CMOS Basic
CMOS Basic
CMOS Basic
SUJIT KUMAR
HOW CMOS WORKS ?
• The term CMOS stands for “Complementary Metal Oxide Semiconductor”.
CMOS technology is one of the most popular technology in the computer
chip design industry and broadly used today to form integrated circuits in
numerous and varied applications.
• The main advantage of CMOS over NMOS and BIPOLAR technology is the
much smaller power dissipation. Unlike NMOS or BIPOLAR circuits, a
Complementary MOS circuit has almost no static power dissipation.
• Power is only dissipated in case the circuit actually switches. This allows
integrating more CMOS gates on an IC than in NMOS or bipolar technology,
resulting in much better performance.
• Complementary Metal Oxide Semiconductor transistor consists of P-
channel MOS (PMOS) and N-channel MOS (NMOS).
NMOS :
• NMOS is built on a p-type substrate with n-type source and drain diffused
on it. In NMOS, the majority carriers are electrons. When a high voltage is
applied to the gate, the NMOS will conduct. Similarly, when a low voltage is
applied to the gate, NMOS will not conduct. NMOS are considered to be
faster than PMOS, since the carriers in NMOS, which are electrons, travel
twice as fast as the holes.
PMOS :
•P- channel MOSFET consists P-type
Source and Drain diffused on an N-
type substrate. Majority carriers are
holes. When a high voltage is applied
to the gate, the PMOS will not
conduct. When a low voltage is
applied to the gate, the PMOS will
conduct. The PMOS devices are
more immune to noise than NMOS
devices.
• Where Qinv is the inversion layer charge per unit area, W is the gate width,
L is the gate length and tr is the transit time. If the velocity of the carriers is
constant between source and drain, the transit time equals :
• where the velocity, v, equals the product of the mobility and the electric field:
• The constant velocity also implies a constant electric field so that the field
equals the drain-source voltage divided by the gate length. This leads to the
following expression for the drain current:
• We now assume that the charge density in the inversion layer is constant
between source and drain. We also assume that the charge density in the
inversion layer equals minus the product of the capacitance per unit area
and the gate-to-source voltage minus the threshold voltage:
• The inversion layer charge is zero if the gate voltage is lower than the
threshold voltage. Replacing the inversion layer charge density in the
expression for the drain current yields the linear model:
• The drain current is still zero if the gate voltage is less than the threshold
voltage :
Pinch Off Voltage
• The MOSFET is a device that controls a current between two contacts
(Source and Drain) using a voltage contact (Gate). The device uses a
surface effect to create a n-type region in a p-type substrate (or the
converse).
• In a latch-up conduction, the current flows from VDD to GND directly via the
two transistors, causing the dangerous condition of a short circuit. The
resistors are bypassed and thus excessive current flows from VDD to
Ground.
• Latchup prevention/protection
includes putting a high resistance in
the path so as to limit the current.
This can be done in 2 ways.
• Surrounding PMOS and NMOS
transistors with an insulating oxide
layer. This breaks parasitic structure.
• Latchup Protection Technology
circuitry which shuts off the device
when latchup is detected.