.1145/3510003.3510208
Feng LHuang JLi LZhang HWang Z(2022)RvDfi: A RISC-V Architecture With Security Enforcement by High Performance Complete Data-Flow IntegrityIEEE Transactions on Computers10.1109/TC.2021.313370171:10(2499-2512)Online publication date: 1-Oct-2022
https://dl.acm.org/doi/10.1109/TC.2021.3133701
Chen XYang Q(2022)Speed and Power Tradeoff Based on FinFET Structure, Voltage Changing and Circuit Layout2022 IEEE 5th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE)10.1109/AUTEEE56487.2022.9994548(465-470)Online publication date: 18-Nov-2022
https://doi.org/10.1109/AUTEEE56487.2022.9994548
Lee SLee JLee JLee W(2021)TEI-DTA: Optimizing a Vehicular Sensor Network Operating with Ultra-Low Power System-on-ChipsElectronics10.3390/electronics1015178910:15(1789)Online publication date: 26-Jul-2021
https://doi.org/10.3390/electronics10151789
Han KLee SOh KBae YJang HLee JLee WPedram M(2021)Developing TEI-Aware Ultralow-Power SoC Platforms for IoT End NodesIEEE Internet of Things Journal10.1109/JIOT.2020.30274798:6(4642-4656)Online publication date: 15-Mar-2021
https://doi.org/10.1109/JIOT.2020.3027479
Hwang WYoo KThai DLee WBaek K(2020)Design of a DC–DC Converter Customized for Ultra-Low Voltage Operating IoT PlatformsEnergies10.3390/en1302046113:2(461)Online publication date: 17-Jan-2020
https://doi.org/10.3390/en13020461
Hossain MSavidis I(2020)Dynamic differential signaling based logic families for robust ultra-low power near-threshold computingMicroelectronics Journal10.1016/j.mejo.2020.104801102(104801)Online publication date: Aug-2020
https://doi.org/10.1016/j.mejo.2020.104801
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