V60DM100C: Ultra Low V 0.40 V at I 5.0 A
V60DM100C: Ultra Low V 0.40 V at I 5.0 A
V60DM100C: Ultra Low V 0.40 V at I 5.0 A
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Vishay General Semiconductor
Dual High-Voltage Trench MOS Barrier Schottky Rectifier
Ultra Low VF = 0.40 V at IF = 5.0 A
FEATURES
® ®
TMBS eSMP Series • Trench MOS Schottky technology Available
Notes
(1) Mounted on infinite heatsink
(2) The heat generated must be less than the thermal conductivity from junction-to-ambient: dP /dT < 1/R
D J JA
70 1000
Average Forward Rectified Current (A)
10
50
1
40 TJ = 100 °C TJ = 150 °C
TJ = 125 °C
0.1
30
0.01
20 TJ = 25 °C
0.001
RthJA = 50 °C/W
10 0.0001
TJ = -40 °C
0 0.00001
0 25 50 75 100 125 150 175 10 20 30 40 50 60 70 80 90 100
30 10 000
D = 0.8 TJ = 25 °C
f = 1.0 MHz
25
Junction Capacitance (pF)
Average Power Loss (W)
Vsig = 50 mVp-p
D = 0.5
20 1000
D = 1.0
D = 0.3
15
D = 0.2
10 T
100
D = 0.1
5
D = tp/T tp
0 10
0 5 10 15 20 25 30 35 0.1 1 10 100
100 100
Transient Thermal Impedance (°C/W)
Junction-to-ambient
Instantaneous Forward Current (A)
TJ = 175 °C
10
TJ = 150 °C
10
1 TJ = 125 °C
TJ = 100 °C
1
0.1 TJ = 25 °C
TJ = -40 °C
0.01 0.1
0 0.2 0.4 0.6 0.8 1.0 0.01 0.1 1 10 100
55
Epoxy printed circuit
board FR4 copper
50
Thermal Resistance (°C/W)
thickness = 70 μm
45
40
35
S (cm2)
30
25
1 2 3 4 5 6 7 8 9
SMPD (TO-263AC)
0.402 (10.20)
0.071 (1.80)
0.386 (9.80) 0.020 (0.52)
0.063 (1.60)
0.059 (1.50) REF. 0.011 (0.27)
0.048 (1.21)
0.032 (0.81)
0.354 (8.99)
0.338 (8.59) 0.509 (12.93)
0.485 (12.33)
0 to 0.01
(0 to 0.254)
0.069 (1.74)
0.053 (1.34)
0.063 (1.60)
0.020 (0.52)
0.047 (1.20)
0.011 (0.27)
0.200 0.052 (1.23)
NOM.
(5.08) 0.028 (0.72)
0.276 (7.00)
0.260 (6.60)
0.330
REF.
(8.38)
0.194
NOM.
(4.93)
0.604 (15.33)
0.525 (13.33)
0.105 (2.67)
0.080 (2.03) MIN.
0.095 (2.41)
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