MAX2021

EVALUATION KIT AVAILABLE
MAX2021
High-Dynamic-Range, Direct Up-/Downconversion
650MHz to 1200MHz Quadrature Mod/Demod
General Description Features
The MAX2021 low-noise, high-linearity, direct upcon- ♦ 650MHz to 1200MHz RF Frequency Range
version/downconversion quadrature modulator/demod- ♦ Scalable Power: External Current-Setting
ulator is designed for RFID handheld and portal
Resistors Provide Option for Operating Device in
readers, as well as single and multicarrier 650MHz to
Reduced-Power/Reduced-Performance Mode
1200MHz GSM/EDGE, cdma2000 ® , WCDMA, and
iDEN ® base-station applications. Direct conversion ♦ 36-Pin, 6mm x 6mm TQFN Provides High Isolation
architectures are advantageous since they significantly in a Small Package
reduce transmitter or receiver cost, part count, and Modulator Operation:
power consumption as compared to traditional IF-based
double conversion systems. ♦ Meets 4-Carrier WCDMA 65dBc ACLR
In addition to offering excellent linearity and noise perfor- ♦ +21dBm Typical OIP3
mance, the MAX2021 also yields a high level of compo- ♦ +58dBm Typical OIP2
nent integration. This device includes two matched
passive mixers for modulating or demodulating in-phase ♦ +16.7dBm Typical OP1dB
and quadrature signals, two LO mixer amplifier drivers, ♦ -32dBm Typical LO Leakage
and an LO quadrature splitter. On-chip baluns are also ♦ 43.5dBc Typical Sideband Suppression
integrated to allow for single-ended RF and LO connec-
tions. As an added feature, the baseband inputs have ♦ -174dBm/Hz Output Noise Density
been matched to allow for direct interfacing to the trans- ♦ DC to 550MHz Baseband Input Allows a Direct
mit DAC, thereby eliminating the need for costly I/Q Launch DAC Interface, Eliminating the Need for
buffer amplifiers. Costly I/Q Buffer Amplifiers
The MAX2021 operates from a single +5V supply. It is ♦ DC-Coupled Input Allows Ability for Customer
available in a compact 36-pin TQFN package (6mm x Offset Voltage Control
6mm) with an exposed pad. Electrical performance is
guaranteed over the extended -40°C to +85°C temper- Demodulator Operation:
ature range. ♦ +35.2dBm Typical IIP3
Applications ♦ +76dBm Typical IIP2
RFID Handheld and Portal Readers ♦ > 30dBm IP1dB
Single and Multicarrier WCDMA 850 Base Stations ♦ 9.2dB Typical Conversion Loss
Single and Multicarrier cdmaOne™ and cdma2000 ♦ 9.3dB Typical NF
Base Stations ♦ 0.06dB Typical I/Q Gain Imbalance
GSM 850/GSM 900 EDGE Base Stations ♦ 0.15° I/Q Typical Phase Imbalance
Predistortion Transmitters and Receivers
WiMAX Transmitters and Receivers
Ordering Information
Fixed Broadband Wireless Access PART TEMP RANGE PIN-PACKAGE
Military Systems 36 TQFN-EP*
MAX2021ETX+ -40°C to +85°C
(6mm x 6mm)
Microwave Links
36 TQFN-EP*
Digital and Spread-Spectrum Communication Systems MAX2021ETX+T -40°C to +85°C
(6mm x 6mm)
Video-on-Demand (VOD) and DOCSIS Compliant
+Denotes a lead(Pb)-free/RoHS-compliant package.
Edge QAM Modulation *EP = Exposed pad.
Cable Modem Termination Systems (CMTS) T = Tape and reel.
cdma2000 is a registered certification mark and registered service mark of the Telecommunications Industry Association.
iDEN is a registered trademark of Motorola Trademark Holdings, LLC.
cdmaOne is a trademark of CDMA Development Group.
For pricing, delivery, and ordering information, please contact Maxim Direct at
1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com. 19-3918; Rev 2; 4/13
MAX2021
ABSOLUTE MAXIMUM RATINGS
VCC_ to GND ........................................................-0.3V to +5.5V RBIASLO3 Maximum Current .............................................10mA
BBI+, BBI-, BBQ+, BBQ- to GND...............-3.5V to (VCC + 0.3V) Continuous Power Dissipation (Note 1) ...............................7.6W
LO, RF to GND Maximum Current ......................................30mA Operating Case Temperature Range (Note 2) ....-40°C to +85°C
RF Input Power ...............................................................+30dBm Maximum Junction Temperature .....................................+150°C
Baseband Differential I/Q Input Power...........................+20dBm Storage Temperature Range .............................-65°C to +150°C
LO Input Power...............................................................+10dBm Lead Temperature (soldering, 10s) .................................+300°C
RBIASLO1 Maximum Current .............................................10mA Soldering Temperature (reflow) .......................................+260°C
RBIASLO2 Maximum Current .............................................10mA
Note 1: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150°C.
Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS

TQFN
Junction-to-Ambient Junction-to-Case
Thermal Resistance (θJA) (Notes 3, 4) .......................+34°C/W Thermal Resistance (θJC) (Notes 1, 4) ......................+8.5°C/W
Note 3: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
DC ELECTRICAL CHARACTERISTICS
(MAX2021 Typical Application Circuit, VCC = 4.75V to 5.25V, GND = 0V, I/Q inputs terminated into 50Ω to GND, LO input terminated into
50Ω, RF output terminated into 50Ω, 0V common-mode input, R1 = 432Ω, R2 = 619Ω, R3 = 332Ω, TC = -40°C to +85°C, unless otherwise
noted. Typical values are at VCC = 5V, TC = +25°C, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC 4.75 5.00 5.25 V
Total Supply Current ITOTAL Pins 3, 13, 15, 31, 33 all connected to VCC 230 271 315 mA
Total Power Dissipation 1355 1654 mW
RECOMMENDED AC OPERATING CONDITIONS

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT
RF Frequency (Note 5) fRF 650 1200 MHz
LO Frequency (Note 5) fLO 750 1200 MHz
IF Frequency (Note 5) f IF 550 MHz
LO Power Range PLO -6 +3 dBm
2 Maxim Integrated
MAX2021
AC ELECTRICAL CHARACTERISTICS (Modulator)
(MAX2021 Typical Application Circuit, VCC = 4.75V to 5.25V, GND = 0V, I/Q differential inputs driven from a 100Ω DC-coupled source,
0V common-mode input, PLO = 0dBm, 750MHz ≤ fLO ≤ 1200MHz, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 619Ω, R3 =
332Ω, TC = -40°C to +85°C. Typical values are at VCC = 5V, VBBI = 1.4VP-P differential, VBBQ = 1.4VP-P differential, fIQ = 1MHz, fLO =
900MHz, TC = +25°C, unless otherwise noted.) (Note 6)

BASEBAND INPUT
Baseband Input Differential Impedance f IQ = 1MHz 53 Ā
BB Common-Mode Input Voltage
-3.5 0 +3.5 V
Range
LO INPUT
LO Input Return Loss RF and IF terminated (Note 7) 12 dB
I/Q MIXER OUTPUTS
fBB1 = 1.8MHz, fLO = 900MHz 21.1
Output IP3 OIP3 dBm
fBB2 = 1.9MHz fLO = 1000MHz 22.3
Output IP2 OIP2 fBB1 = 1.8MHz, fBB2 = 1.9MHz 57.9 dBm
Output P1dB fBB = 25MHz, PLO = 0dBm 16.7 dBm
Output Power POUT 0.7 dBm
Output Power Variation Over
TC = -40°C to +85°C -0.016 dB/°C
Temperature
Sweep fBB, PRF flatness for fBB from 1MHz
Output-Power Flatness 0.15 dB
to 50MHz
ACLR (1st Adjacent Channel
Single-carrier WCDMA (Note 8) 65 dBc
5MHz Offset)
No external calibration, with each
LO Leakage -32 dBm
baseband input terminated in 50Ā
No external calibration, PLO = 0dBm 30 39.6
Sideband Suppression dBc
fLO = 920MHz PLO = -3dBm 43.5
Each baseband input terminated in 50Ā
Output Noise Density -174 dBm/Hz
(Note 9)
Output Noise Floor POUT = 0dBm, fLO = 900MHz (Note 10) -168 dBm/Hz
RF Return Loss (Note 7) 15 dB
Maxim Integrated 3
MAX2021
AC ELECTRICAL CHARACTERISTICS (Demodulator)
(MAX2021 Typical Application Circuit when operated as a demodulator, VCC = 4.75V to 5.25V, GND = 0V, I/Q outputs are recombined
using network shown in Figure 5. Losses of combining network not included in measurements. VDC for BBI+. BBI-, BBQ+, BBQ- = 0V,
PRF = PLO = 0dBm, 750MHz ≤ fLO ≤ 1200MHz, 50Ω LO and RF system impedance, R1 = 432Ω, R2 = 619Ω, R3 = 332Ω, TC = -40°C to
+85°C. Typical values are at VCC = 5V, TC = +25°C, unless otherwise noted.) (Note 6)
RF INPUT
Conversion Loss LC fBB = 25MHz (Note 11) 9.2 dB
Noise Figure NF fLO = 900MHz 9.3 dB
fBLOCKER = 900MHz, PRF = 11dBm,
Noise Figure Under-Blocking NFBLOCK 17.8 dB
fRF = fLO = 890MHz (Note 12)
fRF1 = 925MHz, fRF2 = 926MHz, fLO =
Input Third-Order Intercept IIP3 35.2 dBm
900MHz, PRF = PLO = 0dBm, fSPUR = 24MHz
fRF1 = 925MHz, fRF2 = 926MHz, fLO =
Input Second-Order Intercept IIP2 76 dBm
900MHz, PRF = PLO = 0dBm, fSPUR = 51MHz
Input 1dB Compression P1dB fIF = 50MHz, fLO = 900MHz, PLO = 0dBm 30 dBm
I/Q Gain Mismatch fBB = 1MHz, fLO = 900MHz, PLO = 0dBm 0.06 dB
fBB = 1MHz, PLO = 0dBm 1.1
I/Q Phase Mismatch Degrees
fLO = 900MHz PLO = -3dBm 0.15
Minimum Demodulation 3dB
LO = 1160MHz LO > RF > 550 MHz
Bandwidth
Minimum 1dB Gain Flatness LO = 1160MHz LO > RF > 450 MHz
AC ELECTRICAL CHARACTERISTICS (Demodulator LO = 965MHz)

(Typical Application Circuit when operated as a demodulator. I/Q outputs are recombined using network shown in Figure 5. Losses of
combining network not included in measurements. RF and LO ports are driven from 50Ω sources. Typical values are for TA = +25°C,
VCC = 5.0V, I/Q DC voltage return = 0V, PRF = 0dBm, PLO = 0dBm, fRF = 780MHz, fLO = 965MHz, fIF = 185MHz, unless otherwise noted.)

Conversion Loss Lc 10.1 dB
Noise Figure NFSSB 10.4 dB
fBLOCKER = 700MHz, PBLOCKER = 11dBm,
Noise Figure Under Blocking NFBLOCK 19 dB
fLO = 965MHz, fRF = 865MHz, (Note 12)
fRF1 = 780MHz, fRF2 = 781MHz,

PRF1 = PRF2 = 0dBm, fIF1 = 185MHz, 34.5
Input Third-Order Intercept fIF2 = 184MHz
IIP3 dBm
Point fRF1 = 780MHz, fRF2 = 735MHz,
fIF2 = 230MHz
4 Maxim Integrated
MAX2021
AC ELECTRICAL CHARACTERISTICS (Demodulator LO = 965MHz) (continued)
(Typical Application Circuit when operated as a demodulator. I/Q outputs are recombined using network shown in Figure 5. Losses of
combining network not included in measurements. RF and LO ports are driven from 50Ω sources. Typical values are for TA = +25°C,
VCC = 5.0V, I/Q DC voltage return = 0V, PRF = 0dBm, PLO = 0dBm, fRF = 780MHz, fLO = 965MHz, fIF = 185MHz, unless otherwise noted.)

fRF1 = 780MHz, fRF2 = 781MHz,
Input Second-Order Intercept fIF2 = 184MHz, fIF1+ fIF2 term
IIP2 dBm
Point fRF1 = 780MHz, fRF2 = 735MHz,
fIF2 = 230MHz, fIF1+ fIF2 term
2LO - 2RF, fRF = 872.5MHz, PRF = -10dBm 84
3LO - 3RF, fRF = 903.333MHz, PRF = -10dBm 99
Spurious Relative to a
3RF - 2LO, fRF = 705MHz, PRF = -10dBm 105 dBc
Fundamental at 780MHz
4RF - 3LO, fRF = 770MHz, PRF = -10dBm 114
5RF - 4LO, fRF = 809MHz, PRF = -10dBm 115
Input Compression from Linear PRF = 0dBm to 21dBm 0.17 dB
I/Q Gain Mismatch 0.05 dB
I/Q Phase Mismatch 0.4 Degrees
1dB Conversion Loss Flatness fLO = 965MHz, fLO > fRF 400 MHz
RF Return Loss 17 dB
LO Return Loss 12 dB
Note 5: Recommended functional range. Not production tested. Operation outside this range is possible, but with degraded
performance of some parameters.
Note 6: Guaranteed by design and characterization.
Note 7: Parameter also applies to demodulator topology.
Note 8: Single-carrier WCDMA with 10.5dB peak-to-average ratio at 0.1% complementary cumulative distribution function,
PRF = -10dBm (PRF is chosen to give -65dBc ACLR).
Note 9: No baseband drive input. Measured with the inputs terminated in 50Ω. At low output levels, the output noise is thermal.
Note 10: The output noise versus POUT curve has the slope of LO noise (Ln dBc/Hz) due to reciprocal mixing.
Note 11: Conversion loss is measured from the single-ended RF input to single-ended combined baseband output.
Note 12: The LO noise (L = 10(Ln/10)), determined from the modulator measurements can be used to deduce the noise figure
under-blocking at operating temperature (Tp in Kelvin), FBLOCK = 1 + (Lcn - 1) Tp / To + LPBLOCK / (1000kTo), where
To = 290K, PBLOCK in mW, k is Boltzmann’s constant = 1.381 x 10(-23) J/K, and Lcn = 10(Lc/10), Lc is the conversion loss.
Noise figure under-blocking in dB is NFBLOCK = 10 x log (FBLOCK). Refer to Application Note 3632: Wideband LO Noise in
Passive Transmit-Receive Mixer ICs.
Maxim Integrated 5
MAX2021
Typical Operating Characteristics
332Ω, TC = -40°C to +85°C. Typical values are at VCC = 5V, VBBI = 1.4VP-P differential, VBBQ = 1.4VP-P differential, fIQ = 1MHz,
fLO = 900MHz, TC = +25°C, unless otherwise noted.)
TOTAL SUPPLY CURRENT
MODULATOR
vs. TEMPERATURE (TC) ACLR vs. OUTPUT POWER PER CARRIER ACLR vs. OUTPUT POWER PER CARRIER
300 -60 -60
MAX2021 toc01
MAX2021 toc02
MAX2021 toc03
-62 -62
VCC = 5.25V
TOTAL SUPPLY CURRENT (mA)
280 -64 -64

ADJACENT CHANNEL
-66 -66
260 -68 ADJACENT CHANNEL -68
ACLR (dB)
ACLR (dB)
VCC = 5.0V -70 -70
240 -72 ALTERNATE CHANNEL -72
VCC = 4.75V -74 -74 ALTERNATE CHANNEL
220 -76 -76
-78 -78
SINGLE-CARRIER WCDMA TWO-CARRIER WCDMA
200 -80 -80
-40 -15 10 35 60 85 -47 -37 -27 -17 -7 -47 -37 -27 -17 -7
TEMPERATURE (°C) OUTPUT POWER PER CARRIER (dBm) OUTPUT POWER PER CARRIER (dBm)
SIDEBAND SUPPRESSION SIDEBAND SUPPRESSION

ACLR vs. OUTPUT POWER PER CARRIER vs. LO FREQUENCY vs. LO FREQUENCY
-60 70 70
MAX2021 toc06
MAX2021 toc04
MAX2021 toc05
-62 PLO = -6dBm

ADJACENT CHANNEL 60 PLO = -3dBm 60
SIDEBAND SUPPRESSION (dBc)
-64
-66 50
50
-68
ACLR (dB)
-70 ALTERNATE CHANNEL 40 40

-72
30 30 VCC = 4.75V, 5.0V, 5.25V
-74 PLO = 0dBm
-76 20
20
-78 PLO = +3dBm
FOUR-CARRIER WCDMA
-80 10 10
-47 -37 -27 -17 -7 750 825 900 975 1050 1125 1200 750 825 900 975 1050 1125 1200
OUTPUT POWER PER CARRIER (dBm) LO FREQUENCY (MHz) LO FREQUENCY (MHz)
SIDEBAND SUPPRESSION
vs. LO FREQUENCY OUTPUT IP3 vs. LO FREQUENCY OUTPUT IP3 vs. LO FREQUENCY
70 30 30
MAX2021 toc07
MAX2021 toc08
MAX2021 toc09
PLO = 0dBm, VCC = 5.0V TC = +25°C
60 VCC = 5.25V
TC = +85°C TC = -40°C
25 25
TC = +25°C
OUTPUT IP3 (dBm)
OUTPUT IP3 (dBm)
50
40 20 20
VCC = 5.0V
30 TC = +25°C TC = +85°C
15 15 VCC = 4.75V
20 TC = -40°C
10 10 10
750 825 900 975 1050 1125 1200 750 825 900 975 1050 1125 1200 750 825 900 975 1050 1125 1200
LO FREQUENCY (MHz) LO FREQUENCY (MHz) LO FREQUENCY (MHz)
6 Maxim Integrated
MAX2021
Typical Operating Characteristics (continued)
MODULATOR
OUTPUT IP3 OUTPUT IP3
OUTPUT IP3 vs. LO FREQUENCY vs. COMMON-MODE VOLTAGE vs. COMMON-MODE VOLTAGE
30 26 26
MAX2021 toc11
MAX2021 toc12
MAX2021 toc10
TC = +25°C fLO = 900MHz, PLO = 0dBm fLO = 1000MHz
PLO = -3dBm 25 25
25
PLO = +3dBm
OUTPUT IP3 (dBm)
OUTPUT IP3 (dBm)

OUTPUT IP3 (dBm)
24 24
20 23 23
PLO = -6dBm 22 22
PLO = 0dBm
15
21 21
10 20 20
750 825 900 975 1050 1125 1200 -3.50 -1.75 0 1.75 3.50 -3.50 -1.75 0 1.75 3.50
LO FREQUENCY (MHz) COMMON-MODE VOLTAGE (V) COMMON-MODE VOLTAGE (V)
OUTPUT IP2 vs. LO FREQUENCY OUTPUT IP2 vs. LO FREQUENCY OUTPUT IP2 vs. LO FREQUENCY
80 80 80
MAX2021 toc13
MAX2021 toc14
MAX2021 toc15
TC = -40°C VCC = 5.25V PLO = +3dBm
70 70 70
OUTPUT IP2 (dBm)
OUTPUT IP2 (dBm)
OUTPUT IP2 (dBm)
TC = +25°C
VCC = 5.0V PLO = -6dBm
60 60 60
50 50 50 PLO = 0dBm
TC = +85°C VCC = 4.75V PLO = -3dBm
40 40 40
750 825 900 975 1050 1125 1200 750 825 900 975 1050 1125 1200 750 825 900 975 1050 1125 1200
OUTPUT IP2 OUTPUT IP2 MODULATOR OUTPUT POWER

vs. COMMON-MODE VOLTAGE vs. COMMON-MODE VOLTAGE vs. INPUT POWER
80 70 20
MAX2021 toc16
MAX2021 toc17
MAX2021 toc18
fLO = 900MHz fLO = 1000MHz INPUT SPLIT BETWEEN I AND Q,

fIF = 25MHz, fLO = 900MHz
75 15
65
OUTPUT POWER (dBm)
OUTPUT IP2 (dBm)
OUTPUT IP2 (dBm)
70 10
60
65 5
55 VCC = 4.75V, 5.0V, 5.25V

60 0
55 50 -5
-3.50 -1.75 0 1.75 3.50 -3.50 -1.75 0 1.75 3.50 10 13 16 19 22 25 28
COMMON-MODE VOLTAGE (V) COMMON-MODE VOLTAGE (V) INPUT POWER (dBm)
Maxim Integrated 7
MAX2021
Typical Operating Characteristics (continued)
MODULATOR
MODULATOR OUTPUT POWER MODULATOR OUTPUT POWER
vs. INPUT POWER vs. LO FREQUENCY LO LEAKAGE vs. LO FREQUENCY
20 5 -40
MAX2021 toc20
MAX2021 toc19
MAX2021 toc21
INPUT SPLIT BETWEEN I AND Q, VBBI = VBBQ = 1.4VP-P LO LEAKAGE NULLED AT PRF = -1dBm
fIF = 25MHz, fLO = 900MHz DIFFERENTIAL PRF = -40dBm PRF = +5dBm
3 -50
15
TC = -40°C
OUTPUT POWER (dBm)
OUTPUT POWER (dBm)
LO LEAKAGE (dBm)
-60
10 1
-70 PRF = -7dBm
5 -1 TC = +85°C TC = +25°C
-80
0 PLO = -6dBm, -3dBm, 0dBm, +3dBm -3

-90
PRF = -1dBm
-5 -5 -100
10 13 16 19 22 25 28 750 825 900 975 1050 1125 1200 915 926 937 948 959 970
INPUT POWER (dBm) LO FREQUENCY (MHz) LO FREQUENCY (MHz)
LO LEAKAGE vs. LO FREQUENCY LO LEAKAGE vs. LO FREQUENCY OUTPUT NOISE vs. OUTPUT POWER
-40 -40 -150
MAX2021 toc24
MAX2021 toc23
MAX2021 toc22
PRF = -1dBm, LO LEAKAGE NULLED AT TC = +25°C PRF = -1dBm, LO LEAKAGE NULLED AT PLO = 0dBm TC = +25°C, fLO = 900MHz
PLO = -6dBm
-50 TC = -40°C -50 PLO = -3dBm -155
PLO = -6dBm
OUTPUT NOISE (dBm/Hz)
LO LEAKAGE (dBm)
LO LEAKAGE (dBm)
-60 -60 -160

PLO = -3dBm
-70 TC = +85°C -70 -165
-80 -80 PLO = +3dBm -170

PLO = 0dBm
-90 -90 -175
TC = +25°C PLO = 0dBm PLO = +3dBm

-100 -100 -180
915 926 937 948 959 970 915 926 937 948 959 970 -15 -10 -5 0 5 10 15
LO FREQUENCY (MHz) LO FREQUENCY (MHz) OUTPUT POWER (dBm)
OUTPUT NOISE vs. OUTPUT POWER

-150
MAX2021 toc25
PLO = 0dBm, fLO = 900MHz
-155
OUTPUT NOISE (dBm/Hz)
-160
-165 TC = +85°C
-170
TC = -40°C
-175
TC = +25°C
-180
-15 -10 -5 0 5 10 15
OUTPUT POWER (dBm)
8 Maxim Integrated
MAX2021
(MAX2021 Typical Application Circuit, VCC = 4.75V to 5.25V, GND = 0V, I/Q outputs are recombined using network shown in Figure 5.
Losses of combining network not included in measurements. PRF = 5dBm, PLO = 0dBm, 750MHz ≤ fLO ≤ 1200MHz, 50Ω LO and RF sys-
tem impedance, R1 = 432Ω, R2 = 619Ω, R3 = 332Ω, TC = -40°C to +85°C. Typical values are at VCC = 5V, fLO = 900MHz, TC = +25°C,
unless otherwise noted.)
DEMODULATOR (VARIABLE LO)
DEMODULATOR CONVERSION LOSS DEMODULATOR INPUT IP3 DEMODULATOR INPUT IP3
vs. LO FREQUENCY vs. LO FREQUENCY vs. LO FREQUENCY
12 40 40
MAX2021 toc26
MAX2021 toc27
MAX2021 toc28
PLO = 0dBm, VCC = 5.0V PLO = 0dBm, TC = +25°C PLO = 0dBm, VCC = 5.0V
DEMODULATOR CONVERSION LOSS (dB)
TC = +25°C
DEMODULATOR INPUT IP3 (dBm)

11 38 VCC = 5.25V 38
TC = +25°C
TC = +85°C TC = -40°C
10 36 36
9 34 34
VCC = 5.0V
8 TC = -40°C 32 32
VCC = 4.75V TC = +85°C
7 30 30
750 825 900 975 1050 1125 1200 750 825 900 975 1050 1125 1200 750 825 900 975 1050 1125 1200
DEMODULATOR INPUT IP2 DEMODULATOR PHASE IMBALANCE DEMODULATOR AMPLITUDE IMBALANCE
vs. LO FREQUENCY vs. LO FREQUENCY vs. LO FREQUENCY
90 10 0.20
MAX2021 toc29
MAX2021 toc30
MAX2021 toc31
DEMODULATOR AMPLITUDE IMBALANCE (dB)
PLO = 0dBm, VCC = 5.0V PLO = +3dBm
DEMODULATOR PHASE IMBALANCE (deg)
8
0.15
6 PLO = -3dBm
80 0.10
4
TC = +25°C PLO = 0dBm
2 0.05
70 0 0
TC = +85°C PLO = -6dBm, -3dBm, 0dBm, +3dBm
-2
-0.05
-4 PLO = -6dBm
60 -0.10
TC = -40°C -6
-8 -0.15
50 -10 -0.20
750 825 900 975 1050 1125 1200 750 825 900 975 1050 1125 1200 750 825 900 975 1050 1125 1200
LO PORT RETURN LOSS RF PORT RETURN LOSS IF FLATNESS
vs. LO FREQUENCY vs. LO FREQUENCY vs. BASEBAND FREQUENCY
0 0 -4
MAX2021 toc34
MAX2021 toc33
MAX2021 toc32
PLO = 0dBm
PLO = +3dBm +5 -5
+5 fLO = 900MHz
RF PORT RETURN LOSS (dB)
+10
LO PORT RETURN LOSS (dB)
IF OUTPUT POWER (dBm)
PLO = 0dBm -6
+15
-7
+10
+20
-8
+25
+15 -9 fLO = 1000MHz
+30 PLO = -6dBm, -3dBm, 0dBm, +3dBm
PLO = -6dBm, -3dBm -10
+35
+20
+40 -11
+25 +45 -12

750 825 900 975 1050 1125 1200 750 845 940 1035 1130 1225 0 10 20 30 40 50 60 70 80
LO FREQUENCY (MHz) LO FREQUENCY (MHz) BASEBAND FREQUENCY (MHz)
Maxim Integrated 9
MAX2021
(MAX2021 Typical Application Circuit, VCC = 5.0V, GND = 0V, I/Q outputs are recombined using network shown in Figure 5. Losses of
combining network not included in measurements. PRF = 0dBm, PLO = 0dBm, fLO = 965MHz, fIF = fLO - fRF, 50Ω LO and RF system
impedance, R1 = 432Ω, R2 = 619Ω, R3 = 332Ω, TA = +25°C, unless otherwise noted.)
DEMODULATOR (FIXED LO)

CONVERSION LOSS vs. RF FREQUENCY I/Q GAIN MISMATCH vs. IF FREQUENCY I/Q PHASE MISMATCH vs. IF FREQUENCY
12 0.10 2.0
MAX2021 toc35
MAX2021 toc36
MAX2021 toc37
fLO = 965MHz fLO = 965MHz fLO = 965MHz
1.5
11
PHASE MISMATCH (DEG)

0.05
CONVERSION LOSS (dB)
GAIN MISMATCH (dB)
1.0
10
0 0.5
9
0
-0.05
8
-0.5
7 -0.10 -1.0
650 695 740 785 830 875 90 135 180 225 270 315 90 135 180 225 270 315
RF FREQUENCY (MHz) IF FREQUENCY (MHz) IF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY INPUT IP2 vs. RF FREQUENCY

38 90
MAX2021 toc39
MAX2021 toc38
PRF = 0dBm/TONE PRF = 0dBm/TONE

fLO = 965MHz fLO = 965MHz
37 85
36 80
INPUT IP2 (dBm)
INPUT IP3 (dBm)
1MHz TONE DELTA

1MHz TONE DELTA
35 75
34 70
45MHz TONE DELTA
33 65 45MHz TONE DELTA
32 60
650 725 800 875 950 650 725 800 875 950
RF FREQUENCY (MHz) RF FREQUENCY (MHz)
10 Maxim Integrated
MAX2021
Pin Description
PIN NAME FUNCTION
1, 5, 9–12, 14, 16–19, 22,
GND Ground
24, 27–30, 32, 34–36
2 RBIASLO3 3rd LO Amplifier Bias. Connect a 332Ā resistor to ground.
LO Input Buffer Amplifier Supply Voltage. Bypass to GND with 33pF and 0.1µF
3 VCCLOA
capacitors as close as possible to the pin.
4 LO Local Oscillator Input. 50Ā input impedance. Requires a DC-blocking capacitor.
6 RBIASLO1 1st LO Input Buffer Amplifier Bias. Connect a 432Ā resistor to ground.
7 N.C. No Connection. Leave unconnected.
8 RBIASLO2 2nd LO Amplifier Bias. Connect a 619Ā resistor to ground.
I-Channel 1st LO Amplifier Supply Voltage. Bypass to GND with 33pF and 0.1µF
13 VCCLOI1
I-Channel 2nd LO Amplifier Supply Voltage. Bypass to GND with 33pF and 0.1µF
15 VCCLOI2
20 BBI+ Baseband In-Phase Noninverting Port
21 BBI- Baseband In-Phase Inverting Port
23 RF RF Port. This port is matched to 50Ā. Requires a DC-blocking capacitor.
25 BBQ- Baseband Quadrature Inverting Port
26 BBQ+ Baseband Quadrature Noninverting Port
Q-Channel 2nd LO Amplifier Supply Voltage. Bypass to GND with 33pF and 0.1µF
31 VCCLOQ2
Q-Channel 1st LO Amplifier Supply Voltage. Bypass to GND with 33pF and 0.1µF
33 VCCLOQ1
Exposed Ground Pad. The exposed pad MUST be soldered to the ground plane using
EP GND
multiple vias.
Detailed Description point, and LO and sideband suppression characteris-

tics. These features make the MAX2021 ideal for four-
The MAX2021 is designed for upconverting differential
carrier WCDMA operation.
in-phase (I) and quadrature (Q) inputs from baseband
to a 650MHz to 1200MHz RF frequency range. The LO Input Balun, LO Buffer, and
device can also be used as a demodulator, downcon- Phase Splitter
verting an RF input signal directly to baseband. The MAX2021 requires a single-ended LO input, with a
Applications include RFID handheld and portal readers, nominal power of 0dBm. An internal low-loss balun at
as well as single and multicarrier GSM/EDGE, the LO input converts the single-ended LO signal to a
cdma2000, WCDMA, and iDEN base stations. Direct differential signal at the LO buffer input. In addition, the
conversion architectures are advantageous since they internal balun matches the buffer’s input impedance to
significantly reduce transmitter or receiver cost, part 50Ω over the entire band of operation.
count, and power consumption as compared to tradition-
al IF-based double conversion systems. The output of the LO buffer goes through a phase split-
ter, which generates a second LO signal that is shifted
The MAX2021 integrates internal baluns, an LO buffer, a by 90° with respect to the original. The 0° and 90° LO
phase splitter, two LO driver amplifiers, two matched signals drive the I and Q mixers, respectively.
double-balanced passive mixers, and a wideband
quadrature combiner. The MAX2021’s high-linearity mix- LO Driver
ers, in conjunction with the part’s precise in-phase and Following the phase splitter, the 0° and 90° LO signals
quadrature channel matching, enable the device to pos- are each amplified by a two-stage amplifier to drive the
sess excellent dynamic range, ACLR, 1dB compression I and Q mixers. The amplifier boosts the level of the LO
Maxim Integrated 11
MAX2021
signals to compensate for any changes in LO drive lev- mode range), through an inductor to ground, or through
els. The two-stage LO amplifier allows a wide input a low-value resistor to ground.
power range for the LO drive. The MAX2021 can toler- The MAX2021 is designed to interface directly with
ate LO level swings from -6dBm to +3dBm. Maxim high-speed DACs. This generates an ideal total
I/Q Modulator transmitter lineup, with minimal ancillary circuit elements.
The MAX2021 modulator is composed of a pair of Such DACs include the MAX5875 series of dual DACs,
matched double-balanced passive mixers and a balun. and the MAX5895 dual interpolating DAC. These DACs
The I and Q differential baseband inputs accept signals have ground-referenced differential current outputs.
from DC to 550MHz with differential amplitudes up to Typical termination of each DAC output into a 50Ω load
4VP-P. The wide input bandwidths allow operation of the resistor to ground, and a 10mA nominal DC output cur-
MAX2021 as either a direct RF modulator or as an rent results in a 0.5V common-mode DC level into the
image-reject mixer. The wide common-mode compli- modulator I/Q inputs. The nominal signal level provided
ance range allows for direct interface with the base- by the DACs will be in the -12dBm range for a single
band DACs. No active buffer circuitry is required CDMA or WCDMA carrier, reducing to -18dBm per car-
between the baseband DACs and the MAX2021 for rier for a four-carrier application.
cdma2000 and WCDMA applications. The I/Q input bandwidth is greater than 50MHz at
The I and Q signals directly modulate the 0° and 90° LO -0.1dB response. The direct connection of the DAC to
signals and are upconverted to the RF frequency. The out- the MAX2021 ensures the maximum signal fidelity, with
puts of the I and Q mixers are combined through a balun no performance-limiting baseband amplifiers required.
to produce a singled-ended RF output. The DAC output can be passed through a lowpass filter
to remove the image frequencies from the DAC’s output
Applications Information response. The MAX5895 dual interpolating DAC can be
operated at interpolation rates up to x8. This has the
LO Input Drive benefit of moving the DAC image frequencies to a very
The LO input of the MAX2021 is internally matched to high, remote frequency, easing the design of the base-
50Ω, and requires a single-ended drive at a 750MHz to band filters. The DAC’s output noise floor and interpola-
1200MHz frequency range. An integrated balun con- tion filter stopband attenuation are sufficiently good to
verts the singled-ended input signal to a differential sig- ensure that the 3GPP noise floor requirement is met for
nal at the LO buffer differential input. An external large frequency offsets, 60MHz for example, with no fil-
DC-blocking capacitor is the only external part required tering required on the RF output of the modulator.
at this interface. The LO input power should be within
the -6dBm to +3dBm range. An LO input power of Figure 1 illustrates the ease and efficiency of interfacing
-3dBm is recommended for best overall peformance. the MAX2021 with a Maxim DAC (in this case the
MAX5895 dual 16-bit interpolating-modulating DAC)
Modulator Baseband I/Q Input Drive and with Maxim VGA and VCO/Synth ICs.
Drive the MAX2021 I and Q baseband inputs differen- The MAX5895 DAC has programmable gain and differ-
tially for best performance. The baseband inputs have ential offset controls built in. These can be used to opti-
a 53Ω differential input impedance. The optimum mize the LO leakage and sideband suppression of the
source impedance for the I and Q inputs is 100Ω differ- MAX2021 quadrature modulator.
ential. This source impedance achieves the optimal sig-
nal transfer to the I and Q inputs, and the optimum RF Output
output RF impedance match. The MAX2021 can accept The MAX2021 utilizes an internal passive mixer archi-
input power levels of up to +20dBm on the I and Q tecture that enables the device to possess an excep-
inputs. Operation with complex waveforms, such as tionally low-output noise floor. With such architectures,
CDMA carriers or GSM signals, utilize input power lev- the total output noise is typically a power summation of
els that are far lower. This lower power operation is the theoretical thermal noise (KTB) and the noise contri-
made necessary by the high peak-to-average ratios of bution from the on-chip LO buffer circuitry. As demon-
these complex waveforms. The peak signals must be strated in the Typical Operating Characteristics, the
kept below the compression level of the MAX2021. MAX2021’s output noise approaches the thermal limit of
The four baseband ports need some form of DC return -174dBm/Hz for lower output power levels. As the out-
to establish a common mode that the on-chip circuitry put power increases, the noise level tracks the noise
drives. This can be achieved by directly DC-coupling to contribution from the LO buffer circuitry, which is
the baseband ports (staying within the ±3.5V common- approximately -168dBc/Hz.
12 Maxim Integrated
MAX2021
50I
12
I DAC
50I
MAX2021
31dB 17dB 31dB
MAX5873
DUAL DAC 0 RFOUT
C
90
50I
MAX2058
RF DIGITAL VGA
12
Q DAC SPI
LOGIC
50I
LOOPBACK Rx OFF SPI

OUT CONTROL
(FEEDS BACK
MAX9491
45, 80, INTO Rx CHAIN
VCO + SYNTH FRONT END)
OR
95MHz
LO
Figure 1. Transmitter Lineup
The I/Q input power levels and the insertion loss of the
C = 6.8pF
device determine the RF output power level. The input
power is a function of the delivered input I and Q volt-
MAX2021 ages to the internal 50Ω termination. For simple sinu-
100Ω
RF-MODULATOR soidal baseband signals, a level of 89mVP-P differential
L = 40nH on the I and the Q inputs results in a -17dBm input
I
power level delivered to the I and Q internal 50Ω termi-
nations. This results in an RF output power of -23.2dBm.
100Ω
External Diplexer
LO leakage at the RF port can be nulled to a level less
0° than -80dBm by introducing DC offsets at the I and Q
C = 6.8pF LO 90° ∑ RF ports. However, this null at the RF port can be compro-
mised by an improperly terminated I/Q IF interface. Care
100Ω must be taken to match the I/Q ports to the driving DAC
circuitry. Without matching, the LO’s second-order (2fLO)
Q L = 40nH term may leak back into the modulator’s I/Q input port
where it can mix with the internal LO signal to produce
additional LO leakage at the RF output. This leakage
100Ω effectively counteracts against the LO nulling. In addi-
tion, the LO signal reflected at the I/Q IF port produces a
residual DC term that can disturb the nulling condition.
C = 6.8pF
As demonstrated in Figure 2, providing an RC termina-
Figure 2. Diplexer Network Recommended for GSM 900 tion on each of the I+, I-, Q+, Q- ports reduces the
Transmitter Applications amount of LO leakage present at the RF port under
Maxim Integrated 13
MAX2021
varying temperature, LO frequency, and baseband (staying within the ±3.5V common-mode range),
drive conditions. See the Typical Operating through an inductor to ground, or through a low-value
Characteristics for details. Note that the resistor value is resistor to ground. Figure 4 shows a typical network that
chosen to be 100Ω with a corner frequency 1 / (2πRC) would be used to connect to each baseband port for
selected to adequately filter the fLO and 2fLO leakage, demodulator operation. This network provides a com-
yet not affecting the flatness of the baseband response mon-mode DC return, implements a high-frequency
at the highest baseband frequency. The common- diplexer to terminate unwanted RF terms, and also pro-
mode fLO and 2fLO signals at I+/I- and Q+/Q- effective- vides an impedance transformation to a possible higher
ly see the RC networks and thus become terminated in impedance baseband amplifier.
50Ω (R/2). The RC network provides a path for absorb- The network Ca, Ra, La and Cb form a highpass/low-
ing the 2fLO and fLO leakage, while the inductor pro- pass network to terminate the high frequencies into a
vides high impedance at f LO and 2f LO to help the load while passing the desired lower IF frequencies.
diplexing process. Elements La, Cb, Lb, Cc, Lc, and Cd provide a possible
RF Demodulator impedance transformer. Depending on the impedance
The MAX2021 can also be used as an RF demodulator being transformed and the desired bandwidth, a fewer
(see Figure 3), downconverting an RF input signal number of elements could be used. It is suggested that
directly to baseband. The single-ended RF input La and Cb always be used since they are part of the
accepts signals from 650MHz to 1200MHz with power high frequency diplexer. If power matching is not a
levels up to +30dBm. The passive mixer architecture concern then this would reduce the elements to just the
produces a conversion loss of typically 9.2dB. The diplexer.
downconverter is optimized for high linearity and Resistor Rb provides a DC return to set the common
excellent noise performance, typically with a mode voltage. In this case, due to the on-chip circuitry,
+35.2dBm IIP3, a P1dB of greater than +30dBm, and a the voltage would be approx 0V DC. It can also be
9.3dB noise figure. used to reduce the load impedance of the next stage.
A wide I/Q port bandwidth allows the port to be used as Inductor Ld can provide a bit of high frequency gain
an image-reject mixer for downconversion to a quadra- peaking for wideband IF systems. Capacitor Ce is a DC
ture IF frequency. block.
The RF and LO inputs are internally matched to 50Ω. Typical values for Ca, Ra, La, and Cb would be 1.5pF,
Thus, no matching components are required, and only 50Ω, 11nH, and 4.7pF, respectively. These values can
DC-blocking capacitors are needed for interfacing. change depending on the LO, RF, and IF frequencies
used. Resistor Rb is in the 50Ω to 200Ω range
Demodulator Output Port Considerations The circuitry presented in Figure 4 does not allow for LO
Much like in the modulator case, the four baseband leakage at RF port nulling. Depending on the LO at RF
ports require some form of DC return to establish a com- leakage requirement, a trim voltage might need to be
mon mode that the on-chip circuitry drives. This can be introduced on the baseband ports to null the LO leakage.
achieved by directly DC-coupling to the baseband ports
MAX2021
DIPLEXER/
MATCHING ADC
DC RETURN
RF 90 LO
0
DIPLEXER/
MATCHING ADC
DC RETURN
Figure 3. MAX2021 Demodulator Configuration
14 Maxim Integrated
MAX2021
Ld
Ra
Rb
Ca
La Lb Lc Ce
MAX2021 EXTERNAL
I/Q OUTPUTS STAGE
Cb Cc Cd
Figure 4. Baseband Port Typical Filtering and DC Return Network
I+ 3dB PAD DC BLOCK 0°

MINI-CIRCUITS
ZFSCJ-2-1
I- 3dB PAD DC BLOCK 180°
3dB PADS LOOK LIKE 160I TO GROUND MINI-CIRCUITS

AND PROVIDES THE COMMON-MODE ZFSC-2-1W-S+
DC RETURN FOR THE ON-CHIP CIRCUITRY. 0° COMBINER
Q+ 3dB PAD DC BLOCK 0°

MINI-CIRCUITS
90°
ZFSCJ-2-1
Q- 3dB PAD DC BLOCK 180°
Figure 5. Demodulator Combining Diagram
Power Scaling with Changes Layout Considerations

to the Bias Resistors A properly designed PCB is an essential part of any
Bias currents for the LO buffers are optimized by fine RF/microwave circuit. Keep RF signal lines as short as
tuning resistors R1, R2, and R3. Maxim recommends possible to reduce losses, radiation, and inductance.
using ±1%-tolerance resistors; however, standard ±5% For the best performance, route the ground pin traces
values can be used if the ±1% components are not directly to the exposed pad under the package. The
readily available. The resistor values shown in the PCB exposed pad MUST be connected to the ground
Typical Application Circuit were chosen to provide plane of the PCB. It is suggested that multiple vias be
peak performance for the entire 650MHz to 1200MHz used to connect this pad to the lower-level ground
band. If desired, the current can be backed off from planes. This method provides a good RF/thermal con-
this nominal value by choosing different values for R1, duction path for the device. Solder the exposed pad on
R2, and R3. Tables 1 and 2 outline the performance the bottom of the device package to the PCB. The
trade-offs that can be expected for various combina- MAX2021 evaluation kit can be used as a reference for
tions of these bias resistors. As noted within the tables, board layout. Gerber files are available upon request at
the performance trade-offs may be more pronounced www.maximintegrated.com.
for different operating frequencies. Contact the factory
for additional details.
Maxim Integrated 15
MAX2021
Table 1. Typical Performance Trade-Offs as a Function of Current Draw—Modulator Mode
LO FREQ RF FREQ R1 R2 R3 ICC OIP3 LO LEAK IMAGE REJ OIP2
(MHz) (MHz) Ω)
(Ω Ω)
(Ω Ω)
(Ω (mA) (dBm) (dBm) (dBc) (dBm)
420 620 330 271 19.6 -32.1 23.9 50.5
453 665 360 253 21.9 -32.7 34.0 51.0
800 801.8 499 698 402 229 18.9 -33.7 30.0 52.6
549 806 464 205 15.7 -34.4 23.7 46.0
650 1000 550 173 13.6 -34.2 23.3 32.3
420 620 330 271 20.7 -31.4 43.4 54.0

453 665 360 253 21.6 -31.6 42.4 55.4
900 901.8 499 698 402 229 20.6 -31.8 42.7 59.8
549 806 464 205 19.0 -31.9 40.3 50.7
650 1000 550 173 14.9 -30.5 25.0 34.6
420 620 330 271 22.4 -32.8 39.3 55.5

453 665 360 253 22.2 -33.2 39.1 56.3
1000 1001.8 499 698 402 229 19.9 -33.8 43.5 55.0
549 806 464 205 17.6 -34.8 40.5 51.4
650 1000 550 173 14.6 -33.9 36.8 32.8
Note: VCC = 5V, PLO = 0dBm, TA = +25°C, I/Q voltage levels = 1.4VP-P differential.
Power-Supply Bypassing Exposed Pad RF/Thermal Considerations

Proper voltage-supply bypassing is essential for high- The EP of the MAX2021’s 36-pin TQFN-EP package
frequency circuit stability. Bypass all VCC_ pins with provides a low thermal-resistance path to the die. It is
33pF and 0.1µF capacitors placed as close to the pins important that the PCB on which the IC is mounted be
as possible. The smallest capacitor should be placed designed to conduct heat from this contact. In addition,
closest to the device. the EP provides a low-inductance RF ground path for
To achieve optimum performance, use good voltage- the device.
supply layout techniques. The MAX2021 has several The exposed pad (EP) MUST be soldered to a ground
RF processing stages that use the various VCC_ plane on the PCB either directly or through an array of
pins, and while they have on-chip decoupling, off- plated via holes. An array of 9 vias, in a 3 x 3 array, is
chip interaction between them may degrade gain, lin- suggested. Soldering the pad to ground is critical for
earity, carrier suppression, and output power-control efficient heat transfer. Use a solid ground plane wher-
range. Excessive coupling between stages may ever possible.
degrade stability.
16 Maxim Integrated
MAX2021
Table 2. Typical Performance Trade-Offs as a Function of Current Draw—Demodulator Mode
LO FREQ RF FREQ R1 R2 R3 ICC CONVERSION IIP3 57MHz IIP2
(MHz) (MHz) Ω)
(Ω Ω)
(Ω Ω)
(Ω (mA) LOSS (dB) (dBm) (dBm)
420 620 330 269 9.8 33.85 62.1
453 665 360 254 9.83 33.98 62.9
800 771 499 698 402 230 9.81 32.2 66.6
549 806 464 207 9.84 31.1 66.86
650 1000 550 173 9.95 29.87 65.25
420 620 330 269 9.21 33.1 68

453 665 360 254 9.25 33.9 66.87
900 871 499 698 402 230 9.36 34.77 66.7
549 806 464 207 9.39 35.3 66.6
650 1000 550 173 9.46 32 64.64
420 620 330 269 9.47 34.9 > 77.7

453 665 360 254 9.5 35.4 > 77.5
1000 971 499 698 402 230 9.53 34.58 > 76.5
549 806 464 207 9.5 33.15 > 76.5
650 1000 550 173 9.61 31.5 76
Note: Used on PCB 180° combiners and off PCB quadrature combiner with VCC = 5V, PRF = -3dBm, PLO = 0dBm, TA = +25°C,
IF1 = 28MHz, IF2 = 29MHz.
Maxim Integrated 17
MAX2021
Pin Configuration/Functional Diagram
VCCLOQ1
VCCLOQ2
GND
GND
GND
GND
GND
GND
GND
+ 36 35 34 33 32 31 30 29 28
GND 1 27 GND
MAX2021
BIAS
RBIASLO3 2 LO3 26 BBQ+
VCCLOA 3 25 BBQ-
90°
LO 4 24 GND
0°
GND 5 23 RF
RBIASLO1 6
BIAS
LO1
Σ 22 GND
N.C. 7 21 BBI-
BIAS
RBIASLO2 8 LO2 20 BBI+
EP
GND 9 19 GND
10 11 12 13 14 15 16 17 18
GND
GND
GND
GND
VCCLOI1
VCCLOI2
GND
GND
GND
TQFN
(6mm x 6mm)
Chip Information Package Information

PROCESS: SiGe BiCMOS For the latest package outline information and land patterns (foot-
prints), go to www.maximintegrated.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
PACKAGE PACKAGE OUTLINE LAND

TYPE CODE NO. PATTERN NO.
TQFN T3666+2 21-0141 90-0049
18 Maxim Integrated
MAX2021
Typical Application Circuit
C12 C13 C10 C11

0.1µF 33pF 33pF 0.1µF
VCC VCC
VCCLOQ1
VCCLOQ2
R3 GND GND GND GND GND GND GND
332Ω + 36 34 33 32 31 30 29 28
35
GND
1 27
MAX2021 GND
BIAS
RBIASLO3
2 LO3 26 Q+
C2 C1 BBQ+
0.1µF 33pF VCCLOA
VCC 3 25 Q-
C3 BBQ-
82pF LO 90°
LO 4 24 C9
0° GND 8.2pF
GND RF
5 23 RF
RBIASLO1
6
BIAS
LO1
Σ 22
GND
R1 N.C.
432Ω 7 21 I-
BBI-
RBIASLO2 BIAS
8 LO2 20 I+
BBI+
R2 GND EP
619Ω 9 19
GND
10 11 12 13 14 15 16 17 18
VCCLOI1
VCCLOI2
GND GND GND GND GND GND GND
VCC VCC
C5 C6 C7 C8
0.1µF 33pF 33pF 0.1µF
Table 3. Component List Referring to the Typical Application Circuit

COMPONENT VALUE DESCRIPTION
C1, C6, C7, C10, C13 33pF 33pF ±5%, 50V C0G ceramic capacitors (0402)
C2, C5, C8, C11, C12 0.1µF 0.1µF ±10%, 16V X7R ceramic capacitors (0603)
C3 82pF 82pF ±5%, 50V C0G ceramic capacitor (0402)
C9 8.2pF 8.2pF ±0.1pF, 50V C0G ceramic capacitor (0402)
R1 432Ω 432Ω ±1% resistor (0402)
R2 619Ω 619Ω ±1% resistor (0402)
R3 332Ω 332Ω ±1% resistor (0402)
Maxim Integrated 19
MAX2021
Revision History
REVISION REVISION PAGES
DESCRIPTION
NUMBER DATE CHANGED
0 7/06 Initial release —
Updated Features section; updated Ordering Information, Absolute Maximum Ratings,
DC Electrical Characteristics, Pin Description, AC Electrical Characteristics table,
1 6/12 Typical Operating Characteristics globals, Detailed Description section, I/Q Modulator 1–3, 9–11, 14
section, Baseband I/Q Input Drive section, Power Scaling with the Changes to the
Bias Resistors section, Typical Application Circuit, Figures 1–3, and Table 1
Updated Electrical Characteristics table; updated TOCs 35–39; updated title and 1, 2, 4, 8, 9,
2 4/13
Features section 12, 13
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent
licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and
max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
20 ________________________________Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000
© 2013 Maxim Integrated Products, Inc. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.

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EVALUATION KIT AVAILABLE

PACKAGE THERMAL CHARACTERISTICS

RECOMMENDED AC OPERATING CONDITIONS

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

AC ELECTRICAL CHARACTERISTICS (Demodulator LO = 965MHz)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

fRF1 = 780MHz, fRF2 = 781MHz,

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

280 -64 -64

SIDEBAND SUPPRESSION SIDEBAND SUPPRESSION

-62 PLO = -6dBm

-70 ALTERNATE CHANNEL 40 40

PLO = 0dBm, VCC = 5.0V TC = +25°C

OUTPUT IP3 (dBm)

TC = +25°C fLO = 900MHz, PLO = 0dBm fLO = 1000MHz

OUTPUT IP3 (dBm)

OUTPUT IP2 (dBm)

OUTPUT IP2 (dBm)

OUTPUT IP2 OUTPUT IP2 MODULATOR OUTPUT POWER

fLO = 900MHz fLO = 1000MHz INPUT SPLIT BETWEEN I AND Q,

OUTPUT IP2 (dBm)

55 VCC = 4.75V, 5.0V, 5.25V

OUTPUT POWER (dBm)

0 PLO = -6dBm, -3dBm, 0dBm, +3dBm -3

-60 -60 -160

-80 -80 PLO = +3dBm -170

TC = +25°C PLO = 0dBm PLO = +3dBm

OUTPUT NOISE vs. OUTPUT POWER

PLO = 0dBm, fLO = 900MHz

DEMODULATOR INPUT IP3 (dBm)

IF OUTPUT POWER (dBm)

+25 +45 -12

DEMODULATOR (FIXED LO)

PHASE MISMATCH (DEG)

GAIN MISMATCH (dB)

INPUT IP3 vs. RF FREQUENCY INPUT IP2 vs. RF FREQUENCY

PRF = 0dBm/TONE PRF = 0dBm/TONE

1MHz TONE DELTA

33 65 45MHz TONE DELTA

Detailed Description point, and LO and sideband suppression characteris-

LOOPBACK Rx OFF SPI

Figure 1. Transmitter Lineup

Figure 3. MAX2021 Demodulator Configuration

Figure 4. Baseband Port Typical Filtering and DC Return Network

I+ 3dB PAD DC BLOCK 0°

3dB PADS LOOK LIKE 160I TO GROUND MINI-CIRCUITS

Q+ 3dB PAD DC BLOCK 0°

Figure 5. Demodulator Combining Diagram

Power Scaling with Changes Layout Considerations

420 620 330 271 20.7 -31.4 43.4 54.0

420 620 330 271 22.4 -32.8 39.3 55.5

Power-Supply Bypassing Exposed Pad RF/Thermal Considerations

420 620 330 269 9.21 33.1 68

420 620 330 269 9.47 34.9 > 77.7

Chip Information Package Information

PACKAGE PACKAGE OUTLINE LAND

C12 C13 C10 C11

GND GND GND GND GND GND GND

Table 3. Component List Referring to the Typical Application Circuit

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