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A comfortable, wearable wireless ECG monitoring system is proposed. The device is realized using the combination of two proprietary advanced technologies for electronic packaging and interconnection : the UTCP (Ultra-Thin Chip Package)... more
A comfortable, wearable wireless ECG monitoring system is proposed. The device is realized using the combination of two proprietary advanced technologies for electronic packaging and interconnection : the UTCP (Ultra-Thin Chip Package) technology and the SMI (Stretchable Mould Interconnect) technology for elastic and stretchable circuits. Introduction of these technologies results in small fully functional devices, exhibiting a significant increase in user comfort compared to devices fabricated with more conventional packaging and interconnection technologies.
Publication Date: 2011
Publication Name: Conference proceedings : ... Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual Conference
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In order to fit human body, flexibility, or even better stretchability is requested for biomedical systems like implants or smart clothes. A stretchable electronic technology has been developed. This can provide highly stretchable... more
In order to fit human body, flexibility, or even better stretchability is requested for biomedical systems like implants or smart clothes. A stretchable electronic technology has been developed. This can provide highly stretchable interconnections fully compatible with PCB technologies. In order to prove the feasibility of complex biomedical systems like inner body implants or wearable systems, a variety of stretchable systems has been designed from sensor to power source systems.
Publication Date: 2007
Publication Name: Conference proceedings : ... Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual Conference
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In vitro cytotoxicity testing and the application of elastic interconnection technology for short-term implantable electronicsmore
by Jan Vanfleteren and Frederick Bossuyt
An electronic device was fabricated consisting of 2 flexible electronic circuit islands, interconnected by a 7 cm long elastic interconnection, which could be elongated for at least 50%. This interconnection was based on gold conductor... more
An electronic device was fabricated consisting of 2 flexible electronic circuit islands, interconnected by a 7 cm long elastic interconnection, which could be elongated for at least 50%. This interconnection was based on gold conductor tracks following a 2-D spring pattern, embedded in a biocompatible silicone elastomer. The complete device was embedded in the same silicone elastomer. An in vitro cytotoxicity extraction test, executed on small test-samples in accordance with the ISO 10 993-1 guidelines, revealed that the applied silicone encapsulation to these samples functioned as a good seal for at least 8 days.
Publication Date: 2009
Publication Name: 2009 Annual International Conference of the IEEE Engineering in Medicine and Biology Society
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For user comfort reasons, electronic circuits for implantation in the human body or for use as smart clothes should ideally be soft, stretchable and elastic. In this contribution the results of an MID (Molded Interconnect Device)... more
For user comfort reasons, electronic circuits for implantation in the human body or for use as smart clothes should ideally be soft, stretchable and elastic. In this contribution the results of an MID (Molded Interconnect Device) technology will be presented, showing the feasibility of functional stretchable electronic circuits. In the developed technology rigid or flexible standard components are interconnected by meander shaped metallic wires and embedded by molding in a stretchable substrate polymer. Several technologies have been developed to this purpose, which combine low cost and good reliability under mechanical strain. In this way reliable stretchability of the circuits above 100% has been demonstrated. Enhanced reliability has been reached using an additional conductive polymer layer.
Publication Date: 2007
Publication Name: 2007 29th Annual International Conference of the IEEE Engineering in Medicine and Biology Society
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ABSTRACT For user comfort reasons, electronic circuits for implantation in the human body or for use as smart clothes should ideally be soft, stretchable and elastic. In this contribution the initial results of an MID (Moulded... more
ABSTRACT For user comfort reasons, electronic circuits for implantation in the human body or for use as smart clothes should ideally be soft, stretchable and elastic. In this contribution the initial results of an MID (Moulded Interconnect Device) technology will be presented, ...
Publication Date: 2007
Publication Name: Proceedings 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Polytronic 2007
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For advanced body related applications, there is a need of soft, conformable, elastic, mechanical compliant and washable systems. Smart clothes for health monitoring, sport or professional protection need washable and conformable... more
For advanced body related applications, there is a need of soft, conformable, elastic, mechanical compliant and washable systems. Smart clothes for health monitoring, sport or professional protection need washable and conformable electronic systems, which can be deformed up to 20%. Implants, like monitoring sensors, or functional implants, need softness, stretchability to comply with the human body, chemical resistance, and biocompatibility.
Publication Date: 2008
Publication Name: 2008 IEEE Interdisciplinary Conference on Portable Info Devices (PORTABLE) - Polytronic 2008. IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
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by Jan Vanfleteren and Frederick Bossuyt
Publication Date: 2010
Publication Name: 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2010)
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Publication Date: 2010
Publication Name: 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2010)
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by Jan Vanfleteren and Frederick Bossuyt
Imec has developed a new technology to integrate and interconnect back-contact solar cells into modules, based on embedding cells in silicone on top of a glass substrate. This technology aims at an improved optical performance and... more
Imec has developed a new technology to integrate and interconnect back-contact solar cells into modules, based on embedding cells in silicone on top of a glass substrate. This technology aims at an improved optical performance and reliability (through the use of silicones and low-temperature metallization). One of the additional advantages is that the technology is suitable for integrating very thin cells into modules: whereas standalone interconnection of such fragile thin cells, e.g. tabbing and stringing, would significantly lower the throughput yield due to breakage, the cells are better protected if they are embedded inside silicone. The paper will first elaborate on the process flow, the background and motivation, advantages, drawbacks and limitations, and technical aspects of the developed technology. Then it will present the results of the measurements on the performance of functional solar cells processed into modules using this technology, discussing losses and loss mechanisms. Then, the approach towards determining the reliability of the module will be presented, indicating how imec aims at building up an ageing model, and elaborating the results on the failure mode and effect analysis, modeling, characterization and reliability testing.
Publication Date: 2010
Publication Name: Reliability of Photovoltaic Cells, Modules, Components, and Systems Iii
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by Jan Vanfleteren and Frederick Bossuyt
Publication Date: 2010
Publication Name: Microelectronics International
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The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnectsmore
by Jan Vanfleteren and Frederick Bossuyt
Publication Date: 2011
Publication Name: Thin Solid Films
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by Jan Vanfleteren and Frederick Bossuyt
Publication Date: 2011
Publication Name: Ieee Transactions on Components Packaging and Manufacturing Technology
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Publication Date: 2012
Publication Name: Circuit World
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Stretchable Electronics Technology for Large Area Applications: Fabrication and Mechanical Characterizationmore
by Jan Vanfleteren and Frederick Bossuyt
Publication Date: 2013
Publication Name: Ieee Transactions on Components Packaging and Manufacturing Technology
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by Jan Vanfleteren and Frederick Bossuyt
Publication Date: 2009
Publication Name: Circuit World
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ABSTRACT Well-being applications demand unobtrusive treatment methods in order to reach user acceptance. In the field of light therapy this needs to be carefully addressed because, in most cases, light treatment system size has to be... more
ABSTRACT Well-being applications demand unobtrusive treatment methods in order to reach user acceptance. In the field of light therapy this needs to be carefully addressed because, in most cases, light treatment system size has to be significant with respect to human body scale. At the same time we observe the push to make wearable devices that deliver the treatment on the go. Once scaled up, standard flexible electronics (FPC) fail to conform to body curvatures leading to decrease in comfort. A solution to this problem demands new or modified methods for fabrication of the electronic circuits that fulfill the conformability demand (flexing, but also stretching). Application of Stretchable Molded Interconnect (SMI) technology, that attempts to address these demands, will be discussed. The unique property of SMI is that its manufacturing draws mainly from standard PCB and FCB technologies to inherit the reliability and conductivity. At the same time, however, it allows soft, flexible and stretchable circuits with biomimetic haptics and high optical efficiency. In this work a demonstrator device for blue light therapy of RSI is presented that illustrates the strengths as well as challenges ahead of conformable light circuits. We report system electro-optical efficiency, possible irradiance levels within skin thermal comfort and efficiency under cyclic, tensile stretching deformation.
Publication Date: 2014
Publication Name: Biophotonics: Photonic Solutions for Better Health Care IV
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Laser based fast prototyping methodology of producing stretchable and conformable electronic systemsmore
by Jan Vanfleteren and Frederick Bossuyt
For user comfort and reliability reasons, electronic circuits for human body related applications should ideally be soft, elastic and stretchable, for smart textile application, but also for applications which need a high level of... more
For user comfort and reliability reasons, electronic circuits for human body related applications should ideally be soft, elastic and stretchable, for smart textile application, but also for applications which need a high level of biocompatibility. We are developing several roll-to roll ...
Publication Date: 2008
Publication Name: 2008 2nd Electronics Systemintegration Technology Conference
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Design and implementation of advanced systems in a flexible-stretchable technology for biomedical applicationsmore
by Jan Vanfleteren and Frederick Bossuyt
This paper presents the design and implementation of an advanced system on flexible and stretchable technology. The technology platform consists of a matrix of flexible non-stretchable functional islands linked together by a net of... more
This paper presents the design and implementation of an advanced system on flexible and stretchable technology. The technology platform consists of a matrix of flexible non-stretchable functional islands linked together by a net of elastic interconnections. Several technologies have ...
Publication Date: 2009
Publication Name: Sensors and Actuators A: Physical
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Publication Date: 2011
Publication Name: Proceedings of the National Academy of Sciences
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Publication Date: 2012
Publication Name: Microfluidics and Nanofluidics
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by Jan Vanfleteren and Frederick Bossuyt
Publication Date: 2011
Publication Name: Microelectronics Reliability
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by Jan Vanfleteren and Frederick Bossuyt
Publication Date: 2012
Publication Name: MRS Bulletin
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by Jan Vanfleteren and Frederick Bossuyt
Publication Date: 2012
Publication Name: Journal of the Textile Institute
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Publication Date: 2012
Publication Name: Journal of Micromechanics and Microengineering
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The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuitmore
by Jan Vanfleteren and Frederick Bossuyt
Publication Date: 2010
Publication Name: Journal of Micromechanics and Microengineering
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In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnectmore
by Jan Vanfleteren and Frederick Bossuyt
Publication Date: 2009
Publication Name: Journal of Materials Research
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by Jan Vanfleteren and Frederick Bossuyt
Publication Date: 2000
Publication Name: IEEE Transactions on Electron Devices
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A new low cost, elastic and conformable electronics technology for soft and stretchable electronic devices by use of a stretchable substratemore
by Jan Vanfleteren and Frederick Bossuyt
Publication Date: 2009
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This paper describes the HOP system. It consists of a wireless module built up by multiple nodes and a base station. The nodes detect acceleration of e.g. human movement. At a rate of 100 Hertz the base station collects the acceleration... more
This paper describes the HOP system. It consists of a wireless module built up by multiple nodes and a base station. The nodes detect acceleration of e.g. human movement. At a rate of 100 Hertz the base station collects the acceleration samples. The data can be acquired in real-time software like Pure Data and Max/MSP. The data can be used
Publication Date: 2008
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